KR102673125B1 - 납 프리 땜납 합금, 솔더 페이스트, 전자 회로 실장 기판 및 전자 제어 장치 - Google Patents
납 프리 땜납 합금, 솔더 페이스트, 전자 회로 실장 기판 및 전자 제어 장치 Download PDFInfo
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- KR102673125B1 KR102673125B1 KR1020197007401A KR20197007401A KR102673125B1 KR 102673125 B1 KR102673125 B1 KR 102673125B1 KR 1020197007401 A KR1020197007401 A KR 1020197007401A KR 20197007401 A KR20197007401 A KR 20197007401A KR 102673125 B1 KR102673125 B1 KR 102673125B1
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- lead
- less
- free solder
- solder alloy
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018107086A JP6796108B2 (ja) | 2018-06-04 | 2018-06-04 | 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 |
| JPJP-P-2018-107086 | 2018-06-04 | ||
| PCT/JP2019/007717 WO2019235001A1 (ja) | 2018-06-04 | 2019-02-27 | 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210015600A KR20210015600A (ko) | 2021-02-10 |
| KR102673125B1 true KR102673125B1 (ko) | 2024-06-10 |
Family
ID=68770396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197007401A KR102673125B1 (ko) | 2018-06-04 | 2019-02-27 | 납 프리 땜납 합금, 솔더 페이스트, 전자 회로 실장 기판 및 전자 제어 장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6796108B2 (ja) |
| KR (1) | KR102673125B1 (ja) |
| WO (1) | WO2019235001A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7032687B1 (ja) | 2021-10-22 | 2022-03-09 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、およびはんだ継手 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000018536A1 (fr) * | 1998-09-30 | 2000-04-06 | Matsushita Electric Industrial Co., Ltd. | Materiau de brasage et dispositif electrique/electronique utilisant celui-ci |
| JP2014037005A (ja) * | 2012-07-19 | 2014-02-27 | Harima Chemicals Inc | はんだ合金、ソルダペーストおよび電子回路基板 |
| JP2016010818A (ja) * | 2015-03-24 | 2016-01-21 | 株式会社タムラ製作所 | 鉛フリーはんだ合金含有ソルダペースト組成物、はんだ接合体構造および電子回路基板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3643008B2 (ja) | 1996-02-09 | 2005-04-27 | 松下電器産業株式会社 | はんだ付け方法 |
| JPH09326554A (ja) | 1996-06-06 | 1997-12-16 | Matsushita Electric Ind Co Ltd | 電子部品接合用電極のはんだ合金及びはんだ付け方法 |
| JP3363393B2 (ja) | 1998-12-21 | 2003-01-08 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP3892190B2 (ja) * | 1999-12-03 | 2007-03-14 | 株式会社日立製作所 | 混載実装構造体及び混載実装方法並びに電子機器 |
| JP5024380B2 (ja) | 2007-07-13 | 2012-09-12 | 千住金属工業株式会社 | 車載実装用鉛フリーはんだと車載電子回路 |
| JP4612661B2 (ja) | 2007-09-13 | 2011-01-12 | パナソニック株式会社 | 電子部品のはんだ付け方法 |
| JP6083451B2 (ja) * | 2015-04-20 | 2017-02-22 | 千住金属工業株式会社 | 面実装部品のはんだ付け方法および面実装部品 |
-
2018
- 2018-06-04 JP JP2018107086A patent/JP6796108B2/ja active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000018536A1 (fr) * | 1998-09-30 | 2000-04-06 | Matsushita Electric Industrial Co., Ltd. | Materiau de brasage et dispositif electrique/electronique utilisant celui-ci |
| JP2014037005A (ja) * | 2012-07-19 | 2014-02-27 | Harima Chemicals Inc | はんだ合金、ソルダペーストおよび電子回路基板 |
| JP2016010818A (ja) * | 2015-03-24 | 2016-01-21 | 株式会社タムラ製作所 | 鉛フリーはんだ合金含有ソルダペースト組成物、はんだ接合体構造および電子回路基板 |
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| JP2019209350A (ja) | 2019-12-12 |
| WO2019235001A1 (ja) | 2019-12-12 |
| JP6796108B2 (ja) | 2020-12-02 |
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