KR102667483B1 - The Electro-conductive Contact Pin - Google Patents

Abstract

The present invention provides an electrically conductive contact pin that can effectively remove the oxide layer formed on the surface of an inspection object while minimizing damage to the surface of the inspection object.

Description

The Electro-conductive Contact Pin}

The present invention relates to electrically conductive contact pins.

Figure 1a is a diagram schematically showing a probe card 1 according to the prior art. Figure 1b is a diagram showing the energized state of the probe pin 7 according to the prior art.

In general, the probe card 1 includes a circuit board 2, a spatial converter 3 provided below the circuit board 2, and a probe head 7 provided below the spatial converter 3. do.

The probe head 7 includes guide plates 5 and 6 having a plurality of probe pins 7 and guide holes into which the probe pins 7 are inserted. The probe head 7 includes an upper guide plate 5 and a lower guide plate 6, and the upper guide plate 5 and lower guide plate 6 are fixedly installed through spacers. The probe pin (7) is a structure that is installed vertically between the upper guide plate (5) and the lower guide plate (6) and then elastically deforms in the horizontal direction. By adopting this probe pin (7), the vertical probe card (1) constitutes.

To test the electrical properties of a semiconductor device, a semiconductor wafer (W) is approached to the probe card (1) on which a plurality of probe pins (7) are formed, and each probe pin (7) is connected to the corresponding electrode pad (WP) on the semiconductor wafer (W). ) is carried out by contacting the After the probe pin 7 reaches the position where it contacts the electrode pad WP, an overdrive process is performed to further raise the wafer W to a predetermined height toward the probe card 1. The plurality of probe pins (7) have length differences due to errors in the manufacturing process, the flatness of the guide plates (5, 6) and the spatial converter (3) differ slightly, and there are height differences between the electrode pads (WP). Because of this, an overdrive process is inevitably necessary. Additionally, an overdrive with sufficient lift stroke is required to ensure good electrical and mechanical contact to all probe pins 7.

As shown in Figure 1b, during the overdrive process, the end of the probe pin 7 penetrates the oxide layer 8 formed on the surface of the electrode pad WP and is electrically connected to the conductive material layer of the electrode pad WP. Thus, the probe pin 7 becomes capable of conducting electricity. However, in the inspection device, a contact pressure above a certain level is required to maintain electrical contact between the probe pin 7 and the conductive material layer. The contact point of the probe pin 7 removes the oxide film layer 8 under high contact pressure, and at this time, a large concave portion is formed on the surface of the electrode pad WP due to excessive contact pressure. These large concavities cause connection failures in the bonding process of semiconductor devices and cause excessive shavings to stick to the ends of the probe pins 7, increasing contact resistance.

Registration No. 10-1913355 Registered Patent Gazette

The present invention was made to solve the problems of the prior art described above. The present invention provides an electrically conductive contact pin that can effectively remove the oxide layer formed on the surface of the inspection object while minimizing damage to the surface of the inspection object. The purpose is to do so.

In order to achieve the purpose of the present invention, the electrically conductive contact pin according to the present invention is provided in an inspection device to determine whether an inspection object is defective by applying electricity and makes electrical and physical contact with the inspection object to transmit an electrical signal. In the conductive contact pin used for: a body portion having a space portion provided with a guide portion on the inside; and a movable tip portion at least partially inserted into the space and movably provided, wherein the head portion of the movable tip portion slides on the guide portion so that the connection portion of the movable tip portion performs a wiping operation.

In addition, it includes a connection part that elastically connects the body part and the moving tip part.

Additionally, the connecting portion is compressed when a pressing force is applied to the connecting portion of the moving tip portion and is restored when the pressing force is released from the moving tip portion.

Additionally, the connection portion is provided in the space portion and connects the body portion and the moving tip portion.

Additionally, the connection portion is provided outside the body portion and connects the body portion and the moving tip portion.

In addition, it includes a connection part that elastically connects the elastic part of the body part and the moving tip part.

In addition, when a pressing force is applied to the connection part of the moving tip part, the head of the moving tip part contacts the guide part and slides, and the moving direction of the head does not coincide with the axial direction of the pressing force.

Additionally, when a pressing force is applied to the connection portion of the movable tip portion, the head portion of the movable tip portion is in contact with the guide portion and moves along the guide portion, thereby tilting the movable tip portion.

In addition, when a pressing force is applied to the connection part of the movable tip part, the head of the movable tip part contacts the guide part and moves along the guide part, and the connection part of the movable tip part moves horizontally.

Meanwhile, the electrically conductive contact pin according to the present invention is a conductive contact pin used to transmit an electrical signal by electrically and physically contacting the inspection object by applying electricity to an inspection device to check whether the inspection object is defective. In the body part; and a movable tip portion at least partially inserted into the body portion from an end side of the body portion, wherein when a pressing force is applied to a connection portion of the movable tip portion, at least a portion of the movable tip portion located inside the body portion is connected to the body portion. As it moves in sliding contact with the inside, the connecting portion of the moving tip part performs a wiping operation.

Meanwhile, the electrically conductive contact pin according to the present invention is a conductive contact pin used to transmit an electrical signal by electrically and physically contacting the inspection object by applying electricity to an inspection device to check whether the inspection object is defective. The method includes: a movable tip portion and a body portion, wherein the movable tip portion includes: a first movable tip portion located on a first end side of the electrically conductive contact pin; and a second movable tip portion located on a second end side of the electrically conductive contact pin, wherein the body portion includes the first movable tip portion and the second movable tip portion elastically in the longitudinal direction of the electrically conductive contact pin. an elastic portion that causes displacement; and a support portion provided on the outside of the elastic portion along the longitudinal direction of the electrically conductive contact pin to guide the elastic portion to compress and expand in the longitudinal direction of the electrically conductive contact pin and to prevent the elastic portion from buckling while being compressed. Included, when a pressing force is applied to the connection portion of the second movable tip portion, at least a portion of the second movable tip portion located inside the support portion moves in sliding contact with the inside of the support portion, and the connection portion of the second movable tip portion is wiped. Take action.

Additionally, the elastic unit may include: a first elastic unit connected to the first moving tip unit; a second elastic portion connected to the second moving tip portion; and an intermediate fixing part connected to the first elastic part and the second elastic part between the first elastic part and the second elastic part and integrally provided with the support part.

Additionally, the electrically conductive contact pin is formed by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin.

Additionally, the electrically conductive contact pin includes a fine trench provided on its side.

The present invention provides an electrically conductive contact pin that can effectively remove the oxide layer formed on the surface of an inspection object while minimizing damage to the surface of the inspection object.

