WO2018079141A1

WO2018079141A1 - Heat-dissipating structure and onboard power supply device using same

Info

Publication number: WO2018079141A1
Application number: PCT/JP2017/034039
Authority: WO
Inventors: 篤史一瀬
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2016-10-24
Filing date: 2017-09-21
Publication date: 2018-05-03
Also published as: DE112017005354T5; JP2018074618A; CN209692641U

Abstract

A heat-dissipating structure has a first housing, a second housing, a first heat-dissipating fin and/or a second heat-dissipating fin, and a connecting part. The first housing contains a first heat-generating component, and the second housing contains a second heat-generating component. The first heat-dissipating fin is provided on an outer surface of the first housing, and the second heat-dissipating fin is provided on an outer surface of the second housing. The connecting part thermally connects the first housing and the second housing via the first heat-dissipating fin and/or the second heat-dissipating fin.

Description

Heat dissipating structure and in-vehicle power supply using the same

The present disclosure relates to a heat dissipation structure and an in-vehicle power supply device.

In recent years, power supply devices such as inverter devices and charging devices used in electric vehicles have been increasingly requested to be smaller and lighter in order to increase the cruising range. However, power semiconductors used in inverter devices and charging devices do not reduce the amount of heat generated even if they are reduced in size, so it is necessary to further increase the heat dissipation power of the downsized housing itself.

Patent Document 1 discloses a heat dissipation structure for effectively cooling an inverter device and a charging device using cooling water.

Japanese Patent Laid-Open No. 7-038025

By the way, in an electric vehicle (for example, a micro electric vehicle (EV), an electric commuter), there is a vehicle that does not include cooling water because an engine is not used. In such a vehicle, when applying a heat dissipation structure using cooling water as in Patent Document 1, it is necessary to separately provide a cooling water facility, which not only leads to an increase in cost but also affects the shape of the vehicle body. Squeeze the indoor space.

On the other hand, even in a vehicle equipped with cooling water, routing the circulation circuit for circulating the cooling water inside the vehicle will affect the shape of the vehicle body as described above. There is also a demand for a configuration that uses as little cooling water as possible.

This disclosure provides a heat dissipation structure and an in-vehicle power supply device that can realize good heat dissipation characteristics without using cooling water.

The heat dissipation structure of the present disclosure includes a first casing, a second casing, at least one of a first radiating fin and a second radiating fin, and a connecting portion. The first housing stores the first heat generating component, and the second housing stores the second heat generating component. The first heat radiating fin is provided on the outer surface of the first housing, and the second heat radiating fin is provided on the outer surface of the second housing. The connection part thermally couples the first housing and the second housing via at least one of the first heat radiation fin and the second heat radiation fin.

According to the heat dissipation structure according to the present disclosure, good heat dissipation characteristics can be realized without using cooling water.

The perspective view which looked at the thermal radiation structure concerning a 1st embodiment from the upper part The perspective view which looked at the thermal radiation structure shown in FIG. 1 from the downward direction Side view of the heat dissipation structure shown in FIG. FIG. 1 is a plan view of the heat dissipation structure shown in FIG. The figure explaining operation | movement of the thermal radiation structure shown in FIG. The figure explaining other operation | movement of the thermal radiation structure shown in FIG. The figure which shows typically the heat dissipation structure which concerns on the modification 1 of 1st Embodiment. The figure which shows typically the heat dissipation structure which concerns on the modification 2 of 1st Embodiment. The figure which looked at the case of the heat dissipation structure concerning a 2nd embodiment from the upper part The figure which looked at the case of the heat dissipation structure shown in Drawing 9 from the lower part Side view of heat dissipation structure shown in FIG. Side surface sectional drawing of the thermal radiation structure shown in FIG.

(First embodiment)
Hereinafter, an example of the configuration of the heat dissipation structure according to the present embodiment will be described with reference to FIGS. 1 to 4.

