KR20230089356A - Assembly structure of electronic control device for vehicle and method of assembling the same - Google Patents

Abstract

The present invention relates to an assembly structure of an electronic control device for a vehicle, in which the number of components can be reduced, an assembly process can be simplified, and heat dissipation performance can be improved, and a method of assembling the same. The assembly structure of an electronic control device comprises: a housing having a through portion extending in a direction from one end to the other end and wing portions extending from both ends of the through portion; a plurality of insulated gate bipolar transistors (IGBTs) spaced by a distance from each other in the direction from the one end to the other end and fixed inside the wing portion; a printed circuit board (PCB) accommodated inside the through portion; and a cooling member disposed thereunder inside the through portion to support the PCB, and connected to the IGBT to cool the IGBT in a heat exchange manner.

Description

Assembly structure of electronic control device for vehicle and assembly method thereof

The present invention relates to an assembly structure of an electronic control device, and more particularly, to an assembly structure of an electronic control device for a vehicle capable of improving heat dissipation performance while simplifying the number of parts and assembly process, and an assembly method thereof.

Due to environmental problems and depletion of fossil energy, interest in and development of hybrid vehicles and electric vehicles are increasing.

In the case of such an eco-friendly vehicle, an electronic control device for power conversion such as an inverter or converter is provided to convert power supplied from a battery into motor driving power.

Such an electronic control device for power conversion includes an IGBT (Insulated Gate Bipolar Transistor) for power conversion.

IGBTS generates heat during the power conversion process, and operates stably only when sufficient heat dissipation performance is satisfied.

That is, the electronic control device for power conversion is insulated and heat dissipated using only a heat transfer pad between the housing and the IGBT for stable operation of the IGBT, that is, heat dissipation of the IGBT.

In addition, heat dissipation of the IGBT is performed only on the contact surface between the housing and the IGBT, and the heat dissipation performance is poor in the natural cooling method rather than the water cooling method.

Therefore, in the prior art, a heat transfer pad is used to dissipate heat from the IGBT, but sufficient heat dissipation is not achieved.

In addition, the conventional electronic control device for power conversion is assembled using a separate screw or clip to assemble the IGBT to the housing.

As a result, the electronic control device for power conversion has problems in that the number of parts increases and the assembly structure and assembly process are complicated by adding additional subsidiary materials for assembling the IGBT to the housing.

The present invention to solve the above problems is to provide an assembly structure of an electronic control device for a vehicle that can improve the heat dissipation performance while considering the simplicity of the number of parts and the assembly process.

The foregoing and other objects, advantages and characteristics of the present invention, and methods of achieving them will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings.

An assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention for achieving the above object is a housing composed of a penetrating part extending from one end to the other end and wing parts extending from both ends of the penetrating part; A plurality of IGBTs (INSULATED GATE BIPOLAR TRANSISTOR) spaced apart from each other and fixed at a distance from one end to the other in the inside of the wing; PCB (printed circuit board: PRINTED CIRCUIT BOARD) accommodated inside the through portion; A cooling member is disposed at a lower portion of the through portion to support the PCB, and is connected to the IGBT to cool the IGBT by a heat exchange method.

The IGBTs are fixed to the wings by a caulking method.

Sliding grooves to which the cooling member is coupled in a sliding manner are respectively formed on both sides of the lower portion of the through portion.

Radiating fins are formed on the lower surface of the wings to dissipate heat generated from the IGBT to the outside of the housing.

The IGBT includes a heat transfer fin extending from a surface in a direction in which the cooling member is disposed and inserted into the cooling member.

The heat transfer fin exchanges heat between the IGBT and the cooling member.

The cooling member includes a base portion constituting a body; a sliding protrusion formed on a lower surface of the base portion and slidably engaged with the sliding groove; Extension portions extending upward from both ends of the base portion, respectively; and a hook portion extending in a direction in which the PCB is disposed from an upper surface of the extension portion and coupled to the PCB.

The heat transfer fin is bent in the direction of the PCB, passes through the PCB, and is inserted into a receiving groove formed by the base part and the extension part.

A heat transfer member for cooling the IGBT is filled in the receiving groove.

A fine gap is formed between the sliding groove and the sliding protrusion.

The cooling member further includes a communication hole penetrating the base portion, and the heat transfer member is filled between the sliding groove and the sliding protrusion through the communication hole.

The hook part passes through the PCB and is coupled to the PCB in a hook-coupled manner.