Figure 1a is a diagram schematically showing a probe card according to the prior art.
Figure 1b is a diagram showing an energized state of a probe pin according to the prior art.
Figure 2 shows a probe head equipped with an electrically conductive contact pin according to a first preferred embodiment of the present invention.
3 to 7 are diagrams showing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
Figure 8 is a diagram for explaining a method of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
Figure 9 is a diagram showing an electrically conductive contact pin according to a second preferred embodiment of the present invention.
Figure 10 is a diagram showing an electrically conductive contact pin according to a third preferred embodiment of the present invention.
Figure 11 is a diagram showing an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
Figure 12 is a diagram showing a wiping operation of an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to invent various devices that embody the principles of the invention and are included in the concept and scope of the invention, although not clearly described or shown herein. In addition, all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of ensuring that the inventive concept is understood, and should be understood as not limiting to the embodiments and conditions specifically listed as such. .

The above-mentioned purpose, features and advantages will become clearer through the following detailed description in relation to the attached drawings, and accordingly, those skilled in the art in the technical field to which the invention pertains will be able to easily implement the technical idea of the invention. .

Embodiments described herein will be explained with reference to cross-sectional views and/or perspective views, which are ideal illustrations of the present invention. The thicknesses of films and regions shown in these drawings are exaggerated for effective explanation of technical content. The form of the illustration may be modified depending on manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in form produced according to the manufacturing process. Technical terms used in this specification are merely used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “comprise” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in this specification, but are intended to indicate the presence of one or more other It should be understood that this does not exclude in advance the possibility of the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. In describing various embodiments below, components that perform the same function will be given the same names and same reference numbers for convenience even if the embodiments are different. In addition, the configuration and operation already described in other embodiments will be omitted for convenience.

The electrically conductive contact pins according to each preferred embodiment of the present invention are provided in an inspection device to determine whether an inspection object is defective by applying electricity and are used to transmit an electrical signal by electrically and physically contacting the inspection object. It could be a contact pin. The inspection device may be an inspection device used in a semiconductor manufacturing process, and for example, it may be a probe card or a test socket. The electrically conductive contact pins may be probe pins provided on a probe card to inspect a semiconductor chip, or may be socket pins provided in a test socket for inspecting a packaged semiconductor package and inspected a semiconductor package.

Hereinafter, the first to fourth embodiments will be separately described, but embodiments that combine the components of each embodiment are also included in the preferred embodiment of the present invention.

The width direction of the electrically conductive contact pins described below is the ±x direction shown in the drawings, the length direction of the electrically conductive contact pins is the ±y direction shown in the drawings, and the thickness direction of the electrically conductive contact pins is the ±z direction shown in the drawings. am. The electrically conductive contact pin has an overall length dimension (L) in the longitudinal direction (±y direction), an overall thickness dimension (H) in a thickness direction perpendicular to the longitudinal direction (±z direction), and a vertical thickness dimension (H) in the longitudinal direction. It has an overall width dimension (W) in the width direction (±x direction).

First embodiment

Hereinafter, with reference to FIGS. 2 to 8, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention will be described.

The probe card according to a preferred embodiment of the present invention is used in an inspection process to inspect chips manufactured on a wafer during the semiconductor manufacturing process and is capable of responding to fine measurements. The probe card according to a preferred embodiment of the present invention is more useful for inspecting non-memory semiconductor chips such as microprocessors, microcontrollers, ASICs, etc.

A probe card according to a preferred embodiment of the present invention includes a spatial transducer (ST) having a connection pad (CP); Guide plates (GP1, FP2) provided below the space converter (ST) and spaced apart from the space converter (ST); and a probe pin 100 that is inserted and installed into the holes of the guide plates (GP1, GP2).

The electrically conductive contact pin 100 is inserted into the guide hole of the upper guide plate (GP1) and the guide hole of the lower guide plate (GP2).

The pitch interval between the probe pins 100 installed on the guide plates (GP1, GP2) may be 50 ㎛ or more and 150 ㎛ or less, the left and right widths of the probe pins 100 are 40 ㎛ or more and 200 ㎛ or less, and the probe pins 100 ) may have a thickness of 40 ㎛ or more and 200 ㎛ or less.

The electrically conductive contact pin 100 includes a body portion 120 having a space 125 with a guide portion 127 on the inside; and a movable tip portion at least partially inserted into the space 120 and movably provided. 130); wherein the head portion 131 of the movable tip portion 130 slides on the guide portion 127 so that the connection portion 133 of the movable tip portion 130 performs a wiping operation.

The electrically conductive contact pin 100 includes a body portion 120, a fixed tip portion 110 provided on the upper side of the body portion 120, and at least an inner portion of the body portion 120 from the lower end side of the body portion 120. It includes a movable tip portion 130 that is partially inserted and movable.

The fixed tip portion 110 of the electrically conductive contact pin 100 is connected to the connection pad (CP) of the space transducer (ST), and the moving tip portion 130 of the electrically conductive contact pin 100 is connected to the connection pad of the inspection object. do. Here, the inspection object may be a semiconductor device.

The body portion 120 is provided with a gap portion 121 therein. The void 121 is formed to penetrate the body portion 120 in the thickness direction, and is formed to extend long along the longitudinal direction of the body portion 120, thereby allowing the body portion 120 to be formed into a plurality of beam structures. . Through this, it is possible to shorten the length of the body portion 120 by allowing the body portion 120 to be more easily elastically deformed in the width direction, which is advantageous for transmitting high-frequency signals. In addition, since the surface area of the body portion 120 is expanded through the configuration of the void portion 121, this is advantageous for transmitting high-frequency signals.

A fixed tip portion 110 is provided on the upper side of the body portion 120. The fixed tip portion 110 is electrically connected to the connection pad CP of the spatial converter ST.

The fixed tip portion 110 is provided with an elastic beam 111 for connection to the connection pad CP. The elastic beam 111 is provided in the form of a cantilever, with one end connected to the fixed tip portion 110 and the other end extending toward the connection pad CP to form a free end. Through the configuration of the elastic beam 111, the fixed tip portion 110 can be elastically compressed and contacted to the connection pad CP to always maintain a contact state. Through this, it is possible to prevent the problem of sparks occurring due to a gap between the fixed tip portion 110 and the connection pad (CP).

The fixed tip portion 110 is provided with a stepped portion 113 for fixing the fixed tip portion 110 to the upper guide plate (GP1). The fixing tip part 110 is caught on the upper surface of the upper guide plate (GP1) by the step part 113, thereby preventing the electrically conductive contact pin 100 from passing through the upper guide plate (GP1) and falling off to the lower part.

The lower part of the body portion 120 has a space portion 125 inside which a guide portion 127 is provided. The moving tip portion 130 is provided with at least a portion inserted into the space portion 125.

