KR102686699B1 - PCB bonding device using COF mark - Google Patents
PCB bonding device using COF mark Download PDFInfo
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- KR102686699B1 KR102686699B1 KR1020230181438A KR20230181438A KR102686699B1 KR 102686699 B1 KR102686699 B1 KR 102686699B1 KR 1020230181438 A KR1020230181438 A KR 1020230181438A KR 20230181438 A KR20230181438 A KR 20230181438A KR 102686699 B1 KR102686699 B1 KR 102686699B1
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- 230000006835 compression Effects 0.000 claims abstract description 33
- 238000007906 compression Methods 0.000 claims abstract description 33
- 238000007665 sagging Methods 0.000 claims abstract description 6
- XDIQTPZOIIYCTR-GRFIIANRSA-N [[(2r,3s,4r,5r)-5-(6-aminopurin-9-yl)-4-hydroxy-3-phosphonooxyoxolan-2-yl]methoxy-hydroxyphosphoryl] [(3r)-3-hydroxy-2,2-dimethyl-4-oxo-4-[[3-oxo-3-[2-(3,3,3-trifluoro-2-oxopropyl)sulfanylethylamino]propyl]amino]butyl] hydrogen phosphate Chemical compound O[C@@H]1[C@H](OP(O)(O)=O)[C@@H](COP(O)(=O)OP(O)(=O)OCC(C)(C)[C@@H](O)C(=O)NCCC(=O)NCCSCC(=O)C(F)(F)F)O[C@H]1N1C2=NC=NC(N)=C2N=C1 XDIQTPZOIIYCTR-GRFIIANRSA-N 0.000 claims description 21
- 238000001179 sorption measurement Methods 0.000 claims description 12
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 claims description 10
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- CEOCDNVZRAIOQZ-UHFFFAOYSA-N pentachlorobenzene Chemical compound ClC1=CC(Cl)=C(Cl)C(Cl)=C1Cl CEOCDNVZRAIOQZ-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000003702 image correction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
본 발명은 COF마크를 이용한 PCB 본딩장치에 관한 것으로서, 보다 상세하게는 디스플레이 패널과 PCB를 열압착 가본딩함에 있어서, COF 받침대를 구비하여 COF의 쳐짐을 방지할 수 있도록 하면서, 패널의 COF마크와 PCB마크를 동일한 카메라로 촬상한 후, COF의 부착형태에 따라 패널이 부착된 유닛을 위치를 보정이동하여, COF와 PCB 상호간이 정확하게 대응되는 위치에서 가본딩될 수 있도록 하는 것으로, 종래의 PCB 본딩장치와 비교하여 더욱 정확한 높은 정도의 본딩공정진행이 가능토록 하는 COF마크를 이용한 PCB 본딩장치에 관한 것이다.The present invention relates to a PCB bonding device using a COF mark. More specifically, in temporarily bonding a display panel and a PCB by thermal compression, a COF support is provided to prevent sagging of the COF, and the COF mark of the panel is maintained. After capturing the PCB mark with the same camera, the position of the unit with the panel attached is corrected and moved according to the attachment type of the COF, so that the COF and PCB can be temporarily bonded at the exact corresponding position, which is similar to conventional PCB bonding. This relates to a PCB bonding device using the COF mark that enables a more accurate and high-level bonding process compared to other devices.
Description
본 발명은 COF가 부착된 디스플레이 패널에 ACF가 부착된 PCB를 열압착 본딩 하는 장치에 관한 것으로, 고정도를 기구적으로 구현하여 개선한, COF마크를 이용한 PCB 본딩장치에 관한 것이다.The present invention relates to a device for thermocompression bonding a PCB to which an ACF is attached to a display panel to which a COF is attached, and to a PCB bonding device using a COF mark that has been improved by mechanically implementing high precision.
TCP, COF, FPC 등은 LCD 및 PCB 모듈의 배선패턴에 단자를 압착본딩함으로서 전기적으로 연결되는바, 이러한 압착본딩을 하기 위해서는 별도의 압착장치를 필요로 하게 되고, 이러한 압착장치로 캐리어를 이용해 정확한 압착위치로 이송시켜야만 한다.TCP, COF, FPC, etc. are electrically connected by crimp bonding the terminals to the wiring pattern of the LCD and PCB modules. In order to perform this crimp bonding, a separate crimp device is required, and this crimp device uses a carrier to accurately It must be transported to the pressing position.