An assembly method of an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention includes preparing a housing composed of a penetrating part extending from one end to the other end and a wing part; Soldering a plurality of IGBT modules to the PCB; coupling a cooling member to a lower surface of the PCB; fixing the PCB to the cooling member by penetrating the hook portion of the cooling member through the PCB; inserting the cooling member into a sliding groove formed at a lower portion of the through part in a sliding manner; and filling the cooling member with a heat transfer member.

In the step of inserting the cooling member into the sliding groove formed in the lower part of the through part in a sliding manner, the IGBT soldered to the PCB is inserted into the wing part.

Each of the plurality of IGBTs inserted into the wing is fixed by a caulking method.

In the step of filling the cooling member with the heat transfer member, the cooling member is filled between the sliding groove and the sliding groove through the receiving groove of the cooling member and the communication hole of the cooling member.

According to the present invention, since the IGBT is pressurized by the rivet head formed through the caulking process, the IGBT is fixed to the wings of the housing in a caulking method, thereby reducing the cost and simplifying the assembly process through the deletion of screw parts. .

In addition, since the IGBT is connected to the heat transfer member through the heat transfer fin, the IGBT and the heat transfer member can easily exchange heat with each other, so that the structure of the heat transfer member and the heat transfer fin includes a heat dissipation pad disposed between the IGBT and the wings. There is an effect of cooling the IGBT more effectively by the heat transfer member accommodated in the receiving groove of the cooling member.

1 is a perspective view showing an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.
2 is an exploded perspective view illustrating an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.
3 is a side view illustrating an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.
4 is a flowchart illustrating a method of assembling an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.

The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified in many different forms, and the scope of the present invention is as follows It is not limited to the examples. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art. In addition, each component in the following drawings is exaggerated for convenience and clarity of explanation, and the same reference numerals refer to the same elements in the drawings. As used herein, the term “and/or” includes any one and all combinations of one or more of the listed items.

Terms used in this specification are used to describe specific embodiments and are not intended to limit the present invention.

As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Also, when used herein, "comprise" and/or "comprising" specifies the presence of the recited shapes, numbers, steps, operations, elements, elements, and/or groups thereof. and does not exclude the presence or addition of one or more other shapes, numbers, operations, elements, elements and/or groups.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention, and FIG. It is a side view showing an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.

1 to 3, the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention includes a housing 100, a PCB 400, a printed circuit board: PRINTED CIRCUIT BOARD, and an IGBT module 200, insulation A gate bipolar transistor: INSULATED GATE BIPOLAR TRANSISTOR) and a cooling member 500 are included.

The housing 100, as forming a body, may preferably include an aluminum material. It can be formed by extrusion molding.

Also, a connector (not shown) electrically connected to the PCB 400 may be coupled to the housing 100 .

In addition, various components such as the IGBT module 200, the PCB 400, and the cooling member 500 are accommodated in the housing 100.

Such a housing 100 is composed of a penetrating part 110 extending from one end to the other end and wing parts 120 extending from both ends of the penetrating part 110.

The penetrating portion 110 may have a hollow rectangular parallelepiped shape in which one end and the other end communicate with each other.

A sliding groove 111 is formed inside the through portion 110 .

The sliding grooves 111 are formed on both sides of the lower portion of the through portion 110, respectively, and extend from one end of the housing 100 to the other end.

And, the sliding groove 111 is coupled to the cooling member 500 in a sliding manner.

The wing portion 120 may protrude vertically from each of the left and right sides of the penetrating portion 110 .

In addition, the wing portion 120 extends along one end and the other end of the penetrating portion 110, and a space communicating with the inner space of the penetrating portion 110 is formed.

A heat dissipation fin 121 is formed below the wing portion 120 .

The radiating fin 121 extends from the lower surface of the wing 120 and dissipates the heat generated from the IGBT module 200 to the outside of the housing 100 .

Meanwhile, a cover (not shown) of the housing 100 may be coupled to one end and the other end of the through hole and the wing portion 120 to cover the housing 100 .

Therefore, the housing 100 blocks the interior space from the outside by the cover of the housing 100, so that the IGBT module 200, the PCB 400, the cooling member 500, and the like, which are accommodated in the interior space of the housing, are removed from the outside. Or it can be protected from external forces.

The PCB 400 is accommodated inside the through portion 110 and is a type of printed circuit board on which electronic elements such as diodes (not shown) are mounted.

Also, the width of the PCB 400 is narrower than the width of the penetrating portion 110 .

Due to this, the PCB 400 can be easily accommodated in the through portion 110 .

The IGBT module 200 is made up of a plurality, and is spaced apart from each other in a direction from one end to the other end inside the wing unit 120 and fixed.