The moving tip portion 130 includes a head portion 131 in sliding contact with the guide portion 127 and a connecting portion 133 extending downward from the head portion 131. The head portion 131 of the moving tip portion 130 can be moved by sliding on the guide portion 127. When a pressing force acts on the connection part 133 of the moving tip part 130, the head part 131 of the moving tip part 130 contacts the guide part 127 and slides, and the moving direction of the head part 131 is along the axis of the pressing force. It does not match the direction.

The space portion 125 provides a space in which the moving tip portion 130 can move. The space 125 is provided with a guide portion 127 that contacts the head 131 of the movable tip 130 and guides the head 131 of the movable tip 130 to move in a specific direction. The guide portion 127 may be at least a portion of the inner surface of the body portion 120 constituting the space portion 125.

Looking at the cross-sectional configuration of the space 125 based on the plane including the longitudinal and width directions of the electrically conductive contact pin, only one side of the space 125 is open to the end of the body 120. It bends.

The guide portion 127 is formed in a curved shape at a portion that contacts the head portion 131 of the moving tip portion 130, and the head portion 131 of the moving tip portion 130 is also formed in a curved shape. The head portion 131 is generally provided in the shape of a cylinder in the thickness direction, and the side of the cylinder slides in contact with the guide portion 127. Through this, when the movable tip portion 130 slides along the guide portion 127, the curved portion of the movable tip portion 130 moves along the curved portion of the guide portion 127, thereby forming the head 131 of the movable tip portion 130. guides the smooth movement of

The connection portion 133 of the moving tip portion 130 is provided in a curved shape to minimize damage to the surface of the inspection object when the connection portion 133 contacts the inspection object and performs a wiping operation.

The space portion 125 is provided in the form of an oval with a minor axis and a long axis, and the long axis of the oval forms a predetermined angle with the axis of the body portion 120 and has an oval shape inclined diagonally with respect to the axis of the body portion 120. It can be provided with . The guide portion 127, which is in contact with the upper surface of the head portion 131, is configured in the form of a gently rising curved surface, so that the head portion 131 is deflected to one side and rises along the gently rising curved surface of the guide portion 127. Make it possible.

A locking portion 126 is formed on the lower side of the space portion 125. The locking portion 126 prevents the head portion 131 of the moving tip portion 130 from being separated from the space portion 125. The width of the opening formed by the locking portion 126 is smaller than the size of the head portion 131 of the movable tip portion 130, so that the movable tip portion 130 does not fall out of the space 125.

Additionally, the locking portion 126 limits the tilting angle of the moving tip portion 130 by limiting the horizontal movement distance of the moving tip portion 130. The extent to which the connection part 133 wipes the electrode pad WP of the inspection object can be controlled by the size of the gap between the locking part 126 and the moving tip part 130. The gap between the locking portion 126 and the moving tip portion 130 is a factor that determines the allowable tilting angle. The larger the gap between the locking portion 126 and the moving tip portion 130, the greater the connection portion 133 of the moving tip portion 130. ), the larger the tilting angle, and the smaller the gap between the locking portion 126 and the moving tip portion 130, the smaller the tilting angle of the connecting portion 133 of the moving tip portion 130 becomes.

The head portion 131 of the movable tip portion 130 is deflected to one side and rises while making surface contact with the guide portion 127, and the portion of the movable tip portion 130 on the lower side of the head portion 131 is connected to the locking portion 126. is in contact with it and its horizontal movement is restricted.

When a pressing force is applied to the connection portion 133 of the movable tip portion 130, the head portion 131 of the movable tip portion 130 contacts the guide portion 127 and moves along the guide portion 127, causing the movable tip portion 130 to move. It is tilted. The movable tip portion 130 is tilted relative to the body portion 120 with respect to the locking portion 126, and the connection portion 133 of the movable tip portion 130 performs a wiping operation on the surface of the contact object. In this way, when a pressing force is applied to the connection portion 133 of the movable tip portion 130, at least a portion of the movable tip portion 130 located inside the body portion 120 moves in sliding contact with the interior of the body portion 120, thereby causing the movable tip portion to move. The connection portion 133 of (130) performs a wiping operation.

The side of the movable tip 130 is supported by the locking portion 126, and the head 131 of the movable tip 130 is supported from above by the guide 127, so that the head 131 of the movable tip 130 ) reaches a position where it can no longer rise, the tilting of the moving tip unit 130 does not proceed any further and the tilting angle is maintained.

Referring to FIG. 4C, when the movable tip portion 130 receives a pressing force, the movable tip portion 130 is tilted relative to the body portion 120 to remove the oxide layer 8. Through this, it is possible to minimize damage to the electrode pad WP and do not cause excessive amounts of debris in the oxide layer 8, thereby improving the usage time of the electrically conductive contact pin 100.

While the conventional technology is structured to perform a process of removing the oxide layer 8 while elastically deforming the probe pin 7 itself, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention has a body. There is a difference in the basic operating principle of the wiping operation in that the movable tip unit 130, which is provided in the unit 120 to enable relative displacement, is structured to perform the wiping operation.

Unlike the prior art in which excessive contact pressure is applied to the oxide film layer 8 to penetrate the oxide film layer 8 and form a current-carrying state, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention ) removes the oxide layer 8 while the moving tip portion 130 is tilted relative to the body portion 120, thereby minimizing damage to the electrode pad WP.

Meanwhile, a housing (not shown) may be provided to prevent the moving tip portion 130 from falling in front or behind the electrically conductive contact pin 100. The housing (not shown) may be provided to entirely surround the electrically conductive contact pin 100 or may be provided to seal the front and rear portions of the space 125. Alternatively, as shown in FIGS. 5 to 7, in order to prevent the movable tip portion 130 from falling out before or after the electrically conductive contact pin 100, the body portion 120 and the movable tip portion 130 are elastically connected to each other. A connecting portion 150 may be provided.

FIG. 5 is a diagram for explaining one example of the connection portion 150. Referring to FIG. 5, the connection portion 150 is provided in the space portion 125. The connection portion 150 elastically connects the body portion 120 and the movable tip portion 130 to each other. One end of the connecting portion 150 is connected to the body portion 120 and the other end of the connecting portion 150 is provided to the moving tip portion 130. The moving tip part 130, the connecting part 150, and the body part 150 are provided as one body. The thickness H of the connection portion 130 is formed to be the same as the thickness H of the body portion 120. Through this, damage is effectively prevented when the connection portion 130 is compressed and deformed.

