JP2014192229A - Electronic controller for vehicle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic controller for a vehicle, which is able to ensure the degree of freedom in the design of a vehicle such as two-wheeled motor vehicle and which is also able to improve cooling performance by air cooling even in a case where the controller is mounted in a place nearly sealed such as the body cover of the vehicle.SOLUTION: An electronic controller 10 for a vehicle comprises: a substrate on which a heat generating components 40 and high components 50 are mounted in first and second lines, respectively, which are parallel one with the other; a metal case 20 accommodating the substrate; a heat-generating component fixing part provided on the internal surface side of the metal case 20 and used for fixing the heat-generating components 40; a high-component accommodating part provided so as to project further outside the metal case 20 than the heat-generating part fixing part, and accommodating the high components 50; a radiation fin 30 provided on the external surface side of the metal case 20 opposite the heat-generating fixing part. The plurality of fin parts 32 of the radiation fin 30 are arranged so as to extend orthogonal to the first line of the heat generating components 40.

Description

  The present invention relates to an electronic control device for a vehicle, and more particularly to an electronic control device for a vehicle in which a heat sink fin is provided in a case in which a substrate on which a semiconductor element or the like is mounted is accommodated.

  In recent years, in vehicles such as motorcycles and automobiles, electronic control devices for vehicles have been used. However, the mounting layout of the electronic control device for vehicles particularly in motorcycles is housed in a body cover. It is common to be mounted.

  Thus, when the vehicle electronic control device is laid out in the body cover, the vehicle electronic control device cannot be expected to be cooled by the traveling wind. For this reason, in order to improve the heat dissipation by the vehicle electronic control device itself, the vehicle electronic control device is provided with a heat dissipation fin, and the heat dissipation fin is enlarged, in other words, the surface area of the heat dissipation fin is increased. You will not get. However, increasing the surface area of the heat dissipating fins in this way increases the size of the vehicle electronic control unit, so it is necessary to secure a larger storage space, which also affects the design of the motorcycle. It can also be a problem.

  Under such circumstances, Patent Document 1 relates to a vehicle control device, and includes a heat radiating fin on the heat radiating surface of the case, and a shallow concave portion and a deep concave portion are provided in the case so that a semiconductor element generating a large amount of heat is contained in the shallow concave portion. A configuration is disclosed in which a tall control element is accommodated in a deep recess to promote heat dissipation of a semiconductor element that generates a large amount of heat.

Japanese Patent No. 4034937

  However, according to the study by the present inventor, in the configuration disclosed in Patent Document 1, the heat generated from a semiconductor element having a large heat generation such as a field effect transistor is efficiently passed through the heat radiating fin, so that the vehicle electronic control is performed. Although the device can be cooled, the heat generated in this manner is transmitted to the concave control portion, which accommodates the tall control element, specifically, the capacitor, through the radiation fin. Become.

  Here, according to further studies by the present inventor, since the capacitor is a heat-sensitive component, the heat transmitted to the housing portion that houses the capacitor may cause unnecessary thermal influence on the capacitor. It is believed that there is. Such a thermal influence can be suppressed if cooling by cooling air such as traveling wind can be expected, but in particular, in a vehicle electronic control device such as a mounting layout of a vehicle electronic control device for a motorcycle. On the other hand, there is room for further improvement when the driving wind is only slightly applied.

  The present invention has been made through the above-described studies, and it is possible to secure a degree of freedom in design of a vehicle such as a motorcycle and to be mounted at a mounting place close to a sealed state such as in the body cover of the vehicle. However, an object of the present invention is to provide a vehicle electronic control device that can improve the cooling performance by air cooling.

  In order to achieve the above object, the present invention provides a substrate on which a heat generating component and a tall component are respectively mounted in a first row and a second row that are parallel to each other, and a metal case that houses the substrate. And a heat generating component fixing portion that is provided on the inner surface side of the metal case and fixes the heat generating component, and the inner surface of the metal case is protruded toward the outside of the metal case from the heat generating component fixing portion. In a vehicle electronic control device, comprising: a tall component housing portion that is provided on a side and that accommodates the tall component; and a heat radiating fin that is disposed on an outer surface side of the metal case facing the heat generating component fixing portion. The first aspect is that the plurality of fin portions of the heat dissipating fins are vehicle electronic control devices that are arranged so as to extend orthogonal to the first row of the heat generating components. .