하지만, 종래의 경우, 디스플레이 패널과 PCB를 본딩함에 있어서, 종래의 본딩설비들은 COF와 PCB를 본딩(BONDING)하는 설비임에도 불구하고, 디스플레이 패널의 패널마크와, PCB의 PCB마크를 서로 다른 각각의 카메라로 촬상 후, 위치를 보정하여 압착을 하였고, 이로 인하여 COF의 쳐짐이나 위치 등 부착상태에 따라 PCB BONDING 정도에 오차가 크게 발생하는 문제가 있었다.However, in the conventional case, in bonding the display panel and the PCB, although the conventional bonding equipment is equipment for bonding COF and PCB, the panel mark of the display panel and the PCB mark of the PCB are used for each other. After capturing images with a camera, the position was corrected and pressed, which resulted in the problem of a large error occurring in the degree of PCB bonding depending on the attachment condition such as sagging or position of the COF.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, COF와 PCB를 본딩함에 있어서, 기존처럼 패널과 PCB 각각의 마크가 아니라, 본딩대상이 되는 COF와 PCB의 각마크를 카메라로 동시 또는 순차적을 촬상하도록 장치를 구성하고, 본딩대상의 COF의 쳐짐을 방지할 수 있는 장치를 마련함으로써, PCB에 대응되도록 COF의 위치를 보정하여 열압착 가본딩 공정이 진행됨으로써, 정확하고 확실한 가압착 본딩공정이 가능토록 하는 COF마크를 이용한 PCB 본딩장치를 제공하는데 있다.The present invention was developed to solve the above problems. In bonding COF and PCB, instead of marking each panel and PCB as before, each mark on the COF and PCB that is to be bonded is simultaneously or sequentially marked with a camera. By configuring the device to capture images and providing a device that can prevent the COF of the bonding object from sagging, the position of the COF is corrected to correspond to the PCB and the thermocompression temporary bonding process is carried out, thereby ensuring an accurate and reliable temporary compression bonding process. The aim is to provide a PCB bonding device using the COF mark that makes this possible.
본 발명은 상기와 같은 문제점을 해결하기 위한 수단으로서, The present invention is a means to solve the above problems,
끝단 상면에 ACF가 부착된 PCB(10);PCB (10) with ACF attached to the upper surface of the end;
COF(30)가 일측 끝단에서 전방으로 돌출되도록 부착된 디스플레이 패널(20);A display panel (20) on which the COF (30) is attached so that it protrudes forward from one end;
상기 COF(30)의 저면이 ACF 상면에 대응되도록, 상기 PCB(10) 및 디스플레이 패널(20)을 동시에 지지하는 공급스테이지(40);a supply stage 40 simultaneously supporting the PCB 10 and the display panel 20 so that the bottom of the COF 30 corresponds to the top of the ACF;
상기 PCB(10) 상면에 이격설치되어, 상기 PCB(10)의 PCB마크(11)를 촬상하는 카메라(50);A camera 50 is installed spaced apart from the upper surface of the PCB 10 and captures the PCB mark 11 of the PCB 10;
상기 공급스테이지(40) 상면에 수평을 이루며 이격설치되되, 회전 및 전, 후, 좌, 우방향으로 이동가능하게 설치되며, 끝단에 COF 가압착 툴(62)이 구비되는 가압착 유닛(60); 으로 구성되며, A temporary compression unit (60) is installed horizontally and spaced apart from the upper surface of the supply stage (40), and is installed to be able to rotate and move in the forward, backward, left, and right directions, and is equipped with a COF temporary compression tool (62) at the end. ; It consists of
상기 가압착 유닛(60)이 공급스테이지(40) 상에 배치된 디스플레이 패널(20)을 저면에 진공흡착한 후, 상기 카메라(50)측으로 이동하여 COF(30)의 COF마크(31)가 카메라(50)에 의해 촬상되도록 함으로써,After the temporary compression unit 60 vacuum-adsorbs the display panel 20 placed on the supply stage 40 to the bottom, it moves toward the camera 50 and the COF mark 31 of the COF 30 is attached to the camera. By allowing imaging by (50),
사전에 촬상되었던 PCB마크(11)에 COF마크(31)가 대응되도록, COF(30)의 위치를 보정한 후, 끝단의 COF 가압착 툴(62)을 통해 COF(30)와 PCB(10)를 가본딩함으로서, 본딩오차가 감소되어 정확한 본딩이 가능토록 하는 것을 특징으로 한다.After correcting the position of the COF (30) so that the COF mark (31) corresponds to the PCB mark (11) that was imaged in advance, the COF (30) and the PCB (10) are bonded through the COF temporary pressing tool (62) at the end. By temporarily bonding, the bonding error is reduced to enable accurate bonding.