The connection portion 150 is formed in a ring shape to elastically connect the body portion 120 and the moving tip portion 130 to each other. At least one ring shape is provided to elastically connect the body portion 120 and the moving tip portion 130 to each other. When a pressing force is applied to the connecting part 133 of the moving tip part 130, the connecting part 150 is compressed according to the movement of the moving tip part 130, and when the pressing force applied to the moving tip part 130 is released, it is restored to its original state and the moving tip part ( 130) to return to its original position.

FIG. 6 is a diagram for explaining another example of the connection portion 150. Referring to FIG. 6, the connection portion 150 is provided in the space portion 125. The connection portion 150 elastically connects the body portion 120 and the movable tip portion 130 to each other. One end of the connecting portion 150 is connected to the body portion 120 and the other end of the connecting portion 150 is provided to the moving tip portion 130. The moving tip part 130, the connecting part 150, and the body part 150 are provided as one body. The thickness H of the connection portion 130 is formed to be the same as the thickness H of the body portion 120. Through this, damage is effectively prevented when the connection portion 130 is compressed and deformed.

The connection portion 150 is formed in the shape of a coil spring to elastically connect the body portion 120 and the moving tip portion 130 to each other. The “S” shape is repeatedly formed to elastically connect the body portion 120 and the moving tip portion 130 to each other. When a pressing force is applied to the connecting part 133 of the moving tip part 130, the connecting part 150 is compressed according to the movement of the moving tip part 130, and when the pressing force applied to the moving tip part 130 is released, it is restored to its original state and the moving tip part ( 130) to return to its original position.

FIG. 7 is a diagram for explaining another example of the connection portion 150. Referring to FIG. 7 , the connection portion 150 is provided on the outside of the body portion 120. The connection portion 150 elastically connects the body portion 120 and the movable tip portion 130 to each other. The moving tip part 130, the connecting part 150, and the body part 150 are provided as one body. The thickness H of the connection portion 130 is formed to be the same as the thickness H of the body portion 120. Through this, damage is effectively prevented when the connection portion 130 is compressed and deformed.

One end of the connecting portion 150 is connected to the body portion 120 and the other end of the connecting portion 150 is provided to the moving tip portion 130. More specifically, one end of the connecting portion 150 is connected to the end side of the body portion 120 in the direction of the inspection object, and the other end of the connecting portion 150 is connected to the side of the moving tip portion 130. The connecting portion 150 includes a first connecting portion 151 having one end connected to the left side of the end side of the body portion 120 and the other end connected to the left side of the moving tip portion 130, and one end connected to the end side of the body portion 120. It includes a second connection portion 152 connected to the right side and the other end connected to the right side of the moving tip portion 130.

The connection portion 150 is formed in the shape of a leaf spring to elastically connect the body portion 120 and the moving tip portion 130 to each other. It is formed in an arc-shaped curved shape to elastically connect the body portion 120 and the moving tip portion 130 to each other. When a pressing force is applied to the connecting part 133 of the moving tip part 130, the connecting part 150 is compressed according to the movement of the moving tip part 130, and when the pressing force applied to the moving tip part 130 is released, it is restored to its original state and the moving tip part ( 130) to return to its original position.

The electrically conductive contact pin 100 according to the first preferred embodiment of the present invention is provided by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin 100. The plurality of metal layers includes a first metal layer 160 and a second metal layer 180. The first metal layer 160 is a metal with relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), and nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn) ), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloy. The second metal layer 180 is a metal with relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be.

The first metal layer 160 is provided on the lower and upper surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160. For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of stacked layers consists of three or more layers. It can be.

With reference to FIG. 8, a method of manufacturing the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention will be described.

FIG. 8A is a plan view of the mold M in which the internal space IH is formed, and FIG. 8B is a cross-sectional view taken along line A-A' of FIG. 8A. The mold (M) may be composed of an anodized film, photoresist, silicon wafer, or similar materials. However, the mold M according to a more preferred embodiment of the present invention may be made of an anodic oxide film material. Therefore, the electrically conductive contact pin 100 according to a preferred embodiment of the present invention has effects that are exhibited by being manufactured using a mold (M) made of an anodized film material in addition to the effects that are exhibited by structural advantages. Hereinafter, the preferred mold (M) will be described based on the mold (M) made of an anodized film material.

An anodic oxide film refers to a film formed by anodizing a base metal, and a pore refers to a hole formed in the process of anodizing a metal to form an anodic oxide film. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base material is anodized, an anodic oxide film made of aluminum oxide (Al ₂ 0 ₃ ) is formed on the surface of the base material. However, the base metal is not limited to this and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof. The anodic oxide film formed as above is a barrier layer in which no pores are formed vertically. It is divided into a porous layer with pores formed inside. When the base material is removed from a base material on which an anodic oxide film having a barrier layer and a porous layer is formed on the surface, only an anodic oxide film made of aluminum oxide (Al ₂ 0 ₃ ) remains. The anodic oxidation film may be formed in a structure that penetrates the top and bottom of the pore by removing the barrier layer formed during anodization, or may be formed in a structure that seals the top and bottom ends of the pore while the barrier layer formed during anodization remains intact.

The anodic oxide film has a thermal expansion coefficient of 2~3ppm/℃. For this reason, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even if the production environment for the electrically conductive contact pin 100 is a high temperature environment, the electrically conductive contact pin 100 can be manufactured with precision without thermal deformation.

Since the electrically conductive contact pin 100 according to a preferred embodiment of the present invention is manufactured using a mold (M) made of an anodized film material instead of the mold (M) made of photoresist material, the mold (M) made of photoresist material is It is possible to demonstrate the effect of realizing precise shapes and fine shapes that were previously limited in realization. In addition, in the case of a mold (M) made of an existing photoresist material, an electrically conductive contact pin with a thickness of about 40㎛ can be manufactured, but when a mold (M) made of an anodic oxide film is used, an electrically conductive contact pin with a thickness of 40㎛ or more to 200㎛ or less can be produced. It is possible to manufacture an electrically conductive contact pin 100.

A seed layer (SL) is provided on the lower surface of the mold (M). The seed layer SL may be provided on the lower surface of the mold M before forming the internal space IH in the mold M. Meanwhile, a support substrate (not shown) is formed at the bottom of the mold (M) to improve the handling of the mold (M). Also, in this case, a seed layer (SL) may be formed on the upper surface of the support substrate, and a mold (M) having an internal space (IH) formed thereon may be used by combining the mold (M) with the support substrate. The seed layer SL may be made of copper (Cu) material and may be formed by a deposition method.

The internal space (IH) may be formed by wet etching a partial area of the mold (M) made of an anodized film material. For this purpose, a photo resist is provided on the upper surface of the mold M and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the internal space IH.

Next, an electroplating process is performed on the internal space (IH) of the mold (M) to form the electrically conductive contact pin 100. Figure 8c is a plan view showing an electroplating process performed on the internal space (IH), and Figure 8d is a cross-sectional view taken along line A-A' of Figure 8c.

