TW202319757A - The electro-conductive contact pin - Google Patents

Abstract

The present invention provides an electrically conductive pin, effectively removing an oxide layer formed on the surface of an object to be inspected while minimizing damage to the surface of the object to be inspected.

Description

Conductive Contact Probe

The present invention relates to a conductive contact probe.

Fig. 1a is a diagram schematically showing a probe card (1) according to the prior art. Fig. 1b is a diagram showing the energized state of the probe pin (7) according to the prior art.

In general, the probe card (1) is composed of a circuit board (2), a space transformer (3) arranged under the circuit board (2), and a space transformer (3) arranged under the space transformer (3). the probe head (7).

The probe head (7) includes a plurality of probes (7), and guide plates (5, 6) configured with guide holes for insertion of the probes (7). The probe head (7) includes an upper guide plate (5) and a lower guide plate (6), and the upper guide plate (5) and the lower guide plate (6) are fixedly arranged by a spacer. The probe (7) is a structure that is installed in the vertical direction between the upper guide plate (5) and the lower guide plate (6), and then elastically deforms in the horizontal direction, and this probe (7) is used to form a Vertical probe card (1).

The electrical characteristic test of a semiconductor element is carried out by bringing a probe card (1) formed with a plurality of probes (7) close to a semiconductor wafer (W) and making each probe (7) touch the semiconductor wafer (W) Corresponding electrode pads (WP) are performed. After the probes ( 7 ) reach the positions where they come into contact with the electrode pads (WP), an over drive process of further raising the wafer (W) to a predetermined height toward the probe card ( 1 ) is performed. Due to the difference in length of multiple probes (7) due to manufacturing process errors, there are subtle differences in the flatness of the guide plates (5, 6) and the space transformer (3), and there is a slight difference between the electrode pads (WP) There is also a height difference, so an overdrive process is necessarily required. In addition, in order to ensure good electrical and mechanical contact for all probes (7), an overdrive with sufficient upward stroke is required.

As shown in Figure 1b, during the overdrive process, the tip of the probe (7) penetrates the oxide film layer (8) formed on the surface of the electrode pad (WP) and contacts with the conductive material layer of the electrode pad (WP) are electrically connected, so that the probe (7) is in an electrified state. However, in the detection device, in order to maintain an electrical contact between the probe (7) and the conductive material layer, a contact pressure above a certain level is required. When the contact of the probe (7) removes the oxide layer (8) under high contact pressure, a large depression is formed on the surface of the electrode pad (WP) due to the excessive contact pressure. Such a large concave portion causes poor connection during the bonding process of the semiconductor element, and the generated excessive shavings are attached at the end of the probe (7), causing a problem of increasing contact resistance. [Prior art literature] [Patent Document]

(Patent Document 1) Registered Patent Publication No. 10-1913355

The problem to be solved by the invention

The present invention is proposed to solve the problems of the above-mentioned prior art. The purpose of the present invention is to provide a method that can effectively remove the oxide film layer formed on the surface of the detection object while minimizing the damage to the surface of the detection object. conductive contact probes.

means of solving problems

In order to achieve the object of the present invention, the conductive contact probe according to the present invention is configured to apply electricity to confirm whether the detection object is defective, and is used when making electrical contact and physical contact with the detection object to transmit electrical signals. The contact probe includes: a main body part having a space part equipped with a guide part inside; and a moving tip part at least partially inserted into the space part and arranged in a movably The guide part slides and the connecting part of the moving tip part performs a wiping action.

In addition, the conductive contact probe includes a connecting portion that elastically connects the main body portion and the moving tip portion.

In addition, when the pressing force acts on the connecting portion of the moving tip, the connecting portion is compressed, and when the pressing force is released from the moving tip, the connecting portion returns to its original state.

In addition, the connection part is arranged in the space part to connect the main body part and the moving tip part.

In addition, the connecting portion is arranged outside the main body to connect the main body and the moving tip.

In addition, the conductive contact probe includes a connecting portion that elastically connects the elastic portion of the main body portion and the moving tip portion.

In addition, if the pressing force acts on the connecting portion of the moving tip, the head of the moving tip comes into contact with the guide and slides, and the moving direction of the head is in accordance with the pressing force. axis directions are inconsistent.

In addition, if a pressurizing force acts on the connecting portion of the moving tip, the moving tip is moved while the head of the moving tip comes into contact with the guide and moves along the guide. tilt.

In addition, if a pressurizing force acts on the connecting portion of the moving tip, the moving tip is moved while the head of the moving tip comes into contact with the guide and moves along the guide. The connection part moves horizontally.

On the other hand, the conductive contact probe according to the present invention is configured to apply electricity to confirm whether the detection object is defective or not, and is used when making electrical contact or physical contact with the detection object to transmit electrical signals. , including: a main body; and a moving tip, at least a part of which is inserted into the inside of the main body at an end side of the main body, and is located at the main body when a pressurizing force acts on the connecting portion of the moving tip At least a part of the moving tip part inside the part moves in sliding contact with the inside of the main body part, so that the connecting part of the moving tip part performs a wiping action.

On the other hand, the conductive contact probe according to the present invention is configured to apply electricity to confirm whether the detection object is defective or not, and is used when making electrical contact or physical contact with the detection object to transmit electrical signals. , comprising a moving tip portion and a main body portion, the moving tip portion comprising: a first moving tip portion positioned at a first end side of the conductive contact probe; and a second moving tip portion positioned at the conductive contact probe On the second end portion side of the main body portion, the main body portion includes: an elastic portion for elastically displacing the first moving tip portion and the second moving tip portion in the length direction of the conductive contact probe; and a supporting portion, arranged outside the elastic part along the length direction of the conductive contact probe, guide the elastic part to compress and elongate in the length direction of the conductive contact probe, and prevent the elastic part from buckling when compressed When the pressing force acts on the connecting portion of the second moving tip, at least a part of the second moving tip located inside the supporting portion moves in sliding contact with the inside of the supporting portion, thereby making the The connecting part of the second moving tip part performs a wiping action.

In addition, the elastic part includes: a first elastic part connected to the first moving tip part; a second elastic part connected to the second moving tip part; and an intermediate fixing part connected to the first elastic part. It is connected with the first elastic portion and the second elastic portion between the second elastic portion, and is integrally arranged with the support portion.

In addition, the conductive contact probe is formed by laminating a plurality of metal layers in the thickness direction of the conductive contact probe.

In addition, the conductive contact probes include fine grooves arranged on their side surfaces.

The effect of the invention

The present invention provides a conductive contact probe capable of minimizing damage to the surface of a detection object while effectively removing an oxide film layer formed on the surface of the detection object.

The following is merely illustrative of the principles of the invention. Therefore, even if it is not explicitly described or illustrated in this specification, those skilled in the art can realize the principle of the invention and invent various devices included in the concept and scope of the invention. In addition, all conditional terms and examples listed in this specification should be understood in principle only for the purpose of clearly understanding the concept of the invention, and should not be limited to the examples and states specifically listed above.

The above objects, features and advantages will be further clarified by the following detailed description related to the accompanying drawings, so those who have ordinary knowledge in the technical field of the invention can easily implement the technical idea of the invention.