  Moreover, this invention makes it 2nd aspect to provide the space | gap part in the boundary of the said radiation fin and the said tall component accommodating part in addition to this 1st aspect.

  According to the present invention, in addition to the first or second aspect, the gap is provided over the entire length of the boundary between the radiating fin and the tall component accommodating portion, and a plurality of fin portions of the radiating fin. It is a third aspect that the refrigerant flow path defined between the two is joined to the gap.

  According to the first aspect of the present invention, the substrate on which the heat-generating component and the tall component are respectively mounted in a first row and a second row that are parallel to each other, a metal case that houses the substrate, A heat-generating component fixing portion that is provided on the inner surface side of the metal case and fixes the heat-generating component, and is provided on the inner surface side of the metal case so as to protrude toward the outside of the metal case from the heat-generating component fixing portion. In the electronic control device for a vehicle comprising a tall component housing portion for housing the heat sink and a heat dissipating fin provided on the outer surface side of the metal case facing the heat generating component fixing portion, the plurality of fin portions of the heat dissipating fins generate heat. Compared to the case where a plurality of fin portions of the radiating fins are arranged in the same direction as the first row of heat generating components by being arranged so as to be orthogonal to the first row of components. Reduce the number of heat generating parts per fin Door can be. For this reason, since the amount of heat received per one fin portion can be kept low, the heat-radiating fins can be reliably and efficiently cooled with a slight air flow, and temperature rise due to heat generation of the semiconductor element can also be suppressed. Moreover, since the length of each fin part of a radiation fin becomes short, the flow path of the airflow which flows between fin parts also becomes short, and the flow path resistance can be reduced. For this reason, even if the air flow rate is small, the air flow can flow without stagnation between the fin portions, and the radiating fins can be reliably and efficiently cooled. In addition, the surface area of the radiating fin on the side facing the tall component housing part can be reduced, and the heat received by the tall component housing part can be reduced. Receiving can be reliably reduced.

  According to the second aspect of the present invention, by providing a gap at the boundary between the radiating fin and the tall component accommodating portion, the plurality of fin portions of the radiating fin are arranged in the same direction as the first row of the heat generating components. Compared to the case where the gap is provided, the surface area of the radiating fin on the side facing the tall component housing portion is suppressed, and the heat received by the tall component housing portion can be reduced, and the tall component housing is achieved. It can reduce reliably that the tall components in a part receive the unnecessary heat influence. In addition, since the heat radiation fin and the tall part housing part are not directly connected by the gap part, heat transfer in a part having high thermal conductivity such as a metal part can be cut off. It is possible to more reliably reduce the heat transferred to the tall component accommodating portion through the radiation fin.

  According to the third aspect of the present invention, the gap is provided over the entire length of the boundary between the radiating fin and the tall component accommodating portion, and the refrigerant flow path defined between the plurality of fin portions of the radiating fin is provided. By joining the gap, the airflow flowing between the fins can merge with the airflow flowing through the gap, and can be smoothly discharged out of the gap. By cooling, the temperature rise due to heat generation of the semiconductor element can be suppressed. In addition, it is possible to reliably and efficiently cool the tall component housing portion and to suppress the temperature rise of the tall component.

It is a figure which shows the mounting position to the vehicle of the electronic control apparatus for vehicles in embodiment of this invention. It is a perspective view which shows the electronic controller for vehicles in this embodiment. Fig.3 (a) is a fragmentary top view which shows the electronic controller for vehicles in this embodiment, FIG.3 (b) is AA sectional drawing of Fig.3 (a).

  Hereinafter, an electronic control device for a vehicle according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate. 2 and 3, the x-axis, y-axis, and z-axis are assumed to form a three-axis orthogonal coordinate system. For convenience of explanation, the x-axis direction corresponds to the front-rear direction, and the z-axis direction is May correspond to the vertical direction.

    FIG. 1 is a diagram illustrating a mounting position of a vehicle electronic control device according to the present embodiment on a vehicle. FIG. 2 is a perspective view showing the vehicle electronic control device according to the present embodiment. Moreover, Fig.3 (a) is a partial top view which shows the electronic controller for vehicles in this embodiment, FIG.3 (b) is AA sectional drawing of Fig.3 (a).