FIG. 1 is a perspective view of the heat dissipation structure as viewed from above. FIG. 2 is a perspective view of the heat dissipation structure as viewed from below. FIG. 3 is a side view of the heat dissipation structure. FIG. 4 is a plan view of the heat dissipation structure at a position between the housing 2a and the housing 2b. In addition, the right figure of FIG. 3 is the figure which expanded the area | region enclosed with the dotted line of the left figure.

The heat dissipation structure according to the present embodiment is applied to, for example, an in-vehicle power supply device, and is used to dissipate heat generated by a power supply circuit such as an inverter device or a charging device to the outside.

The power supply device according to the present embodiment includes a housing 2a that stores the heat generating component 1a and a housing 2b that stores the heat generating component 1b. And the power supply device which concerns on this embodiment has the

radiation fins

3a and 3b, the

connection parts

4a and 4b, and the fan 5 as a structure for radiating the heat | fever from the heat-emitting component 1a and the heat-generating component 1b. Note that at least one of the heat generating

components

1a and 1b corresponds to a power supply circuit.

The heat generating component 1a, the heat radiating fin 3a, and the connecting portion 4a are provided in the upper housing 2a, and the heat generating component 1b, the heat radiating fin 3b, and the connecting portion 4b are provided in the lower housing 2b. However, it is needless to say that the housing 2a and the housing 2b may be arranged on the left and right instead of being arranged on the top and bottom.

The heat generating component 1a is a heating element housed in the upper casing 2a, and the heating component 1b is a heating element stored in the lower casing 2b.

As the heat generating

components

1a and 1b, from the viewpoint of heat radiation characteristics described later, a heat generating component that performs mutual exclusive operation (represents that there is no state in which both operate simultaneously; the same applies hereinafter), or a heat generating component that generates a different amount of heat. It is desirable that a combination be applied. Examples of the combination of the

heat generating components

1a and 1b that perform the exclusive operation include an inverter device and a charging device (hereinafter also referred to as “inverter device 1a” and “charging device 1b”).

The inverter device 1a is a power supply circuit for supplying electric power from a vehicle-mounted battery (not shown) to the motor, and has a large heat generation amount in a power element that controls electric power. Moreover, the charging device 1b is a power supply circuit for charging an in-vehicle battery from an external commercial power supply or the like, and has a large heat generation amount in a power element or a reactor that controls electric power. The inverter device 1a is a power circuit that operates mainly during vehicle travel, and the charging device 1b is a power circuit that operates mainly during charging when the vehicle is stopped. That is, both have an exclusive operation.

However, it goes without saying that the heat generating

components

1a and 1b may be other combinations such as an inverter device and a DCDC converter device. Further, both the heat generating

components

1a and 1b do not necessarily have to be power circuits, and either one may be a power circuit, and the other may be a heat generating component other than the power circuit such as a motor.

The

housings

2a and 2b are housed in a sealed state in order to protect the electrical devices (inverter device, charging device, electronic device, etc.) to be stored from surrounding moisture and the like (in FIGS. 1 and 2) For convenience of explanation, a part of the wall surface is omitted). These electric devices may be the heat generating

components

1a and 1b themselves, or may be other electronic devices or the like housed together with the heat generating

components

1a and 1b.

The housing 2a and the housing 2b are arranged adjacent to each other in the vertical direction. And the housing | casing 2a and the housing | casing 2b each have the radiation fin 3a and the radiation fin 3b in the outer surface which mutually opposes.

In the

casings

2a and 2b, at least the wall surface on the side where the

radiation fins

3a and 3b are formed is made of a member having high thermal conductivity (for example, aluminum material). Further, the heat generating

components

1a and 1b are arranged so that at least a part thereof contacts these wall surfaces. As a result, the heat generated by the heat generating

components

1a and 1b is transmitted from the wall surfaces of the

housings

2a and 2b to the

heat radiation fins

3a and 3b, and is radiated to the outside.