Embodiments described in this specification will be described with reference to cross-sectional views and/or perspective views that are ideal illustrations of the present invention. In order to effectively explain the technical content, the thicknesses of the films and regions shown in these drawings are exaggerated. The shape of the illustrations may be deformed due to manufacturing techniques and/or tolerances. Thus, embodiments of the invention are not limited to the specific forms shown, but also include variations in forms resulting from manufacturing processes. The technical terms used in this specification are for describing specific examples only, and are not intended to limit the present invention. Expressions in the singular include expressions in the plural unless the context clearly dictates otherwise. In this specification, it should be understood that terms such as "comprising" or "have" are intended to designate the existence of features, numbers, steps, actions, constituent elements, parts or combinations thereof described in this specification, and do not exclude in advance Existence or additional possibility of one or more other features or numbers, steps, actions, constituent elements, components, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the accompanying drawings. When various embodiments are described below, even if the embodiments are different, components performing the same functions are given the same names and the same reference numerals for convenience. In addition, for the sake of convenience, configurations and operations already described in other embodiments will be omitted.

The conductive contact probe according to the preferred embodiments of the present invention can be configured as a detection device that applies electricity to confirm whether the detection object is defective, and is used when making electrical contact or physical contact with the detection object to transmit electrical signals. Needle. The detection device may be a detection device used in a semiconductor manufacturing process, and may be a probe card as an example, and may be a test socket. The conductive contact probes may be probes configured on a probe card for testing a semiconductor wafer, and may be socket pins configured in a test socket for testing a packaged semiconductor package.

In the following, the first to fourth embodiments will be described separately, but the embodiments in which the components of the respective embodiments are combined are also included in the preferred embodiments of the present invention.

The width direction of the conductive contact probe described below is the ±x direction marked in the figure, the length direction of the conductive contact probe is the ±y direction marked in the figure, and the thickness direction of the conductive contact probe is the marked direction in the figure The ±z direction. The conductive contact probe has an overall length dimension (L) in the length direction (±y direction), an overall thickness dimension (H) in the thickness direction (±z direction) perpendicular to the length direction, and an overall thickness dimension (H) in the direction perpendicular to the length direction. There is an overall width dimension (W) in the width direction (±x direction).

first embodiment

Hereinafter, the conductive contact probe (100) according to a preferred first embodiment of the present invention will be described with reference to Fig. 2 to Fig. 8e.

The probe card according to the preferred embodiment of the present invention is used in the inspection process of the wafer manufactured on the wafer in the semiconductor manufacturing process and can correspond to fine pitch. The probe card according to the preferred embodiment of the present invention is more useful in inspecting non-memory semiconductor wafers such as microprocessors, microcontrollers, application specific integrated circuits (ASICs), and the like.

The probe card according to a preferred embodiment of the present invention includes: a space transformer (ST), configured with a connection pad (CP); guide plates (GP1, FP2), connected to the space transformer ( ST) spaced configuration; and probes (100), which are inserted into the holes of the guide plates (GP1, GP2) for setting.

The conductive contact probes (100) are inserted into the guide holes of the upper guide plate (GP1) and the guide holes of the lower guide plate (GP2).

The pitch interval between the probes (100) set on the guide plate (GP1, GP2) can be 50 μm or more and 150 μm or less, the left and right width of the probes (100) is 40 μm or more and 200 μm or less, and the probes The needle ( 100 ) may have a thickness of not less than 40 μm and not more than 200 μm.

The conductive contact probe (100) includes: a main body part (120) having a space part (125) equipped with a guide part (127) inside; and a moving tip part (130) at least partially inserted into the space part (120) and Configured in a movable manner, the head (131) of the moving tip (130) slides on the guide (127) and the connecting portion (133) of the moving tip (130) performs a wiping action.

The conductive contact probe (100) includes: a main body (120); a fixed tip (110) disposed on the upper side of the main body (120); and a moving tip (130) disposed on the lower end of the main body (120) At least a part of the side of the body is inserted into the main body (120) and configured in a movable manner.

The fixed tip part (110) of the conductive contact probe (100) is connected to the connection pad (CP) of the space transformer (ST), and the moving tip part (130) of the conductive contact probe (100) is connected to the connection of the detection object. pad. Here, the detection object may be a semiconductor element.

The main body part (120) has a void part (121) disposed therein. The void portion (121) is formed through the thickness direction of the main body portion (120), and is formed by extending long along the length direction of the main body portion (120), so that the main body portion (120) is formed with a plurality of beams )structure. Thereby, the main body (120) can be more easily elastically deformed in the width direction, so that the length of the main body (120) can be shortened, which is favorable for high-frequency signal transmission. In addition, the surface area of the main body part (120) is widened by the configuration of the gap part (121), thereby facilitating high-frequency signal transmission.

A fixed tip part (110) is disposed on the upper side of the main body part (120). The fixed tip ( 110 ) is electrically connected to the connection pad (CP) of the space transformer (ST).

The fixed tip (110) is provided with elastic posts (111) for connection with connection pads (CP). One end of the elastic column (111) is connected to the fixed tip (110), and the other end extends toward the connection pad (CP) side and constitutes a free end, thereby being configured in a cantilever configuration. By virtue of the constitution of the elastic column (111), the fixed tip portion (110) is in contact with the connection pad (CP) when being elastically compressed, so that the contact state can always be maintained. Thereby, the problem of sparks (spark) generated due to the gap between the fixed tip portion ( 110 ) and the connection pad (CP) can be prevented.

The fixed tip part (110) is configured with a step part (113) for fixing the fixed tip part (110) to the upper guide plate (GP1). The fixed tip part (110) is clamped on the upper surface of the upper guide plate (GP1) by the step part (113), thereby preventing the conductive contact probe (100) from falling off through the upper guide plate (GP1).

The lower part of the main body part (120) has a space part (125) equipped with a guide part (127) inside it. At least a part of the moving tip part (130) is inserted into the space part (125) for placement.

The moving tip part (130) includes a head part (131) in sliding contact with the guide part (127), and a connecting part (133) extending downward from the head part (131). The head part (131) of the moving tip part (130) can slide and move on the guide part (127). If the pressurized force acts on the connection part (133) of the moving tip part (130), the head part (131) of the moving tip part (130) is in contact with the guide part (127) and slides, and the head part (131) The direction of movement is inconsistent with the direction of the axis of the pressurized force.

The space part (125) provides a space for the movable tip part (130) to move. The guide part (127) is arranged in the space part (125), and the guide part (127) contacts and guides the head (131) of the moving tip part (130), so that the movement tip part (130) The head (131) is movable in a specific direction. The guide part (127) may be at least a part of the inner side surface of the main body part (120) constituting the space part (125).

Based on the plane including the length direction and width direction of the conductive contact probe, the cross-sectional structure of the space part (125) is observed, and only one side of the space part (125) is bent so as to open on the end part side of the main body part (120) form.

The part of the guide part (127) in contact with the head (131) of the moving tip part (130) is formed in a curved shape, and the head (131) of the moving tip part (130) is also formed in a curved shape. The head ( 131 ) is arranged in the shape of a cylinder as a whole in the thickness direction, and the side surface of the cylinder contacts and slides with the guide part ( 127 ). Thereby, when the moving tip part (130) slides along the guide part (127), the curved surface part of the moving tip part (130) moves along the curved surface part of the guide part (127), thereby guiding the moving tip part (130) head (131) for smooth movement.

