KR102623024B1 - Assembly structure of electronic control device for vehicle and method of assembling the same - Google Patents

Abstract

The present invention relates to an assembly structure and an assembly method of an electronic control device for a vehicle that can simplify the number of parts and the assembly process and improve heat dissipation performance, and include a penetrating portion extending from one end to the other end and a penetrating portion extending from both ends of the penetrating portion. A housing consisting of extended wings; A plurality of IGBTs (INSULATED GATE BIPOLAR TRANSISTOR) fixed at a distance from each other in the direction from one end to the other inside the wing portion; A PCB (PRINTED CIRCUIT BOARD) accommodated inside the through portion; It includes a cooling member disposed at a lower portion of the through portion to support the PCB and connected to the IGBT to cool the IGBT through heat exchange.

Description

Assembly structure of electronic control device for vehicle and assembly method thereof {ASSEMBLY STRUCTURE OF ELECTRONIC CONTROL DEVICE FOR VEHICLE AND METHOD OF ASSEMBLING THE SAME}

The present invention relates to an assembly structure for an electronic control device, and more specifically, to an assembly structure for an electronic control device for a vehicle that can simplify the number of parts and assembly process and improve heat dissipation performance, and to an assembly method thereof.

Interest in and development of hybrid and electric vehicles is increasing due to environmental issues and depletion of fossil energy.

In the case of such eco-friendly vehicles, an electronic control device for power conversion, such as an inverter or converter, is provided to convert the power supplied from the battery into motor driving power.

This electronic control device for power conversion includes an IGBT (INSULATED GATE BIPOLAR TRANSISTOR) for power conversion.

IGBTS generates heat during the power conversion process and operates stably only when it satisfies sufficient heat dissipation performance.

That is, the electronic control device for power conversion is insulated and heat dissipated using only a heat transfer pad between the housing and the IGBT for stable operation of the IGBT, that is, heat dissipation of the IGBT.

Additionally, IGBT heat dissipation occurs only at the contact surface of the housing and IGBT, so heat dissipation performance is poor in natural cooling methods rather than water cooling.

Therefore, in the past, a heat transfer pad was used to dissipate heat from the IGBT, but sufficient heat dissipation effect was not observed.

Additionally, the conventional electronic control device for power conversion uses separate screws or clips to assemble the IGBT to the housing.

As a result, the electronic control device for power conversion has problems in that the number of parts increases and the assembly structure and assembly process are complicated by adding separate subsidiary materials for assembling the IGBT to the housing.

The present invention to solve the problems described above is to provide an assembly structure for a vehicle electronic control device that can simplify the number of parts and assembly process and improve heat dissipation performance.

The above-described object and other objects, advantages and features of the present invention, and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings.

An assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention for achieving the above-described object includes a housing consisting of a penetrating portion extending from one end to the other end and a wing portion extending from both ends of the penetrating portion; A plurality of IGBTs (INSULATED GATE BIPOLAR TRANSISTOR) fixed at a distance from each other in the direction from one end to the other inside the wing portion; A PCB (PRINTED CIRCUIT BOARD) accommodated inside the through portion; It includes a cooling member disposed at a lower portion of the through portion to support the PCB and connected to the IGBT to cool the IGBT through heat exchange.

The IGBT is fixed to each of the wings using a caulking method.

Inside the penetrating portion, sliding grooves into which the cooling member is slidably coupled are formed on both sides of the lower portion.

A heat dissipation fin is formed on the lower surface of the wing portion to dissipate heat generated from the IGBT to the outside of the housing.

The IGBT includes a heat transfer fin that extends from a surface in the direction in which the cooling member is disposed and is inserted into the cooling member.

The heat transfer fin exchanges heat between the IGBT and the cooling member.

The cooling member includes a base portion forming a body; a sliding protrusion formed on the lower surface of the base portion and slidably coupled to the sliding groove; Extension portions each extending upward from both ends of the base portion; and a hook portion extending from the upper surface of the extension portion in the direction in which the PCB is disposed and coupled to the PCB.