이상에서 살펴본 바와 같이, 본 발명은 본딩대상이 되는 COF와 PCB의 각마크를 카메라로 촬상하도록 장치를 구현하여, PCB와 COF를 촬상보정함으로서, 종래의 PCB BONDER와 비교하여 고정도(3σ±20um 이하, 정확도)의 본딩값을 얻을 수 있는 효과가 있다.As seen above, the present invention implements a device to capture images of each mark of the COF and PCB, which are bonding objects, with a camera, and performs image correction of the PCB and COF, resulting in high accuracy (3σ ± 20um) compared to the conventional PCB BONDER. There is an effect of obtaining a bonding value of (hereinafter, accuracy).
또한, 본 발명은 PCB와 COF 본딩에서 미리부착된 COF 본딩정도에 따른 오차를 줄일 수 있는 효과가 있다.Additionally, the present invention has the effect of reducing errors due to the degree of pre-attached COF bonding in PCB and COF bonding.
또한, 본 발명은 가압착을 함으로 이후 안정적인 본딩을 할 수 있는 효과가 있다.In addition, the present invention has the effect of enabling stable bonding after temporary compression.
또한, 본 발명은 종래의 PCB의 패턴 피치보다 작은 Fine Pitch Pattern 대응에 적용 할수 있는 효과가 있다.Additionally, the present invention has the effect of being applicable to the Fine Pitch Pattern, which is smaller than the pattern pitch of a conventional PCB.
도 1은 본 발명에 따른 PCB마크와 COF마크를 나타낸 일실시예의 도면.
도 2는 본 발명에 따른 본딩장치를 나타낸 일실시예의 도면.
도 3 및 도 4는 본 발명에 따른 공급스테이지를 나타낸 일실시예의 도면.
도 5 및 도 6은 본 발명에 따른 가압착 유닛을 나타낸 일실시예의 도면.
도 7은 본 발명에 따른 카메라를 나타낸 일실시예의 도면.
도 8 및 도 9는 본 발명에 따른 본딩장치의 작동순서를 나타낸 일실시예의 도면.1 is a diagram showing an embodiment of a PCB mark and a COF mark according to the present invention.
Figure 2 is a diagram showing an embodiment of a bonding device according to the present invention.
Figures 3 and 4 are diagrams of an embodiment of a supply stage according to the present invention.
Figures 5 and 6 are diagrams of an embodiment of a temporary compression unit according to the present invention.
Figure 7 is a diagram showing an embodiment of a camera according to the present invention.
Figures 8 and 9 are diagrams showing an embodiment of the operating sequence of the bonding device according to the present invention.
본 발명의 여러 실시예들을 상세히 설명하기 전에, 다음의 상세한 설명에 기재되거나 도면에 도시된 구성요소들의 구성 및 배열들의 상세로 그 응용이 제한되는 것이 아니라는 것을 알 수 있을 것이다. 본 발명은 다른 실시예들로 구현되고 실시될 수 있고 다양한 방법으로 수행될 수 있다. 또, 장치 또는 요소 방향(예를 들어 "전(front)", "후(back)", "위(up)", "아래(down)", "상(top)", "하(bottom)", "좌(left)", "우(right)", "횡(lateral)")등과 같은 용어들에 관하여 본원에 사용된 표현 및 술어는 단지 본 발명의 설명을 단순화하기 위해 사용되고, 관련된 장치 또는 요소가 단순히 특정 방향을 가져야 함을 나타내거나 의미하지 않는다는 것을 알 수 있을 것이다. 또한, "제 1(first)", "제 2(second)"와 같은 용어는 설명을 위해 본원 및 첨부 청구항들에 사용되고 상대적인 중요성 또는 취지를 나타내거나 의미하는 것으로 의도되지 않는다.Before describing the various embodiments of the present invention in detail, it will be appreciated that its application is not limited to the details of the configuration and arrangement of components described in the following detailed description or shown in the drawings. The invention may be embodied and practiced in different embodiments and carried out in various ways. Additionally, device or element orientation (e.g. “front”, “back”, “up”, “down”, “top”, “bottom”). The expressions and predicates used herein with respect to terms such as ", "left", "right", "lateral", etc. are merely used to simplify the description of the invention and related devices. Alternatively, you may notice that it does not simply indicate or imply that an element should have a particular orientation. Additionally, terms such as “first,” “second,” and the like are used herein and in the appended claims for purposes of description and are not intended to indicate or imply relative importance or intent.
본 발명은 상기의 목적을 달성하기 위해 아래의 특징을 갖는다.The present invention has the following features to achieve the above object.