Specifically, the IGBT modules 200 are fixed to the wings 120 in a caulking method.

That is, the IGBT module 200 is pressed by the rivet head 600 formed through caulking.

Therefore, in the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention, the IGBT module 200 is fixed to the wing portion 120 of the housing 100 in a caulking method to reduce costs and reduce costs by deleting screw parts. The assembly process can be simple.

And, the IGBT module 200 is mounted on the PCB 400 by a soldering method.

This IGBT module 200 includes heat transfer fins 210.

The heat transfer fin 210 extends from the surface in the direction in which the cooling member 500 is disposed in the IGBT module 200 and is inserted into the cooling member 500 .

That is, the heat transfer fin 210 extends from the IGBT module 200 and is bent toward the cooling member 500 .

These heat transfer fins 210 exchange heat between the IGBT module 200 and the cooling member 500 .

Meanwhile, since heat is generated in the power conversion process, the IGBT module 200 operates stably only when sufficient heat dissipation performance is satisfied.

To this end, an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention includes a cooling member 500 .

Meanwhile, a heat dissipation pad 300 is disposed between the lower surface of the IGBT module 200 and the wings.

The heat dissipation pad 300 cools the heat generated from the IGBT module 200 and is made of a metal having excellent thermal conductivity, such as aluminum or an alloy material.

The cooling member 500 extends from one end to the other end of the housing 100 at a position corresponding to the sliding groove 111, and is disposed adjacent to the PCB 400 at the bottom of the through-hole 110. The PCB 400 is supported.

Specifically, the cooling member 500 is coupled to the sliding grooves 111 respectively formed on both sides of the lower portion of the through portion 110 inside the through portion 110 in a sliding manner.

In addition, the cooling member 500 is made of a metal having excellent thermal conductivity, such as aluminum or an alloy material.

The cooling member 500 is connected to the IGBT module 200 and absorbs heat generated from the IGBT module 200 to cool the IGBT module 200 by a heat exchange method.

The cooling member 500 includes a base portion 510, a sliding protrusion, an extension portion 530, and a hook portion 540.

The base part 510 forms the body of the cooling member 500 and is disposed at a spaced distance from the PCB 400 at a lower part inside the through part 110 .

Specifically, the lower surface of the base part 510 is in contact with the upper surface of the protruding part of the sliding groove 111 formed in the lower part of the through part 110 .

Due to this, the cooling member 500 is supported by the protrusion of the sliding groove 111 .

The sliding protrusion 520 is formed on the lower surface of the base portion 510 and is slidably coupled to the sliding groove 111 .

Therefore, the sliding protrusion 520 inserts the cooling member 500, the PCB 400 supported by the cooling member 500, and the IGBT module 200 mounted on the PCB 400 by soldering into the inside of the housing 100. can be easily inserted in a sliding manner.

The extension portions 530 extend upward from both ends of the base portion 510 , respectively.

And, the upper surface of the extension part 530 is in contact with the lower surface of the PCB 400 .

Due to this, the extension part 530 can firmly support the PCB 400 .

Meanwhile, as shown in the drawing, an accommodation groove 550 is formed inside the base part 510 and the extension part 530 by the base part 510 and the extension part 530 .

In addition, the heat transfer member 560 for cooling the IGBT module 200 is filled in the receiving groove 550 .

The heat transfer member 560 is preferably made of a liquid such as silicon, and is filled in the receiving groove 550 formed by the base portion 510 and the extension portion 530 of the cooling member 500 .

The heat transfer member 560 exchanges heat with the IGBT module 200 .

In detail, the end of the heat transfer fin 210 extending from the IGBT module 200 is accommodated in the receiving groove 550 in which the heat transfer member 560 is accommodated.

That is, the end of the heat transfer fin 210 is locked to the heat transfer member 560 .

Accordingly, the IGBT module 200 is connected to the heat transfer member 560 through the heat transfer pin 210, so that the IGBT module 200 and the heat transfer member 560 can easily exchange heat with each other.

Due to this, the structure of the heat transfer member 560 and the heat transfer fin 210 of the present invention includes the heat dissipation pad 300 disposed between the IGBT module 200 and the wing portion 120 to accommodate the cooling member 500. The IGBT module 200 can be cooled more effectively by the heat transfer member 560 accommodated in the groove 550 .

At this time, the heat transfer fin 210 is bent in the direction of the PCB 400 and penetrates the PCB 400 to be inserted into the receiving groove 550 formed by the base part 510 and the extension part 530 .