Here, for example, the

casings

2a and 2b and the

radiation fins

3a and 3b are integrally formed by die casting. Thereby, compared with the case where the heat radiation fin by which extrusion molding was carried out is separately installed in a housing | casing, it can form cheaply. However, in die casting, it is difficult to make the interval (fin pitch) between the protrusions of the heat radiating fins finer, and the heat radiating performance is inferior compared to extrusion molding.

Therefore, in the present disclosure, the housing 2a and the housing 2b are arranged so that the heat dissipating fins 3a of the housing 2a and the heat dissipating fins 3b of the housing 2b are alternately arranged, and the heat dissipating fins 3a of the housing 2a are disposed in the housing. The heat dissipating fins 3b of the housing 2b are in contact with the housing 2a in contact with the body 2b. As a result, it is possible to dissipate the heat generated in the housing 2a or the housing 2b using both the heat radiation fins 3a of the housing 2a and the heat radiation fins 3b of the housing 2b, without using cooling water. Inexpensive and good heat dissipation characteristics can be realized.

The upper radiating fins 3a are formed on the outer surface of the housing 2a, and the lower radiating fins 3b are formed on the outer surface of the housing 2b. As will be described later, the heat radiating fins 3a and 3b integrally dissipate heat generated by the heat generating

components

1a and 1b to the outside.

More specifically, the upper radiating fin 3a is formed by a plurality of protrusions formed on the lower surface of the upper casing 2a. The protrusions of the heat radiating fins 3a extend to a position where they contact the upper surface of the lower housing 2b, and are thermally coupled to the housing 2b through the connection portions 4a.

Similarly, the lower radiating fin 3b is formed by a plurality of protrusions formed on the upper surface of the lower casing 2b. The protrusions of the heat radiating fins 3b extend to a position where they contact the lower surface of the lower housing 2a, and are thermally coupled to the housing 2a via the connecting portions 4b.

The protrusions of the upper radiating fins 3a and the protrusions of the lower radiating fins 3b are arranged so as to be alternately combined in a state of being separated from each other (see FIG. 4). Further, the protrusions of the upper radiating fins 3 a and the protrusions of the lower radiating fins 3 b both have a plate shape, and are arranged in parallel so that the longitudinal plate surface is along the blowing direction of the fan 5. ing.

Note that the radiating

fins

3a and 3b may have other shapes such as a pin shape instead of the plate shape. However, when the projections of the

heat radiating fins

3a and 3b have other shapes, similarly, it is desirable to arrange them so as to be alternately combined in a state of being separated from each other.

The

heat radiation fins

3a and 3b are both formed integrally with the

housings

2a and 2b by die casting. As a result, the strength and sealing performance of the

housings

2a and 2b are ensured, and the housing 2a and the radiation fins 3a can be integrally molded, and the housing 2b and the radiation fins 3b can be integrally molded. In addition, the manufacturing process for forming the

housings

2a and 2b and the

radiation fins

3a and 3b can be simplified. The radiating

fins

3a and 3b are formed of an aluminum material or the like, similarly to the

casings

2a and 2b.

The connecting portion 4a thermally couples the upper radiating fin 3a and the lower casing 2b. Further, the connecting portion 4b thermally couples the lower radiating fin 3b and the upper casing 2a.

More specifically, the connecting portion 4a is provided at the tip of the upper radiating fin 3a, and connects the upper radiating fin 3a and the outer surface of the lower casing 2b. Further, the connecting portion 4b is provided at the tip of the lower radiating fin 3b, and connects the lower radiating fin 3b and the outer surface of the upper casing 2a. The connecting

portions

4a and 4b connect the members using, for example, soldering, welding, a heat radiation adhesive, aluminum brazing, or the like so that heat conduction between the members is performed satisfactorily. As the

connection portions

4a and 4b, those having a high thermal conductivity are particularly desirable.

The connecting

portions

4a and 4b may be configured to connect the radiating fins 3a and the radiating fins 3b instead of connecting the tips of the radiating

fins

3a and 3b and the outer surfaces of the

housings

2a and 2b.