The connection part (133) of the moving tip part (130) is configured as a curved surface with curvature, so that when the connection part (133) contacts the detection object and performs a wiping action, damage to the surface of the detection object is minimized.

The space part (125) is configured as an ellipse with a short axis and a long axis, and the long axis of the ellipse forms a specified angle with the axis of the main body (120), and can be arranged on an oblique line based on the axis of the main body (120). The shape of the ellipse is inclined in the direction. The guide part (127) that the upper surface of the head part (131) touches is configured in the form of a slowly rising curved surface, so that the head part (131) rises sideways along the slowly rising curved surface of the guide part (127) .

A stopper part (126) is formed on the lower side of the space part (125). The stopper part (126) prevents the head part (131) of the moving tip part (130) from detaching from the space part (125). By making the opening width of the stopper part (126) smaller than the size of the head part (131) of the moving tip part (130), the moving tip part (130) does not fall out of the space part (125) .

In addition, the stopper part (126) limits the inclination angle of the moving tip part (130) by limiting the horizontal moving distance of the moving tip part (130). The degree to which the connecting part (133) wipes the electrode pad (WP) of the detection object can control the size of the gap between the stopper part (126) and the moving tip part (130). The gap between the stopper part (126) and the moving tip part (130) is a factor that determines the allowable inclination angle. If the gap between the stopper part (126) and the moving tip part (130) is large, the larger the gap, the more the movement will be. The greater the inclination angle of the connection part (133) of the tip part (130), the smaller the gap between the stopper part (126) and the moving tip part (130), the smaller the gap, the connection of the moving tip part (130) The inclination angle of the portion (133) becomes smaller.

The head (131) of the moving tip (130) makes surface contact with the guide (127) and rises to one side, and the part of the moving tip (130) on the lower side of the head (131) meets the stopper (126) contacts, thereby restricting the horizontal movement of the mobile tip (130).

If the pressing force acts on the connection part (133) of the moving tip part (130), the head part (131) of the moving tip part (130) contacts the guide part (127) and moves along the guide part (127), Simultaneously tilt the mobile tip (130). The moving tip part (130) is relatively inclined relative to the main body part (120) based on the stop part (126), and the connecting part (133) of the moving tip part (130) performs a wiping action on the surface of the contact object. In this way, when the pressing force acts on the connecting portion (133) of the moving tip portion (130), at least a part of the moving tip portion (130) inside the main body portion (120) is in sliding contact with the inside of the main body portion (120). move, so that the connecting part (133) of the moving tip part (130) performs a wiping action.

The side of the moving tip (130) is supported by the stopper (126), while the head (131) of the moving tip (130) is supported above by the guide (127). If the moving tip (130) When the head (131) reaches a position where it cannot rise further, the moving tip (130) will not tilt further and maintain the tilt angle.

Referring to Fig. 4c, when the moving tip portion (130) is subjected to pressure, the moving tip portion (130) is relatively inclined relative to the main body portion (120) and the oxide film layer (8) is removed. Thereby, the damage of the electrode pad (WP) can be minimized, and excessive debris of the oxide film layer (8) will not be induced, thereby achieving the effect of increasing the service time of the conductive contact probe (100).

There is a difference in the basic operating principle of the wiping action in the following respects: the probe (7) of the prior art is a structure that undergoes elastic deformation itself and performs a process of removing the oxide film layer (8), in contrast, according to the present invention In the conductive contact probe (100) of the preferred first embodiment, the moving tip portion (130) disposed on the main body portion (120) in a manner capable of relative displacement is a structure for performing a wiping action.

Different from the prior art that applies excessive contact pressure to the oxide film layer (8) and penetrates through the oxide film layer (8) to form an electrified state, the conductive contact probe according to the preferred first embodiment of the present invention (100) The oxide film layer (8) is removed while moving the tip portion (130) relative to the main body portion (120), thereby minimizing damage to the electrode pad (WP).

On the other hand, housings (not shown) may be configured to prevent the moving tip part ( 130 ) from falling on the front and back of the conductive contact probe ( 100 ). The case (not shown) may be configured to surround the conductive contact probe (100) as a whole, or to seal the front and rear parts of the space (125). Furthermore, as shown in Figures 5a to 7b, in order to prevent the moving tip part (130) from falling in front of and behind the conductive contact probe (100), the main body part (120) and the moving tip part ( 130) The connecting parts (150) elastically connected to each other.

Fig. 5a and Fig. 5b are diagrams for explaining an example of the connection part (150). Referring to Fig. 5a and Fig. 5b, the connection part (150) is arranged in the space part (125). The connecting part (150) elastically connects the main body part (120) and the moving tip part (130) between the main body part (120) and the moving tip part (130). One end of the connecting part (150) is connected to the main body part (120), and the other end of the connecting part (150) is arranged on the moving tip part (130). The moving tip part (130), the connecting part (150) and the main body part (150) are arranged integrally. The thickness (H) of the connecting portion (130) is formed to be the same as the thickness (H) of the main body portion (120). Thereby, the linking part (130) is effectively prevented from being damaged when being compressed and deformed.

The connecting part (150) is formed in a ring shape to elastically connect the main body part (120) and the moving tip part (130) to each other. At least one ring pattern is arranged so as to elastically connect the main body (120) and the moving tip (130) to each other. If the pressing force acts on the connection part (133) of the moving tip part (130), the connecting part (150) is compressed by the movement of the moving tip part (130), and if the pressure applied to the moving tip part (130) is released When pressure is applied, the connecting part (150) returns to its original state, and the moving tip part (130) returns to its original position.

Fig. 6a and Fig. 6b are diagrams for explaining another example of the connection part (150). Referring to Fig. 6a and Fig. 6b, the connection part (150) is arranged in the space part (125). The connecting part (150) elastically connects the main body part (120) and the moving tip part (130) between the main body part (120) and the moving tip part (130). One end of the connecting part (150) is connected to the main body part (120), and the other end of the connecting part (150) is arranged on the moving tip part (130). The moving tip part (130), the connecting part (150) and the main body part (150) are arranged integrally. The thickness (H) of the connecting portion (130) is formed to be the same as the thickness (H) of the main body portion (120). Thereby, the linking part (130) is effectively prevented from being damaged when being compressed and deformed.

The connecting part (150) is formed in the shape of a coil spring to elastically connect the main body part (120) and the moving tip part (130) to each other. Formed in a repeating "S" shape, thereby elastically connecting the main body (120) and the moving tip (130) to each other. If the pressing force acts on the connection part (133) of the moving tip part (130), the connecting part (150) is compressed by the movement of the moving tip part (130), and if the pressure applied to the moving tip part (130) is released When pressure is applied, the connecting part (150) returns to its original state, and the moving tip part (130) returns to its original position.

Fig. 7a and Fig. 7b are diagrams for explaining still another example of the connection part (150). Referring to Fig. 7a and Fig. 7b, the connecting part (150) is disposed outside the main part (120). The connecting part (150) elastically connects the main body part (120) and the moving tip part (130) between the main body part (120) and the moving tip part (130). The moving tip part (130), the connecting part (150) and the main body part (150) are arranged integrally. The thickness (H) of the connecting portion (130) is formed to be the same as the thickness (H) of the main body portion (120). Thereby, the linking part (130) is effectively prevented from being damaged when being compressed and deformed.