Meanwhile, the cooling member 500 further includes a communication hole 511 penetrating the base portion 510 and the sliding protrusion 520 .

Also, a fine gap is formed between the sliding protrusion 520 and the sliding groove 111 .

Therefore, when the heat transfer member 560 is filled in the receiving groove 550 formed by the base portion 510 and the extension portion 530, the base portion 510 and the sliding protrusion 520 pass through the communication hole 511. is introduced

Then, the heat transfer member 560 introduced through the communication hole 511 is introduced into a fine gap formed between the sliding protrusion 520 and the sliding groove 111 .

Due to this, the assembly structure of the electronic control device for a vehicle of the present invention sufficiently cools the outer circumferential surface of the cooling member 500 by the heat transfer member 560 introduced between the communication hole 511 and the fine gap to cool the IGBT module 200. Efficiency can be further increased.

The hook part 540 extends from the upper surface of the extension part 530 in the direction in which the PCB 400 is disposed, and couples the cooling member 500 to the PCB 400.

Specifically, the hook portion 540 penetrates the PCB 400 seated on the upper surface of the extension portion 530 and is coupled to the upper surface of the PCB 400 by a hook coupling method.

Due to this, the cooling member 500 and the PCB 400 of the present invention are firmly coupled to each other, and the PCB 400 can be easily supported by the cooling member 500 .

Hereinafter, an assembly process of an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention will be described in detail with reference to the drawings.

4 is a flowchart illustrating a method of assembling an assembly structure of an electronic control device for a vehicle according to an embodiment of the present invention.

First, a housing 100 composed of a penetrating portion 110 extending from one end to the other end and a wing portion 120 is prepared (S110).

Then, a plurality of IGBT modules 200 are soldered to the PCB 400 (S120).

A heat transfer fin 210 extends from the IGBT module 200, and an end in a direction in which the PCB 400 is disposed is bent toward the PCB 400.

Also, the ends of the bent heat transfer fins 210 pass through the PCB 400 .

Subsequently, the cooling member 500 is coupled to the lower surface of the PCB 400 to which the IGBT module 200 is connected (S130).

Specifically, a hook part 540 is formed on the upper surface of the cooling member 500, and the hook part 540 penetrates the PCB 400 seated on the upper surface of the extension part 530 to penetrate the upper surface of the PCB 400. It is fixed to (S140).

That is, the hook unit 540 couples the cooling member 500 to the PCB 400 in a hook-coupled manner.

Subsequently, the cooling member 500 to which the PCB 400 is coupled is inserted into the sliding groove 111 formed in the lower portion of the through part 110 in a sliding manner (S150).

At this time, the IGBT module 200 soldered to the PCB 400 is inserted into the wing portion 120 of the housing 100.

And, the IGBT module 200 inserted into the wing part 120 is coupled to the wing part 120 by a caulking method.

For this reason, in the assembly structure of the electronic control device for a vehicle according to an embodiment of the present invention, the IGBT module 200 is fixed to the wing part 120 of the housing 100 by a caulking method, thereby reducing costs by removing screw parts. And the assembly process can be simple.

In addition, the heat transfer fins 210 extending from the IGBT module 200 and penetrating the PCB 400 are located in the receiving groove 550 formed by the base portion 510 and the extension portion 530 constituting the cooling member 500. inserted

Meanwhile, a heat dissipation pad 300 may be disposed between the lower surface of the IGBT module 200 on the wing portion 120 .

Subsequently, the heat transfer member 560 is filled in the cooling member 500 (S160).

Specifically, the receiving groove 550 formed by the base portion 510 and the extension portion 530 constituting the cooling member 500 is filled.

At this time, the end of the heat transfer fin 210 already inserted into the receiving groove 550 is locked into the heat transfer member 560 .

Since the IGBT module 200 is connected to the heat transfer member 560 through the heat transfer pin 210, the IGBT module 200 and the heat transfer member 560 can easily exchange heat with each other.

Due to this, the structure of the heat transfer member 560 and the heat transfer fin 210 of the present invention includes the heat dissipation pad 300 disposed between the IGBT module 200 and the wing portion 120 to accommodate the cooling member 500. The IGBT module 200 can be cooled more effectively by the heat transfer member 560 accommodated in the groove 550 .

In addition, a communication hole 511 penetrating the base portion 510 and the sliding protrusion 520 is formed in the cooling member 500 , and a fine gap is formed between the sliding protrusion 520 and the sliding groove 111 .