The heat transfer fin is bent in the direction of the PCB, penetrates the PCB, and is inserted into a receiving groove formed by the base portion and the extension portion.

The receiving groove is filled with a heat transfer member that cools the IGBT.

A fine gap is formed between the sliding groove and the sliding protrusion.

The cooling member further includes a communication hole penetrating the base, and the heat transfer member is filled between the sliding groove and the sliding protrusion through the communication hole.

The hook portion penetrates the PCB and is coupled to the PCB by a hook coupling method.

A method of assembling an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention includes preparing a housing consisting of a penetrating portion and a wing portion extending from one end to the other end; Soldering a plurality of IGBT modules on a PCB; coupling a cooling member to the lower surface of the PCB; fixing the PCB to the cooling member by penetrating the hook portion of the cooling member into the PCB; Inserting the cooling member into a sliding groove formed in the lower part of the penetrating part in a sliding manner; and filling the cooling member with a heat transfer member.

In the step of slidingly inserting the cooling member into the sliding groove formed in the lower part of the through portion, the IGBT soldered to the PCB is inserted into the wing portion.

Each of the plurality of IGBTs inserted into the wing portion is fixed by caulking.

In the step of filling the cooling member with the heat transfer member, the heat transfer member is filled between the sliding groove and the sliding groove through the receiving groove of the cooling member and the communication hole of the cooling member.

According to the present invention, the IGBT is pressed by the rivet head formed through caulking, so that the IGBT is fixed to the wing of the housing by caulking, which has the effect of reducing costs and simplifying the assembly process by eliminating screw parts. .

In addition, the IGBT is connected to the heat transfer member via a heat transfer fin, allowing the IGBT and the heat transfer member to easily exchange heat with each other, so that the structure of the heat transfer member and the heat transfer fin includes a heat dissipation pad disposed between the IGBT and the wing. The IGBT can be cooled more effectively by the heat transfer member accommodated in the receiving groove of the cooling member.

1 is a perspective view showing the assembled structure of an electronic control device for a vehicle according to an embodiment of the present invention.
Figure 2 is an exploded perspective view showing the assembled structure of an electronic control device for a vehicle according to an embodiment of the present invention.
Figure 3 is a side view showing the assembled structure of an electronic control device for a vehicle according to an embodiment of the present invention.
Figure 4 is a flowchart showing a method of assembling the assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.

The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified into various other forms, and the scope of the present invention is as follows. It is not limited to examples. Rather, these embodiments are provided to make the disclosure more faithful and complete, and to fully convey the spirit of the invention to those skilled in the art. In addition, in the drawings below, each component is exaggerated for convenience and clarity of explanation, and like symbols refer to the same elements in the drawings. As used herein, the term “and/or” includes any one and all combinations of one or more of the listed items.

The terms used herein are used to describe specific embodiments and are not intended to limit the invention.

As used herein, the singular forms include the plural forms unless the context clearly indicates otherwise. Additionally, when used herein, “comprise” and/or “comprising” means specifying the presence of stated features, numbers, steps, operations, members, elements and/or groups thereof. and does not exclude the presence or addition of one or more other shapes, numbers, operations, members, elements and/or groups.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a perspective view showing the assembled structure of a vehicle electronic control device according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing the assembled structure of a vehicle electronic control device according to an embodiment of the present invention, and Figure 3 is This is a side view showing the assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.

1 to 3, the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention includes a housing 100, a PCB (400, printed circuit board: PRINTED CIRCUIT BOARD), and an IGBT module (200, insulated). Includes a gate bipolar transistor: INSULATED GATE BIPOLAR TRANSISTOR) and a cooling member (500).

The housing 100 forms the body and may preferably include aluminum. It can be formed by extrusion molding.