Since the metal layer is formed while growing in the thickness direction of the mold (M), the shape of each cross section in the thickness direction of the electrically conductive contact pin 100 is the same. In addition, a plurality of metal layers are stacked in the thickness direction of the electrically conductive contact pin 100. The plurality of metal layers includes a first metal layer 160 and a second metal layer 180. The first metal layer 160 is a metal with relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), and nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn) ), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloy. The second metal layer 180 is a metal with relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be.

The first metal layer 160 is provided on the lower and upper surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160. For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of stacked layers consists of three or more layers. It can be.

Meanwhile, after the plating process is completed, the first metal layer 160 and the second metal layer 180 can be made more dense by raising the temperature to a high temperature and applying pressure to press the metal layer on which the plating process has been completed. When using a photoresist material as the mold (M), the process of raising the temperature to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layer after the plating process is completed. Differently, according to a preferred embodiment of the present invention, a mold M made of an anodized film is provided around the metal layer on which the plating process has been completed, so even if the temperature is raised to a high temperature, deformation is minimized due to the low thermal expansion coefficient of the anodized film. It is possible to densify the first metal layer 160 and the second metal layer 180. Therefore, it is possible to obtain a more dense first metal layer 160 and a second metal layer 180 compared to the technology using photoresist as the mold (M).

When the electroplating process is completed, a process of removing the mold (M) and the seed layer (SL) is performed. If the mold (M) is made of an anodic oxide film material, the mold (M) is removed using a solution that selectively reacts with the anodic oxide film material. Additionally, if the seed layer (SL) is made of copper (Cu), the seed layer (SL) is removed using a solution that selectively reacts with copper (Cu).

According to the technology of manufacturing pins by electroplating using photoresist as a mold (M), it is difficult to make the height of the mold (M) sufficiently high with only a single layer of photoresist. As a result, the thickness of the electrically conductive contact pin 100 cannot be sufficiently thick. Considering electrical conductivity, resilience, brittle fracture, etc., the electrically conductive contact pin 100 needs to be manufactured to a predetermined thickness or more. In order to increase the thickness of the electrically conductive contact pin 100, a mold (M) in which photoresist is stacked in multiple stages can be used. However, in this case, each layer of the photoresist sheet is slightly stepped, causing the problem that the side of the electrically conductive contact pin 100 is not formed vertically and a slightly stepped area remains. In addition, when photoresists are stacked in multiple stages, a problem arises in that it is difficult to precisely reproduce the shape of the electrically conductive contact pin 100 having a size range of several to tens of μm or less. In particular, the mold M made of photoresist material is provided with photoresist between its inner spaces. If the width of the photoresist provided between the inner spaces is less than 15㎛, the photoresist is not formed properly. In particular, when the height to width ratio is large, a problem occurs in which the standing state of the photoresist at the corresponding position is not properly maintained.

Referring to FIG. 8E, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention includes a fine trench 88 formed on its side. On the side of the electrically conductive contact pin 100, ridges and valleys with a depth of 20 nm or more and 1 μm or less are repeated along the side of the electrically conductive contact pin 100 in a direction perpendicular to the thickness direction of the electrically conductive contact pin 100. A fine trench 88 in a wrinkled shape is formed.

The fine trench 88 is formed to extend long from the side of the electrically conductive contact pin 100 in the thickness direction of the electrically conductive contact pin 100. In other words, the extension direction of the peaks and valleys of the micro trench 88 becomes the thickness direction of the electrically conductive contact pin 100. Here, the thickness direction of the electrically conductive contact pin 100 refers to the direction in which the metal filler grows during electroplating.

On the side of the plate-shaped plate constituting the electrically conductive contact pin 100, the micro trench 88 is formed in a wrinkled form in which peaks and valleys are repeated in a direction perpendicular to the thickness direction of the plate-shaped plate.

The fine trench 88 has a depth ranging from 20 nm to 1 μm, and its width also ranges from 20 nm to 1 μm. Here, since the fine trench 88 is caused by a pore formed during the manufacture of the anodic oxide mold (M), the width and depth of the fine trench 88 have values less than the range of the diameter of the pore of the anodic oxide mold (M). . Meanwhile, in the process of forming the internal space (IH) in the anodic oxide mold (M), some of the pores of the anodic oxide mold (M) are crushed by the etching solution, and the diameter of the pores formed during anodization is larger than that of the pores. At least a portion of the fine trench 88 may be formed with a depth of .

The anodic oxide film mold (M) includes numerous pores, and at least a portion of the anodic oxide film mold (M) is etched to form an internal space (IH), and an electrically conductive contact pin (100) is formed by electroplating into the internal space (IH). ) is manufactured, the side of the electrically conductive contact pin 100 is provided with a fine trench 88 formed while contacting the pores of the anodic oxide film mold (M).

The fine trench 88 as described above has a wrinkled shape in which peaks and valleys with a depth of 20 nm or more and 1 ㎛ or less are repeated in the direction perpendicular to the thickness direction, so that the surface area on the side of the electrically conductive contact pin 100 can be increased. It has a possible effect. Through the configuration of the fine trench 88 formed on the side of the electrically conductive contact pin 100, the surface area through which the current flows according to the skin effect is increased, thereby increasing the density of the current flowing along the electrically conductive contact pin 100. can be increased to improve the electrical characteristics (particularly, high-frequency characteristics) of the electrically conductive contact pin 100. In addition, the configuration of the fine trench 88 allows the heat generated in the electrically conductive contact pin 100 to be quickly dissipated, thereby suppressing an increase in the temperature of the electrically conductive contact pin 100.

Second embodiment

Next, we will look at the second embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 9, the electrically conductive contact pin 200 according to the second preferred embodiment of the present invention will be described. Figure 9 is a diagram showing an electrically conductive contact pin and its wiping operation according to a second preferred embodiment of the present invention.

The electrically conductive contact pin 200 according to a second preferred embodiment of the present invention includes a body portion 220 having a space portion 225 with a guide portion 227 therein; A moving tip portion 230 at least partially inserted into the space 220 and movably provided; and a connection portion 250 that elastically connects the body portion 220 and the movable tip portion 230; the head portion 231 of the movable tip portion 230 slides on the guide portion 227 to form the movable tip portion 230. The connection part 233 performs a wiping operation.

The moving tip portion 230 includes a head portion 231 in sliding contact with the guide portion 227, a connection portion 233 in contact with the inspection object, and a neck portion 232 connecting the head portion 231 and the connection portion 233. Includes.

The connection part 233 is provided in the form of a curved surface to minimize damage to the surface of the inspection object when the connection part 233 performs a wiping operation.

