KR102640177B1 - 화학적 기계적 연마 캐리어 헤드를 위한 외부 클램프 링 - Google Patents

화학적 기계적 연마 캐리어 헤드를 위한 외부 클램프 링 Download PDF

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Publication number
KR102640177B1
KR102640177B1 KR1020187013720A KR20187013720A KR102640177B1 KR 102640177 B1 KR102640177 B1 KR 102640177B1 KR 1020187013720 A KR1020187013720 A KR 1020187013720A KR 20187013720 A KR20187013720 A KR 20187013720A KR 102640177 B1 KR102640177 B1 KR 102640177B1
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KR
South Korea
Prior art keywords
clamp ring
cylindrical wall
chemical mechanical
mechanical polishing
external clamp
Prior art date
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KR1020187013720A
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English (en)
Korean (ko)
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KR20180058838A (ko
Inventor
패트릭 아라
보 비. 딩
용퀴 후
사이먼 야벨베르크
메츠 라손
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20180058838A publication Critical patent/KR20180058838A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020187013720A 2015-10-16 2016-08-04 화학적 기계적 연마 캐리어 헤드를 위한 외부 클램프 링 Active KR102640177B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562242946P 2015-10-16 2015-10-16
US62/242,946 2015-10-16
US15/176,998 2016-06-08
US15/176,998 US10029346B2 (en) 2015-10-16 2016-06-08 External clamp ring for a chemical mechanical polishing carrier head
PCT/US2016/045626 WO2017065861A1 (en) 2015-10-16 2016-08-04 External clamp ring for a chemical mechanical polishing carrier head

Publications (2)

Publication Number Publication Date
KR20180058838A KR20180058838A (ko) 2018-06-01
KR102640177B1 true KR102640177B1 (ko) 2024-02-22

Family

ID=58517708

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187013720A Active KR102640177B1 (ko) 2015-10-16 2016-08-04 화학적 기계적 연마 캐리어 헤드를 위한 외부 클램프 링

Country Status (7)

Country Link
US (1) US10029346B2 (enExample)
EP (1) EP3363041B1 (enExample)
JP (1) JP6956710B2 (enExample)
KR (1) KR102640177B1 (enExample)
CN (2) CN206602095U (enExample)
TW (2) TWM544392U (enExample)
WO (1) WO2017065861A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7003838B2 (ja) * 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
CN108857909A (zh) * 2018-07-20 2018-11-23 宁波江丰电子材料股份有限公司 一种用于cmp保持环粘接面的加工方法以及cmp保持环的制备方法
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
CN110842766B (zh) * 2019-11-26 2022-07-12 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种芯片装载机构及芯片研抛系统
CN116000784B (zh) * 2022-12-29 2024-08-16 西安奕斯伟材料科技股份有限公司 硅片双面抛光装置的承载件及硅片双面抛光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100774096B1 (ko) 2005-08-30 2007-11-06 강준모 화학기계적 연마를 위한 리테이닝 링
JP2009034745A (ja) * 2007-07-31 2009-02-19 Nippon Seimitsu Denshi Co Ltd Ｃｍｐ装置用リテーナリング

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6024630A (en) 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5990012A (en) 1998-01-27 1999-11-23 Micron Technology, Inc. Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads
US6436228B1 (en) 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6159079A (en) 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
US6165058A (en) 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6444326B1 (en) * 1999-03-05 2002-09-03 Restek Corporation Surface modification of solid supports through the thermal decomposition and functionalization of silanes
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6602114B1 (en) * 2000-05-19 2003-08-05 Applied Materials Inc. Multilayer retaining ring for chemical mechanical polishing
US20040005842A1 (en) * 2000-07-25 2004-01-08 Chen Hung Chih Carrier head with flexible membrane
JP2003025217A (ja) * 2001-07-13 2003-01-29 Tokyo Seimitsu Co Ltd ウエーハ研磨装置
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US6945845B2 (en) 2003-03-04 2005-09-20 Applied Materials, Inc. Chemical mechanical polishing apparatus with non-conductive elements
JP4086722B2 (ja) * 2003-06-24 2008-05-14 株式会社荏原製作所 基板保持装置及び研磨装置
US20070049164A1 (en) 2005-08-26 2007-03-01 Thomson Clifford O Polishing pad and method for manufacturing polishing pads
JP5026710B2 (ja) * 2005-09-02 2012-09-19 株式会社フジミインコーポレーテッド 研磨用組成物
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US20090023368A1 (en) * 2007-07-18 2009-01-22 United Microelectronics Corp. Polishing head and edge control ring thereof, and method of increasing polishing rate at wafer edge
US7530887B2 (en) * 2007-08-16 2009-05-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with controlled wetting
KR101024674B1 (ko) 2007-12-28 2011-03-25 신한다이아몬드공업 주식회사 소수성 절삭공구 및 그제조방법
WO2009120641A2 (en) * 2008-03-25 2009-10-01 Applied Materials, Inc. Improved carrier head membrane
MY155563A (en) 2009-06-02 2015-10-30 Saint Gobain Abrasives Inc Corrosion-resistant cmp conditioning tools and methods for making and using same
JP5735522B2 (ja) * 2009-10-27 2015-06-17 シルコテック コーポレイション 化学気相成長コーティング、物品、及び方法
US8721391B2 (en) * 2010-08-06 2014-05-13 Applied Materials, Inc. Carrier head with narrow inner ring and wide outer ring
KR101512579B1 (ko) * 2010-10-05 2015-04-15 실코텍 코포레이션 내마모성 코팅, 물건 및 방법
JP5635482B2 (ja) * 2011-11-30 2014-12-03 株式会社荏原製作所 弾性膜
CN103302587B (zh) * 2012-03-16 2016-01-06 中芯国际集成电路制造(上海)有限公司 化学机械研磨装置及系统
KR20130131120A (ko) 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
US10702972B2 (en) * 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
KR101392401B1 (ko) * 2012-11-30 2014-05-07 이화다이아몬드공업 주식회사 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법
KR102059524B1 (ko) * 2013-02-19 2019-12-27 삼성전자주식회사 화학적 기계적 연마 장치와 연마 헤드 어셈블리
US9381613B2 (en) * 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head
WO2015051134A1 (en) 2013-10-04 2015-04-09 Applied Materials, Inc. Coated retaining ring
CN103862364A (zh) * 2014-03-24 2014-06-18 上海华力微电子有限公司 研磨垫、研磨机台及研磨方法
KR20160013461A (ko) * 2014-07-25 2016-02-04 삼성전자주식회사 캐리어 헤드 및 화학적 기계식 연마 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100774096B1 (ko) 2005-08-30 2007-11-06 강준모 화학기계적 연마를 위한 리테이닝 링
JP2009034745A (ja) * 2007-07-31 2009-02-19 Nippon Seimitsu Denshi Co Ltd Ｃｍｐ装置用リテーナリング

Also Published As

Publication number Publication date
TW201714705A (zh) 2017-05-01
KR20180058838A (ko) 2018-06-01
EP3363041B1 (en) 2023-06-07
US10029346B2 (en) 2018-07-24
EP3363041A4 (en) 2019-06-12
CN106965077A (zh) 2017-07-21
JP6956710B2 (ja) 2021-11-02
WO2017065861A1 (en) 2017-04-20
US20170106496A1 (en) 2017-04-20
JP2018531804A (ja) 2018-11-01
TWI680828B (zh) 2020-01-01
TWM544392U (zh) 2017-07-01
EP3363041A1 (en) 2018-08-22
CN206602095U (zh) 2017-10-31
CN106965077B (zh) 2021-07-30

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