이하 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하도록 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Prior to this, the terms or words used in this specification and claims should not be construed as limited to their usual or dictionary meanings, and the inventor should appropriately use the concept of terms to explain his or her invention in the best way. It must be interpreted as meaning and concept consistent with the technical idea of the present invention based on the principle of definability.
따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형 예들이 있을 수 있음을 이해하여야 한다.Accordingly, the embodiments described in this specification and the configurations shown in the drawings are only one of the most preferred embodiments of the present invention and do not represent the entire technical idea of the present invention, so at the time of filing this application, various alternatives are available to replace them. It should be understood that equivalents and variations may exist.
이하, 도 1 내지 도 9를 참조하여 본 발명의 바람직한 실시예에 따른 COF마크를 이용한 PCB 본딩장치를 상세히 설명하도록 한다.Hereinafter, a PCB bonding device using a COF mark according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 9.
본 발명에 따른 COF마크를 이용한 PCB 본딩장치(100)는 PCB(10), 디스플레이 패널(20), 공급스테이지(40), 카메라(50), 가압착 유닛(60)을 포함한다.The PCB bonding device 100 using the COF mark according to the present invention includes a PCB 10, a display panel 20, a supply stage 40, a camera 50, and a temporary compression unit 60.
상기 PCB(10)(인쇄회로기판, Printed Circuit Board)는 일측 끝단 상면에 ACF(이방 전도성 필름, Anisotropic Conductive Film)가 부착되어 있으며, The PCB (10) (Printed Circuit Board) has an ACF (Anisotropic Conductive Film) attached to the upper surface of one end,
상기 디스플레이 패널(20)은 COF(30)(Chip On Film)가 일측 끝단에서 전방으로 돌출되도록 부착되어 있다.The display panel 20 is attached so that a COF 30 (Chip On Film) protrudes forward from one end.
상기 공급스테이지(40)는 전술된 COF(30)의 저면이 ACF 상면에 대응되도록, 상기 PCB(10) 및 디스플레이 패널(20)을 동시에 지지하는 스테이지이다. The supply stage 40 is a stage that simultaneously supports the PCB 10 and the display panel 20 so that the bottom of the COF 30 described above corresponds to the top of the ACF.
이를 위한 공급스테이지(40)는, 패널공급스테이지(41), PCB백업(42)(BACK-UP), 패널고속이송부(43), COF 받침대(44)를 포함한다.The supply stage 40 for this includes a panel supply stage 41, a PCB backup 42 (BACK-UP), a high-speed panel transfer unit 43, and a COF stand 44.
상기 패널공급스테이지(41)는 디스플레이 패널(20)을 지지하며, 회전 및 전, 후, 좌, 우로 이동가능하게 설치되는 부분이며, 상기 PCB백업(42)은 패널공급스테이지(41)의 전방에 설치되어, 상기 PCB(10)가 상면에 올려지는 부분이며, 상기 패널고속이송부(43)는 상부에 설치되는 상기 패널공급스테이지(41) 및 PCB백업(42)을 좌, 우로 이동시키는 이송장치이다.The panel supply stage 41 supports the display panel 20 and is installed so that it can rotate and move forward, backward, left, and right, and the PCB backup 42 is located in front of the panel supply stage 41. It is installed and is the part where the PCB (10) is placed on the upper surface, and the panel high-speed transfer unit (43) is a transfer device that moves the panel supply stage (41) and PCB backup (42) installed at the top left and right. am.
상기 COF 받침대(44)는 전술된 패널공급스테이지(41)와 PCB백업(42) 사이에서 승, 하강 가능하도록, 상기 PCB백업(42)의 일면에 직립설치됨으로써, 상기 패널고속이송부(43)의 끝단으로 돌출되는 COF(30)의 저면을 지지하여, 상기 COF(30)가 하단으로 쳐지지않고 수평으로 배치될 수 있도록 하여, 상기 가압착 유닛(60)이 COF(30)가 펴진 상태로 진공흡착가능토록 하는 것이다. The COF stand 44 is installed upright on one side of the PCB backup 42 so that it can be raised and lowered between the panel supply stage 41 and the PCB backup 42, so that the panel high-speed transfer unit 43 By supporting the bottom of the COF (30) protruding from the end of the COF (30) so that the COF (30) can be placed horizontally without sagging to the bottom, the temporary compression unit (60) can be used to keep the COF (30) in an unfolded state. This is to enable vacuum adsorption.