One end of the connecting part (150) is connected to the main body part (120), and the other end of the connecting part (150) is arranged on the moving tip part (130). More specifically, one end of the connection part (150) is connected to the end side of the main body part (120) in the detection object direction, and the other end of the connection part (150) is connected to the side surface of the moving tip part (130). The connecting part (150) includes: a first connecting part (151), one end of which is connected to the left side of the end part of the main body part (120), and the other end is connected to the left side of the moving tip part (130); and a second connecting part ( 152 ), one end is attached to the right side of the end side of the main body portion ( 120 ), and the other end is attached to the right side of the moving tip portion ( 130 ).

The connecting part (150) is formed in the form of a leaf spring to elastically connect the main body part (120) and the moving tip part (130) to each other. The connecting part (150) is formed in a shape bent into an arc, so as to elastically connect the main body part (120) and the moving tip part (130) to each other. If the pressing force acts on the connection part (133) of the moving tip part (130), the connecting part (150) is compressed by the movement of the moving tip part (130), and if the pressure applied to the moving tip part (130) is released When pressure is applied, the connecting part (150) returns to its original state, and the moving tip part (130) returns to its original position.

The conductive contact probe (100) according to the preferred first embodiment of the present invention is configured by laminating a plurality of metal layers in the thickness direction of the conductive contact probe (100). The multiple metal layers include a first metal layer (160) and a second metal layer (180). The first metal layer (160), as a metal with relatively high wear resistance compared with the second metal layer (180), is preferably formed from a metal selected from the following: rhodium (Rd), platinum (Pt), iridium ( Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium cobalt (PdCo) alloy, palladium nickel (PdNi) alloy or nickel phosphorus (NiPh) alloy, nickel manganese (NiMn), nickel cobalt (NiCo) or nickel tungsten (NiW) alloy. The second metal layer (180), as a metal with relatively high electrical conductivity compared with the first metal layer (160), is preferably made of an alloy selected from copper (Cu), silver (Ag), gold (Au) or the like. Metal formation in.

The first metal layer (160) is arranged on the lower surface and the upper surface in the thickness direction of the conductive contact probe (100), and the second metal layer (180) is arranged between the first metal layers (160). For example, the conductive contact probe (100) alternately laminates the first metal layer (160), the second metal layer (160) in the order of the first metal layer (160), the second metal layer (180), and the first metal Layers (180) are configured, and the number of laminated layers can be composed of more than three layers.

Referring to Fig. 8a to Fig. 8e, the manufacturing method of the conductive contact probe (100) according to the preferred first embodiment of the present invention will be described.

Fig. 8a is a plan view of a mold (M) formed with an inner space (IH), and Fig. 8b is an AA' sectional view of Fig. 8a. The mold (M) can be formed of anodized film, photoresist, silicon wafer or similar materials. However, the mold (M) according to a more preferred embodiment of the present invention can be formed of anodized film material. Therefore, the conductive contact probe (100) according to the preferred embodiment of the present invention not only has the effect exerted by the structural advantages, but also has the advantage of being produced by using the mold (M) made of anodized film material. Effect. Hereinafter, as a preferable mold (M), it demonstrates based on the mold (M) made of anodized film material.

The anodized film means a film formed by anodizing a metal as a base material, and the pores mean pores formed during the process of anodizing a metal to form an anodized film. For example, when the metal as the base material is aluminum (Al) or an aluminum alloy, anodic oxidation of the base material forms an anodized film made of aluminum oxide (Al ₂ O ₃ ) on the surface of the base material. However, the base material metal is not limited thereto, and includes alloys of Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or the like. The anodized film formed as described above is vertically divided into a barrier layer in which no pores are formed, and a porous layer in which pores are formed. In the base material on which the anodized film having the barrier layer and the porous layer is formed on the surface, if the base material is removed, only the anodized film made of aluminum oxide (Al ₂ O ₃ ) remains. The anodized film can be formed by removing the barrier layer formed when anodizing is performed and the pores pass through along the upper and lower sides, or by leaving the barrier layer formed when anodizing as it is and leaving the upper and lower ends of the pores A closed structure is formed.

The anodized film has a thermal expansion coefficient of 2 ppm/°C to 3 ppm/°C. Therefore, in the case of being exposed in a high-temperature environment, thermal deformation due to temperature is small. Therefore, even if the manufacturing environment of the conductive contact probe (100) is a high temperature environment, the precise conductive contact probe (100) can be manufactured without thermal deformation.

In the aspect that the conductive contact probe (100) according to the preferred embodiment of the present invention is manufactured by using the mold (M) made of anodic oxide film instead of the mold (M) made of photoresist material, it can be used as a mold made of photoresist material. (M) The precision of the shape and the effect of the fine shape that had been limited in the realization. In addition, in the case of the existing photoresist material mold (M), it is possible to produce conductive contact probes with a thickness of 40 μm, but in the case of using an anodized film material mold (M), it is possible to produce conductive contact probes with a thickness of 40 μm. A conductive contact probe (100) having a thickness of not less than 200 μm.

A seed layer (SL) is disposed on the lower surface of the mold (M). The seed layer (SL) may be disposed on the lower surface of the mold (M) before the inner space (IH) is formed in the mold (M). On the other hand, a support substrate (not shown) is formed at the lower portion of the mold (M), so that the handleability of the mold (M) can be improved. In addition, in this case, the seed layer (SL) may be formed on the upper surface of the support substrate, and the mold (M) in which the internal space (IH) is formed may be bonded to the support substrate and used. The seed layer (SL) may be formed of copper (Cu) and may be formed by a deposition method.

The inner space (IH) can be formed by wet etching a part of the mold (M) made of anodized film. For this purpose, a photoresist is placed on the upper surface of the mold (M) and patterned, and then the anodized film of the patterned open area reacts with an etching solution to form an internal space (IH).

Next, an electroplating process is performed on the inner space (IH) of the mold (M) to form conductive contact probes ( 100 ). FIG. 8c is a plan view illustrating a state where an electroplating process is performed on an inner space (IH), and FIG. 8d is an AA' sectional view of FIG. 8c.

Since the metal layer is grown and formed in the thickness direction of the mold (M), the shape in each section in the thickness direction of the conductive contact probe (100) is the same. In addition, a plurality of metal layers are stacked and arranged in the thickness direction of the conductive contact probe (100). The multiple metal layers include a first metal layer (160) and a second metal layer (180). The first metal layer (160), as a metal with relatively high wear resistance compared with the second metal layer (180), is preferably formed from a metal selected from the following: rhodium (Rd), platinum (Pt), iridium ( Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium cobalt (PdCo) alloy, palladium nickel (PdNi) alloy or nickel phosphorus (NiPh) alloy, nickel manganese (NiMn), nickel cobalt (NiCo) or nickel tungsten (NiW) alloy. The second metal layer (180), as a metal with relatively high electrical conductivity compared with the first metal layer (160), is preferably made of an alloy selected from copper (Cu), silver (Ag), gold (Au) or the like. Metal formation in.