  As shown in FIGS. 1 to 3, the vehicle electronic control device 10 in the present embodiment is typically an ECU (Electronic Control Unit), and is typically mounted on a vehicle 1 that is a motorcycle. The vehicular electronic control device 10 operates with power supplied from a battery (not shown) mounted on the vehicle.

  As shown in FIG. 1, the mounting position of the vehicle electronic control device 10 on the vehicle 1 is typically a case where the vehicle electronic control device 10 is fixed to a steering shaft 2 a that is covered and extended by the front cowl 2. The frame 3a extending in the front-rear direction of the vehicle 1 so as to reach from the cowl 2 to the rear cover 5 below the seat 4 via the lower step 3 is fixed to the frame 3a below the lower step 3. The case where it is provided, and the case where it is covered with the rear cover 5 below the seat of the vehicle 1 and fixed to the frame 3a with respect to the frame 3a. The mounting position of the vehicular electronic control device 10 on the vehicle 1 is not a position where the traveling wind of the vehicle 1 directly hits, but is a position where heat generated during operation of the vehicular electronic control device 10 is likely to be trapped. The frame 3a may be branched and connected to a separate rear frame in the rear cover 5 below the seat 4.

  In particular, as shown in FIGS. 2 and 3, the vehicle electronic control device 10 typically includes a metal case 20 such as an aluminum alloy, a radiating fin 30 provided on the case 20, A plurality of semiconductor elements 40 housed in the case 20 and electrically connected to the circuit board S are electrically connected to a circuit board S such as a printed wiring board made of glass epoxy resin fixed to the circuit board S. And a plurality of capacitors 50 housed in the case 20.

Specifically, the case 20 includes a flat upper wall 22, a pair of flat side walls 23 and 24 connected to the upper wall 22 on the positive side of the y axis and the negative side of the y axis, and the x axis. And a flat plate-like rear wall 25 connected to the upper wall 22 and the pair of side walls 23 and 24 on the negative direction side. The case 20 has an internal storage chamber 26 defined by an upper wall 22, a pair of side walls 23 and 24, and a rear wall 25, and a plurality of semiconductor elements 40 are provided on the lower surface of the upper wall 22. A semiconductor element fixing part 26a for fixing is provided, and a part of the accommodation chamber 26 is extended upward to have a capacitor accommodation part 26b for accommodating a plurality of capacitors 50. In addition, in the front side part which opposes the rear wall 25 of the case 20, although the storage chamber 26 is open | released, you may provide a front wall etc. and may be closed as needed. In addition, the storage chamber 26 is also opened at the lower portion facing the upper wall 22 of the case 20, but may be closed by providing a bottom wall or the like as necessary.

  The heat radiation fin 30 typically has a plurality of fin portions 32 made of metal such as an aluminum alloy. Each of the plurality of fin portions 32 is a flat plate-like member parallel to a yz plane standing from the upper surface of the upper wall 22 of the case 20 and extends in the y-axis direction as the flat plate-like member. The Further, from the viewpoint of efficiently receiving and radiating heat generated by the plurality of semiconductor elements 40 during operation, the plurality of fin parts 32 are each of the plurality of semiconductor elements 40. It is preferable to be provided immediately above the corresponding one. The plurality of fin portions 32 are each configured integrally with the upper wall 22 of the case 20 and as the same member as the case 20, so that the number of manufacturing steps can be reduced while ensuring their strength and rigidity. To preferred. Of course, if necessary, the plurality of fin portions 32 may be configured as members different from the case 20 and joined to the upper wall 22 of the case 20.

  Each of the plurality of semiconductor elements 40 is typically a semiconductor element such as a field effect transistor, and is a heating element that generates a relatively large amount of heat during operation thereof. Each of the plurality of semiconductor elements 40 is electrically connected to the circuit board S via leads 42 and fastened to the lower surface of the upper wall 22 of the case 20 by a fastening member (not shown) via a heat dissipation member 44. Fixed. In this way, the portion of the lower surface of the upper wall 22 of the case 20 that fixes the plurality of semiconductor elements 40 is the semiconductor element fixing portion 26 a of the case 20.

