KR20230049214A - The Electro-conductive Contact Pin and Testing Device Having The Same - Google Patents

Abstract

The present invention provides an electrically conductive contact pin that prevents application of excessive pressure to a connection object in contact with the electrically conductive contact pin by including an elastic part at an end of the electrically conductive contact pin and a testing device including the same.

Description

The Electro-conductive Contact Pin and Testing Device Having The Same

The present invention relates to an electrically conductive contact pin and a testing device having the same.

1 is a diagram schematically illustrating a probe card 1 according to the prior art.

In general, the probe card 1 includes a circuit board 2, a space converter 3 provided on the lower side of the circuit board 2, and a probe head 7 provided on the lower side of the space converter 3. do.

The probe head 7 includes guide plates 5 and 6 having a plurality of probe pins 7 and guide holes into which the probe pins 7 are inserted. The probe head 7 includes an upper guide plate 5 and a lower guide plate 6, and the upper guide plate 5 and the lower guide plate 6 are fixedly installed through a spacer. The probe pin 7 has a structure that is elastically deformed between the upper guide plate 5 and the lower guide plate 6, and adopts such a probe pin 7 to configure the vertical probe card 1.

In the electrical property test of a semiconductor device, a semiconductor wafer (W) is approached to a probe card (1) formed with a plurality of probe pins (7), and each probe pin (7) is placed on a corresponding object (semiconductor wafer (W)). It is performed by contacting the electrode pad (WP).

On the other hand, in recent LSI chip inspections, there are cases in which high-frequency currents are passed. However, when a gap between the probe pin 7 and the space converter 3 or between the probe pin 7 and the object to be inspected occurs, a spark occurs, and the spark causes the probe pin 7 and the object to be connected to There is a problem of breakage.

Registration No. 10-1913355 Registered Patent Publication

The present invention has been made to solve the above-mentioned problems of the prior art, and the present invention is an electrically conductive contact capable of preventing sparks from occurring by keeping at least one end of an electrically conductive contact pin always in contact with an object to be connected. Its object is to provide a pin and an inspection device having the same.

In addition, the present invention provides an electrically conductive contact pin that prevents excessive pressure from being applied to a connection object in contact with the electrically conductive contact pin by including an elastic part on at least one end of the electrically conductive contact pin and a test device including the same. The purpose.

In order to achieve the object of the present invention, a testing device according to the present invention includes: an electrically conductive contact pin having one end in contact with a connection pad of the testing device and the other end in contact with a connection pad of an inspection object to inspect the inspection object; and a guide plate having guide holes into which the electrically conductive contact pins are inserted, wherein the one end is compressed and deformed by being pressed by a connection pad of the test device in a state in which the guide plate is installed on the test device side. The one end is provided with an elastic part between the guide plate and the connection pad of the inspection device so that the one end always maintains a contact state with the connection pad of the inspection device.

In addition, the guide plate, the upper guide plate; and a lower guide plate spaced apart from the upper guide plate, wherein the electrically conductive contact pin is elastically deformed in a lateral direction between the upper guide plate and the lower guide plate.

In addition, the electrically conductive contact pin has a length in the longitudinal direction, a width in the transverse direction, and a thickness in directions perpendicular to the longitudinal and transverse directions, and the thickness of one end including the elastic portion is the same as the above except for the elastic portion. It is the same as the thickness of the rest of the electrically conductive contact pins.

In addition, the elastic part is a sealed elastic part having an inner space penetrating in the thickness direction and composed of a pillar part entirely surrounding the inner space.

In addition, the elastic part is an open type elastic part composed of a pillar part having an inner space penetrating in a thickness direction and having an upper or side portion cut to partially surround the inner space.

On the other hand, in the electrically conductive contact pin according to the present invention, one end is in contact with the connection pad of the testing device and the other end is in contact with the connection pad of the inspection object to inspect the inspection object, wherein the electrically conductive contact pin In the state where the pin is installed on the side of the inspection device, the one end is compressed and deformed by being pressed by the connection pad of the inspection device, so that the one end is always in contact with the connection pad of the inspection device, and the one end is connected to the guide plate. An elastic part is provided between the connection pads of the inspection device.

In addition, the one end is composed of a sealed elastic part provided with an inner space.

In addition, the one end portion is composed of a sealed elastic portion provided with an inner space and a contact plane portion composed of a flat surface on the upper portion of the elastic portion.

In addition, the one end is composed of an elastic part provided with an inner space but having an upper portion cut and having at least two or more contact portions.

In addition, the one end portion is composed of an elastic portion having an inner space and having an upper portion cut so that at least two or more contact portions are provided, and a contact plane portion formed as a flat surface on the upper portion of the elastic portion.

In addition, the one end portion is composed of an elastic portion having an inner space and having a cut side portion.

In addition, the one end portion includes a locking jaw formed larger than the size of the guide hole to prevent the end portion from passing through the guide hole of the guide plate, and the elastic part is located above the locking jaw.