또한, 상기 COF 받침대(44)의 경우, 상기 COF(30)와 접촉되는 상면이 'ㅗ'자 형태를 가짐으로서, 상기 COF(30)의 저면 일부만이 접촉지지되어, 상기 가압착 유닛(60)에 COF(30)가 진공흡착될때 COF 받침대(44)로부터 탈거가 용이토록 할 수 있음이다.In addition, in the case of the COF stand 44, the upper surface in contact with the COF 30 has a 'ㅗ' shape, so that only a portion of the bottom surface of the COF 30 is contacted and supported, and the temporary compression unit 60 When the COF (30) is vacuum adsorbed, it can be easily removed from the COF holder (44).
상기 카메라(50)는 PCB(10) 상면에 이격설치되어, 상기 PCB(10)의 PCB마크(11)를 촬상하는 것으로, 물론 좌, 우, 상, 하로 이동가능하게 설치되어 있어야 함은 당연할 것이다.The camera 50 is installed at a distance from the upper surface of the PCB 10 to capture images of the PCB mark 11 of the PCB 10. Of course, it is natural that it must be installed to be able to move left, right, up, and down. will be.
상기 가압착 유닛(60)은 공급스테이지(40) 상면에 수평을 이루며 이격설치되되, 회전 및 전, 후, 좌, 우방향으로 이동가능하게 설치되며, 끝단에 COF 가압착 툴(62)이 구비되는 장치로서, 패널흡착 플레이트(61), COF 가압착 툴(62)을 포함한다.The temporary compression unit 60 is installed horizontally and spaced apart from the upper surface of the supply stage 40, and is installed to be able to rotate and move in the forward, backward, left, and right directions, and is equipped with a COF temporary compression tool 62 at the end. The device includes a panel adsorption plate 61 and a COF temporary compression tool 62.
상기 패널흡착 플레이트(61)의 경우, 디스플레이 패널(20)이 저면에 진공흡착되도록 다수의 제1흡착부(64)가 형성되어 있으며, 회전 및 전, 후, 좌, 우 이동이 가능하게 설치되는 부분이며, 상기 COF 가압착 툴(62)은 패널흡착 플레이트(61)의 끝단에 설치되며, 저면에 COF(30)가 진공흡착되도록 제2흡착부(65)가 형성되어 있으며, 인접설치된 히터블럭(63)(HEATER BLOCK)에 의해 열압착 가압본딩이 되도록 하는 부분이다.In the case of the panel adsorption plate 61, a plurality of first adsorption parts 64 are formed on the bottom so that the display panel 20 is vacuum adsorbed, and are installed to enable rotation and movement forward, backward, left, and right. The COF temporary compression tool 62 is installed at the end of the panel adsorption plate 61, and a second adsorption part 65 is formed on the bottom to vacuum adsorb the COF 30, and a heater block installed adjacent to it. (63) This is the part that allows heat compression and pressure bonding by (HEATER BLOCK).
상기와 같은 구성을 가지는 COF마크(31)를 이용한 PCB 본딩장치는,The PCB bonding device using the COF mark 31 having the above configuration,
상기 가압착 유닛(60)이 공급스테이지(40) 상에 배치된 디스플레이 패널(20)을 저면에 진공흡착한 후, 상기 카메라(50)측으로 이동하여 COF(30)의 COF마크(31)가 카메라(50)에 의해 촬상되도록 함으로써, 사전에 촬상 또는 동시촬상되었던 PCB마크(11)에 COF마크(31)가 대응되도록, COF(30)의 위치를 보정한 후, 끝단의 COF 가압착 툴(62)을 통해 COF(30)와 PCB(10)를 가본딩함으로서, 본딩오차가 감소되어 정확한 본딩이 가능토록 하는 것이다.After the temporary compression unit 60 vacuum-adsorbs the display panel 20 placed on the supply stage 40 to the bottom, it moves toward the camera 50 and the COF mark 31 of the COF 30 is attached to the camera. After correcting the position of the COF (30) so that the COF mark (31) corresponds to the PCB mark (11) that was previously imaged or simultaneously imaged by allowing the image to be captured by (50), the COF temporary pressing tool (62) at the end ) By temporarily bonding the COF (30) and the PCB (10), the bonding error is reduced to enable accurate bonding.
이를 위한 장치의 작동순서를 설명하면 하기와 같다.The operating sequence of the device for this is described as follows.
1. 패널공급스테이지(41)의 상면에 디스플레이 패널(20)이 공급(Loading)되는데, 이때, 끝단에 부착된 COF(30)는 쳐져있는 상태가 된다.1. The display panel 20 is loaded onto the upper surface of the panel supply stage 41, and at this time, the COF 30 attached to the end is in a sagging state.