The fan 5 is attached to the outside of the

housings

2a and 2b, and blows air toward the position where the

radiation fins

3a and 3b are provided. More specifically, the fan 5 blows air along the longitudinal direction of the plate-like

heat radiation fins

3a and 3b. In the present embodiment, by providing the fan 5, heat exchange between the

heat radiation fins

3a and 3b and the air is promoted to improve heat radiation characteristics. If the coolant is used, the solder material and heat-dissipating adhesive of the connecting

portions

4a and 4b are dissolved in the coolant, resulting in poor heat transfer between the members, debris is generated, and the coolant is There is a risk of falling into a bad state.

The fan 5 is not limited to the blower fan but may be a suction fan. In addition, the fan 5 can be omitted when sufficient heat dissipation characteristics can be obtained even by natural convection, such as when the power supply device is disposed at a position where air flowing through the vehicle hits.

[Heat dissipation of power supply]
The present inventors have intensively studied in order to realize good heat dissipation characteristics and downsizing, and the heat generating component 1a and the heat generating component 1b such as an inverter device and a charging device mounted on a vehicle are not necessarily operated simultaneously. In addition, the heat generating component 1a and the heat generating component 1b pay attention to the point that they do not emit the same amount of heat, and have arrived at the heat dissipation structure described above.

5 and 6 are diagrams for explaining the heat radiation operation of the power supply device.

FIG. 5 is a diagram for explaining an example of the heat radiation operation while the vehicle is running. While the vehicle is running, the inverter device 1a operates to supply power to the motor, while the charging device 1b does not operate. Therefore, only the inverter device 1a is in a state of generating heat.

The heat generated by the inverter device 1a is radiated to the outside through the bottom surface of the upper casing 2a and the heat radiation fins 3a. Further, since the upper casing 2a is hotter than the lower radiating fins 3b, the heat generated by the inverter device 1a is simultaneously applied to the lower radiating fins 3b via the connecting portions 4b. Communicated. In addition, the arrow in FIG. 5 represents the heat flow at this time.

That is, the heat generated by the inverter device 1a is radiated to the outside from both the upper radiating fins 3a and the lower radiating fins 3b. As a result, the surface area for dissipating the heat generated by the inverter device 1a is larger than in the case where heat is radiated only from the upper radiating fins 3a, and the amount of heat that can be radiated per unit time is also increased.

FIG. 6 is a diagram illustrating an example of a heat radiation operation during charging when the vehicle is stopped. During charging when the vehicle is stopped, the charging device 1b operates while the inverter device 1a does not operate. Therefore, only the charging device 1b is in a state of generating heat.

The heat generated by the charging device 1b is radiated to the outside through the upper surface of the lower housing 2b and the radiation fins 3b. Further, since the lower casing 2b is in a higher temperature than the upper radiating fins 3a, the heat generated by the charging device 1b is simultaneously applied to the upper radiating fins 3a via the connecting portions 4a. introduce. In addition, the arrow in FIG. 6 represents the heat flow at this time.

That is, the heat generated by the charging device 1b is radiated from both the upper radiating fin 3a and the lower radiating fin 3b. As a result, the surface area for dissipating the heat generated by the charging device 1b is larger than in the case where heat is radiated only from the lower radiating fins 3b, and the amount of heat radiated per unit time is also increased.

In addition, said effect is mainly based on the

connection parts

4a and 4b, and originates in the speed of the heat transfer between metals being very large compared with the speed of the heat transfer between a metal and air. . Therefore, if the

connection portions

4a and 4b are not provided, a gap is formed between the outer surface of the housing 2a and the heat radiating fins 3b or between the outer surface of the housing 2b and the heat radiating fins 3a. As a result, the speed at which heat is transferred from the housing 2a to the lower radiating fin 3b or the speed at which heat is transferred from the housing 2b to the upper radiating fin 3a is considerably reduced, and good heat dissipation characteristics are obtained. It will be in an unobtainable state.

