KR102610063B1 - 적외선 온도 센서, 회로 기판 및 상기 센서를 이용한 장치 - Google Patents

적외선 온도 센서, 회로 기판 및 상기 센서를 이용한 장치 Download PDF

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Publication number
KR102610063B1
KR102610063B1 KR1020177026408A KR20177026408A KR102610063B1 KR 102610063 B1 KR102610063 B1 KR 102610063B1 KR 1020177026408 A KR1020177026408 A KR 1020177026408A KR 20177026408 A KR20177026408 A KR 20177026408A KR 102610063 B1 KR102610063 B1 KR 102610063B1
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KR
South Korea
Prior art keywords
temperature sensor
infrared
substrate
infrared temperature
sensor according
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KR1020177026408A
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English (en)
Korean (ko)
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KR20170129755A (ko
Inventor
토시유키 노지리
타케시 후세
마사유키 우스이
료 호소미즈
Original Assignee
세미텍 가부시키가이샤
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Publication of KR20170129755A publication Critical patent/KR20170129755A/ko
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Publication of KR102610063B1 publication Critical patent/KR102610063B1/ko

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0215Compact construction
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0225Shape of the cavity itself or of elements contained in or suspended over the cavity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • G03G15/20Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
KR1020177026408A 2015-03-25 2016-01-21 적외선 온도 센서, 회로 기판 및 상기 센서를 이용한 장치 KR102610063B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015063207 2015-03-25
JPJP-P-2015-063207 2015-03-25
PCT/JP2016/051663 WO2016152220A1 (ja) 2015-03-25 2016-01-21 赤外線温度センサ、回路基板及び赤外線温度センサを用いた装置

Publications (2)

Publication Number Publication Date
KR20170129755A KR20170129755A (ko) 2017-11-27
KR102610063B1 true KR102610063B1 (ko) 2023-12-05

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KR1020177026408A KR102610063B1 (ko) 2015-03-25 2016-01-21 적외선 온도 센서, 회로 기판 및 상기 센서를 이용한 장치

Country Status (4)

Country Link
JP (1) JP6076549B1 (zh)
KR (1) KR102610063B1 (zh)
CN (1) CN107407602B (zh)
WO (1) WO2016152220A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109073468B (zh) * 2016-12-20 2020-04-28 株式会社芝浦电子 红外线温度传感器及其制造方法
WO2018225141A1 (ja) * 2017-06-06 2018-12-13 株式会社芝浦電子 赤外線温度センサおよびその製造方法
JP6892500B2 (ja) * 2017-09-12 2021-06-23 株式会社芝浦電子 赤外線温度センサ
CN111504476A (zh) * 2019-01-31 2020-08-07 众智光电科技股份有限公司 红外线温度传感器
CN113447132A (zh) * 2020-03-27 2021-09-28 维沃移动通信有限公司 电子设备
TWI841861B (zh) * 2021-07-29 2024-05-11 原相科技股份有限公司 高穩定度溫度計結構及使用該溫度計結構的系統
CN115767881B (zh) * 2022-12-29 2024-02-13 安徽光智科技有限公司 红外焦平面成像系统的emc整改方法、红外焦平面成像系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003194630A (ja) * 2001-12-27 2003-07-09 Ishizuka Electronics Corp 非接触温度センサおよび非接触温度センサ用検出回路
JP2008111849A (ja) * 1997-09-29 2008-05-15 Ishizuka Electronics Corp 非接触温度センサ
JP2011013213A (ja) * 2009-06-02 2011-01-20 Mitsubishi Materials Corp 赤外線センサ
WO2015020081A1 (ja) * 2013-08-09 2015-02-12 Semitec株式会社 赤外線温度センサ及び赤外線温度センサを用いた装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4628540B2 (ja) 2000-11-20 2011-02-09 石塚電子株式会社 赤外線温度センサ
JP2006270885A (ja) * 2005-03-25 2006-10-05 Orion Denki Kk 電子機器
JP2007255929A (ja) * 2006-03-20 2007-10-04 Kyoto Univ 焦電型赤外線センサ
JP5640529B2 (ja) 2009-10-17 2014-12-17 三菱マテリアル株式会社 赤外線センサ及びこれを備えた回路基板
CN102478432A (zh) * 2010-11-30 2012-05-30 三菱综合材料株式会社 红外线传感器
CN202420687U (zh) * 2011-12-20 2012-09-05 友丽系统制造股份有限公司 测量模块
WO2014112392A1 (ja) * 2013-01-21 2014-07-24 パナソニック株式会社 赤外線検出素子、赤外線検出器及び赤外線式ガスセンサ
US9377365B2 (en) * 2013-04-22 2016-06-28 Excelitas Technologies Singapore Pte. Ltd. Thermal sensor module with lens array

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008111849A (ja) * 1997-09-29 2008-05-15 Ishizuka Electronics Corp 非接触温度センサ
JP2003194630A (ja) * 2001-12-27 2003-07-09 Ishizuka Electronics Corp 非接触温度センサおよび非接触温度センサ用検出回路
JP2011013213A (ja) * 2009-06-02 2011-01-20 Mitsubishi Materials Corp 赤外線センサ
WO2015020081A1 (ja) * 2013-08-09 2015-02-12 Semitec株式会社 赤外線温度センサ及び赤外線温度センサを用いた装置

Also Published As

Publication number Publication date
CN107407602A (zh) 2017-11-28
JPWO2016152220A1 (ja) 2017-04-27
CN107407602B (zh) 2020-10-23
JP6076549B1 (ja) 2017-02-08
WO2016152220A1 (ja) 2016-09-29
KR20170129755A (ko) 2017-11-27

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