2. 공급스테이지(40)에 설치되는 COF 받침대(44)를 승강시켜, 디스플레이 패널(20)의 COF(30)를 저면을 받침으로서, COF(30)가 펴질 수 있도록 지지한다.2. The COF support 44 installed on the supply stage 40 is raised and lowered to support the bottom of the COF 30 of the display panel 20 so that the COF 30 can be unfolded.
3. 패널공급스테이지(41)의 상부에 위치되는 가압착 유닛(60)이 하강하여 COF(30)를 눌러 펴지게하며, 펴진 형상그대로 디스플레이 패널(20) 및 COF(30)를 진공흡착한다.3. The temporary compression unit 60 located at the top of the panel supply stage 41 descends and presses the COF 30 to unfold it, and vacuum-adsorbs the display panel 20 and the COF 30 in the unfolded shape.
4. 가압착 유닛(60)이 디스플레이 패널(20) 및 COF(30)를 진공흡착한 상태로 상부를 향해 이동하며 PICK-UP한다.4. The temporary compression unit 60 moves upward and picks up the display panel 20 and the COF 30 while vacuum-adsorbing the display panel 20 and the COF 30.
5. PCB백업(42) 상면에 PCB(10)가 공급되고, 상기 카메라(50)를 통해 PCB(10)의 PCB마크(11)가 촬상된다.5. The PCB (10) is supplied to the upper surface of the PCB backup (42), and the PCB mark (11) of the PCB (10) is imaged through the camera (50).
6. 가압착 UNIT이 COF(30)가 펴진 상태로 카메라(50)측으로 이동하여, 카메라(50)를 통해 COF(30)의 COF마크(31)가 촬상되도록 한다. 물론, 상기 카메라(50)를 이용한 마크 촬상의 경우, PCB마크(11)가 사전에 촬상된 후 이후에 COF마크(31)가 촬상될 수 있지만, COF마크(31) 촬상시 동시에 PCB마크(11)도 촬영되는 동시촬상 형태가 될 수도 있음이다.6. The temporary compression unit moves to the camera 50 side with the COF 30 unfolded, so that the COF mark 31 of the COF 30 is imaged through the camera 50. Of course, in the case of mark imaging using the camera 50, the COF mark 31 may be imaged later after the PCB mark 11 has been imaged in advance, but at the same time when the COF mark 31 is imaged, the PCB mark 11 ) can also be taken in the form of simultaneous imaging.
이후, PCB마크(11)를 타켓으로 가압착 UNIT이 보정(Align)동작한다.(회전, 전, 후, 좌, 우 등으로 위치보정 등)Afterwards, the temporary compression unit performs a correction (alignment) operation targeting the PCB mark (11). (Rotation, forward, backward, left, right, etc. position correction, etc.)
7. 가압착 UNIT이 위치보정(COF(30)의 위치를 보정) 후, 가압착 유닛(60)이 하강(Z축)하여, COF(30)와 PCB(10)가 상호간 열압착 가압되며 가본딩이 되도록 한다.7. After the temporary compression unit corrects the position (correction of the position of the COF (30)), the temporary compression unit (60) descends (Z-axis), and the COF (30) and the PCB (10) are thermally compressed and pressed against each other. Make sure it dings.
8. 가압착 완료 후 패널고속이송부(43)에 전달한다. 전달된 패널을 고정 후 본압고정부로 이동한다.8. After temporary compression is completed, transfer to the panel high-speed transfer unit (43). After fixing the delivered panel, it moves to the main pressure fixing part.
본 발명의 본딩장치(100)는 이러한 상기의 공정순서에 의해, 종래의 PCB BONDER와 비교하여 높은 정도의 본딩을 할 수 있고, COF마크(31)와 PCB마크(11)를 이용하여 본딩함으로서, PCB(10)와 COF(30) 본딩에서 미리부착된 COF(30) 본딩정도에 따른 오차를 줄일 수 있으며, 가압착을 함으로 안정적인 본딩을 할 수 있도록 하고, 종래의 PCB(10)의 패턴 피치보다 작은 Fine Pitch Pattern 대응에 적용 할수 있게 되는 것이다.The bonding device 100 of the present invention can achieve a high degree of bonding compared to a conventional PCB bonder by using the above process sequence, and bonds using the COF mark 31 and the PCB mark 11, In bonding the PCB (10) and the COF (30), errors depending on the degree of bonding of the pre-attached COF (30) can be reduced, and stable bonding can be achieved by temporary compression, and the pattern pitch of the conventional PCB (10) can be reduced. It can be applied to respond to small Fine Pitch Patterns.