In addition, the electrically conductive contact pin is formed by stacking a plurality of metal layers in a thickness direction of the electrically conductive contact pin.

In addition, the electrically conductive contact pin includes a fine trench provided on its side surface.

The present invention provides an electrically conductive contact pin capable of preventing sparks from occurring by keeping at least one end of the electrically conductive contact pin always in contact with an object to be connected, and a testing device having the same.

In addition, the present invention provides an electrically conductive contact pin that prevents application of excessive pressure to a connection object in contact with the electrically conductive contact pin by including an elastic part on at least one end of the electrically conductive contact pin and a testing device including the same.

1 is a view schematically showing a probe card according to the prior art;
Fig. 2 shows a probe head equipped with electrically conductive contact pins according to a first preferred embodiment of the present invention;
3 shows an electrically conductive contact pin according to a first preferred embodiment of the present invention;
4 and 5 show modified examples of the elastic part of the electrically conductive contact pin according to the first preferred embodiment of the present invention.
Figure 6 shows an electrically conductive contact pin according to a second preferred embodiment of the present invention.
Fig. 7 shows a modified example of an elastic part of an electrically conductive contact pin according to a second preferred embodiment of the present invention;
Figure 8 shows an electrically conductive contact pin according to a third preferred embodiment of the present invention.
Figure 9 shows an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
Figure 10 shows an electrically conductive contact pin according to a fifth preferred embodiment of the present invention.
Figure 11 shows an electrically conductive contact pin according to a sixth preferred embodiment of the present invention.
12 is a view for explaining a method of manufacturing an electrically conductive contact pin according to a preferred embodiment of the present invention.
13 is a side view of an electrically conductive contact pin according to a preferred embodiment of the present invention.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art can invent various devices that embody the principles of the invention and fall within the concept and scope of the invention, even though not explicitly described or shown herein. In addition, it should be understood that all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of making the concept of the invention understood, and are not limited to such specifically listed embodiments and conditions. .

The above objects, features and advantages will become more apparent through the following detailed description in conjunction with the accompanying drawings, and accordingly, those skilled in the art to which the invention belongs will be able to easily implement the technical idea of the invention. .

Embodiments described in this specification will be described with reference to sectional views and/or perspective views, which are ideal exemplary views of the present invention. Films and thicknesses of regions shown in these drawings are exaggerated for effective description of technical content. The shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes. Technical terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "comprise" or "comprise" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in this specification, but one or more other It should be understood that it does not preclude the possibility of addition or existence of features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of various embodiments, the same names and the same reference numbers will be given to components performing the same functions even if the embodiments are different. In addition, configurations and operations already described in other embodiments will be omitted for convenience.

The electrically conductive contact pins according to each preferred embodiment of the present invention are provided in a test device for checking whether an object to be tested is defective by applying electricity and electrically and physically contact with the object to be tested to transmit an electrical signal. It may be a contact pin. The inspection device may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket. The electrically conductive contact pins may be probe pins provided in a probe card to inspect a semiconductor chip, or socket pins provided in a test socket to inspect a packaged semiconductor package to inspect a semiconductor package.

Hereinafter, the first to sixth embodiments are separately described, but embodiments in which configurations of each embodiment are combined are also included in the preferred embodiment of the present invention.

The width direction of the electrically conductive contact pin described below is the ±x direction indicated in the drawing, the length direction of the electrically conductive contact pin is the ±y direction indicated in the drawing, and the thickness direction of the electrically conductive contact pin is the ±z direction indicated in the drawing. am. The electrically conductive contact pin has an overall length dimension L in the longitudinal direction (±y direction), an overall thickness dimension H in the thickness direction (±z direction) perpendicular to the longitudinal direction, and It has an overall width dimension (W) in the width direction (±x direction).

Example 1

Hereinafter, an electrically conductive contact pin 100 according to a first preferred embodiment of the present invention will be described with reference to FIGS. 2 and 3 .

A probe card according to a preferred embodiment of the present invention is used in an inspection process of inspecting a chip fabricated on a wafer during a semiconductor manufacturing process, and is capable of responding to micrometers. A probe card according to a preferred embodiment of the present invention is more useful for testing non-memory semiconductor chips such as microprocessors, microcontrollers, and ASICs.

A probe card according to a preferred embodiment of the present invention includes a space converter (ST) having a connection pad (CP); Guide plates (GP1, FP2) provided spaced apart from the space converter (ST) below the space converter (ST); and probe pins 100 installed by being inserted into the holes of the guide plates GP1 and GP2.

The guide plate includes an upper guide plate GP1 and a lower guide plate GP2 provided to be spaced apart from the upper guide plate GP1. The electrically conductive contact pins 100 are inserted into the guide holes of the upper guide plate GP1 and the guide holes of the lower guide plate GP2. The electrically conductive contact pin 100 is elastically deformed in the lateral direction (x direction) between the upper guide plate GP1 and the lower guide plate GP2.

