KR20240009100A - The Electro-conductive Contact Pin and Testing Device Having The Same - Google Patents

Abstract

The present invention provides an electrically conductive contact pin that can prevent sparks from occurring by ensuring that at least one end of the electrically conductive contact pin is always in contact with a connection object, and an inspection device including the same.

Description

Electrically conductive contact pin and testing device having the same {The Electro-conductive Contact Pin and Testing Device Having The Same}

The present invention relates to an electrically conductive contact pin and an inspection device having the same.

Figure 1 is a diagram schematically showing a probe card 1 according to the prior art.

In general, the probe card 1 includes a circuit board 2, a spatial converter 3 provided below the circuit board 2, and a probe head 7 provided below the spatial converter 3. do.

The probe head 7 includes guide plates 5 and 6 having a plurality of probe pins 7 and guide holes into which the probe pins 7 are inserted. The probe head 7 includes an upper guide plate 5 and a lower guide plate 6, and the upper guide plate 5 and lower guide plate 6 are fixedly installed through spacers. The probe pin 7 is a structure that elastically deforms between the upper guide plate 5 and the lower guide plate 6, and the vertical probe card 1 is formed by adopting the probe pin 7.

To test the electrical properties of a semiconductor device, the semiconductor wafer (W) is approached to the probe card (1) on which a plurality of probe pins (7) are formed, and each probe pin (7) is connected to a corresponding test object (semiconductor wafer (W)). This is performed by contacting the electrode pad (WP).

On the other hand, in recent LSI chip inspections, etc., there are cases where high-wave current flows. However, if a gap occurs between the probe pin (7) and the space converter (3) or between the probe pin (7) and the object to be inspected, a spark is generated, and the probe pin (7) and the connection object are damaged by the spark. Damage problems may occur.

Registration No. 10-1913355 Registered Patent Gazette

The present invention was made to solve the problems of the prior art described above. The present invention provides an electrically conductive contact that can prevent sparks from occurring by ensuring that at least one end of the electrically conductive contact pin is always in contact with the connection object. The purpose is to provide a pin and an inspection device equipped with the same.

In addition, the present invention provides an electrically conductive contact pin that prevents excessive pressure from being applied to a connection object in contact with the electrically conductive contact pin by providing an elastic portion on at least one end of the electrically conductive contact pin, and an inspection device including the same. The purpose.

In order to achieve the object of the present invention, an electrically conductive contact pin according to the present invention includes a main body portion having a first connection portion; second connection part; and an elastic portion provided between the main body portion and the second connection portion, wherein the elastic portion maintains the second connection portion in contact with the circuit board at all times when the electrically conductive contact pin is installed on the circuit board side. The part undergoes elastic deformation.

Additionally, the elastic portion is formed by alternately connecting straight portions and curved portions, and the curved portions connect the straight portions that are adjacent above and below.

Additionally, the elastic portion is formed by alternately connecting hollow portions and connecting portions, and the connecting portions connect the respective hollow portions to each other.

Additionally, the second connection part includes a ring-shaped connection part with a hollow interior.

Additionally, it includes an outer wall portion provided outside the elastic portion to guide the position of the elastic portion when the elastic portion elastically deforms.

In addition, it further includes a lower elastic part provided between the first connection part and the main body part.

Additionally, the main body portion has a length in the longitudinal direction, a width in the transverse direction, and a thickness in a direction perpendicular to the longitudinal and transverse directions, and the thickness of the elastic portion is the same as the thickness of the main body portion.

Additionally, the electrically conductive contact pin is formed by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin.

In addition, the elastic portion is primarily compressed and deformed in a state in which the electrically conductive contact pin is installed on the circuit board side, so that the second connection portion is maintained in contact with the connection pad of the circuit board, and the second connection portion is connected to the second connection pad. When the connection pad of the inspection object touches, it undergoes secondary compression deformation.

Additionally, the main body portion includes a locking protrusion larger than the guide hole to prevent the guide plate from passing through the guide hole, and the elastic portion is located on an upper portion of the locking protrusion.