However, the above-described effects can be obtained even when the

heat generation components

1a and 1b have different heat generation amounts or the

heat dissipation fins

3a and 3b, even if the heat generation components that perform the exclusive operation like the inverter device 1a and the charging device 1b are not combined. If the heat dissipating power is different, it can also be exerted on those that generate heat at the same time.

For example, when the heat generating component 1a is an inverter device and the heat generating component 1b is a battery, the inverter device and the battery generate heat at the same time. However, since the heat generation amount of the battery is small, the heat generated by the inverter device is radiated downward on the battery side. It transmits to the fin 3b. As a result, similarly to the above, the heat generated by the inverter device is radiated from both the upper side radiating fins 3a and the lower side radiating fins 3b, and good heat radiating characteristics can be ensured.

As described above, the heat dissipating structure according to the present embodiment thermally couples the upper heat dissipating fins 3a and the lower housing 2b via the connecting portions 4a and also lowers them via the connecting portions 4b. The heat radiation fins 3b on the side and the housing 2a on the upper side are thermally coupled. Therefore, the heat generated by the

heat generating components

1a and 1b is distributed to the heat radiating fins 3a and the heat radiating fins 3b and radiated from both. As a result, the heat dissipation characteristics of the power supply device as a whole can be improved.

Further, according to the heat dissipation structure according to the present embodiment, the protrusions of the upper heat dissipating fins 3a and the protrusions of the lower heat dissipating fins 3b are alternately combined in a state where at least some of them are separated from each other. It is arranged so that. As a result, the air blown from the fan 5 can be made to flow smoothly, and the density of the number of protrusions of the

heat radiation fins

3a and 3b can be increased, so that downsizing and improvement of heat radiation characteristics can be achieved. In particular, since the radiating

fins

3a and 3b according to the present embodiment are formed by die casting, there is a limit to downsizing the radiating fins and reducing the fin pitch. In this respect, with the above-described configuration, it is possible to configure a heat dissipation structure that is small and has excellent heat dissipation characteristics.

In addition, since the heat dissipation structure according to the present embodiment employs air cooling, cooling equipment such as a cooling water circulation circuit and a circulation pump is unnecessary, and space saving and cost reduction can be achieved.

In the above embodiment, as an example of the heat radiating structure, the connection portion 4a and the connection portion 4b are used to thermally couple the two

casings

2a and 2b. However, even if only one of the connection portion 4a and the connection portion 4b is used, it is possible to improve certain heat dissipation characteristics.

On the other hand, in addition to the

housings

2a and 2b, when the housing is disposed adjacent to the housings, a heat radiating fin and a connecting portion may be provided for the housing. In this way, by thermally coupling a plurality of housings, the heat dissipation characteristics can be further improved while ensuring the degree of freedom of design.

(Modification 1 of the first embodiment)
In the above embodiment, the upper radiating fin 3a is thermally coupled to the outer surface of the housing 2b via the connecting portion 4a, and the lower radiating fin 3b is connected to the outer surface of the housing 2a via the connecting portion 4b. The embodiment is shown in which it is thermally coupled with. However, the heat radiating structure for sharing the heat radiating fins between the housing 2a and the housing 2b may be in another form.

FIG. 7 is a diagram schematically showing a heat dissipation structure according to the first modification. FIG. 7 shows a side sectional view of the heat dissipation structure.

The heat dissipating structure according to Modification 1 is different from the above embodiment in that the heat dissipating fins 3a and the heat dissipating fins 3b are connected via the connecting portions 4c. In addition, description is abbreviate | omitted about the structure which is common in the said embodiment (Hereafter, it is the same also about other embodiment).

More specifically, the radiating fin 3a and the radiating fin 3b are disposed so as to face each other, as in the above-described embodiment, and the tip end portion of the radiating fin 3a and the tip end portion of the radiating fin 3b define the connection portion 4c. It is the structure connected via. In other words, the connection portion 4c thermally couples the heat radiating fins 3a and the heat radiating fins 3b.