이상과 같이, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술 사상과 아래에 기재될 특허청구범위의 균등범위 내에서 다양한 수정 및 변경이 가능함은 물론이다.As described above, although the present invention has been described with limited examples and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following will be understood by those skilled in the art to which the present invention pertains. Of course, various modifications and changes are possible within the scope of equivalence of the patent claims to be described.
10: PCB 11: PCB마크
20: 디스플레이 패널 30: COF
31: COF마크 40: 공급스테이지
41: 패널공급 스테이지 42: PCB백업
43; 패널 고속이송부 44: COF 받침대
50: 카메라 60: 가압착 유닛
61: 패널흡착플레이트 62: COF 가압착 툴
63: 히터블럭 64: 제1흡착부
65: 제2흡착부10: PCB 11: PCB mark
20: display panel 30: COF
31: COF mark 40: Supply stage
41: Panel supply stage 42: PCB backup
43; Panel high-speed transfer unit 44: COF stand
50: Camera 60: Temporary compression unit
61: Panel adsorption plate 62: COF temporary compression tool
63: heater block 64: first adsorption unit
65: Second adsorption unit
Claims (5)
COF(30)가 일측 끝단에서 전방으로 돌출되도록 부착된 디스플레이 패널(20);
상기 COF(30)의 저면이 ACF 상면에 대응되도록, 상기 PCB(10) 및 디스플레이 패널(20)을 동시에 지지하는 공급스테이지(40);
상기 PCB(10) 상면에 이격설치되어, 상기 PCB(10)의 PCB마크(11)를 촬상하는 카메라(50);
상기 공급스테이지(40) 상면에 수평을 이루며 이격설치되되, 회전 및 전, 후, 좌, 우방향으로 이동가능하게 설치되며, 끝단에 COF 가압착 툴(62)이 구비되는 가압착 유닛(60); 으로 구성되며,
상기 가압착 유닛(60)이 공급스테이지(40) 상에 배치된 디스플레이 패널(20)을 저면에 진공흡착한 후, 상기 카메라(50)측으로 이동하여 COF(30)의 COF마크(31)가 카메라(50)에 의해 촬상되도록 함으로써,
사전에 촬상 또는 동시촬상되었던 PCB마크(11)에 COF마크(31)가 대응되도록, COF(30)의 위치를 보정한 후, 끝단의 COF 가압착 툴(62)을 통해 COF(30)와 PCB(10)를 가본딩함으로서, 본딩오차가 감소되어 정확한 본딩이 가능토록 하며,
상기 공급스테이지(40)는
상기 디스플레이 패널(20)을 지지하며, 회전 및 전, 후, 좌, 우로 이동가능하게 설치되는 패널공급스테이지(41);
상기 패널공급스테이지(41)의 전방에 설치되어, 상기 PCB(10)가 상면에 올려지는 PCB백업(42);
상부에 설치되는 상기 패널공급스테이지(41) 및 PCB백업(42)을 좌, 우로 이동시키는 패널고속이송부(43); 로 이루어지며,
상기 패널공급스테이지(41)와 PCB백업(42) 사이에서 승, 하강 가능하도록, 상기 PCB백업(42)의 일면에 직립설치됨으로써, 상기 패널공급스테이지(41)의 끝단으로 돌출되는 COF(30)의 저면을 지지하여, 상기 COF(30)가 하단으로 쳐지지않고 수평으로 배치될 수 있도록 하여, 상기 가압착 유닛(60)이 COF(30)가 펴진 상태로 진공흡착가능토록 하는 COF 받침대(44); 가 구비되며,
상기 가압착 유닛(60)은
상기 디스플레이 패널(20)이 저면에 진공흡착되도록 다수의 제1흡착부(64)가 형성되어 있으며, 회전 및 전, 후, 좌, 우 이동이 가능하게 설치되는 패널흡착 플레이트(61);
상기 패널흡착 플레이트(61)의 끝단에 설치되며, 저면에 COF(30)가 진공흡착되도록 제2흡착부(65)가 형성되어 있으며, 인접설치된 히터블럭(63)에 의해 열압착 가압본딩이 되도록 하는 COF 가압착 툴(62);
로 이루어지는 것을 특징으로 하는 COF마크를 이용한 PCB 본딩장치.