Meanwhile, the inspection device according to the present invention includes a main body portion having a first connection portion in contact with the inspection object, a second connection portion in contact with a circuit board, and an elastic portion provided between the main body portion and the second connection portion. an electrically conductive contact pin that inspects the inspection object; and a guide plate having a guide hole into which the electrically conductive contact pin is inserted, wherein the second connection portion is always in contact with the connection pad of the circuit board while the electrically conductive contact pin is installed on the circuit board side. The elastic portion is elastically deformed to maintain its state.

Additionally, the guide plate includes: an upper guide plate; and a lower guide plate provided to be spaced apart from the upper guide plate, wherein the elastic portion is located between the upper guide plate and the circuit board.

In addition, the distance d1 from the upper part of the guide plate to the end of the second connection portion before installing the electrically conductive contact pin on the circuit board side is the distance d1 from the guide plate after installing the electrically conductive contact pin on the circuit board side. It is larger than the separation distance (d2) between the plate and the connection pad of the circuit board.

The present invention provides an electrically conductive contact pin that can prevent sparks from occurring by ensuring that at least one end of the electrically conductive contact pin is always in contact with a connection object, and an inspection device including the same.

In addition, the present invention provides an electrically conductive contact pin that prevents excessive pressure from being applied to a connection object in contact with the electrically conductive contact pin by providing an elastic portion on at least one end of the electrically conductive contact pin, and an inspection device including the same.

1 is a diagram schematically showing a probe card according to the prior art.
Figure 2 is a plan view showing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
Figure 3 is a perspective view showing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
Figure 4 is a diagram showing a state in which an electrically conductive contact pin according to a first preferred embodiment of the present invention is installed on a guide plate.
Figure 5 is a diagram showing a state in which an electrically conductive contact pin according to a first preferred embodiment of the present invention is installed on the circuit board.
Figure 6 is a plan view showing an electrically conductive contact pin according to a second preferred embodiment of the present invention.
Figure 7 is a perspective view showing an electrically conductive contact pin according to a second preferred embodiment of the present invention.
Figure 8 is a plan view showing an electrically conductive contact pin according to a third preferred embodiment of the present invention.
Figure 9 is a perspective view showing an electrically conductive contact pin according to a third preferred embodiment of the present invention.
Figure 10 is a plan view showing an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
Figure 11 is a perspective view showing an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
Figure 12 is a plan view showing an electrically conductive contact pin according to a fifth preferred embodiment of the present invention.
Figure 13 is a perspective view showing an electrically conductive contact pin according to a fifth preferred embodiment of the present invention.
Figure 14 is a plan view showing an electrically conductive contact pin according to a sixth preferred embodiment of the present invention.
Figure 15 is a side view of an electrically conductive contact pin according to preferred embodiments of the present invention.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to invent various devices that embody the principles of the invention and are included in the concept and scope of the invention, although not clearly described or shown herein. In addition, all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of ensuring that the inventive concept is understood, and should be understood as not limiting to the embodiments and conditions specifically listed as such. .

The above-mentioned purpose, features and advantages will become clearer through the following detailed description in relation to the attached drawings, and accordingly, those skilled in the art in the technical field to which the invention pertains will be able to easily implement the technical idea of the invention. .

Embodiments described herein will be explained with reference to cross-sectional views and/or perspective views, which are ideal illustrations of the present invention. The thicknesses of films and regions shown in these drawings are exaggerated for effective explanation of technical content. The form of the illustration may be modified depending on manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in form produced according to the manufacturing process. Technical terms used in this specification are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “comprise” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in this specification, but are intended to indicate the presence of one or more other It should be understood that this does not exclude in advance the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. In describing various embodiments below, components that perform the same function will be given the same names and same reference numbers for convenience even if the embodiments are different. In addition, the configuration and operation already described in other embodiments will be omitted for convenience.

The electrically conductive contact pins 100 according to each preferred embodiment of the present invention are provided in the inspection device 10 to determine whether an inspection object is defective by applying electricity, and electrically and physically contact the inspection object to generate an electrical signal. It may be a conductive contact pin used to transmit . The inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be a probe card or a test socket, for example. The electrically conductive contact pins 100 may be probe pins provided on a probe card to inspect a semiconductor chip, or may be socket pins provided in a test socket for inspecting a packaged semiconductor package.

Hereinafter, the first to sixth embodiments will be described separately, but embodiments that combine the components of each embodiment are also included in the preferred embodiment of the present invention.