Also with such a configuration, heat transfer occurs between the heat radiating fins 3a and the heat radiating fins 3b, and heat generated by the

heat generating components

1a and 1b can be integrally dissipated to the outside. This configuration is suitable, for example, when the housing 2a and the housing 2b are separated to some extent.

(Modification 2 of the first embodiment)
FIG. 8 is a diagram schematically illustrating a heat dissipation structure according to the second modification. FIG. 8 shows a side sectional view of the heat dissipation structure.

The heat dissipating structure according to Modification 2 is different from the above embodiment in that the heat dissipating fins are formed only on one of the

housings

2a and 2b.

More specifically, the case 2a has the heat radiating fins 3a, and the heat radiating fins 3a are thermally coupled to the case 2b via the connecting portions 4a, as in the above embodiment. On the other hand, the housing 2b has a configuration that does not have heat radiating fins.

Even with such a configuration, heat transfer is generated in the radiating fins 3a via the connecting portions 4a, and the heat generated by the

heat generating components

1a and 1b can be integrally dissipated to the outside. This configuration is effective in that, for example, when it is possible to make the interval (fin pitch) between the protrusions of the heat radiating fins 3a fine, it is not necessary to provide the heat radiating fins on the other housing 2b.

(Second Embodiment)
Next, a heat dissipation structure according to the second embodiment will be described with reference to FIGS. The heat dissipating structure according to the present embodiment is different from the first embodiment in that it has a conducting portion 7 and an opening portion 8 for conducting the conductive wire 6 between the housing 2a and the housing 2b. Note that a description of the same configuration as in the first embodiment is omitted.

FIG. 9 is a view of the housing 2a of the heat dissipation structure according to the present embodiment as viewed from above. FIG. 10 is a view of the housing 2b of the heat dissipation structure according to the present embodiment as viewed from below. FIG. 11 is a side view of the heat dissipation structure according to the present embodiment. FIG. 12 is a diagram schematically showing a cross-sectional side view of the heat dissipation structure according to the present embodiment.

In the present embodiment, an electric circuit including the heat generating component 1a accommodated in the housing 2a (hereinafter also referred to as “electric circuit 1a”) and an electric circuit including the heat generating component 1b accommodated in the housing 2b (hereinafter referred to as “electrical”). The circuit 1b "is also electrically connected by a conductive line 6 (for example, a bus bar).

The conducting portion 7 and the opening 8 are configured to route the conductive wire 6 between them while maintaining the inside of the housing 2a and the inside of the housing 2b in a sealed state.

The conducting portion 7 according to the present embodiment is a cylindrical protrusion that is formed integrally with the housing 2a on the lower surface of the housing 2a and protrudes toward the housing 2b. The opening 8 is an opening formed on the upper surface of the housing 2b and leading to the inside of the housing 2b.

The conducting portion 7 extends to the upper surface of the housing 2 b and is connected to the upper surface of the housing 2 b at the position of the opening 8. And the hollow area | region inside the conduction | electrical_connection part 7 is connected with the opening part 8 formed in the upper surface of the housing | casing 2b. In addition, a conductive wire 6 having one end connected to the electric circuit 1a of the housing 2a and the other end connected to the electric circuit 1b of the housing 2b is disposed in the hollow region inside the conducting portion 7.

Here, the conducting portion 7 and the housing 2b are connected so that the inside of the conducting portion 7 is sealed by a connecting portion 4d such as solder, welding, or aluminum brazing. Thereby, the conduction | electrical_connection part 7 for electrically connecting the electric circuit 1a and the electric circuit 1b can be contributed to a heat dissipation improvement, maintaining the waterproofness inside the housing | casing 2a and the housing | casing 2b. In addition, by configuring the connection portion 4d and the

connection portions

4a and 4b with the same member, the

connection portions

4a and 4b and the connection portion 4d can be formed in the same manufacturing process, which contributes to a reduction in manufacturing cost. To do.