PCB (10) with ACF attached to the upper surface of the end;
A display panel (20) on which the COF (30) is attached so that it protrudes forward from one end;
a supply stage 40 simultaneously supporting the PCB 10 and the display panel 20 so that the bottom of the COF 30 corresponds to the top of the ACF;
A camera 50 is installed spaced apart from the upper surface of the PCB 10 and captures the PCB mark 11 of the PCB 10;
A temporary compression unit (60) is installed horizontally and spaced apart from the upper surface of the supply stage (40), and is installed to be able to rotate and move in the forward, backward, left, and right directions, and is equipped with a COF temporary compression tool (62) at the end. ; It consists of
After the temporary compression unit 60 vacuum-adsorbs the display panel 20 placed on the supply stage 40 to the bottom, it moves toward the camera 50 and the COF mark 31 of the COF 30 is attached to the camera. By allowing imaging by (50),
After correcting the position of the COF (30) so that the COF mark (31) corresponds to the PCB mark (11) that was imaged or simultaneously imaged in advance, the COF (30) and the PCB are bonded through the COF temporary pressing tool (62) at the end. By temporarily bonding (10), the bonding error is reduced to enable accurate bonding,
The supply stage 40 is
A panel supply stage (41) that supports the display panel (20) and is installed to rotate and move forward, backward, left, and right;
A PCB backup (42) installed in front of the panel supply stage (41), on which the PCB (10) is placed on the upper surface;
A panel high-speed transfer unit (43) that moves the panel supply stage (41) and PCB backup (42) installed at the top left and right; It consists of
A COF (30) is installed upright on one side of the PCB backup (42) so that it can be raised and lowered between the panel supply stage (41) and the PCB backup (42), thereby protruding from the end of the panel supply stage (41). The COF holder 44 supports the bottom of the COF (30) so that the COF (30) can be placed horizontally without sagging to the bottom, so that the temporary compression unit (60) can vacuum adsorb the COF (30) in an unfolded state. ); is provided,
The temporary compression unit 60 is
A panel suction plate 61 having a plurality of first suction parts 64 formed on the bottom of the display panel 20 to vacuum suction, and being installed to be able to rotate and move forward, backward, left, and right;
It is installed at the end of the panel adsorption plate 61, and a second adsorption portion 65 is formed on the bottom surface to allow vacuum adsorption of the COF 30, and is thermally compressed and pressure bonded by the adjacent heater block 63. COF temporary compression tool (62);
A PCB bonding device using a COF mark, characterized in that it consists of.
상기 COF 받침대(44)는
상기 COF(30)와 접촉되는 상면이 'ㅗ'자 형태를 가짐으로서, 상기 COF(30)의 저면 일부만이 접촉지지되어, 상기 가압착 유닛(60)에 COF(30)가 진공흡착될때 COF 받침대(44)로부터 탈거가 용이토록 하는 것을 특징으로 하는 COF마크를 이용한 PCB 본딩장치.
According to paragraph 1,
The COF stand (44) is
Since the upper surface in contact with the COF (30) has a 'ㅗ' shape, only a portion of the bottom surface of the COF (30) is contacted and supported, so that when the COF (30) is vacuum adsorbed to the temporary compression unit (60), the COF support (44) A PCB bonding device using a COF mark that facilitates removal from the device.
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| KR1020230181438A KR102686699B1 (en) | 2023-12-14 | 2023-12-14 | PCB bonding device using COF mark |
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| KR1020230181438A KR102686699B1 (en) | 2023-12-14 | 2023-12-14 | PCB bonding device using COF mark |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100816992B1 (en) * | 2007-11-06 | 2008-03-26 | 주식회사 디엠티 | Bonding device using an anisotropic conductive film and bonding method |
| KR102025192B1 (en) | 2018-04-06 | 2019-09-25 | (주)제이스텍 | Apparatus for image pickup simultaneously display panel and COF by one light |
| KR102169281B1 (en) | 2020-01-28 | 2020-10-23 | (주)제이스텍 | Hybrid laser bonding device |
| KR102314387B1 (en) | 2020-04-20 | 2021-10-19 | 주식회사 제이스텍 | OLB Side Bonding System |
-
2023
- 2023-12-14 KR KR1020230181438A patent/KR102686699B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100816992B1 (en) * | 2007-11-06 | 2008-03-26 | 주식회사 디엠티 | Bonding device using an anisotropic conductive film and bonding method |
| KR102025192B1 (en) | 2018-04-06 | 2019-09-25 | (주)제이스텍 | Apparatus for image pickup simultaneously display panel and COF by one light |
| KR102169281B1 (en) | 2020-01-28 | 2020-10-23 | (주)제이스텍 | Hybrid laser bonding device |
| KR102314387B1 (en) | 2020-04-20 | 2021-10-19 | 주식회사 제이스텍 | OLB Side Bonding System |
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