The width direction of the electrically conductive contact pin 100 described below is the ±x direction shown in the drawing, the longitudinal direction of the electrically conductive contact pin 100 is the ±y direction shown in the drawing, and the longitudinal direction of the electrically conductive contact pin 100 is the ±y direction shown in the drawing. The thickness direction is the ±z direction indicated in the drawing. The electrically conductive contact pin 100 has an overall length dimension (L) in the longitudinal direction (±y direction), an overall thickness dimension (H) in a thickness direction perpendicular to the longitudinal direction (±z direction), and an overall thickness dimension (H) in the longitudinal direction (±y direction). It has an overall width dimension (W) in the vertical width direction (±x direction).

Embodiment 1

Hereinafter, with reference to FIGS. 2 to 5, the electrically conductive contact pin 100 and the inspection device 10 including the same according to the first preferred embodiment of the present invention will be described.

Figure 2 is a plan view showing an electrically conductive contact pin 100 according to a first preferred embodiment of the present invention, and Figure 3 is a perspective view showing an electrically conductive contact pin 100 according to a first preferred embodiment of the present invention. 4 is a diagram showing the state in which the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention is installed on the guide plates (GP1, GP2), and FIG. 5 shows the first preferred embodiment of the present invention. This is a diagram showing the electrically conductive contact pin 100 according to an example installed on the circuit board (ST) and before inspecting the inspection object.

The inspection device 10 according to a preferred embodiment of the present invention includes a circuit board (ST) having connection pads (CP); Guide plates (GP1, FP2) provided at the bottom of the circuit board (ST) and spaced apart from the circuit board (ST); and a probe pin 100 that is inserted and installed into the holes of the guide plates (GP1, GP2). Here, the circuit board (ST) may be a spatial converter.

The guide plate includes an upper guide plate (GP1) and a lower guide plate (GP2) that is provided to be spaced apart from the upper guide plate (GP1). The electrically conductive contact pin 100 is inserted into the guide hole of the upper guide plate (GP1) and the guide hole of the lower guide plate (GP2).

The electrically conductive contact pin 100 is an elastic body provided between the main body 200 having the first connection part 210, the second connection part 300, and the main body 200 and the second connection part 300. Includes part 400.

The second connection portion 300 of the electrically conductive contact pin 100 is connected to the connection pad (CP) of the inspection device (space converter (ST)), and the first connection portion 210 of the electrically conductive contact pin 100 is connected to the inspection device. It is connected to the connection pad of the object. Here, the inspection object may be a semiconductor wafer.

The electrically conductive contact pin 100 includes a body portion 200. The main body 200 allows the electrically conductive contact pin 100 to be elastically deformed in the transverse direction and functions to form a current path between the connection objects (inspection device and object). The main body 200 includes at least one bent portion 255.

The electrically conductive contact pin 100 has an elastic portion 400. More specifically, the elastic part 400 is provided between the main body 200 and the second connection part 300.

By providing an elastic part 400 between the main body 200 and the second connection part 300, it cushions the contact with the connection pad CP of the circuit board ST and connects the electrically conductive contact pin 100 to the circuit board. In the state where it is installed on the side, the second connection part 300 is pressed by the connection pad CP of the circuit board ST, and the elastic part 400 is elastically deformed, so that the second connection part 300 is attached to the circuit board ST. Always maintain contact with the connection pad (CP).

The elastic portion 400 is formed by alternately connecting straight portions 411 and curved portions 413. The straight portion 411 connects the curved portions 413 adjacent to the left and right, and the curved portion 413 connects the straight portions 411 adjacent to the top and bottom. The curved portion 413 is provided in an arc shape. A straight portion 411 is disposed at the center of the elastic portion 400, and a curved portion 413 is disposed at an outer portion of the elastic portion 400. The straight portion 411 is provided parallel to the width direction to make it easier to deform the curved portion 413 according to contact pressure.

The second connection part 300 is connected to the curved part 413 of the elastic part 400, and the main body part 200 is connected to the curved part 413 of the elastic part 400. Based on Figure 2, the second connection part 300 is connected to the curved part 413 on the right side, and the main body part 200 is connected to the curved part 413 on the left side. Through this, even if the elastic part 400, which is composed of a plate-shaped plate curved in the shape of S (English letter), is compressed and deformed by pressure, it is possible to ensure the straightness of the raising and lowering of the second connection part 300.