The first metal layer (160) is arranged on the lower surface and the upper surface in the thickness direction of the conductive contact probe (100), and the second metal layer (180) is arranged between the first metal layers (160). For example, the conductive contact probe (100) alternately laminates the first metal layer (160), the second metal layer (160) in the order of the first metal layer (160), the second metal layer (180), and the first metal Layers (180) are configured, and the number of laminated layers can be composed of more than three layers.

On the other hand, after the plating process is completed, the metal layer that has completed the plating process can be pressed by applying pressure after the temperature is raised to a high temperature, so that the first metal layer (160) and the second metal layer (180) can be further improved. Densification. In the case of using a photoresist material as the mold (M), since the photoresist exists around the metal layer after the plating process, the process of raising the temperature to a high temperature and applying pressure cannot be performed. Different from this, according to the preferred embodiment of the present invention, since the mold (M) made of anodic oxide film is arranged around the metal layer that completes the plating process, even if the temperature rises to a high temperature, the low thermal expansion of the anodic oxide film coefficient to minimize deformation and increase the density of the first metal layer (160) and the second metal layer (180). Therefore, compared with the technique of using photoresist as the mold (M), higher density of the first metal layer ( 160 ) and the second metal layer ( 180 ) can be obtained.

When the electroplating process is completed, a process of removing the mold (M) and the seed layer (SL) is performed. In the case that the mold (M) is made of anodized film material, the mold (M) is removed using a solution that selectively reacts with the material of the anodized film. In addition, when the seed layer (SL) is made of copper (Cu), the seed layer (SL) is removed using a solution that selectively reacts with copper (Cu).

According to the technique of manufacturing needles by electroplating using a photoresist as a mold (M), it is difficult to make the height of the mold (M) high enough only with a single layer of photoresist. Therefore, the thickness of the conductive contact probe (100) cannot become thick enough. In consideration of electrical conductivity, resilience, brittle fracture, etc., it is necessary to manufacture the conductive contact probe (100) with a predetermined thickness or more. In order to increase the thickness of the conductive contact probe (100), a mold (M) for laminating photoresist in multiple steps may be used. However, in this case, the following problems will arise: fine steps appear in each layer of the photoresist, so that the side surfaces of the conductive contact probes (100) are not formed vertically and a fine step region remains. In addition, when the photoresist is laminated in multiple steps, it is difficult to accurately reproduce the shape of the conductive contact probe ( 100 ) having a size ranging from several micrometers to tens of micrometers or less. In particular, when the mold (M) made of photoresist material has photoresist between its internal space and the width of the photoresist placed between the internal spaces is 15 μm or less, the photoresist cannot be formed smoothly , especially when the width is larger than the height, there will be a problem that the photoresist at the corresponding position cannot be kept upright smoothly.

Referring to Fig. 8e, the conductive contact probe (100) according to the preferred first embodiment of the present invention includes fine grooves (88) formed on the side thereof. A fine groove (88) is formed on the side of the conductive contact probe (100), and the fine groove (88) is along the direction perpendicular to the thickness direction of the conductive contact probe (100) along the direction of the conductive contact probe ( 100) in the form of repeated folds of mountains and valleys on the side, and the depth of the fine grooves (88) is not less than 20 nm and not more than 1 μm.

The fine groove (88) is formed in the side surface of the conductive contact probe (100) to extend long in the thickness direction of the conductive contact probe (100). In other words, the extension direction of the mountains and valleys of the fine groove (88) is the thickness direction of the conductive contact probe (100). Here, the thickness direction of the conductive contact probe (100) means the direction in which the metal filler grows when electroplating is performed.

In the side surface of the plate-shaped plate constituting the conductive contact probe (100), the fine groove (88) is formed in a wrinkle form in which hills and valleys repeat in a direction perpendicular to the thickness direction of the plate-shaped plate.

The depth of the fine groove ( 88 ) is in the range of 20 nm to 1 μm, and its width is also in the range of 20 nm to 1 μm. Here, since the microgrooves (88) originate from pores formed when the anodized film mold (M) is manufactured, the width and depth of the microgrooves (88) have the diameter range of the pores of the anodized film mold (M). The following values. On the other hand, in the process of forming the inner space (IH) in the anodized film mold (M), part of the pores of the anodized film mold (M) can be broken each other by an etching solution, and at least part of the air holes with a higher Micro-grooves (88) with a wider range of diameters and depths of pores formed during anodization.

Since the anodized film mold (M) includes a large number of pores, at least a part of such anodized film mold (M) is etched to form an inner space (IH), and conductive contact probes are fabricated inside the inner space (IH) by electroplating ( 100), therefore, on the side of the conductive contact probe (100), there are fine grooves (88) formed while contacting the pores of the anodized film mold (M).

Since the fine grooves ( 88 ) as described above have a wrinkled form of repeated hills and valleys with a depth of not less than 20 nm and not more than 1 μm in the direction perpendicular to the thickness direction, the side surface of the conductive contact probe ( 100 ) It has the effect of increasing the surface area. By virtue of the composition of the fine groove (88) formed on the side of the conductive contact probe (100), the surface area for the current to flow through the skin effect (skin effect) is increased, thereby increasing the surface area along the conductive contact probe (100). 100) the density of the flowing current and improve the electrical characteristics (especially high frequency characteristics) of the conductive contact probe (100). In addition, heat generated in the conductive contact probe (100) can be quickly released by the configuration of the micro-groove (88), so that the temperature rise of the conductive contact probe (100) can be suppressed.

second embodiment

Next, a second embodiment according to the present invention will be described. However, in the embodiments described below, compared with the above-mentioned first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted as much as possible.

Hereinafter, a conductive contact probe ( 200 ) according to a preferred second embodiment of the present invention will be described with reference to FIGS. 9 a and 9 b. 9a and 9b are diagrams illustrating a conductive contact probe and its wiping action according to a preferred second embodiment of the present invention.

The conductive contact probe (200) according to the preferred second embodiment of the present invention includes: a main body part (220) having a space part (225) equipped with a guide part (227) inside; a moving tip part (230), at least A part is inserted into the space part (220) and configured in a movable manner; and the link part (250) elastically connects the main body part (220) and the moving tip part (230), and the head of the moving tip part (230) ( 231) Slide the guide part (227) and move the connection part (233) of the tip part (230) to perform a wiping action.

The moving tip part (230) includes: the head part (231), which is in sliding contact with the guide part (227); the connecting part (233), which is in contact with the detection object; and the neck part (232), which connects the head part (231) with the connecting part Ministry (233).

The connecting part (233) is configured as a curved surface with curvature, so as to minimize damage to the surface of the detection object when the connecting part (233) performs a wiping action.

A part of the guide part (227) in contact with the head part (231) of the moving tip part (230) is formed in the form of a curved surface that rises toward one side. The head ( 231 ) of the moving tip ( 130 ) is also formed in a curved shape, and the head ( 231 ) is in sliding contact with the guide part ( 227 ) and slides along the shape of the guide part ( 227 ).