Although specific examples of the present disclosure have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

For example, in the above-described embodiment, the configuration in which the connection portions (4a, 4b) are provided in all the radiation fins (3a, 3b) is exemplified. However, as the configuration in which the connection portions (4a, 4b) are provided only in some of the radiation fins. Also good.

Further, for example, when the heat generation amount of the heat generating component 1a (electric circuit 1a) stored in the housing 2a is large and the heat generation amount of the heat generating component 1b (electric circuit 1b) stored in the housing 2b is small, heat is radiated from the housing 2a. You may provide a connection part (4a, 4b) so that it may carry out easily. Specifically, taking FIG. 5 as an example, only the connection portion 4b (thermal connection between the housing 2a and the heat radiation fin 3b) may be provided, and the connection portion 4a may not be provided.

Further, for example, when only a part of the heat generating component 1a (electric circuit 1a) housed in the housing 2a has a large heat generation amount, the connection portions (4a, 4b) are provided only in the vicinity of the component having a large heat generation amount, and other heat generation is performed. It is good also as a structure which does not provide a connection part (4a, 4b) in a location with small quantity.

As described above, the heat dissipation structure according to the first and second embodiments includes the first housing 2a, the second housing 2b, at least one of the

heat dissipation fins

3a and 3b, and the connection portion. The first housing 2a houses the first heat generating component 1a, and the second housing 2b houses the second heat generating component 1b. The radiation fin 3a that is the first radiation fin is provided on the outer surface of the first housing 2a, and the radiation fin 3b that is the second radiation fin is provided on the outer surface of the second housing 2b. The connecting portion thermally couples the first housing 2a and the second housing 2b via at least one of the

heat radiation fins

3a and 3b. According to this heat dissipation structure, the heat dissipation characteristics of the entire power supply device can be improved.

Moreover, the radiation fin 3a is formed in the outer surface of the 1st housing | casing 2a, the radiation fin 3b is formed in the outer surface of the 2nd housing | casing 2b, and the connection part 4a is at least one part of the radiation fin 3a, the 2nd housing | casing 2b, May be thermally coupled.

Alternatively, the first housing 2a may store a first electric circuit including the first heat generating component 1a, and the second housing 2b may store a second electric circuit including the second heat generating component 1b. In this case, a conducting portion 7 for conducting the first electric circuit and the second electric circuit is formed on the outer surface of the first housing 2a, and an opening corresponding to the conducting portion 7 is formed on the outer surface of the second housing 2b. The part 8 is formed, and the conduction part 7 and the opening 8 may be coupled by the connection part 4d.

The heat dissipation structure may further include a connection portion 4b that thermally couples at least a part of the heat dissipation fins 3b of the second casing 2b and the first casing 2a.

In this heat dissipation structure, the first casing 2a and the second casing 2b may be disposed adjacent to each other so that the outer surfaces on which the

heat dissipation fins

3a and 3b are formed face each other. .

In this heat dissipation structure, the

heat dissipation fins

3a and 3b of the first casing 2a and the second casing 2b may each be formed by a plurality of protrusions. In this case, the first housing 2a and the second housing 2b may be arranged so that at least a part of the plurality of protrusions of the

respective radiation fins

3a and 3b are alternately assembled in a state of being separated from each other. . According to this heat radiating structure, it is possible to smoothly flow the air from the fan 5 and increase the density of the number of protrusions of the

heat radiating fins

3a and 3b, thereby reducing the size and improving the heat radiating characteristics.

Further, in this heat dissipation structure, even if the heat generated by the first heat generating component 1a or the second heat generating component 1b is dissipated through the air flowing through the region where the

heat dissipating fins

3a, 3b are disposed. Good.