The main body portion 200 of the electrically conductive contact pin 100 has a length L in the longitudinal direction, a width W in the transverse direction, and a thickness H in a direction perpendicular to the longitudinal and transverse directions. , the thickness (H) of the main body portion 200 is the same as the thickness (H) of the elastic portion 400. By making the thickness H of the main body 200 and the thickness H of the elastic part 400 the same, the elastic part 400 is made to have sufficient rigidity.

The electrically conductive contact pin 100 is provided by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin 100. The plurality of metal layers include a first metal layer 110 and a second metal layer 120. The first metal layer 110 is a metal with relatively high rigidity or wear resistance compared to the second metal layer 120, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), or nickel ( Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese It may be formed of a metal selected from (NiMn), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloy. The second metal layer 120 is a metal with relatively high electrical conductivity compared to the first metal layer 110, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be.

The first metal layer 110 is provided on the lower and upper surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 120 is provided between the first metal layers 110. For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 110, the second metal layer 120, and the first metal layer 110 in that order, and the number of stacked layers consists of three or more layers. It can be.

The first metal layer 110 and the second metal layer 120 are formed not only in the main body portion 200 but also in the elastic portion 400.

The main body 200 of the electrically conductive contact pin 100 is sized to pass through the guide holes of the guide plates GP1 and GP2. The main body 200 of the electrically conductive contact pin 100 has a square cross-section, and the guide holes of the guide plates GP1 and GP2 also have a square cross-section. Through this, after the electrically conductive contact pin 100 is inserted into the guide hole, the electrically conductive contact pin 100 does not rotate within the guide hole, so that the bending direction of the plurality of electrically conductive contact pins 100 remains constant. Make it possible.

At the lower part of the elastic portion 400, a locking protrusion ( 220).

The locking protrusion 220 is provided to protrude in the width direction from at least one of both sides of the main body 200 of the electrically conductive contact pin 100. The locking protrusion 220 is caught on the upper surface of the guide plate (more specifically, the upper guide plate (GP1)) to prevent the electrically conductive contact pin 100 from falling from the upper guide plate (GP1).

The locking protrusion 220 is provided only on the upper part of the main body 200, so that the electrically conductive contact pin 100 is limited to movement in one direction and does not restrict movement in the other direction.

Based on the state in which the electrically conductive contact pins 100 are installed on the guide plates (GP1, GP2), the elastic portion 400 is located between the upper guide plate (GP1) and the connection pad (CP) of the circuit board (ST). Located. In addition, since the elastic part 400 is provided on the upper part of the locking step 220, even if the elastic part 400 is compressed and deformed, the elastic part 400 is connected to the connection pad (CP) between the upper guide plate (GP1) and the circuit board (ST). ) is located between.

The distance (d1) from the top of the guide plate (more specifically, the upper guide plate (GP1)) to the end of the second connection portion 300 before installing the electrically conductive contact pin 100 on the circuit board (ST) side is the electric It is larger than the separation distance d2 between the upper guide plate GP1 and the connection pad CP of the circuit board ST after the conductive contact pin 100 is installed on the circuit board ST side. Through this, when the electrically conductive contact pin 100 is installed on the circuit board (ST), the elastic part 400 is elastically deformed by compressive force and the second connection part 300 is connected to the circuit board (ST) by the restoring force. ) is always in contact with the contact pad (CP).

The multiple electrically conductive contact pins 100 have length differences due to errors in the manufacturing process, the flatness of the guide plates (GP1, GP2) and the circuit board (ST) differ slightly, and the connection pads (CP) also have different lengths. There is bound to be a difference in height. Therefore, in order to ensure good electrical and mechanical contact for all electrically conductive contact pins 100, the electrically conductive contact pins 100 must be installed while being pressed toward the circuit board ST. In a state where the guide plates (GP1, GP2) on which the electrically conductive contact pins 100 are installed are installed on the circuit board (ST), the second connection portion 300 of the electrically conductive contact pins 100 is connected to the circuit board (ST). They are closely adhered and pressed, and the elastic portion 400 is compressively deformed accordingly. Through this, not only does the connection reliability between the second connection portion 300 and the connection pad (CP) of the circuit board (ST) improve, but the second connection portion (300) of all electrically conductive contact pins (100) is connected to the circuit board (ST). Sparks can be prevented from occurring by always maintaining contact with the connection pad (CP).