The guide portion 227 is formed in a curved shape where the portion in contact with the head portion 231 of the moving tip portion 230 rises in one direction. The head portion 231 of the moving tip portion 130 is also formed in a curved shape, and the head portion 231 is in sliding contact with the guide portion 227 and slides along the shape of the guide portion 227.

The locking portion 226 prevents the head portion 231 of the moving tip portion 230 from being separated from the space portion 225. The width of the opening formed by the locking portion 226 is smaller than the size of the head portion 231 of the moving tip portion 230, so that the moving tip portion 230 does not fall out of the space portion 225. Additionally, the locking portion 226 limits the tilting angle of the moving tip portion 230 by limiting the horizontal movement distance of the moving tip portion 230. The extent to which the connection part 233 wipes the electrode pad WP of the inspection object can be controlled by the size of the gap between the locking part 226 and the moving tip part 230. The gap between the locking portion 226 and the moving tip portion 230 is a factor that determines the allowable tilting angle. The larger the gap between the locking portion 226 and the moving tip portion 230, the greater the connection portion 233 of the moving tip portion 230. ), the larger the tilting angle, and the smaller the gap between the locking portion 226 and the moving tip portion 230, the smaller the tilting angle of the connecting portion 233 of the moving tip portion 230 becomes.

When a pressing force is applied to the connection portion 233 of the movable tip portion 230, at least a portion of the movable tip portion 230 located inside the body portion 220 moves in sliding contact with the interior of the body portion 220, thereby causing the movable tip portion ( The connection portion 233 of 230 performs a wiping operation.

One end of the connecting portion 250 is connected to the body portion 220 and the other end of the connecting portion 250 is provided to the moving tip portion 230. More specifically, one end of the connecting portion 250 is connected to the end side of the body portion 220 in the direction of the inspection object, and the other end of the connecting portion 250 is connected to the side of the moving tip portion 230. The connecting portion 250 includes a first connecting portion 251 having one end connected to the left side of the end side of the body portion 220 and the other end connected to the left side of the moving tip portion 230, and one end connected to the end side of the body portion 220. It includes a second connection portion 252 connected to the right side and the other end connected to the right side of the moving tip portion 230.

The connection portion 250 is formed in the shape of a leaf spring to elastically connect the body portion 220 and the moving tip portion 230 to each other. It is formed in an arc-shaped curved shape to elastically connect the body portion 220 and the moving tip portion 230 to each other. The thickness H of the connection portion 230 is formed to be the same as the thickness H of the body portion 220. When a pressing force is applied to the connecting part 233 of the moving tip part 230, the connecting part 250 is compressed according to the movement of the moving tip part 230, and when the pressing force applied to the moving tip part 230 is released, it is restored to its original state and the moving tip part ( 230) to return to its original position.

Meanwhile, the configuration of the connecting portion 250 is not limited to this, and it is also possible to adopt the configuration of the connecting portion 150 of the first embodiment described above.

While the conventional technology is structured to perform a process of removing the oxide layer 8 while elastically deforming the probe pin 7 itself, the electrically conductive contact pin 200 according to the second preferred embodiment of the present invention has a body. There is a difference in the basic operating principle of the wiping operation in that the movable tip unit 230, which is provided in the unit 220 to enable relative displacement, is structured to perform the wiping operation.

Unlike the prior art in which excessive contact pressure is applied to the oxide layer 8 to penetrate the oxide layer 8 and form a current-carrying state, the electrically conductive contact pin 200 according to the second preferred embodiment of the present invention ) removes the oxide layer 8 while the moving tip portion 230 is tilted relative to the body portion 220, thereby minimizing damage to the electrode pad WP.

Third embodiment

Next, we will look at the third embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 10, an electrically conductive contact pin 300 according to a third preferred embodiment of the present invention will be described. Figure 10 is a diagram showing an electrically conductive contact pin and its wiping operation according to a third preferred embodiment of the present invention.

The electrically conductive contact pin 300 according to a third preferred embodiment of the present invention includes a body portion 320 having a space portion 325 with a guide portion 327 therein; A movable tip portion 330 that is at least partially inserted into the space 320 and movably provided; and a connection portion 350 that elastically connects the body portion 320 and the movable tip portion 330; the head portion 331 of the movable tip portion 330 slides on the guide portion 327 to form the movable tip portion 330. The connection part 333 performs a wiping operation.

The movable tip portion 330 includes a head portion 331 in sliding contact with the guide portion 327 and a connection portion 333 in contact with the inspection object. The connection part 333 is provided in the form of a curved surface to minimize damage to the surface of the inspection object when the connection part 333 performs a wiping operation.

The guide portion 327 is formed in a diagonal shape so that the portion in contact with the head portion 331 of the moving tip portion 330 rises in one direction. The guide part 327 includes a first guide part 327a in the form of a diagonal line oriented upward to the right, and a second guide part 327b in the form of a diagonal line oriented downward to the right.

The head portion 331 of the moving tip portion 330 is formed in a triangular shape consisting of a first side side 331a in the form of a diagonal line pointing upward to the right and a second side side 331b in the form of a diagonal line pointing downward to the right. As the movable tip portion 33 slides so that the second side side 331b and the second guide portion 327b come into contact with each other by pressing force, the connection portion 333 of the movable tip portion 330 moves in the horizontal direction. Afterwards, when the first side 331a comes into contact with the first guide part 327a, the movement of the head 331 is stopped.

The locking portion 326 prevents the head portion 331 of the moving tip portion 330 from being separated from the space portion 325. The width of the opening formed by the locking portion 326 is smaller than the size of the head portion 331 of the movable tip portion 330, so that the movable tip portion 330 does not fall out of the space 325.

When a pressing force is applied to the connection portion 333 of the movable tip portion 330, at least a portion of the movable tip portion 330 located inside the body portion 320 moves in sliding contact with the interior of the body portion 320, thereby causing the movable tip portion ( The connection portion 333 of 330 performs a wiping operation.

One end of the connecting portion 350 is connected to the body portion 320 and the other end of the connecting portion 350 is provided to the moving tip portion 330. More specifically, one end of the connecting portion 350 is connected to the end side of the body portion 320 in the direction of the inspection object, and the other end of the connecting portion 350 is connected to the side of the moving tip portion 330. The connecting portion 350 includes a first connecting portion 351 having one end connected to the left side of the end side of the body portion 320 and the other end connected to the left side of the moving tip portion 330, and one end connected to the end side of the body portion 320. It includes a second connection portion 352 connected to the right side and the other end connected to the right side of the moving tip portion 330.