  The plurality of semiconductor elements 40 are each arranged in a row in the x-axis direction. The lengths of the plurality of semiconductor elements 40 in the y-axis direction, more specifically, on the case 20 Each length of the semiconductor element fixing portion 26a of the wall 22 in the y-axis direction is the sum of the lengths of the plurality of semiconductor elements 40 in the x-axis direction, more specifically, the semiconductor element fixing portion of the upper wall 22 of the case 20 It is shorter than the sum of the lengths in the x-axis direction of 26a. That is, the plurality of fin portions 32 of the heat radiating fin 30 extend in the y-axis direction as flat plate members parallel to the yz plane standing from the upper surface of the upper wall 22 of the case 20. Corresponding to the row of the semiconductor elements 40 in the x-axis direction, more specifically, the row of the semiconductor element fixing portions 26a of the upper wall 22 of the case 20 in the x-axis direction. As a flat plate member parallel to the xz plane to be provided, the length is shorter than that of a configuration extending in the x-axis direction. In the present embodiment, the rows of the semiconductor elements 40 are illustrated as two rows juxtaposed in parallel to the x-axis direction and facing the y-axis direction. In such a case, one of the plurality of fin portions 32 of the heat radiating fin 30 may be provided directly above the corresponding one of the two semiconductor elements 40 arranged in parallel facing each other in the y-axis direction. This is preferable from the viewpoint of efficiently receiving and radiating the heat generated by the two semiconductor elements 40.

  Each of the plurality of capacitors 50 is a tall component whose vertical length is longer than that of the plurality of semiconductor elements 40, and is typically a capacitor such as a large-capacity electrolytic capacitor. The amount of heat generated at times is smaller than that of the plurality of semiconductor elements 40. Each of the plurality of capacitors 50 is electrically connected to the circuit board S via a connection portion that is omitted from the reference numerals, and is fixed upright from the circuit board S. Further, the plurality of capacitors 50 are each arranged in a row in the x-axis direction, and in this embodiment, it is assumed that the number of the capacitors 50 is one.

The upper part of each of the plurality of capacitors 50 that exceeds the upper wall 22 of the case 20 is housed in a rectangular tube-like cover 52 that is typically made of a metal such as an aluminum alloy and the upper part thereof is closed. As described above, the portion of each of the plurality of capacitors 50 that accommodates the upper portion of the case 20 beyond the upper wall 22 is a capacitor accommodation portion 26 b that is spatially continuous with the accommodation chamber 26 of the case 20. Further, the wall portion on the negative direction side of the y axis of the cover 52 is an adjacent wall 52 a that is spaced apart from the end portion on the negative direction side of the y axis of each of the plurality of fin portions 32 of the radiating fin 30. From the viewpoint of preventing direct thermal contact between the negative wall end of each of the plurality of fin portions 32 of the radiating fin 30 and the adjacent wall 52 a, the adjacent wall 52 a It is preferable that the plurality of fin portions 32 face each other at a distance from the end portion on the negative direction side of the y-axis. In addition, it is preferable that the cover 52 is integrally configured as the same member as the upper wall 22 of the case 20 from the viewpoint of reducing the number of manufacturing steps while ensuring the strength and rigidity. Of course, the cover 50 may be formed of a member different from the case 20 and bonded onto the upper wall 22 of the case 20 as necessary.

  Here, in the above configuration, a gap portion G1 is defined between the plurality of fin portions 32 of the radiating fin 30 adjacent to each other in the x-axis direction. The gap G1 functions as a first refrigerant flow path 32a through which air as a refrigerant can flow as indicated by an arrow parallel to the y-axis direction in FIG.

  Further, a gap portion G2 is defined between the end portion on the negative side of the y-axis of each of the plurality of fin portions 32 of the radiating fin 30 and the adjacent wall 52a of the cover 50 that is spaced apart from the end portion. It is preferred that This is because the gap G2 functions as a second refrigerant flow path 32b through which air as a refrigerant can flow as indicated by an arrow parallel to the x-axis direction of FIG. This is because the negative end of each of the plurality of fin portions 32 of the fin 30 functions as a heat transfer blocking portion that does not directly come into thermal contact with the adjacent wall 52 a of the cover 52. Further, from the viewpoint that the heated air flowing through the first refrigerant flow path 32a flows into the second refrigerant flow path 32b and is discharged therefrom, and heat from the plurality of semiconductor elements 40 is more efficiently exhausted. The first refrigerant flow path 32a and the second refrigerant flow path 32b are preferably joined from the second refrigerant flow path 32b.