Additionally, a connector (not shown) electrically connected to the PCB 400 may be coupled to the housing 100 .

In addition, the housing 100 accommodates various components such as the IGBT module 200, the PCB 400, and the cooling member 500.

This housing 100 includes a penetrating portion 110 extending from one end to the other end and wing portions 120 extending from both ends of the penetrating portion 110.

The penetrating portion 110 may be formed in the shape of a hollow rectangular parallelepiped whose one end and the other end communicate with each other.

A sliding groove 111 is formed inside the penetrating portion 110.

The sliding grooves 111 are formed on both sides of the lower portion inside the penetrating portion 110 and extend from one end of the housing 100 to the other end.

And, the sliding groove 111 is coupled to the cooling member 500 in a sliding manner.

The wing portion 120 may be formed to protrude vertically from each of the left and right sides of the penetrating portion 110.

In addition, the wing portion 120 extends along the direction of one end and the other end of the penetrating portion 110, and a space communicating with the internal space of the penetrating portion 110 is formed.

Heat dissipation fins 121 are formed in the lower part of the wings 120.

The heat dissipation fin 121 extends from the lower surface of the wing portion 120 and dissipates heat generated from the IGBT module 200 to the outside of the housing 100.

Meanwhile, a housing 100 cover (not shown) may be coupled to one end and the other end of the through hole and the wing portion 120 to cover the housing 100.

Therefore, the interior space of the housing 100 is blocked from the outside by the cover of the housing 100, thereby preventing the IGBT module 200, PCB 400, and cooling member 500 accommodated in the interior space of the housing from external foreign substances. Or it can be protected from external forces.

The PCB 400 is accommodated inside the penetrating portion 110 and is a type of printed circuit board on which electronic devices (not shown) such as diodes are mounted.

And, the width of the PCB 400 is narrower than the width of the through portion 110.

Because of this, the PCB 400 can be easily accommodated inside the penetration portion 110.

The IGBT module 200 is composed of a plurality of IGBT modules, and is fixed at a distance from each other in the direction from one end to the other end inside the wing portion 120.

Specifically, the IGBT module 200 is fixed to each wing 120 using a caulking method.

That is, the IGBT module 200 is pressed by the rivet head 600 formed through caulking.

Therefore, in the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention, the IGBT module 200 is fixed to the wing portion 120 of the housing 100 by caulking, thereby reducing costs and eliminating screw parts. The assembly process can be simple.

And, the IGBT module 200 is mounted on the PCB 400 by soldering.

This IGBT module 200 includes heat transfer fins 210.

The heat transfer fin 210 extends from the surface of the IGBT module 200 in the direction in which the cooling member 500 is disposed and is inserted into the cooling member 500.

That is, the heat transfer fin 210 extends from the IGBT module 200 and is bent in the direction of the cooling member 500.

These heat transfer fins 210 exchange heat between the IGBT module 200 and the cooling member 500.

Meanwhile, since the IGBT module 200 generates heat during the power conversion process, it must have sufficient heat dissipation performance to operate stably.

To this end, the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention includes a cooling member 500.

Meanwhile, a heat dissipation pad 300 is disposed between the lower surface and the wing of the IGBT module 200.

The heat dissipation pad 300 cools the heat generated from the IGBT module 200 and is made of a metal with excellent thermal conductivity, such as aluminum or an alloy material.

The cooling member 500 extends in a direction corresponding to the sliding groove 111, that is, from one end of the housing 100 to the other end, and is disposed adjacent to the PCB 400 at the lower portion inside the penetrating portion 110. Supports PCB (400).

Specifically, the cooling member 500 is coupled to the sliding grooves 111 formed on both sides of the lower portion inside the penetrating portion 110 in a sliding manner.

Additionally, the cooling member 500 is made of a metal with excellent thermal conductivity, such as aluminum or an alloy material.

This cooling member 500 is connected to the IGBT module 200 and absorbs heat generated from the IGBT module 200 to cool the IGBT module 200 through heat exchange.