The pitch interval between the probe pins 100 disposed on the guide plates GP1 and GP2 may be 50 μm or more and 150 μm or less, the left and right widths of the probe pins 100 are 40 μm or more and 200 μm or less, and the probe pins 100 may be 40 μm or more and 200 μm or less. The thickness of (100) may be 40 μm or more and 200 μm or less.

One end of the electrically conductive contact pin 100 is connected to the connection pad CP of the test device (space converter ST), and the other end of the electrically conductive contact pin 100 is connected to the connection pad of the test object. Here, the inspection target may be a semiconductor device.

The electrically conductive contact pin 100 has a length L in a longitudinal direction, a width W in a transverse direction, a thickness H in a direction perpendicular to the longitudinal and transverse directions, and an elastic portion 110a. The thickness H of one end including the is the same as the thickness H of the rest of the electrically conductive contact pin 100 excluding the elastic portion 110a.

The electrically conductive contact pin 100 includes a body 150. The body 150 causes the electrically conductive contact pins 100 to be elastically deformed in the lateral direction, and serves to form a current path between connection objects (testing device and test object). The body 150 includes at least one bent portion 155 . Through the configuration of the bent portion 155, the body 150 can be deformed in the lateral direction.

One end of the electrically conductive contact pin 100 has an elastic portion 110a. More specifically, an elastic part 110a is provided on one side of the body 150 .

One end of the electrically conductive contact pin 100 has an elastic part 110a between the guide plate GP1 and the connection pad CP of the testing device, thereby buffering it when in contact with the connection pad CP of the testing device, and In a state where the conductive contact pin 100 is installed on the test device side, one end is compressed and deformed by being pressed by the contact pad CP of the test device, so that one end always maintains contact with the test device connection pad CP. do.

The electrically conductive contact pin 100 is provided by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin 100 . The plurality of metal layers include a first metal layer 160 and a second metal layer 180 . The first metal layer 160 is a metal having relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), or nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn ), a nickel-cobalt (NiCo) or a nickel-tungsten (NiW) alloy. The second metal layer 180 is a metal having relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof. It can be.

The first metal layer 160 is provided on the bottom and top surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160 . For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of layers to be stacked is three or more. It can be.

The first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the elastic part 110a. When the elastic part 110a contacts the object to be connected, the first metal layer 160 and the second metal layer 180 are simultaneously contacted with the object to be connected, so that high wear resistance and electrical conductivity can be secured at the contact portion.

The body 150 of the electrically conductive contact pin 100 is formed to a size capable of passing through the guide holes of the guide plates GP1 and GP2. The body 150 of the electrically conductive contact pin 100 has a rectangular cross section, and the guide holes of the guide plates GP1 and GP2 also have a rectangular cross section. Through this, after the electrically conductive contact pin 100 is inserted into the guide hole, the electrically conductive contact pin 100 does not rotate in the guide hole, so that the bending direction of the plurality of electrically conductive contact pins 100 is kept constant. Let it be.

The lower part of the elastic part 110a is a locking jaw formed larger than the size of the guide hole to prevent one end of the electrically conductive contact pin 100 from passing through the guide hole of the guide plate (more specifically, the upper guide plate GP1). 130).

The locking protrusion 130 protrudes in the width direction from at least one of both side surfaces of the body 150 of the electrically conductive contact pin 100 . The hooking jaw 130 is caught on the upper surface of the guide plate (more specifically, the upper guide plate GP1) to prevent the electrically conductive contact pin 100 from falling from the upper guide plate GP1.

The length of the plurality of electrically conductive contact pins 100 is different due to errors in the manufacturing process, and the flatness of the guide plates GP1 and GP2 and the space converter ST is slightly different, and the connection pads CP are also slightly different. There is always a difference in height. Therefore, in order to ensure good electrical and mechanical contact to all the electrically conductive contact pins 100, the electrically conductive contact pins 100 must be installed while being pressed toward the testing device. In a state where the guide plates GP1 and GP2 on which the electrically conductive contact pins 100 are installed are installed on the testing device side, the elastic portion 110a of the electrically conductive contact pin 100 adheres closely to the connection pad CP of the testing device. and pressurized to compressively deform. Through this, since the ends of all the electrically conductive contact pins 100 are always in contact with the connection pads CP of the inspection device, it is possible to prevent sparks from occurring.

The elastic part 110a is a sealed elastic part having an inner space penetrating in the thickness direction and composed of a pillar part entirely surrounding the inner space. The closed elastic part has a structure that is elastically deformed when there is a contact pressure with the object to be connected.

The elastic part 110a has a circular or elliptical cross-sectional shape. The elastic part 110a is configured in the shape of a column in the thickness direction, so that even when excessive contact pressure is applied, the elastic part 110a can be prevented from being damaged. In addition, the first metal layer 160 and the second metal layer 180 are provided alternately on the column surface of the circular column, so that high abrasion resistance and high electrical conductivity of the elastic part 110a can be secured.