The stopper part (226) prevents the head part (231) of the moving tip part (230) from detaching from the space part (225). By making the opening width of the stopper part (226) smaller than the size of the head part (231) of the moving tip part (230), the moving tip part (230) does not fall out of the space part (225) . In addition, the stopper part (226) limits the inclination angle of the moving tip part (230) by limiting the horizontal moving distance of the moving tip part (230). The degree to which the connecting part (233) wipes the electrode pad (WP) of the detection object can control the size of the gap between the stopper part (226) and the moving tip part (230). The gap between the stopper part (226) and the moving tip part (230) is a factor that determines the allowable inclination angle. If the gap between the stopper part (226) and the moving tip part (230) is large, the larger the gap is, the larger the gap will be. The greater the inclination angle of the connection part (233) of the tip part (230), the smaller the gap between the stopper part (226) and the moving tip part (230), the smaller the gap, the connection of the moving tip part (230) The inclination angle of the portion (233) becomes smaller.

When the pressing force acts on the connection part (233) of the moving tip part (230), at least a part of the moving tip part (230) located inside the main body part (220) moves in sliding contact with the inside of the main body part (220), Thus, the connecting part (233) of the moving tip part (230) performs a wiping action.

One end of the connecting part (250) is connected to the main body part (220), and the other end of the connecting part (250) is arranged on the moving tip part (230). More specifically, one end of the connection part (250) is connected to the end side of the main body part (220) in the detection object direction and the other end of the connection part (250) is connected to the side surface of the moving tip part (230). The connecting part (250) includes: a first connecting part (251), one end of which is connected to the left side of the end part of the main body part (220), and the other end is connected to the left side of the moving tip part (230); and a second connecting part ( 252 ), one end is attached to the right side of the end side of the main body portion ( 220 ), and the other end is attached to the right side of the moving tip portion ( 230 ).

The connecting part ( 250 ) is formed in the form of a leaf spring to elastically connect the main body part ( 220 ) and the moving tip part ( 230 ) to each other. The connecting part (250) is formed in a shape bent into an arc, so as to elastically connect the main body part (220) and the moving tip part (230) to each other. The thickness (H) of the connecting portion (230) is formed to be the same as the thickness (H) of the main body portion (220). If the pressing force acts on the connection part (233) of the moving tip part (230), the connecting part (250) is compressed by the movement of the moving tip part (230), and if the pressure applied to the moving tip part (230) is released When pressure is applied, the connecting part (250) returns to its original state, and the moving tip part (230) returns to its original position.

On the other hand, the configuration of the connection part ( 250 ) is not limited thereto, and the configuration of the connection part ( 150 ) in the first embodiment described above may also be adopted.

There is a difference in the basic operating principle of the wiping action in the following respects: the probe (7) of the prior art is a structure that undergoes elastic deformation itself and performs a process of removing the oxide film layer (8), in contrast, according to the present invention In the conductive contact probe (200) of the preferred second embodiment, the moving tip portion (230) disposed on the main body portion (220) in a relatively displaceable manner is a structure for performing a wiping action.

Different from the prior art that applies excessive contact pressure to the oxide film layer (8) and penetrates through the oxide film layer (8) to form an electrified state, the conductive contact probe according to the preferred second embodiment of the present invention ( 200 ) removing the oxide film layer ( 8 ) while moving the tip portion ( 230 ) to be relatively inclined relative to the body portion ( 220 ), thereby minimizing damage to the electrode pad (WP).

third embodiment

Next, a third embodiment according to the present invention will be described. However, in the embodiments described below, compared with the above-mentioned first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted as much as possible.

Hereinafter, a conductive contact probe ( 300 ) according to a preferred third embodiment of the present invention will be described with reference to FIG. 10 a and FIG. 10 b . 10a and 10b are diagrams illustrating a conductive contact probe and its wiping action according to a preferred third embodiment of the present invention.

The conductive contact probe (300) according to the preferred third embodiment of the present invention includes: a main body part (320) having a space part (325) equipped with a guide part (327) inside; a moving tip part (330), at least A part is inserted into the space part (320) and configured in a movable manner; and the link part (350) elastically connects the main body part (320) and the moving tip part (330), and the head of the moving tip part (330) ( 331) Slide the guide part (327) and move the connection part (333) of the tip part (330) to perform a wiping action.

The moving tip part (330) includes a head part (331) in sliding contact with the guide part (327), and a connection part (333) in contact with a detection object. The connecting part (333) is configured as a curved surface with curvature, so as to minimize damage to the surface of the detection object when the connecting part (333) performs a wiping action.

A part of the guide part (327) in contact with the head part (331) of the moving tip part (330) is formed in the shape of an oblique line rising to one side. The guide part ( 327 ) includes a first guide part ( 327 a ) in the form of a right upward oblique line, and a second guide part ( 327 b ) in the form of a right downward oblique line.

The head ( 331 ) of the moving tip ( 330 ) is formed in a triangular shape formed by a first side wall ( 331 a ) in a right upward oblique shape and a right downward oblique second side wall ( 331 b ). The moving tip part (33) makes the second side wall (331b) and the second guide part (327b) abut against each other and slide and move by pressurizing, so that the connecting part (333) of the moving tip part (330) is in the horizontal direction move up. Afterwards, when the first side wall (331a) abuts against the first guide part (327a), the head (331) stops moving.

The stopper part (326) prevents the head part (331) of the moving tip part (330) from detaching from the space part (325). By making the opening width of the stopper part (326) smaller than the size of the head part (331) of the moving tip part (330), the moving tip part (330) does not fall out of the space part (325) .

When the pressing force acts on the connecting portion (333) of the moving tip portion (330), at least a part of the moving tip portion (330) inside the main body portion (320) moves in sliding contact with the inside of the main body portion (320), Thus, the connecting part (333) of the moving tip part (330) performs a wiping action.

One end of the connecting part (350) is connected to the main body part (320), and the other end of the connecting part (350) is arranged on the moving tip part (330). More specifically, one end of the connection part (350) is connected to the end side of the main body part (320) in the detection object direction and the other end of the connection part (350) is connected to the side surface of the moving tip part (330). The connecting part (350) includes: a first connecting part (351), one end of which is connected to the left side of the end part of the main body part (320), and the other end is connected to the left side of the moving tip part (330); and a second connecting part ( 352 ), one end is attached to the end side right side of the main body portion ( 320 ), and the other end is attached to the right side side of the moving tip portion ( 330 ).

The connecting part (350) is formed in the form of a leaf spring to elastically connect the main body part (320) and the moving tip part (330) to each other. The connecting part (350) is formed in a shape bent into an arc, so as to elastically connect the main body part (320) and the moving tip part (330) to each other. The thickness (H) of the connecting portion (330) is formed to be the same as the thickness (H) of the main body portion (320). If the pressing force acts on the connection part (333) of the moving tip part (330), the connecting part (350) is compressed by the movement of the moving tip part (330), and if the pressure applied to the moving tip part (330) is released When pressure is applied, the connecting part (350) returns to its original state, and the moving tip part (330) returns to its original position.

On the other hand, the configuration of the connection part ( 250 ) is not limited thereto, and the configuration of the connection part ( 150 ) in the first embodiment described above may also be adopted.

If the pressing force acts on the connection part (333) of the moving tip part (330), the head part (331) of the moving tip part (330) will contact the guide part (327) and move along the guide part (327) At the same time, the connecting part (333) of the moving tip part (330) is moved horizontally. The third embodiment is different from the first embodiment, the second embodiment, and the fourth embodiment, and there may be differences in the following aspects: the moving tip part (330) is not inclined and the connecting part (333) is in the horizontal direction on the surface of the detection object Remove the oxide film layer while moving up. Moving the tip portion ( 330 ) relative to the main body portion ( 320 ) in a horizontal direction while removing the oxide film layer can minimize damage to the surface of the detection object during the wiping process.