This cooling member 500 includes a base portion 510, a sliding protrusion, an extension portion 530, and a hook portion 540.

The base portion 510 forms the body of the cooling member 500 and is disposed at a position spaced apart from the PCB 400 at a lower portion inside the penetrating portion 110.

Specifically, the lower surface of the base portion 510 contacts the upper surface of the protrusion of the sliding groove 111 formed in the lower portion of the penetrating portion 110.

Because of this, the cooling member 500 is supported by the protrusion of the sliding groove 111.

The sliding protrusion 520 is formed on the lower surface of the base portion 510 and is slidably coupled to the sliding groove 111.

Therefore, the sliding protrusion 520 attaches the cooling member 500, the PCB 400 supported on the cooling member 500, and the IGBT module 200 mounted on the PCB 400 by soldering to the inside of the housing 100. It can be easily inserted using a sliding method.

The extension portions 530 extend upward from both ends of the base portion 510, respectively.

And, the upper surface of the extension part 530 is in contact with the lower surface of the PCB 400.

Because of this, the extension portion 530 can firmly support the PCB 400.

Meanwhile, as shown in the drawing, a receiving groove 550 is formed inside the base portion 510 and the extension portion 530 by the base portion 510 and the extension portion 530.

And, this receiving groove 550 is filled with a heat transfer member 560 that cools the IGBT module 200.

The heat transfer member 560 is preferably made of a liquid such as silicon, and is filled in the receiving groove 550 formed by the base portion 510 and the extension portion 530 of the cooling member 500.

This heat transfer member 560 exchanges heat with the IGBT module 200.

Specifically, the end of the heat transfer fin 210 extending from the IGBT module 200 is accommodated in the receiving groove 550 in which the heat transfer member 560 is accommodated.

That is, the end of the heat transfer fin 210 is locked in the heat transfer member 560.

Accordingly, the IGBT module 200 is connected to the heat transfer member 560 via the heat transfer fin 210, so that the IGBT module 200 and the heat transfer member 560 can easily exchange heat with each other.

For this reason, the structure of the heat transfer member 560 and the heat transfer fin 210 of the present invention includes a heat dissipation pad 300 disposed between the IGBT module 200 and the wing portion 120 to accommodate the cooling member 500. The IGBT module 200 can be cooled more effectively by the heat transfer member 560 accommodated in the groove 550.

At this time, the heat transfer fin 210 is bent in the direction of the PCB 400, penetrates the PCB 400, and is inserted into the receiving groove 550 formed by the base portion 510 and the extension portion 530.

Meanwhile, the cooling member 500 further includes a communication hole 511 penetrating the base portion 510 and the sliding protrusion 520.

And, a fine gap is formed between the sliding protrusion 520 and the sliding groove 111.

Therefore, when the heat transfer member 560 is filled in the receiving groove 550 formed by the base portion 510 and the extension portion 530, it is filled with the communication hole 511 penetrating the base portion 510 and the sliding protrusion 520. comes in.

Then, the heat transfer member 560 introduced through the communication hole 511 flows into the micro gap formed between the sliding protrusion 520 and the sliding groove 111.

For this reason, the assembly structure of the electronic control device for a vehicle of the present invention cools the IGBT module 200 by sufficiently cooling the outer peripheral surface of the cooling member 500 by the heat transfer member 560 introduced between the communication hole 511 and the micro gap. Efficiency can be further increased.

The hook portion 540 extends from the upper surface of the extension portion 530 in the direction in which the PCB 400 is disposed, and couples the cooling member 500 to the PCB 400.

Specifically, the hook portion 540 penetrates the PCB 400 mounted on the upper surface of the extension portion 530, and is connected to the upper surface of the PCB 400 by a hook coupling method.

Because of this, the cooling member 500 and the PCB 400 of the present invention are firmly coupled to each other, and the PCB 400 can be easily supported on the cooling member 500.