Looking at the assembly process of the probe card provided with the electrically conductive contact pin 100 according to a preferred embodiment of the present invention, the electrically conductive contact pin 100 is first inserted into the guide plates (GP1 and GP2) to assemble the probe head. . At this time, since the main body portion 200 of the electrically conductive contact pin 100 is smaller than the guide hole, it passes through the guide hole and the locking protrusion 220 is caught on the upper surface of the upper guide plate GP1, thereby guiding the electrically conductive contact pin 100. It does not fall off from the plates (GP1, GP2). Next, fix the probe head to the circuit board (ST) side. At this time, the second connection portion 300 of the electrically conductive contact pin 100 is in contact with the connection pad CP of the circuit board ST and the elastic portion 400 is compressed and deformed. As the second connection part 300 is elastically supported by the elastic part 400 while in contact with the circuit board (ST), the second connection part 300 of the plurality of electrically conductive contact pins 100 is connected to the circuit board (ST). ) Always maintain contact with the connection pad (CP).

With the above assembly process completed, the inspection object is placed at the lower end of the electrically conductive contact pin 100 to inspect the inspection object. The inspection object is brought into contact with the first connection portion 210 of the electrically conductive contact pin 100, and then overdrive is performed for a certain distance. During the overdrive process, the elastic portion 400 is additionally compressed and deformed so that the first connection portions 210 of all electrically conductive contact pins 100 can reliably contact the connection pad of the inspection object.

As described above, the elastic portion 400 is primarily compressed and deformed with the electrically conductive contact pin 100 installed on the circuit board (ST) side, so that the second connection portion 300 is connected to the connection pad of the circuit board (ST). It remains in contact with (CP), and is compressed and deformed secondarily when the connection pad of the inspection object contacts the second connection portion 300. In addition, when the elastic portion 400 is primarily compressed and deformed, it functions to buffer the instantaneous collision force with the connection pad (CP) of the circuit board (ST) to protect the connection pad (CP) of the circuit board (ST). , When the elastic portion 400 is secondarily compressed and deformed, it protects the connection pad of the inspection object by buffering the instantaneous collision force with the connection pad of the inspection object.

The electrically conductive contact pin 100 of the present invention can be manufactured using an anodic oxide mold. The electrically conductive contact pin 100 manufactured using an anodic oxide mold can have a total thickness dimension (H) in the range of 80 ㎛ or more and 160 ㎛ or less. In addition, since the highly rigid anodic oxide film remains as a wall when forming the internal space in the anodic oxide film mold, it is possible to configure the line width of the plate-shaped plate constituting the elastic portion 400 to have a high aspect ratio. That is, it is possible to form the plate-shaped plate constituting the elastic portion 400 to have a small line width and a large overall thickness H of the plate-shaped plate. Since the line width of the elastic portion 400 is configured to have a high aspect ratio, the strength is improved and the elastic portion 400 can be prevented from being easily damaged. In addition, since the electrically conductive contact pin 100 manufactured using an anodic oxide mold is capable of forming a large overall thickness dimension (H), the electrically conductive contact pin 100 can be made even if the first and second metal layers 110 and 120 are multilayered. It is possible to secure the rigidity of the pin 100. Additionally, the current carrying capacity (CCC) of the electrically conductive contact pin 100 can be greatly improved compared to a case consisting of only a single layer.

Second embodiment

Next, we will look at the second embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIGS. 6 and 7, the electrically conductive contact pin 100 according to the second preferred embodiment of the present invention will be described. Figure 6 is a plan view showing an electrically conductive contact pin 100 according to a second preferred embodiment of the present invention, and Figure 7 is a perspective view showing an electrically conductive contact pin 100 according to a second preferred embodiment of the present invention. am.