The connection portion 350 is formed in the shape of a leaf spring to elastically connect the body portion 320 and the moving tip portion 330 to each other. It is formed in an arc-shaped curved shape to elastically connect the body portion 320 and the moving tip portion 330 to each other. The thickness H of the connection portion 330 is formed to be the same as the thickness H of the body portion 320. When a pressing force is applied to the connecting part 333 of the moving tip part 330, the connecting part 350 is compressed according to the movement of the moving tip part 330, and when the pressing force applied to the moving tip part 330 is released, it is restored to its original state and the moving tip part ( 330) to return to its original position.

Meanwhile, the configuration of the connecting portion 250 is not limited to this, and it is also possible to adopt the configuration of the connecting portion 150 of the first embodiment described above.

When a pressing force is applied to the connection portion 333 of the movable tip portion 330, the head portion 331 of the movable tip portion 330 is in contact with the guide portion 327 and moves along the guide portion 327 to move the movable tip portion 330. The connection part 333 moves horizontally. The third embodiment differs from the first, second, and fourth embodiments in that the moving tip portion 330 is not tilted and the connection portion 333 moves horizontally on the surface of the inspection object to remove the oxide layer. You can. Since the moving tip portion 330 removes the oxide layer while moving relative to the body portion 320 in the horizontal direction, damage to the surface of the inspection object during the wiping process can be minimized.

While the conventional technology is structured to perform a process of removing the oxide layer 8 while elastically deforming the probe pin 7 itself, the electrically conductive contact pin 300 according to the third preferred embodiment of the present invention has a body. There is a difference in the basic operating principle of the wiping operation in that the movable tip unit 330, which is provided in the unit 320 to enable relative displacement, is structured to perform the wiping operation.

Unlike the prior art in which excessive contact pressure is applied to the oxide film layer 8 to penetrate the oxide film layer 8 and form a current-carrying state, the electrically conductive contact pin 300 according to the third preferred embodiment of the present invention ) removes the oxide film layer 8 while the moving tip part 330 moves relative to the body part 320, thereby minimizing damage to the electrode pad WP.

Embodiment 4

Next, we will look at the fourth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIGS. 11 and 12, the electrically conductive contact pin 300 according to the fourth preferred embodiment of the present invention will be described. FIG. 11 is a diagram showing an electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention, and FIG. 12 is a diagram showing a wiping operation of the electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention. This is a drawing showing.

The electrically conductive contact pin 400 according to the fourth preferred embodiment includes a moving tip portion 430 and a body portion 420.

The movable tip portion 430 includes a first movable tip portion 431 located on the first end side of the electrically conductive contact pin 400, and a second movable tip portion located on the second end side of the electrically conductive contact pin 400. (435); Includes.

The body portion 420 includes an elastic portion 421 that allows the first movable tip portion 431 and the second movable tip portion 435 to elastically displace in the longitudinal direction of the electrically conductive contact pin 400; and guides the elastic portion 421 to be compressed and expanded in the longitudinal direction of the electrically conductive contact pin 400, and is positioned along the longitudinal direction of the electrically conductive contact pin 400 to prevent the elastic portion 421 from buckling while being compressed. It includes a support part 425 provided on the outside of the elastic part 421.

One end of the first movable tip portion 431 is a free end and the other end is connected to the first elastic portion 421a, allowing elastic vertical movement by contact pressure. One end of the second movable tip portion 435 is a free end and the other end is connected to the second elastic portion 421b, allowing elastic vertical movement by contact pressure.

One end of the first elastic part 421a is connected to the first movable tip part 431, and the other end is connected to the middle fixing part 421c. One end of the second elastic part 421b is connected to the connecting part 450 and the other end is connected to the middle fixing part 421c. The connection portion 450 connects the second elastic portion 421b of the body portion 420 and the second movable tip portion 435.

The support portion 425 includes a first support portion 425a provided on the left side of the elastic portion 421 and a second support portion 425b provided on the right side of the elastic portion 421.

The intermediate fixing portion 421c extends in the width direction of the electrically conductive contact pin 400 and connects the first support portion 425a and the second support portion 425b.

The first elastic part 421a is provided above the middle fixing part 421c, and the second elastic part 421b is provided below the middle fixing part 421c. The first elastic part 421a and the second elastic part 421b are compressed or stretched based on the intermediate fixing part 421c. The intermediate fixing part 421c is fixed to the first and second supporting parts 425a and 425b and moves the position of the first and second elastic parts 421a and 421b when the first and second elastic parts 421a and 421b are compressed and deformed. It performs a limiting function.

By the intermediate fixing part 421c, the area where the first elastic part 421a is provided and the area where the second elastic part 421b is provided are separated from each other. Accordingly, foreign matter flowing into the upper opening 143a cannot flow into the second elastic part 421b, and foreign matter flowing into the lower opening 143b also cannot flow into the first elastic part 421a. Through this, it is possible to prevent the operation of the first and second elastic parts 421a and 421b from being disturbed by foreign substances by restricting the movement of foreign substances introduced into the support portion 425.

The first support portion 425a and the second support portion 425b are formed along the longitudinal direction of the electrically conductive contact pin 400, and the first support portion 425a and the second support portion 425b are formed along the electrically conductive contact pin 100. It is integrally connected to the intermediate fixing portion 421c that extends along the width direction of . The first and second elastic parts 421a and 421b are integrally connected through the middle fixing part 421c, and the electrically conductive contact pin 400 is composed of one body as a whole.

The first and second elastic parts 421a and 421b are formed by alternately connecting a plurality of straight parts and a plurality of curved parts. The straight part connects the curved parts that are adjacent to the left and right, and the curved part connects the straight parts that are adjacent to the top and bottom. The curved portion is provided in an arc shape.

A straight portion is disposed at the central portion of the first and second elastic portions 421a and 421b, and a curved portion is disposed at an outer portion of the first and second elastic portions 421a and 421b. The straight portion is provided parallel to the width direction to make it easier to deform the curved portion according to contact pressure.

While the first elastic portion 421a requires a compression amount sufficient to allow the first moving tip portions 431 of the plurality of electrically conductive contact pins 400 to make stable contact with the connection pads (CP) of the space converter (ST). , the second elastic portion 421b requires an amount of compression that allows the second moving tip portions 435 of the plurality of electrically conductive contact pins 400 to make stable contact with each chip. Therefore, the spring coefficient of the first elastic part 421a and the spring coefficient of the second elastic part 421b are different from each other. For example, the length of the first elastic part 421a and the second elastic part 421b are provided differently. Additionally, the length of the second elastic portion 421b may be formed to be longer than the length of the first elastic portion 421a.