Looking at the assembly process of the probe card having the electrically conductive contact pins 100 according to the first preferred embodiment of the present invention, first, the electrically conductive contact pins 100 are inserted into the guide plates GP1 and GP2 to form a probe head. Assemble. At this time, since the body 150 of the electrically conductive contact pin 100 is smaller than the guide hole, the electrically conductive contact pin 100 passes through the guide hole and the locking jaw 130 is caught on the upper surface of the upper guide plate GP1 so that the electrically conductive contact pin 100 moves through the guide plate. (GP1, GP2) does not drop out. Then, fix the probe head to the space converter (ST) side. At this time, the elastic part 110a of the electrically conductive contact pin 100 comes into contact with the connection pad CP of the space converter ST so that the elastic part 110a is elastically deformed. As the elastic part 110a is elastically supported while in contact with the connection object, one end of the plurality of electrically conductive contact pins 100 always maintains contact with the connection pad of the space converter ST. In the state in which the above assembling process is completed, the inspection object is placed on the lower end of the electrically conductive contact pin 100 to inspect the inspection object.

4 and 5 are diagrams showing modified examples of the elastic part 110a of the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention.

Referring to FIG. 4A, the elastic part 110b shown in FIG. 4A is configured so that at least a part of the inner space of the elastic part 110b is provided at a position overlapping with the position of the locking jaw 130. There is a difference from the configuration of the elastic part (110a) shown in Figure 3. Through this, it is possible to exert an effect of preventing damage due to deformation of the elastic part 110d by preventing a stress concentration phenomenon.

Referring to FIG. 4B, the elastic part 110c shown in FIG. 4B is configured such that at least a part of the inner space of the elastic part 110c overlaps with the position of the locking jaw 130, and elasticity. There is a difference from the configuration of the elastic portion 110a shown in FIG. 3 in that the configuration includes a thick portion that makes the side surface of the portion 110c thicker. Through this, it is possible to exert an effect of preventing damage due to deformation of the elastic part 110d by preventing a stress concentration phenomenon.

Referring to FIG. 4C , the elastic part 110d shown in FIG. 4C is different from the elastic part 110a shown in FIG. 3 in that it is composed of a plurality of closed pillar parts. The cross-sectional shapes of the plurality of closed pillar parts may be the same or different from each other. Through this, it is possible to exert an effect of preventing damage due to deformation of the elastic part 110d by preventing a stress concentration phenomenon.

Referring to FIG. 5A, the elastic part 110e shown in FIG. 5A is different from the structure of the elastic part 110a shown in FIG. 3 in that the inner space is in the form of a triangle and the shape of the closed pillar part is formed in a triangle. there is

Referring to FIG. 5B, the elastic part 110f shown in FIG. 5B has a structure of the elastic part 110a shown in FIG. 3 in that the inner space is in the form of a rhombus and the shape of the closed pillar part is configured in a diamond shape. There is a difference with

Referring to FIG. 5C, the elastic part 110g shown in FIG. 5C is different from the elastic part 110a shown in FIG. 3 in that the inner space is formed in a semicircular shape so that the shape of the sealed column part is formed in a semicircular shape. there is

The modified example of the elastic part 110a according to the first embodiment is not limited to the elastic parts 110b, 110c, 110d, 110e, 110f, and 110g of the modified example described above, and is provided with an internal space for sealing type elastic. If it is the composition of wealth, it will be all included.

On the other hand, in the above, it has been described that one end provided with the elastic part 110a is located on the inspection device side, but as a modification thereof, a configuration in which the elastic part 110a is located on the test object side is also possible, and the elastic part 110a It is also possible to be configured to be located on both sides of the inspection device side and the inspection object side.

In addition, although a probe card is shown as an example in FIG. 2, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention is provided in a test socket for inspecting a packaged semiconductor package as well as a probe card to inspect a semiconductor package. It may be an electrically conductive contact pin 100 to be inspected.

Example 2

Next, look at the second embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.

Hereinafter, referring to FIG. 6, an electrically conductive contact pin 200 according to a second preferred embodiment of the present invention will be described. 6 is a diagram showing an electrically conductive contact pin 200 according to a second preferred embodiment of the present invention.

The electrically conductive contact pin 200 according to the second preferred embodiment of the present invention includes a sealed elastic part 210a having an inner space at one end and a contact flat part formed as a flat surface on the upper part of the sealed elastic part 210. 220, it is different from the configuration of the electrically conductive contact pin 100 according to the first embodiment in which the contact plane portion 220 is not provided.

The contact plane part 220 provided on the upper part of the sealed elastic part 210 is a part in contact with the connection pad CP of the inspection device, which is a connection object, and is configured as a plane to improve connection reliability.

The sealed elastic part 210 may be composed of the elastic parts 110a, 110b, 110c, 110d, 110e, 110f, and 110g according to the first preferred embodiment of the present invention described above.