  In the vehicle electronic control device 10 having the above-described configuration, when the plurality of semiconductor elements 40 start operating, the plurality of semiconductor elements 40 generate heat.

  The heat generated in this manner is transferred from the semiconductor element fixing portion 26a, which is a part of the upper wall 22 of the case 20, to the plurality of fin portions 32 of the heat radiation fin 30 corresponding thereto. In a state where the amount of heat received by each is suppressed, heat is radiated reliably and efficiently to the air in contact with it. Further, at this time, the plurality of fin portions 32 are shortened in such a manner that they are extended in the direction of the y-axis as flat plate members parallel to the yz plane standing from the upper surface of the upper wall 22 of the case 20. Therefore, the amount of heat received by each of the plurality of fin portions 32 is kept low, and even if the flow rate of the air flowing through the first refrigerant flow path 32a is small, it is efficiently discharged without causing it to stay unnecessarily. To do. Note that the arrows shown in FIG. 3B indicate that the heat generated from the plurality of semiconductor elements 40 is generated from the semiconductor element fixing portion 26a that is a part of the upper wall 22 of the case 20, and the plurality of heat radiation fins 30 corresponding thereto. After the heat transfer to the fin portion 32, a state where heat is radiated to the air flowing through the first refrigerant flow path 32a is exemplarily shown, and the air flows in the positive direction of the x axis.

  Further, at this time, a gap portion G2 is formed between the negative end portion of the y-axis of each of the plurality of fin portions 32 of the radiating fin 30 and the adjacent wall 52a of the cover 50 facing away from it. In the case where the gap G2 is defined, the gap portion G2 is such that the negative end of the y-axis of each of the plurality of fin portions 32 of the radiating fin 30 is not directly in thermal contact with the adjacent wall 52a of the cover 52. It functions as a heat shut-off part, and it suppresses that heat of a plurality of fin parts 32 is transmitted to cover 52 and a plurality of capacitors 50 stored in it, and suppresses that heat rises unnecessarily.

Furthermore, at this time, when the first refrigerant flow path 32a and the second refrigerant flow path 32b merge from the second refrigerant flow path 32b, the heat flowing through the first refrigerant flow path 32a is heated. Air flows into the second refrigerant flow path 32b and is discharged therefrom, and heat from the plurality of semiconductor elements 40 is more reliably and efficiently discharged.

  According to the above configuration, the substrate S on which the heat generating component 40 and the tall component 50 are mounted in a first row and a second row that are parallel to each other, and the metal case 20 that houses the substrate S, The heat generating component fixing portion 26a that is provided on the inner surface side of the metal case 20 and fixes the heat generating component 40, and the inner surface side of the metal case 20 so as to protrude outward from the heat generating component fixing portion 26a. The vehicle electronic control device is provided with a tall component accommodating portion 26b that accommodates the tall component 50 and a radiating fin 30 provided on the outer surface side of the metal case 20 facing the heat generating component fixing portion 26a. 10, the plurality of fin portions 32 of the heat radiating fins 30 are disposed so as to be orthogonal to the first row of the heat generating components 40, thereby being the same as the first row of the heat generating components 40. Multiple heat dissipating fins 30 in the direction As compared with the case of arranging the fin portion 32, it is possible to suppress the number of heat-generating components 40 per one fin portion 32 smaller. For this reason, since the amount of heat received per one fin portion 32 can be kept low, the radiating fins 30 can be reliably and efficiently cooled with a slight air flow, and temperature rise due to heat generation of the semiconductor element 40 can also be suppressed. Can do. Moreover, since the length of each fin part 32 of the radiation fin 30 becomes short, the flow path of the airflow which flows between the fin parts 32 also becomes short, and the flow path resistance can be reduced. For this reason, even if the air flow rate is small, the air flow can flow without stagnation between the fin portions 32, and the radiating fins 30 can be reliably and efficiently cooled. Moreover, the surface area of the radiation fin 30 on the side facing the tall component housing portion 26b can be suppressed, the heat received by the tall component housing portion 26b can be reduced, and the tall component 50 in the tall component housing portion 26b can be reduced. It is possible to reliably reduce the influence of unnecessary heat.