Hereinafter, the assembly process of the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention will be described in detail with reference to the drawings.

Figure 4 is a flowchart showing a method of assembling an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.

First, prepare a housing 100 consisting of a penetrating portion 110 and a wing portion 120 extending from one end to the other end (S110).

Then, a plurality of IGBT modules 200 are soldered to the PCB 400 (S120).

Heat transfer fins 210 are extended in the IGBT module 200, and an end in the direction in which the PCB 400 is disposed is bent in the direction of the PCB 400.

And, the end of the bent heat transfer fin 210 penetrates the PCB 400.

Next, the cooling member 500 is coupled to the lower surface of the PCB 400 to which the IGBT module 200 is connected (S130).

Specifically, a hook portion 540 is formed on the upper surface of the cooling member 500, and the hook portion 540 penetrates the PCB 400 seated on the upper surface of the extension portion 530 and penetrates the upper surface of the PCB 400. It is fixed at (S140).

That is, the hook portion 540 allows the cooling member 500 to be coupled to the PCB 400 using a hook coupling method.

Next, the cooling member 500 to which the PCB 400 is coupled is inserted into the sliding groove 111 formed in the lower part of the penetrating portion 110 in a sliding manner (S150).

At this time, the IGBT module 200 soldered to the PCB 400 is inserted into the wing portion 120 of the housing 100.

Then, the IGBT module 200 inserted into the wing portion 120 is coupled to the wing portion 120 by caulking.

For this reason, in the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention, the IGBT module 200 is fixed to the wing portion 120 of the housing 100 by caulking, thereby reducing costs by eliminating screw parts. And the assembly process can be simple.

In addition, the heat transfer fin 210 extending from the IGBT module 200 and penetrating the PCB 400 is in the receiving groove 550 formed by the base portion 510 and the extension portion 530 forming the cooling member 500. is inserted.

Meanwhile, a heat dissipation pad 300 may be disposed between the wing portion 120 and the lower surface of the IGBT module 200.

Next, the cooling member 500 is filled with the heat transfer member 560 (S160).

Specifically, the receiving groove 550 formed by the base portion 510 and the extension portion 530 forming the cooling member 500 is filled.

At this time, the end of the heat transfer pin 210 already inserted into the receiving groove 550 is locked in the heat transfer member 560.

The IGBT module 200 is connected to the heat transfer member 560 via the heat transfer fin 210, so that the IGBT module 200 and the heat transfer member 560 can easily exchange heat with each other.

For this reason, the structure of the heat transfer member 560 and the heat transfer fin 210 of the present invention includes a heat dissipation pad 300 disposed between the IGBT module 200 and the wing portion 120 to accommodate the cooling member 500. The IGBT module 200 can be cooled more effectively by the heat transfer member 560 accommodated in the groove 550.

Additionally, a communication hole 511 penetrating the base portion 510 and the sliding protrusion 520 is formed in the cooling member 500, and a fine gap is formed between the sliding protrusion 520 and the sliding groove 111.

Therefore, when the heat transfer member 560 is filled in the receiving groove 550 formed by the base portion 510 and the extension portion 530, it is filled with the communication hole 511 penetrating the base portion 510 and the sliding protrusion 520. comes in.

Then, the heat transfer member 560 introduced through the communication hole 511 flows into the micro gap formed between the sliding protrusion 520 and the sliding groove 111.

For this reason, the assembly structure of the electronic control device for a vehicle of the present invention cools the IGBT module 200 by sufficiently cooling the outer peripheral surface of the cooling member 500 by the heat transfer member 560 introduced between the communication hole 511 and the micro gap. Efficiency can be further increased.

As such, the embodiments disclosed in this specification should be considered from an illustrative perspective rather than a limiting perspective. The scope of the present invention is indicated in the claims, not the foregoing description, and all differences within the equivalent scope should be construed as being included in the present invention.