As a few examples, FIG. 7 is a view showing a modified example of one end of an electrically conductive contact pin 200 according to a second preferred embodiment of the present invention. One end of the electrically conductive contact pin 200 shown in FIG. 7A has a structure in which a contact plane part 220 is provided on top of the sealed elastic part 110e shown in FIG. 5A. One end of the electrically conductive contact pin 200 shown in FIG. 7B has a structure in which a contact plane part 220 is provided on top of the sealed elastic part 110f shown in FIG. 5B. One end of the electrically conductive contact pin 200 shown in FIG. 7C has a structure in which a contact plane part 220 is provided on top of the sealed elastic part 110g shown in FIG. 5C.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the sealed elastic part 210 and the contact plane part 220 . When the contact plane portion 220 contacts the object to be connected, the first metal layer 160 and the second metal layer 180 are simultaneously contacted with the object to be connected, so that high wear resistance and electrical conductivity can be secured at the contact portion.

3rd embodiment

Next, look at the third embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.

Hereinafter, referring to FIG. 8, an electrically conductive contact pin 300 according to a third preferred embodiment of the present invention will be described. 8 is a diagram showing an electrically conductive contact pin 300 according to a third preferred embodiment of the present invention.

The electrically conductive contact pin 300 according to the third preferred embodiment of the present invention is composed of an open elastic part 310 having an inner space at one end and having at least two or more contact parts cut in the upper part. In this respect, there is a difference from the configuration of the electrically conductive contact pin 100 according to the first embodiment composed of the sealed elastic part 110a.

The open elastic part 310 is provided with two elastic deformable parts having an arc-shaped cross section on both sides thereof, so that it is elastically deformed and forms at least two or more contact parts, thereby improving connection reliability.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the open elastic part 310 and the contact plane part 220 . When the open elastic part 310 contacts the object to be connected, the first metal layer 160 and the second metal layer 180 are simultaneously contacted with the object to be connected, so that high wear resistance and electrical conductivity can be secured at the contact portion.

Example 4

Next, look at the fourth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.

Hereinafter, referring to FIG. 9, an electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention will be described. 9 is a diagram showing an electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention.

An electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention includes an open elastic part 410 having an inner space at one end and having at least two contact parts cut in the upper part, and an open elastic part 410. In that it is composed of the contact plane portion 420 composed of a flat surface on the upper portion of the portion 410, the electrical conductivity according to the first embodiment composed of the sealed elastic portion 110a and not provided with the contact plane portion 420 There is a difference from the configuration of the contact pin 100.

The open elastic part 410 has two elastic deformable parts having an arc shape in cross section on both sides thereof, and a contact plane part 420 is provided on the upper part of each elastic deformable part. Through this, the reliability of connection with the connection object is improved.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the open elastic part 410 and the contact plane part 420 . When the contact plane portion 420 contacts the object to be connected, the first metal layer 160 and the second metal layer 180 are simultaneously contacted with the object to be connected, so that high wear resistance and electrical conductivity can be secured at the contact portion.

Example 5

Next, look at the fifth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.

Hereinafter, referring to FIG. 10, an electrically conductive contact pin 500 according to a fifth preferred embodiment of the present invention will be described. 10 is a diagram showing an electrically conductive contact pin 500 according to a fifth preferred embodiment of the present invention.

In that the electrically conductive contact pin 500 according to the fifth preferred embodiment of the present invention is composed of an open elastic part having an inner space penetrating in the thickness direction and a pillar part partially covering the inner space by cutting the side, There is a difference from the configuration of the electrically conductive contact pin 100 according to the first embodiment composed of the sealed elastic portion 110a.

The electrically conductive contact pin 500 according to the fifth embodiment includes a front end 510 with one end in contact with a connection object, a base end 530 provided on the upper part of the body of the electrically conductive contact pin 500, and a front end ( 510) and the base end 530 are connected to each other so that the front end 510 is in elastic contact with the object to be connected, including a connection part 520, and an open elastic part composed of a pillar part partially surrounding the inner space.

The front end 510 is configured as a plane to improve the reliability of contact with the connection object.

The connecting portion 520 is formed in a structure that can be elastically deformed when the connection object presses the front end portion 510, and preferably may be provided in an arc shape having a curvature.

The base end 530 includes a first base end 530a directly connected to the connection part 520 and a second base end 530b located on the opposite side of the connection part 520 and not directly connected to the connection part 520. It consists of The first base end 530a is connected to the connection part 520 to perform a function of supporting the connection part 520 and may be configured as a plane. The first base end 530a protrudes to the right side of the body 150 of the electrically conductive contact pin 500, and the second base end 530b protrudes to the left side of the body 150 of the electrically conductive contact pin 500. The lower surfaces of each of the first base end 530a and the second base end 530b are supported on the upper surface of the upper guide plate GP1. Through this, the electrically conductive contact pins 500 are supported on the upper guide plate GP1 so that the electrically conductive contact pins 500 do not fall from the upper guide plate GP1.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the front end 510 , the connection part 520 and the base end 530 . When the front end 510 contacts the object to be connected, the first metal layer 160 and the second metal layer 180 are simultaneously contacted with the object to be connected, so that high wear resistance and electrical conductivity can be secured at the contact portion.