There is a difference in the basic operating principle of the wiping action in the following respects: the probe (7) of the prior art is a structure that undergoes elastic deformation itself and performs a process of removing the oxide film layer (8), in contrast, according to the present invention In the conductive contact probe (300) of the preferred third embodiment, the moving tip portion (330) disposed on the main body portion (320) in a relatively displaceable manner is a structure for performing a wiping action.

Different from the previous technology that applies excessive contact pressure to the oxide film layer (8) and penetrates the oxide film layer (8) to form an electrified state through excessive contact pressure, the conductive contact probe according to the preferred third embodiment of the present invention ( 300 ) removing the oxide film layer ( 8 ) while moving the tip portion ( 330 ) relative to the main body portion ( 320 ), thereby minimizing damage to the electrode pad (WP).

Fourth embodiment

Next, a fourth embodiment according to the present invention will be described. However, in the embodiments described below, compared with the above-mentioned first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted as much as possible.

Hereinafter, a conductive contact probe ( 300 ) according to a preferred fourth embodiment of the present invention will be described with reference to FIGS. 11 to 12 b . Fig. 11 is a diagram showing a conductive contact probe (400) according to a preferred fourth embodiment of the present invention, and Fig. 12a and Fig. 12b are diagrams showing a conductive contact probe (400) according to a preferred fourth embodiment of the present invention ) diagram of the wiping action.

The conductive contact probe (400) according to the preferred fourth embodiment comprises a moving tip part (430) and a main body part (420).

The moving tip part (430) includes: a first moving tip part (431) located at the first end side of the conductive contact probe (400); and a second moving tip part (435) located at the conductive contact probe (400) side of the second end.

The main body part (420) includes: an elastic part (421), which elastically displaces the first moving tip part (431) and the second moving tip part (435) in the length direction of the conductive contact probe (400); and a supporting part ( 425), arranged outside the elastic part (421) along the length direction of the conductive contact probe (400), guide the elastic part (421) to compress and elongate in the length direction of the conductive contact probe (400), and prevent the elastic The portion (421) buckles when compressed.

One end of the first moving tip part (431) is a free end, and the other end is connected to the first elastic part (421a), so that it can elastically move vertically by contact pressure. One end of the second moving tip part (435) is a free end, and the other end is connected to the second elastic part (421b), so as to be elastically vertically movable by contact pressure.

One end of the first elastic part (421a) is connected to the first moving tip part (431), and the other end is connected to the middle fixed part (421c). One end of the second elastic part (421b) is connected to the connecting part (450), and the other end is connected to the middle fixing part (421c). The connecting part (450) connects the second elastic part (421b) of the main body part (420) and the second moving tip part (435).

The support part (425) includes: a first support part (425a), arranged on the left side of the elastic part (421); and a second support part (425b), arranged on the right side of the elastic part (421).

The middle fixing part (421c) is formed extending in the width direction of the conductive contact probe (400), and connects the first supporting part (425a) and the second supporting part (425b).

The first elastic part (421a) is arranged on the upper part of the middle fixing part (421c) and the second elastic part (421b) is arranged on the lower part of the middle fixing part (421c). The first elastic part (421a) and the second elastic part (421b) are compressed or elongated based on the intermediate fixing part (421c). The middle fixing part (421c) is fixed on the first support part (425a) and the second support part (425b), so as to limit the first elastic part when the first elastic part (421a) and the second elastic part (421b) are compressed and deformed (421a), the function of the position movement of the second elastic part (421b).

The region where the first elastic part (421a) is arranged and the region where the second elastic part (421b) is arranged are distinguished from each other by the middle fixing part (421c). Therefore, foreign matter flowing into the upper opening (143a) does not flow into the second elastic portion (421b), and foreign matter flowing into the lower opening (143b) does not flow into the first elastic portion (421a). Thereby, by restricting the movement of the foreign matter flowing into the support part (425), the movement of the first elastic part (421a) and the second elastic part (421b) can be prevented from being hindered by the foreign matter.

The first support part (425a) and the second support part (425b) are formed along the length direction of the conductive contact probe (400), and the first support part (425a) and the second support part (425b) are connected to the The middle fixing part (421c) formed by extending in the width direction of the needle (100) is integrated. The first elastic part (421a) and the second elastic part (421b) are connected into one body through the intermediate fixing part (421c), and meanwhile the conductive contact probe (400) is integrally formed as a whole.

The first elastic part (421a) and the second elastic part (421b) are formed by alternately connecting a plurality of straight parts and a plurality of curved parts. The straight portion connects the left and right adjacent curved portions, and the curved portion connects the upper and lower adjacent straight portions. The curved portion is arranged in an arc shape.

The straight line part is arranged at the central part of the first elastic part (421a) and the second elastic part (421b), and the curved part is arranged at the outer part of the first elastic part (421a) and the second elastic part (421b). The straight portion is arranged parallel to the width direction so that the bent portion can be more easily deformed by contact pressure.

The first elastic part (421a) needs to be compressed to such an extent that the first moving tip parts (431) of the plurality of conductive contact probes (400) can respectively stably contact the connection pads (CP) of the space transformer (ST) , in contrast, the second elastic part ( 421b ) needs to be compressed to such an extent that the second moving tip parts ( 435 ) of the plurality of conductive contact probes ( 400 ) can respectively stably contact the wafer. Therefore, the elastic constant of the first elastic part (421a) and the elastic constant of the second elastic part (421b) are different from each other. For example, the length of the first elastic part (421a) and the length of the second elastic part (421b) are arranged differently from each other. In addition, the length of the second elastic part (421b) may be formed longer than the length of the first elastic part (421a).

A guide part (427) that enables the first moving tip part (435) to perform a wiping operation is disposed on the support part (425). The guide part (427) includes a first guide part (427a) arranged on the first support part (425a), and a second guide part (427b) arranged on the second support part (425b). The first guide part ( 427 a ) and the second guide part ( 427 b ) are guided in such a way that the head part ( 437 ) of the first moving tip part ( 435 ) can move upward along one side by pressing force. The first guide part (427a) and the second guide part (427b) are arranged in the form of a curved surface.

A space part (429) is provided between the first guide part (427a) and the second guide part (427b). The space part (429) is a space for the second moving tip part (435) to move, and the inner wall of the support part (425) forming the space part (429) is a guide part (427).

If the pressing force acts on the connection part (436) of the second moving tip part (435), at least a part of the second moving tip part (435) inside the supporting part (425) slides with the inside of the supporting part (425) The contact moves, so that the connecting part (436) of the second moving tip part (435) performs a wiping action.

If the pressing force acts on the connection part (436) of the second moving tip part (435), the second elastic part (421b) is compressed by the movement of the second moving tip part (435), and if the pressure on the second moving tip part (435) is released The pressing force exerted by the moving tip part (435) restores the second elastic part (421b) to its original state, and returns the second moving tip part (435) to its original position. When the second moving tip part (435) returns to its original position, the second moving tip part (435) is also guided by any one of the first guide part (427a) and the second guide part (427b) while falling.