The support part 425 is provided with a guide part 427 that allows the first moving tip part 435 to perform a wiping operation. The guide part 427 includes a first guide part 427a provided in the first support part 425a and a second guide part 427b provided in the second support part 425b. The first guide part 427a and the second guide part 427b guide the head part 437 of the first movable tip part 435 to move upward to one side by pressing force. The first guide part 427a and the second guide part 427b are provided in a curved shape.

A space 429 is provided between the first guide part 427a and the second guide part 427b. The space 429 is a space in which the second movable tip part 435 can move, and the inner wall of the support part 425 forming the space 429 becomes the guide part 427.

When a pressing force is applied to the connection portion 436 of the second movable tip portion 435, at least a portion of the second movable tip portion 435 located inside the support portion 425 moves in sliding contact with the inside of the support portion 425. 2The connection portion 436 of the moving tip portion 435 performs a wiping operation.

When a pressing force is applied to the connection part 436 of the second movable tip part 435, the second elastic part 421b is compressed according to the movement of the second movable tip part 435, and the pressing force applied to the second movable tip part 435 is released. When this happens, it is restored to its original state and the second moving tip part 435 returns to its original position. Even when the second movable tip part 435 is restored to its original position, the second movable tip part 435 is guided by at least one of the first guide part 427a and the second guide part 427b and moves down.

At least part of the guide part 427 may be in the form of a curved surface or at least part may be in the form of an oblique line, but it is not limited to this shape, and when a pressing force is applied to the second movable tip part 435, the second movable tip part 435 Any shape in which 435 can perform a wiping operation is included.

While the conventional technology is structured to perform a process of removing the oxide layer 8 while the probe pin 7 itself is elastically deformed, the electrically conductive contact pin 400 according to the fourth preferred embodiment of the present invention has a body. There is a difference in the basic operating principle of the wiping operation in that the second movable tip unit 435, which is provided in the unit 420 to enable relative displacement, is structured to perform the wiping operation.

Unlike the prior art in which excessive contact pressure is applied to the oxide film layer 8 to penetrate the oxide film layer 8 and form a current-carrying state, the electrically conductive contact pin 400 according to the fourth preferred embodiment of the present invention ) removes the oxide layer 8 while the second moving tip portion 435 is tilted relative to the body portion 420, thereby minimizing damage to the electrode pad WP.

As described above, although the present invention has been described with reference to preferred embodiments, those skilled in the art may modify the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the following patent claims. Or, it can be carried out in modification.

100: electrically conductive contact pin 110: fixed tip portion
120: body part 130: moving tip part
160: first metal layer 180: second metal layer

Claims (14)

In the conductive contact pin provided in an inspection device for applying electricity to check whether an inspection object is defective and used to transmit an electrical signal by electrically and physically contacting the inspection object,
A body portion having a space portion provided with a guide portion on the inside; and
A moving tip portion at least partially inserted into the space and movably provided,
The head of the moving tip portion slides on the guide portion so that the connecting portion of the moving tip portion performs a wiping operation,
The body portion includes a locking portion formed on a lower side of the space portion,
An electrically conductive contact pin wherein the locking portion prevents the head portion of the moving tip portion from being separated from the space portion.
According to paragraph 1,
An electrically conductive contact pin including a connection portion that elastically connects the body portion and the moving tip portion.
According to paragraph 2,
The connecting portion is compressed when a pressing force is applied to the connecting portion of the moving tip portion and is restored when the pressing force is released from the moving tip portion.
According to paragraph 2,
The connecting portion is provided in the space portion and connects the body portion and the moving tip portion.
According to paragraph 2,
The connecting portion is provided outside the body portion and connects the body portion and the moving tip portion.
According to paragraph 1,
An electrically conductive contact pin including a connecting portion connecting the elastic portion of the body portion and the moving tip portion.
According to paragraph 1,
When a pressing force is applied to the connection part of the moving tip part, the head of the moving tip part comes into contact with the guide part and moves slidingly, and the moving direction of the head does not coincide with the axis direction of the pressing force.
According to paragraph 1,
An electrically conductive contact pin, wherein when a pressing force is applied to the connection portion of the movable tip portion, the head of the movable tip portion contacts the guide portion and moves along the guide portion, thereby tilting the movable tip portion.
According to paragraph 1,
When a pressing force is applied to the connection part of the movable tip part, the head part of the movable tip part contacts the guide part and moves along the guide part, and the connection part of the movable tip part moves horizontally.
In the conductive contact pin provided in an inspection device for applying electricity to check whether an inspection object is defective and used to transmit an electrical signal by electrically and physically contacting the inspection object,
A body portion having a space portion provided with a guide portion on the inside; and
Includes a movable tip portion at least partially inserted into the body portion from an end side of the body portion,
When a pressing force is applied to the connection portion of the movable tip portion, at least a portion of the movable tip portion located inside the body portion slides into contact with the interior of the body portion and moves, causing the connection portion of the movable tip portion to perform a wiping operation,
The body portion includes a locking portion formed on a lower side of the space portion,
An electrically conductive contact pin wherein the locking portion prevents the head portion of the moving tip portion from being separated from the space portion.
In the electrically conductive contact pin provided in an inspection device to determine whether an inspection object is defective by applying electricity and used to transmit an electrical signal by electrically and physically contacting the inspection object,
Including a moving tip part and a body part,
The moving tip part,
a first moving tip portion located on a first end side of the electrically conductive contact pin; and
It includes a second moving tip portion located on the second end side of the electrically conductive contact pin,
The body part,
an elastic portion that allows the first movable tip portion and the second movable tip portion to elastically displace in the longitudinal direction of the electrically conductive contact pin; and
A support portion is provided on the outside of the elastic portion along the longitudinal direction of the electrically conductive contact pin to guide the elastic portion to compress and expand in the longitudinal direction of the electrically conductive contact pin, and to prevent the elastic portion from buckling while being compressed. do,
When a pressing force is applied to the connection portion of the second movable tip portion, at least a portion of the second movable tip portion located inside the support portion moves in sliding contact with the inside of the support portion, and the connection portion of the second movable tip portion performs a wiping operation. ,
The body portion further includes a space portion formed in the support portion, and a locking portion formed on a lower side of the space portion,
An electrically conductive contact pin wherein the locking portion prevents the head of the second moving tip portion from being separated from the space portion.
According to clause 11,
The elastic part,
a first elastic portion connected to the first moving tip portion;
a second elastic portion connected to the second moving tip portion; and
An electrically conductive contact pin comprising: an intermediate fixing part connected to the first elastic part and the second elastic part between the first elastic part and the second elastic part and provided integrally with the support part.
According to any one of claims 1, 10, and 11,
The electrically conductive contact pin is formed by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin.
According to any one of claims 1, 10, and 11,
The electrically conductive contact pin includes a fine trench provided on a side thereof.

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