6th embodiment

Next, look at the sixth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.

Hereinafter, referring to FIG. 11, an electrically conductive contact pin 600 according to a sixth preferred embodiment of the present invention will be described. 11 is a diagram showing an electrically conductive contact pin 600 according to a sixth preferred embodiment of the present invention.

In that the electrically conductive contact pin 600 according to the sixth preferred embodiment of the present invention is composed of an open elastic part having an inner space penetrating in the thickness direction and a pillar part partially covering the inner space by cutting the side, There is a difference from the configuration of the electrically conductive contact pin 100 according to the first embodiment composed of the sealed elastic portion 110a.

An electrically conductive contact pin 600 according to the sixth embodiment is a cantilever composed of a base end 630 having one end provided above the body 150, one end connected to the base end 630, and the other end being a free end. It constitutes an open elastic part composed of a pillar part including the beam 610 and partially enclosing the inner space.

The base end portion 630 includes a portion protruding from one side of the body 150, and the protruding portion is supported on the upper surface of the upper guide plate GP1 so that the electrically conductive contact pin 600 is removed from the upper guide plate GP1. It performs the function of the jamming jaw to prevent it from happening.

The cantilever beam 610 has a structure that is elastically deformed upon contact with a connection object, and one end is connected to the base end 630 at one side of the base end 630 based on the width direction of the base end 630 and the other end is connected to the base end 630 It is configured in a form extending toward the other side of.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the base end 630 and the cantilever beam 610 . When the cantilever beam 610 contacts the object to be connected, the first metal layer 160 and the second metal layer 180 are simultaneously contacted with the object to be connected, so that high wear resistance and electrical conductivity can be secured at the contact portion.

manufacturing method

Hereinafter, a manufacturing method of the electrically conductive contact pins 100, 200, 300, 400, 500, and 600 according to preferred embodiments of the present invention will be described with reference to FIG. 12 . However, the electrically conductive contact pin 100 shown in FIG. 12 is an example of the electrically conductive contact pin 100 according to the first embodiment, and the electrically conductive contact pins 200, 300, and 400 according to other embodiments , 500, 600) are also manufactured by the same manufacturing method as the manufacturing method described below.

Referring to FIG. 12, a method of manufacturing an electrically conductive contact pin 100 according to a preferred embodiment of the present invention will be described.

FIG. 12A is a plan view of the mold M in which the etching space IH is formed, and FIG. 12B is a cross-sectional view taken along line A-A' of FIG. 8A. The mold M may be made of an anodic oxide film, photoresist, silicon wafer or similar material. However, the mold M according to a more preferred embodiment of the present invention may be made of an anodic oxide film material. Therefore, the electrically conductive contact pin 100 according to a preferred embodiment of the present invention has an effect exerted by being manufactured using the mold M made of an anodic oxide film in addition to the effect exhibited by the structural advantage. Hereinafter, as a preferable mold (M), the mold (M) made of anodized film material will be described as a standard.

The anodic oxide film means a film formed by anodic oxidation of a base metal, and the pore means a hole formed in the process of forming an anodic oxide film by anodic oxidation of a metal. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base metal is anodized, an anodized film made of aluminum oxide (Al ₂ O ₃ ) is formed on the surface of the base metal. However, the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof. The anodic oxide film formed as above is a barrier layer without pores formed vertically therein. And, it is divided into a porous layer in which pores are formed. In the base material on which the anodic oxide film having the barrier layer and the porous layer is formed, when the base material is removed, only the anodic oxide film made of aluminum oxide (Al ₂ O ₃ ) remains. The anodic oxidation film may be formed in a structure in which the barrier layer formed during anodic oxidation is removed to pass through the upper and lower pores, or in a structure in which the barrier layer formed during anodic oxidation remains as it is and seals one end of the upper and lower portions of the pores.

The anodic oxide film has a thermal expansion coefficient of 2 to 3 ppm/°C. Due to this, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, the electrically conductive contact pin 100 can be manufactured accurately without thermal deformation even in a high-temperature environment in which the electrically conductive contact pin 100 is manufactured.

Since the electrically conductive contact pin 100 according to a preferred embodiment of the present invention is manufactured using a mold M made of anodized film instead of a mold M made of photoresist, the mold M made of photoresist It is possible to exert the effect of realizing the precision of the shape and the fine shape, which were limited in implementation. In addition, in the case of the existing photoresist mold (M), it is possible to manufacture an electrically conductive contact pin with a thickness of 40 μm, but in the case of using the mold (M) made of anodized film, a thickness of 40 μm or more to 200 μm or less The electrically conductive contact pin 100 can be manufactured.

