KR102671977B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR102671977B1
KR102671977B1 KR1020190040964A KR20190040964A KR102671977B1 KR 102671977 B1 KR102671977 B1 KR 102671977B1 KR 1020190040964 A KR1020190040964 A KR 1020190040964A KR 20190040964 A KR20190040964 A KR 20190040964A KR 102671977 B1 KR102671977 B1 KR 102671977B1
Authority
KR
South Korea
Prior art keywords
hole
circuit board
printed circuit
reinforcing material
adhesive layer
Prior art date
Application number
KR1020190040964A
Other languages
English (en)
Korean (ko)
Other versions
KR20200118690A (ko
Inventor
송요한
민태홍
최정우
김주호
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020190040964A priority Critical patent/KR102671977B1/ko
Priority to JP2019109992A priority patent/JP7283028B2/ja
Priority to TW108120805A priority patent/TWI814840B/zh
Publication of KR20200118690A publication Critical patent/KR20200118690A/ko
Application granted granted Critical
Publication of KR102671977B1 publication Critical patent/KR102671977B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020190040964A 2019-04-08 2019-04-08 인쇄회로기판 KR102671977B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020190040964A KR102671977B1 (ko) 2019-04-08 2019-04-08 인쇄회로기판
JP2019109992A JP7283028B2 (ja) 2019-04-08 2019-06-13 プリント回路基板
TW108120805A TWI814840B (zh) 2019-04-08 2019-06-17 印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190040964A KR102671977B1 (ko) 2019-04-08 2019-04-08 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20200118690A KR20200118690A (ko) 2020-10-16
KR102671977B1 true KR102671977B1 (ko) 2024-06-05

Family

ID=72831836

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190040964A KR102671977B1 (ko) 2019-04-08 2019-04-08 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP7283028B2 (zh)
KR (1) KR102671977B1 (zh)
TW (1) TWI814840B (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132486U (zh) * 1981-02-12 1982-08-18
JPS59146975U (ja) * 1983-03-18 1984-10-01 松下電器産業株式会社 フレキシブル配線板
JPS6355456U (zh) * 1986-09-26 1988-04-13
JPH10229255A (ja) * 1997-02-14 1998-08-25 Iwaki Electron Corp Ltd 平板付きフレキシブルプリント基板
JP2001036199A (ja) 1999-07-16 2001-02-09 Matsushita Electric Ind Co Ltd 両面接着フレキシブルプリント基板
JP4383609B2 (ja) 1999-11-24 2009-12-16 キヤノン株式会社 プリント配線板
TW201127246A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
JP2011171352A (ja) 2010-02-16 2011-09-01 Canon Inc 両面フレキシブルプリント基板
JP6319762B2 (ja) * 2013-10-31 2018-05-09 日東電工株式会社 光電気混載基板およびその製法
JP6355456B2 (ja) 2014-07-02 2018-07-11 キヤノン株式会社 画像形成装置、画像形成装置の制御方法、及びプログラム
JP2016058509A (ja) * 2014-09-09 2016-04-21 株式会社東芝 補強板付きフレキシブルプリント配線板の製造方法およびフレキシブルプリント配線板中間体
JP7173752B2 (ja) * 2017-04-28 2022-11-16 日東電工株式会社 フレキシブル配線回路基板、その製造方法、および、撮像装置

Also Published As

Publication number Publication date
TWI814840B (zh) 2023-09-11
JP2020174168A (ja) 2020-10-22
JP7283028B2 (ja) 2023-05-30
TW202038683A (zh) 2020-10-16
KR20200118690A (ko) 2020-10-16

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right