The electrically conductive contact pin 100 according to the second embodiment differs from that of the first embodiment only in the configuration of the elastic portion 400, and the remaining configuration is the same. According to a second preferred embodiment of the present invention, the elastic portion 400 is formed by alternately connecting hollow portions 421 and connecting portions 423, and the connecting portions 423 connect each hollow portion 421 to each other. do.

The hollow portion 421 has a three-dimensional shape with a predetermined thickness and is formed in a long circular cylindrical shape when viewed from the front. The connection portion 423 has the same thickness as the hollow portion 421, and each connection portion 423 is arranged coaxially in a line with the central axis of the hollow portion 421. This configuration of the connection portion 423 improves the straightness of the second connection portion 300.

Third embodiment

Next, we will look at the third embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIGS. 8 and 9, the electrically conductive contact pin 100 according to a third preferred embodiment of the present invention will be described. Figure 8 is a plan view showing an electrically conductive contact pin 100 according to a third preferred embodiment of the present invention, and Figure 9 is a perspective view showing an electrically conductive contact pin 100 according to a third preferred embodiment of the present invention. am.

The electrically conductive contact pin 100 according to the third embodiment is different from that of the first embodiment only in the configuration of the second connection portion 300, and the remaining configuration is the same. According to a third preferred embodiment of the present invention, the second connection part 300 includes a ring-shaped connection part 311. The ring-shaped connection portion 311 has a hollow structure formed inside. As the second connection part 300 includes a ring-shaped connection part 311, the second connection part 300 may be elastically deformed by a pressing force.

In addition, the second connection part 300 has an elastic connection part 312 formed at the lower part of the ring-shaped connection part 311. The elastic connection part 312 is provided between the elastic part 400 and the ring-shaped connection part 311 to elastically connect the sealed connection part 311 to the elastic part 400. Through the configuration of the elastic connection portion 312, the second connection portion 300 can be elastically deformed by pressing force.

Embodiment 4

Next, we will look at the fourth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIGS. 10 and 11, the electrically conductive contact pin 100 according to the fourth preferred embodiment of the present invention will be described. Figure 10 is a plan view showing an electrically conductive contact pin 100 according to a fourth preferred embodiment of the present invention, and Figure 11 is a perspective view showing an electrically conductive contact pin 100 according to a fourth preferred embodiment of the present invention. am.

The electrically conductive contact pin 100 according to the fourth embodiment is different from that of the first embodiment only in the configuration of the second connection portion 300 and the elastic portion 400, and the remaining configuration is the same. According to a fourth preferred embodiment of the present invention, the second connection part 300 includes a sealed connection part 321. The sealed connection part 321 has a hollow structure formed inside. As the second connection part 300 includes a sealed connection part 321, the second connection part 300 may be elastically deformed by a pressing force. In addition, the second connection part 300 has a straight connection part 322 formed at the lower part of the sealed connection part 321. The straight connection part 322 is provided between the elastic part 400 and the sealed connection part 321 to connect the sealed connection part 321 to the elastic part 400. The straight connecting portion 322 is connected to the straight portion 411 of the elastic portion 400.

An outer wall portion 430 is provided outside the elastic portion 400. The outer wall portion 430 is provided outside the elastic portion 400. The outer wall portion 430 functions to guide the position of the elastic portion 400 when the elastic portion 400 is elastically deformed.

The outer wall portion 430 has a bent portion 431 extending toward the straight connecting portion 322. The space between the bent parts 431 guides the raising and lowering of the vertical connection part 322. In addition, the space between the bent portions 431 is formed to be smaller than the width of the sealed connecting portion 321 to prevent the sealed connecting portion 321 from entering and exiting the internal space between the outer wall portions. Through this, excessive deformation of the elastic portion 400 is prevented.

Embodiment 5

Next, we will look at the fifth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIGS. 12 and 13, the electrically conductive contact pin 100 according to the fifth preferred embodiment of the present invention will be described. FIG. 12 is a plan view showing an electrically conductive contact pin 100 according to a fifth preferred embodiment of the present invention, and FIG. 12 is a perspective view showing an electrically conductive contact pin 100 according to a fifth preferred embodiment of the present invention. am.