A seed layer SL is provided on the lower surface of the mold M. The seed layer SL may be provided on a lower surface of the mold M before forming the etching space IH in the mold M. Meanwhile, a support substrate (not shown) is formed under the mold M to improve handling of the mold M. Also, in this case, the seed layer SL is formed on the upper surface of the support substrate and the mold M in which the etching space IH is formed may be coupled to the support substrate and used. The seed layer SL may be formed of a copper (Cu) material and may be formed by a deposition method.

The etching space IH may be formed by wet etching a partial area of the mold M made of an anodic oxide film. To this end, a photoresist is provided on the upper surface of the mold M and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form an etching space IH.

Then, an electroplating process is performed on the etching space IH of the mold M to form the electrically conductive contact pins 100 . FIG. 12c is a plan view illustrating an electroplating process performed on the etching space IH, and FIG. 12d is a cross-sectional view A-A′ of FIG. 12c.

Since the metal layer is formed while growing in the thickness direction of the mold M, the shape of each cross section in the thickness direction of the electrically conductive contact pin 100 is the same. In addition, a plurality of metal layers are stacked in the thickness direction of the electrically conductive contact pin 100 . The plurality of metal layers include a first metal layer 160 and a second metal layer 180 . The first metal layer 160 is a metal having relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), or nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn ), a nickel-cobalt (NiCo) or a nickel-tungsten (NiW) alloy. The second metal layer 180 is a metal having relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof. It can be.

The first metal layer 160 is provided on the bottom and top surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160 . For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of layers to be stacked is three or more. It can be.

Meanwhile, after the plating process is completed, the first metal layer 160 and the second metal layer 180 may be made more dense by raising the temperature to a high temperature and pressing the metal layer on which the plating process is completed by applying pressure. When a photoresist material is used as the mold M, a process of heating to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layer after the plating process is completed. Unlike this, according to a preferred embodiment of the present invention, since the mold M made of the anodic oxide film is provided around the metal layer on which the plating process is completed, even if the temperature is raised to a high temperature, the deformation is minimized due to the low thermal expansion coefficient of the anodic oxide film. It is possible to densify the first metal layer 160 and the second metal layer 180 . Therefore, it is possible to obtain a higher density first metal layer 160 and second metal layer 180 compared to a technique using a photoresist as a mold M.

When the electroplating process is completed, a process of removing the mold M and the seed layer SL is performed. When the mold M is made of an anodic oxide film material, the mold M is removed using a solution that selectively reacts to the anodic oxide film material. Also, when the seed layer SL is made of copper (Cu), the seed layer SL is removed using a solution that selectively reacts with copper (Cu).

According to the technique of manufacturing a fin by electroplating using a photoresist as a mold M, it is difficult to make the height of the mold M sufficiently high with only a single layer of photoresist. As a result, the thickness of the electrically conductive contact pin 100 cannot be made sufficiently thick either. The electrically conductive contact pin 100 needs to be manufactured to have a predetermined thickness or more in consideration of electrical conductivity, restoring force and brittle fracture. In order to increase the thickness of the electrically conductive contact pins 100, a mold M in which photoresists are stacked in multiple stages may be used. However, in this case, since each layer of the photoresist is finely stepped, the side surface of the electrically conductive contact pin 100 is not formed vertically, and a slightly stepped area remains. In addition, when the photoresist is laminated in multiple layers, it is difficult to precisely reproduce the shape of the electrically conductive contact pin 100 having a size range of several to several tens of μm or less. In particular, the mold M made of photoresist material has a photoresist between its inner space and the inner space. When the width of the photoresist provided between the inner spaces is 15 μm or less, the photoresist is not properly formed, In particular, when the height compared to the width is large, a problem arises in that the standing state of the photoresist at the corresponding position is not properly maintained.

Referring to FIG. 13 , an electrically conductive contact pin 100 according to a preferred embodiment of the present invention includes a fine trench 88 formed on its side surface. On the side surface of the electrically conductive contact pin 100, peaks and valleys with a depth of 20 nm or more and 1 μm or less are repeated along the side surface of the electrically conductive contact pin 100 in a direction perpendicular to the thickness direction of the electrically conductive contact pin 100. A fine trench 88 having a corrugated shape is formed.

The fine trench 88 is formed to elongate in the thickness direction of the electrically conductive contact pin 100 from the side of the electrically conductive contact pin 100 . In other words, the extension direction of the peaks and valleys of the fine trench 88 becomes the thickness direction of the electrically conductive contact pin 100 . Here, the thickness direction of the electrically conductive contact pin 100 means a direction in which metal fillers grow during electroplating.

On the side of the plate-shaped plate constituting the electrically conductive contact pin 100, the fine trench 88 is configured in a corrugated form in which peaks and valleys are repeated in a direction perpendicular to the thickness direction of the plate-shaped plate.