Therefore, when the heat transfer member 560 is filled in the receiving groove 550 formed by the base portion 510 and the extension portion 530, the base portion 510 and the sliding protrusion 520 pass through the communication hole 511. is introduced

Then, the heat transfer member 560 introduced through the communication hole 511 is introduced into a fine gap formed between the sliding protrusion 520 and the sliding groove 111 .

Due to this, the assembly structure of the electronic control device for a vehicle of the present invention sufficiently cools the outer circumferential surface of the cooling member 500 by the heat transfer member 560 introduced between the communication hole 511 and the fine gap to cool the IGBT module 200. Efficiency can be further increased.

As such, the embodiments disclosed in this specification should be considered from an illustrative point of view rather than a limiting point of view. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the equivalent range should be construed as being included in the present invention.

100: housing 110: through part
111: sliding groove 120: wing
121: heat dissipation fin 200: IGBT module
210: heat transfer pin 300: heat dissipation pad
400: PCB 500: cooling member
510: base part 511: communicating hole
520: sliding protrusion 530: extension
540: hook part 550: receiving groove
560: heat transfer member

Claims (16)

A housing composed of a penetrating part extending from one end to the other end and wing parts extending from both ends of the penetrating part;
A plurality of IGBT modules (INSULATED GATE BIPOLAR TRANSISTOR) spaced apart and fixed at a distance from each other in the direction from one end to the other inside the wing;
PCB (printed circuit board: PRINTED CIRCUIT BOARD) accommodated inside the through portion;
An assembly structure of an electronic control device for a vehicle including a cooling member disposed inside the through-hole at a lower portion to support the PCB and connected to the IGBT module to cool the IGBT module by a heat exchange method.
According to claim 1,
The IGBT module is an assembly structure of an electronic control device for a vehicle, each of which is fixed to the wing by a caulking method.
According to claim 1,
An assembly structure of an electronic control device for a vehicle, wherein sliding grooves to which the cooling member is coupled in a sliding manner are formed at both sides of the lower portion of the through portion.
According to claim 1,
An assembled structure of an electronic control device for a vehicle, wherein a heat radiating fin is formed on a lower surface of the wing portion to radiate heat generated from the IGBT module to the outside of the housing.
The method of claim 1, wherein the IGBT module,
An assembly structure of an electronic control device for a vehicle comprising heat transfer fins extending from a surface in a direction in which the cooling member is disposed and inserted into the cooling member.
According to claim 5,
The heat transfer fin exchanges heat between the IGBT module and the cooling member.
The method of claim 6, wherein the cooling member,
a base portion constituting a body;
a sliding protrusion formed on a lower surface of the base portion and slidably engaged with the sliding groove;
Extension portions extending upward from both ends of the base portion, respectively; and
An assembly structure of an electronic control device for a vehicle including a hook portion extending from an upper surface of the extension portion in a direction in which the PCB is disposed and coupled to the PCB.
According to claim 7,
The heat transfer fin is bent in the direction of the PCB, passes through the PCB, and is inserted into a receiving groove formed by the base part and the extension part.
According to claim 8,
An assembly structure of an electronic control device for a vehicle, wherein the receiving groove is filled with a heat transfer member for cooling the IGBT module.
According to claim 9,
An assembly structure of an electronic control device for a vehicle in which a fine gap is formed between the sliding groove and the sliding protrusion.
According to claim 10,
The cooling member further includes a communication hole passing through the base, and the heat transfer member is filled between the sliding groove and the sliding protrusion through the communication hole.
According to claim 7,
The hook part penetrates the PCB and is coupled to the PCB in a hook-coupled manner.
Preparing a housing composed of a penetrating part extending from one end to the other end and a wing part;
Soldering a plurality of IGBT modules to the PCB;
coupling a cooling member to a lower surface of the PCB;
fixing the PCB to the cooling member by penetrating the hook portion of the cooling member through the PCB;
inserting the cooling member into a sliding groove formed at a lower portion of the through part in a sliding manner; and
A method of assembling an assembly structure of an electronic control device for a vehicle comprising the step of filling the cooling member with a heat transfer member.
According to claim 13,
In the step of inserting the cooling member into the sliding groove formed in the lower part of the through part in a sliding manner, the IGBT module soldered to the PCB is inserted into the wing part.
According to claim 14,
A method of assembling an assembly structure of an electronic control device for a vehicle, wherein each of the plurality of IGBT modules inserted into the wing is fixed by a caulking method.
According to claim 13,
The step of filling the heat transfer member in the cooling member,
A method of assembling an assembly structure of an electronic control device for a vehicle filled between the sliding groove and the sliding groove through the receiving groove of the cooling member and the communication hole of the cooling member.

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