The electrically conductive contact pin 100 according to the fifth embodiment is different from that of the first embodiment only in the configuration of the second connection portion 300 and the elastic portion 400, and the remaining configuration is the same. According to a fifth preferred embodiment of the present invention, the second connection part 300 includes a protrusion 330. The protrusion 330 is provided in a concavo-convex shape to enable multi-contact with the connection pad CP of the circuit board ST. The second connection part 300 is connected to the straight part 411 of the elastic part 400.

An outer wall portion 430 is provided outside the elastic portion 400. The outer wall portion 430 is provided outside the elastic portion 400. The outer wall portion 430 functions to guide the position of the elastic portion 400 when the elastic portion 400 is elastically deformed.

The outer wall portion 430 has a horizontal portion 433 that extends and bends toward the second connection portion 300 . At least one horizontal portion 433 may be formed, but the drawing shows that the horizontal portion 433 is formed on only one side.

When the second connection part 300 is pressed by the connection pad (CP) of the circuit board (ST) and falls, the function of removing the oxide film on the connection pad (CP) is not performed because the second connection part 300 is located eccentrically. becomes possible to perform. Additionally, when the second connection part 300 is further lowered, the horizontal part 433 comes into contact with the connection pad CP to form an additional current path.

An outer wall portion 430 is provided outside the elastic portion 400. The outer wall portion 430 is provided outside the elastic portion 400. The outer wall portion 430 functions to guide the position of the elastic portion 400 when the elastic portion 400 is elastically deformed.

The outer wall portion 430 includes a horizontal portion 433 that extends and bends toward the second connection portion 300 . At least one horizontal portion 433 may be formed, but the drawing shows that the horizontal portion 433 is formed on only one side.

When the second connection part 300 is pressed by the connection pad (CP) of the circuit board (ST) and falls, the function of removing the oxide film on the connection pad (CP) is not performed because the second connection part 300 is located eccentrically. becomes possible to perform. Additionally, when the second connection part 300 is further lowered, the horizontal part 433 comes into contact with the connection pad CP to form an additional current path.

Embodiment 6

Next, we will look at the sixth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 14, the electrically conductive contact pin 100 according to the sixth preferred embodiment of the present invention will be described. Figure 14 is a plan view showing an electrically conductive contact pin 100 according to a sixth preferred embodiment of the present invention.

The electrically conductive contact pin 100 according to the sixth embodiment has a main body portion ( There is a difference from the configuration of the electrically conductive contact pin 100 according to the first embodiment, which is coupled to the 200) without elasticity.

The electrically conductive contact pin 100 according to the sixth embodiment is provided between the first connection part 210, the main body 200, the second connection part 300, and the first connection part and the main body 200. It includes a lower elastic part 600 and an elastic part 400 provided between the second connection part 300 and the main body 200.

The lower elastic portion 600 is formed by alternately connecting lower straight portions 611 and lower curved portions 613. The lower straight portion 611 connects the lower curved portions 613 adjacent to the left and right, and the lower curved portion 613 connects the lower straight portions 611 adjacent to the top and bottom. The lower curved portion 613 is provided in an arc shape. A lower straight portion 611 is disposed at the center of the lower elastic portion 600, and a lower curved portion 613 is disposed at an outer portion of the lower elastic portion 600. Meanwhile, the configuration of the lower elastic portion 600 is not limited to this, and may be provided with the configuration of the elastic portion 400 according to the second to fifth embodiments.

As the first connection part 210 is elastically coupled to the main body 200, it is possible to prevent damage to the connection pad of the inspection object during the overdrive process.

Side of electrically conductive contact pin 100

Referring to FIG. 15, the electrically conductive contact pin 100 according to preferred embodiments of the present invention includes a plurality of fine trenches 88 on its side. The fine trench 88 is formed by extending long from the side of the electrically conductive contact pin 100 in the thickness direction (±z direction) of the electrically conductive contact pin 100a. Here, the thickness direction (±z direction) of the electrically conductive contact pin 100 refers to the direction in which the metal filler grows during electroplating.

The fine trench 88 has a depth ranging from 20 nm to 1 μm, and its width also ranges from 20 nm to 1 μm. Here, since the fine trench 88 is caused by a pore formed during the manufacture of the anodic oxide mold, the width and depth of the fine trench 88 have values less than or equal to the diameter of the pore hole of the anodic oxide mold. Meanwhile, in the process of forming an internal space in the anodic oxide mold, some of the pores of the anodic oxide mold are crushed by the etching solution, creating a fine trench 88 having a depth greater than the diameter of the pore hole formed during anodization. may be formed at least in part.