The fine trench 88 has a depth of 20 nm or more and 1 μm or less, and a width of 20 nm or more and 1 μm or less. Here, since the fine trench 88 is due to the pores formed during the manufacture of the anodic oxide film mold M, the width and depth of the fine trench 88 have a value less than the range of the diameter of the pore of the anodic oxide film mold M. . On the other hand, in the process of forming the etching space (IH) in the anodic oxide film mold (M), some of the pores of the anodic oxide film mold (M) are crushed together by the etching solution, and a range larger than the range of diameters of the pores formed during anodic oxidation At least a portion of the fine trench 88 having a depth of ? may be formed.

The anodic oxide film mold (M) includes numerous pores, and at least a portion of the anodic oxide film mold (M) is etched to form an etching space (IH), and an electrically conductive contact pin (100) is electroplated into the etching space (IH). ), the side surface of the electrically conductive contact pin 100 is provided with a fine trench 88 formed while contacting the pores of the anodic oxide film mold M.

Since the fine trench 88 as described above has a corrugated shape in which peaks and valleys with a depth of 20 nm or more and 1 μm or less are repeated in a direction perpendicular to the thickness direction, the surface area on the side surface of the electrically conductive contact pin 100 can be increased. have a possible effect. The density of the current flowing along the electrically conductive contact pin 100 by increasing the surface area through which the current flows according to the skin effect through the configuration of the micro trench 88 formed on the side surface of the electrically conductive contact pin 100. is increased to improve electrical characteristics (particularly, high-frequency characteristics) of the electrically conductive contact pin 100 . In addition, since the heat generated from the electrically conductive contact pins 100 can be quickly dissipated through the configuration of the micro trenches 88, the temperature rise of the electrically conductive contact pins 100 can be suppressed.

As described above, although it has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. Or it can be carried out by modifying.

100: electrically conductive contact pin 110a: elastic part
130: locking jaw 150: body
155: bent portion 160: first metal layer
180: second metal layer

Claims (14)

an electrically conductive contact pin having one end in contact with the connection pad of the inspection device and the other end in contact with the connection pad of the inspection object to inspect the inspection object; and
A guide plate having guide holes into which the electrically conductive contact pins are inserted;
In a state in which the guide plate is installed on the side of the inspection device, the one end portion is compressed and deformed by being pressed by the connection pad of the inspection device, so that the one end portion always maintains a contact state with the connection pad of the inspection device. An inspection apparatus comprising an elastic part between a plate and a connection pad of the inspection apparatus.
According to claim 1,
The guide plate,
upper guide plate; and
Including; lower guide plate provided spaced apart from the upper guide plate,
wherein the electrically conductive contact pin is elastically deformed in a lateral direction between the upper guide plate and the lower guide plate.
According to claim 1,
the electrically conductive contact pin has a length in a longitudinal direction, a width in a transverse direction, and a thickness in directions perpendicular to the longitudinal and transverse directions;
A thickness of one end including the elastic portion is the same as a thickness of the rest of the electrically conductive contact pin excluding the elastic portion.
According to claim 3,
The elastic part is a sealed elastic part having an inner space penetrating in a thickness direction and composed of a pillar part entirely surrounding the inner space.
According to claim 3,
The elastic part is an open type elastic part composed of a pillar part having an inner space penetrating in the thickness direction and having a top or side portion cut to partially surround the inner space.
An electrically conductive contact pin for inspecting an object to be inspected by having one end in contact with a connection pad of a testing device and the other end in contact with a connection pad of an object to be inspected,
In a state where the electrically conductive contact pin is installed on the testing device side, the one end portion is compressed and deformed by being pressed by the connecting pad of the testing device, so that the one end portion always maintains a contact state with the connecting pad of the testing device. An electrically conductive contact pin having an elastic part between the guide plate and the connection pad of the test device.
According to claim 6,
The electrically conductive contact pin, wherein the one end is composed of a sealed elastic part with an inner space.
According to claim 6,
The electrically conductive contact pin, wherein the one end portion is composed of a sealed elastic portion having an inner space and a contact flat portion formed as a flat surface on an upper portion of the elastic portion.
According to claim 6,
The electrically conductive contact pin, wherein the one end is composed of an elastic part having an inner space and having an upper portion cut away and having at least two or more contact portions.
According to claim 6,
The electrically conductive contact pin, wherein the one end portion is composed of an elastic part having an inner space and having at least two or more contact parts provided with an upper portion cut out and a contact plane part formed of a flat surface on the upper part of the elastic part.
According to claim 6,
The electrically conductive contact pin, wherein the one end is composed of an elastic part having an inner space and having a cut side.
According to claim 6,
The electrically conductive contact pin of claim 1 , wherein the one end portion includes a locking jaw formed larger than the size of the guide hole to prevent the end portion from passing through the guide hole of the guide plate, and wherein the elastic part is positioned above the locking jaw.
According to claim 6,
The electrically conductive contact pin is formed by stacking a plurality of metal layers in a thickness direction of the electrically conductive contact pin.
According to claim 6,
The electrically conductive contact pin includes a fine trench provided on a side surface thereof.

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