In this heat dissipation structure, the first power supply component 1a first power supply circuit and the second power supply circuit including the second heat generation component 1b may perform an exclusive operation. Thus, the heat dissipation structure can be suitably used for a heat generating component.

Further, in this heat dissipation structure, the first heat generating component 1a and the second heat generating component 1b may have different heat generation amounts during operation. Thus, the heat dissipation structure can be suitably used for a heat generating component.

In this heat dissipation structure, at least one of the first casing 2a and the second casing 2b may be integrally formed with the

heat dissipation fins

3a and 3b by die casting. This heat dissipating structure is suitable from the viewpoints of hermeticity, miniaturization, manufacturing cost, and the like.

In this heat dissipation structure, the connecting portion 4a includes a solder material, a welded portion, a heat dissipation adhesive, and an aluminum brazing portion that connect the tips of the heat dissipation fins 3a of the first casing 2a and the outer surface of the second casing 2b. It may contain at least one of.

The present disclosure can be suitably used as a heat dissipation structure.

1a Heat-generating parts (electric circuit, inverter device)
1b Heat-generating parts (electric circuit, charging device)
2a,

2b Housings

3a,

3b Radiation fins

4a, 4b, 4c, 4d Connection part 5 Fan 6 Conductive wire 7 Conductive part 8 Opening part

Claims

A first housing that houses a first heat-generating component;
A second housing that houses the second heat generating component;
At least one of a first radiating fin provided on the outer surface of the first casing and a second radiating fin provided on the outer surface of the second casing;
A connecting portion that thermally couples the first housing and the second housing via at least one of the first heat radiating fin and the second heat radiating fin;
Heat dissipation structure.
The first heat dissipating fin is provided on the outer surface of the first housing;
The second radiating fin is provided on the outer surface of the second casing;
The connecting portion thermally couples at least a part of the first heat radiation fin and the second housing,
The heat dissipation structure according to claim 1.
A conductive portion that is provided on the outer surface of the first housing and connects the first electric circuit including the first heat generating component and the second electric circuit including the second heat generating component;
An opening corresponding to the conducting portion is provided on the outer surface of the second housing.
The conduction portion and the opening are coupled at the connection portion,
The heat dissipation structure according to claim 1 or 2.
A second connection portion that thermally couples at least a part of the second heat radiation fin and the first housing;
The heat dissipation structure according to claim 2.
The first housing and the outer surface of the first housing so that the outer surface of the first housing is formed and the outer surface of the second housing of the second housing are formed with the second heat radiating fin. A second housing is disposed adjacent to the second housing;
The heat dissipation structure according to claim 4.
Each of the first radiating fin and the second radiating fin includes a plurality of protrusions,
The first housing such that at least a part of the plurality of protrusions of the first radiating fin and at least a part of the plurality of protrusions of the second radiating fin are alternately assembled in a state of being separated from each other. And the second housing are disposed,
The heat dissipation structure according to claim 5.
The heat generated by the first heat generating component and the second heat generating component is dissipated through the air flowing through the area where the first heat dissipating fin and the second heat dissipating fin are disposed.
The heat dissipation structure according to claim 5.
The first housing is at least one of a first heat radiating fin and a die cast, or the second housing is at least one of a second heat radiating fin and a die cast.
The heat dissipation structure according to claim 1.
The said connection part contains at least any one of the solder material which connects the front-end | tip of the said 1st radiation fin and the outer surface of the said 2nd housing | casing, a welding part, a thermal radiation adhesive agent, and an aluminum brazing part. Heat dissipation structure.
A heat dissipating structure according to claim 1;
A first electric circuit including the first heat generating component and housed in the first housing;
A second electric circuit including the second heat generating component and housed in the second housing.
In-vehicle power supply.
The first electric circuit and the second power supply circuit perform mutually exclusive operations.
The in-vehicle power supply device according to claim 10.
The amount of heat generated during operation of the first heat generating component is different from the amount of heat generated during operation of the second heat generating component.
The in-vehicle power supply device according to claim 10.