At least a part of the guide part (427) may be in the form of a curved surface or at least a part may be in the form of an oblique line, but it is not limited to this shape. When the pressing force acts on the second moving tip part (435), as long as the second moving Any shape in which the tip (435) can perform a wiping action can be included.

There is a difference in the basic operating principle of the wiping action in the following respects: the probe (7) of the prior art is a structure that undergoes elastic deformation itself and performs a process of removing the oxide film layer (8), in contrast, according to the present invention In the conductive contact probe (400) of the preferred fourth embodiment, the second moving tip portion (435) disposed on the main body portion (420) in a relatively displaceable manner is a structure for performing a wiping action.

Different from the prior art that applies excessive contact pressure to the oxide film layer (8) and penetrates through the oxide film layer (8) to form an electrified state, the conductive contact probe according to the preferred fourth embodiment of the present invention ( 400 ) The oxide film layer ( 8 ) is removed while the second moving tip portion ( 435 ) is relatively inclined relative to the main body portion ( 420 ), thereby minimizing damage to the electrode pad (WP).

As mentioned above, although the description is made with reference to the preferred embodiments of the present invention, those of ordinary skill in the corresponding technical field can implement various modifications to the present invention within the scope of the ideas and fields of the present invention described in the scope of the following claims or out of shape.

1: Vertical probe card/probe card 2: Circuit board 3. ST: Space Transformer 4: Probe head 5. GP1: Upper guide plate/guide plate 6. GP2: Lower guide plate/guide plate 7: Probe 8: Oxide film layer 88: micro groove 100, 200, 300: Conductive contact probe 110: fixed tip 111: elastic column 113: Step Department 120, 220, 320, 420: main body 121: Gap 125, 429: Department of Space 127, 227, 327, 427: Guidance Department 130, 230, 330, 430: mobile tip 131, 231, 331, 437: head 133, 233, 333, 436: connecting part 150, 250, 350, 450: connection part 160: the first metal layer 180: second metal layer 232: Neck 327a, 427a: the first guide part 327b, 427b: the second guide part 331a: first side wall 331b: second side wall 421: elastic part 421a: first elastic portion 421b: second elastic part 421c: middle fixed part 425: support part 425a: the first support part 425b: the second support part 431: The first mobile tip 435: the second mobile tip CP: connection pad H: overall thickness size/thickness IH: interior space L: overall length dimension M: mold/anodized film mold SL: seed layer W: semiconductor wafer/wafer/overall width dimension WP: electrode pad x, y, z: direction

Fig. 1a is a diagram schematically showing a probe card according to the prior art. Fig. 1b is a diagram showing an energized state of a probe according to the prior art. FIG. 2 is a diagram showing a probe head configured with a conductive contact probe according to a preferred first embodiment of the present invention. 3a to 7b are diagrams illustrating a conductive contact probe according to a preferred first embodiment of the present invention. 8a to 8e are diagrams for explaining a method of manufacturing a conductive contact probe according to a preferred first embodiment of the present invention. 9a and 9b are diagrams illustrating a conductive contact probe according to a preferred second embodiment of the present invention. 10a and 10b are diagrams illustrating a conductive contact probe according to a preferred third embodiment of the present invention. FIG. 11 is a diagram showing a conductive contact probe according to a preferred fourth embodiment of the present invention. 12a and 12b are diagrams showing the wiping action of the conductive contact probe according to the preferred fourth embodiment of the present invention.

100: Conductive contact probe

110: fixed tip

120: Main body

130: mobile tip

CP: connection pad

GP1: Upper Guide Plate/Guide Plate

GP2: Lower Guide Plate/Guide Plate

ST: space transformer

Claims (14)

A conductive contact probe is a conductive contact probe that is configured to apply electricity to confirm whether the detection object is defective and is used when making electrical contact or physical contact with the detection object to transmit electrical signals, including: a main body part having a space part equipped with a guide part inside; and a movable tip part, at least a part of which is inserted into the space part and arranged in a movable manner, The head of the moving tip slides on the guide part and the connecting part of the moving tip performs a wiping action. The conductive contact probe as claimed in item 1, comprising: The connection part elastically connects the main body part and the moving tip part. The conductive contact probe as claimed in claim 2, wherein When the pressing force acts on the connecting portion of the moving tip, the connecting portion is compressed, and when the pressing force is released from the moving tip, the connecting portion returns to its original state. The conductive contact probe as claimed in claim 2, wherein The connecting part is disposed in the space part to connect the main body part and the moving tip part. The conductive contact probe as claimed in claim 2, wherein The connecting portion is arranged outside the main body to connect the main body and the moving tip. The conductive contact probe as claimed in item 1, comprising: The connection part connects the elastic part of the main body part and the moving tip part. The conductive contact probe as claimed in claim 1, wherein When the pressing force acts on the connecting portion of the moving tip, the head of the moving tip comes into contact with the guide and slides, and the moving direction of the head is in line with the axis of the pressing force. Inconsistent directions. The conductive contact probe as claimed in claim 1, wherein When the pressing force acts on the connecting portion of the moving tip, the moving tip is inclined while the head of the moving tip comes into contact with the guide and moves along the guide. The conductive contact probe as claimed in claim 1, wherein If pressurized force acts on the connecting portion of the moving tip, the connection of the moving tip will be made while the head of the moving tip is in contact with the guide and moves along the guide. move horizontally. A conductive contact probe is a conductive contact probe that is configured to apply electricity to confirm whether the detection object is defective and is used when making electrical contact or physical contact with the detection object to transmit electrical signals, including: main body; and moving the tip part, inserting at least a part into the inside of the main body part at the end part side of the main body part, When the pressing force acts on the connecting portion of the moving tip, at least a part of the moving tip located inside the main body moves in sliding contact with the inside of the main body, thereby making the connection of the moving tip Do the wiping action. A conductive contact probe is a conductive contact probe that is configured to apply electricity to confirm whether the detection object is defective and is used when making electrical contact or physical contact with the detection object to transmit electrical signals, including: Move the tip and body, The mobile tip includes: a first moving tip portion on the first end side of the conductive contact probe; and a second moving tip portion located on the second end side of the conductive contact probe, The main body includes: an elastic portion for elastically displacing the first moving tip portion and the second moving tip portion in the length direction of the conductive contact probe; and The support part is arranged outside the elastic part along the length direction of the conductive contact probe, guides the elastic part to compress and elongate in the length direction of the conductive contact probe, and prevents the elastic part from buckle when compressed, When a pressing force acts on the connecting portion of the second moving tip, at least a part of the second moving tip located inside the supporting portion moves in sliding contact with the inside of the supporting portion, thereby causing the first moving tip to slide. 2. Move the connecting part of the tip part to perform a wiping action. The conductive contact probe of claim 11, wherein The elastic part includes: a first elastic part connected to the first moving tip part; a second elastic portion coupled to the second moving tip portion; and The intermediate fixing part is connected to the first elastic part and the second elastic part between the first elastic part and the second elastic part, and is arranged integrally with the support part. The conductive contact probe according to any one of claim 1, claim 10 and claim 11, wherein The conductive contact probe is formed by laminating a plurality of metal layers in a thickness direction of the conductive contact probe. The conductive contact probe according to any one of claim 1, claim 10 and claim 11, wherein The conductive contact probe includes fine grooves arranged on its side.

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