  In addition, by providing a gap G2 at the boundary between the radiating fin 30 and the tall component accommodating portion 26b, the plurality of fin portions 32 of the radiating fin 30 are arranged in the same direction as the first row of the heat generating components 40. Compared with the case where a gap is provided, the surface area of the radiation fin 30 on the side facing the tall component housing portion 26b can be suppressed, and the heat received by the tall component housing portion 26b can be reduced. It can reduce reliably that the tall component 50 in the part 26b receives an unnecessary heat influence. In addition, since the heat radiation fin 30 and the tall component housing portion 26b are not directly connected by the gap portion G2, heat transfer in a portion having a high thermal conductivity such as a metal portion can be blocked. It can reduce more reliably that the heat from the heat-emitting component 40 is transmitted to the tall component housing portion 26b through the heat radiation fin 30.

  In addition, the gap G2 is provided over the entire length of the boundary between the radiating fin 30 and the tall component accommodating portion 26b, and the refrigerant flow path 32a defined between the plurality of fin portions 32 of the radiating fin 30 includes the gap portion. By merging with G2, the airflow flowing between the fin portions 32 merges with the airflow flowing through the gap portion G2, and can be smoothly discharged out of the gap portion G2. Therefore, the temperature rise due to heat generation of the semiconductor element 40 can be suppressed. In addition, the tall component housing portion 26b can be reliably and efficiently cooled, and the temperature rise of the tall component 50 can be suppressed.

  In the present invention, the type, arrangement, number, and the like of the members are not limited to the above-described embodiments, and the constituent elements thereof are appropriately replaced with those having the same operational effects, and the gist of the invention is not deviated. Of course, it can be appropriately changed within the range.

  As described above, in the present invention, the degree of freedom in design of a vehicle such as a motorcycle can be ensured, and even when mounted in a mounting place close to a sealed state such as in the body cover of the vehicle, air cooling is used. An electronic control device for a vehicle that can improve cooling performance can be provided, and it is expected that it can be widely applied to an electronic control device used for a vehicle or the like due to its general-purpose universal character. .

DESCRIPTION OF SYMBOLS 1 ... Vehicle 2 ... Front cowl 2a ... Steering shaft 3 ... Lower step 3a ... Frame 4 ... Seat 5 ... Rear cover 10 ... Vehicle electronic control device 20 ... Case 22 ... Upper wall 23, 24 ... Side wall 25 ... Rear wall 26 ... Accommodating Chamber 26a ... Semiconductor element fixing part 26b ... Capacitor housing part 30 ... Radiation fin 32 ... Fin part 32a ... First refrigerant channel 32b ... Second refrigerant channel 40 ... Semiconductor element 42 ... Lead 44 ... Heat radiation member 50 ... Capacitor 52 ... Cover 52a ... Adjacent wall S ... Circuit board G1, G2 ... Gap

Claims (3)

A substrate on which the heat-generating component and the tall component are respectively mounted in a first row and a second row parallel to each other;
A metal case for housing the substrate;
A heat generating component fixing portion that is provided on the inner surface side of the metal case and fixes the heat generating component;
A tall component housing portion that is provided on the inner surface side of the metal case so as to protrude toward the outside of the metal case from the heat generating component fixing portion;
Radiation fins provided on the outer surface side of the metal case facing the heat generating component fixing part,
In the vehicle electronic control device comprising:
The electronic control device for a vehicle according to claim 1, wherein the plurality of fin portions of the heat dissipating fins are arranged so as to extend perpendicular to the first row of the heat generating components.   The vehicle electronic control device according to claim 1, wherein a gap is provided at a boundary between the radiating fin and the tall component housing.   The gap is provided over the entire length of the boundary between the radiating fin and the tall component housing, and a refrigerant flow path defined between the plurality of fins of the radiating fin joins the gap. The vehicular electronic control device according to claim 2.

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