100: housing 110: penetration part
111: sliding groove 120: wing portion
121: Heat dissipation fin 200: IGBT module
210: heat transfer fin 300: heat dissipation pad
400: PCB 500: Cooling member
510: base part 511: communication hole
520: sliding protrusion 530: extension part
540: Hook portion 550: Receiving groove
560: Absence of heat transfer

Claims (16)

A housing consisting of a penetrating portion extending from one end to the other end and a wing portion extending from both ends of the penetrating portion;
A plurality of IGBT modules (INSULATED GATE BIPOLAR TRANSISTOR) fixed at a distance from each other in the direction from one end to the other inside the wing portion;
A PCB (PRINTED CIRCUIT BOARD) accommodated inside the through portion;
A cooling member disposed at a lower portion of the through portion to support the PCB and connected to the IGBT module to cool the IGBT module through heat exchange,
The IGBT module is,
An assembly structure for an electronic control device for a vehicle including a heat transfer fin extending from a surface in the direction in which the cooling member is disposed and inserted into the cooling member.
According to paragraph 1,
The IGBT module is an assembly structure of an electronic control device for a vehicle that is fixed to each of the wings by caulking.
According to paragraph 1,
An assembly structure for an electronic control device for a vehicle, in which sliding grooves in which the cooling member is slidably coupled are formed on both lower sides of the penetrating portion.
According to paragraph 1,
An assembly structure for an electronic control device for a vehicle in which a heat dissipation fin is formed on the lower surface of the wing portion to dissipate heat generated from the IGBT module to the outside of the housing.
delete According to paragraph 3,
The heat transfer fin is an assembly structure of an electronic control device for a vehicle that exchanges heat between the IGBT module and the cooling member.
The method of claim 6, wherein the cooling member is:
Base portion forming the body;
a sliding protrusion formed on the lower surface of the base portion and slidably coupled to the sliding groove;
Extension portions each extending upward from both ends of the base portion; and
An assembly structure for an electronic control device for a vehicle including a hook portion that extends from the upper surface of the extension portion in the direction in which the PCB is disposed and is coupled to the PCB.
In clause 7,
The heat transfer fin is bent in the direction of the PCB, penetrates the PCB, and is inserted into a receiving groove formed by the base portion and the extension portion.
According to clause 8,
An assembly structure for a vehicle electronic control device in which the receiving groove is filled with a heat transfer member that cools the IGBT module.
According to clause 9,
An assembly structure for an electronic control device for a vehicle in which a fine gap is formed between the sliding groove and the sliding protrusion.
According to clause 10,
The cooling member further includes a communication hole penetrating the base, and the heat transfer member is filled between the sliding groove and the sliding protrusion through the communication hole.
In clause 7,
The hook portion penetrates the PCB and is coupled to the PCB by a hook coupling method.
Preparing a housing consisting of a penetrating portion and a wing portion extending from one end to the other end;
Soldering a plurality of IGBT modules on a PCB;
coupling a cooling member to the lower surface of the PCB;
fixing the PCB to the cooling member by penetrating the hook portion of the cooling member into the PCB;
Inserting the cooling member into a sliding groove formed in the lower part of the penetrating part in a sliding manner; and
A method of assembling an assembly structure of an electronic control device for a vehicle, including the step of filling the cooling member with a heat transfer member.
According to clause 13,
In the step of slidingly inserting the cooling member into the sliding groove formed in the lower part of the penetration part, the IGBT module soldered to the PCB is inserted into the wing part.
According to clause 14,
A method of assembling an assembly structure of an electronic control device for a vehicle in which the plurality of IGBT modules inserted into the wing portion are each fixed by caulking.
According to clause 13,
The step of filling the cooling member with a heat transfer member,
A method of assembling an assembly structure of an electronic control device for a vehicle, wherein the space between the sliding groove and the sliding groove is filled through the receiving groove of the cooling member and the communication hole of the cooling member.

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