The anodic oxide mold includes numerous pores, and an internal space is formed by etching at least a portion of the anodic oxide mold, and a metal filling is formed inside the internal space by electroplating, so that the side of the electrically conductive contact pin 100 is an anode. A fine trench 88 is formed while contacting the pores of the oxide mold.

The fine trench 88 as described above has the effect of increasing the surface area on the side of the electrically conductive contact pin 100. Through the configuration of the fine trench 88 formed on the side of the electrically conductive contact pin 100, heat generated in the electrically conductive contact pin 100 can be quickly dissipated, thereby suppressing the temperature rise of the electrically conductive contact pin 100. You can do it. In addition, through the configuration of the fine trench 88 formed on the side of the electrically conductive contact pin 100, the torsion resistance ability when the electrically conductive contact pin 100 is deformed can be improved.

As described above, although the present invention has been described with reference to preferred embodiments, those skilled in the art may modify the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the following patent claims. Alternatively, it can be carried out in modification.

100: electrically conductive contact pin 200: main body
210: first connection part 300: second connection part
400: elastic part

Claims (13)

A main body portion having a first connection portion;
second connection part; and
Including an elastic portion provided between the main body portion and the second connection portion,
An electrically conductive contact pin in which the elastic portion is elastically deformed so that the second connection portion always remains in contact with the circuit board when the electrically conductive contact pin is installed on the circuit board.
According to paragraph 1,
The elastic portion is formed by alternately connecting straight portions and curved portions,
An electrically conductive contact pin, wherein the curved portion connects the straight portions adjacent to each other above and below.
According to paragraph 1,
The elastic portion is formed by alternately connecting hollow portions and connecting portions,
The connecting portion is an electrically conductive contact pin that connects each hollow portion to each other.
According to paragraph 1,
An electrically conductive contact pin, wherein the second connection portion includes a ring-shaped connection portion having a hollow interior.
According to paragraph 1,
An electrically conductive contact pin comprising an outer wall portion provided outside the elastic portion and guiding the position of the elastic portion when the elastic portion elastically deforms.
According to paragraph 1,
An electrically conductive contact pin further comprising a lower elastic portion provided between the first connection portion and the main body portion.
According to paragraph 1,
The main body portion has a length in the longitudinal direction, a width in the transverse direction, and a thickness in a direction perpendicular to the longitudinal and transverse directions,
An electrically conductive contact pin, wherein the elastic portion has a thickness equal to the thickness of the main body portion.
According to paragraph 1,
The electrically conductive contact pin is formed by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin.
According to paragraph 1,
The elastic portion is primarily compressed and deformed in a state in which the electrically conductive contact pin is installed on the circuit board side, so that the second connection portion is maintained in contact with the connection pad of the circuit board, and the inspection object is connected to the second connection portion. An electrically conductive contact pin that undergoes secondary compressive deformation when its contact pads come into contact.
According to paragraph 1,
The main body portion includes a locking protrusion larger than the guide hole to prevent passage through the guide hole of the guide plate, and the elastic portion is located on an upper portion of the locking protrusion.
An electrically conductive contact for inspecting the inspection object, including a main body portion having a first connection portion in contact with the inspection object, a second connection portion in contact with a circuit board, and an elastic portion provided between the main body portion and the second connection portion. pin; and
Including a guide plate having a guide hole into which the electrically conductive contact pin is inserted,
An inspection device in which the elastic portion is elastically deformed so that the second connection portion always remains in contact with the connection pad of the circuit board while the electrically conductive contact pin is installed on the circuit board side.
According to clause 11,
The guide plate is,
upper guide plate; and
Including a lower guide plate provided to be spaced apart from the upper guide plate,
The elastic portion is located between the upper guide plate and the circuit board.
According to clause 11,
The distance (d1) from the upper part of the guide plate before installing the electrically conductive contact pin to the circuit board side to the end of the second connection portion is the distance d1 from the guide plate after installing the electrically conductive contact pin to the circuit board side. An inspection device that is greater than the separation distance (d2) between the connection pads of the circuit board.

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