CN115767881B - 红外焦平面成像系统的emc整改方法、红外焦平面成像系统 - Google Patents
红外焦平面成像系统的emc整改方法、红外焦平面成像系统 Download PDFInfo
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- CN115767881B CN115767881B CN202211705712.4A CN202211705712A CN115767881B CN 115767881 B CN115767881 B CN 115767881B CN 202211705712 A CN202211705712 A CN 202211705712A CN 115767881 B CN115767881 B CN 115767881B
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- 238000003384 imaging method Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 33
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- 238000012360 testing method Methods 0.000 abstract description 15
- 238000013461 design Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
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- 238000010586 diagram Methods 0.000 description 5
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- 238000004088 simulation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
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- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
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- 230000008054 signal transmission Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104730078A (zh) * | 2013-12-23 | 2015-06-24 | 北京红源光电技术公司 | 一种基于红外热像仪aoi的电路板检测方法 |
CN107407602A (zh) * | 2015-03-25 | 2017-11-28 | 世美特株式会社 | 红外线温度传感器、电路基板以及使用红外线温度传感器的装置 |
KR20180000668A (ko) * | 2017-01-26 | 2018-01-03 | 천종옥 | 솔리드 스테이트 드라이브 |
CN211184412U (zh) * | 2020-01-10 | 2020-08-04 | 深圳市康冠商用科技有限公司 | 具有屏蔽结构的pcb板 |
KR20220114675A (ko) * | 2021-02-09 | 2022-08-17 | (주)케이아이오티 | 발열 검사 장치 및 그를 이용한 발열 검사 방법 |
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KR102662052B1 (ko) * | 2019-07-26 | 2024-05-02 | 삼성전자 주식회사 | Emi 차폐 부재 및 이를 포함하는 전자 장치 |
KR102806954B1 (ko) * | 2020-01-09 | 2025-05-14 | 삼성전자 주식회사 | 차폐 부재 및 이를 포함하는 전자 장치 |
WO2021188784A1 (en) * | 2020-03-18 | 2021-09-23 | Marvell Asia Pte, Ltd. | On-board integrated enclosure for electromagnetic compatibility shielding |
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- 2022-12-29 CN CN202211705712.4A patent/CN115767881B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104730078A (zh) * | 2013-12-23 | 2015-06-24 | 北京红源光电技术公司 | 一种基于红外热像仪aoi的电路板检测方法 |
CN107407602A (zh) * | 2015-03-25 | 2017-11-28 | 世美特株式会社 | 红外线温度传感器、电路基板以及使用红外线温度传感器的装置 |
KR20180000668A (ko) * | 2017-01-26 | 2018-01-03 | 천종옥 | 솔리드 스테이트 드라이브 |
CN211184412U (zh) * | 2020-01-10 | 2020-08-04 | 深圳市康冠商用科技有限公司 | 具有屏蔽结构的pcb板 |
KR20220114675A (ko) * | 2021-02-09 | 2022-08-17 | (주)케이아이오티 | 발열 검사 장치 및 그를 이용한 발열 검사 방법 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: EMC rectification method for infrared focal plane imaging system, infrared focal plane imaging system Granted publication date: 20240213 Pledgee: Huishang Bank Co.,Ltd. Chuzhou Fenghuang road sub branch Pledgor: Anhui Guangzhi Technology Co.,Ltd. Registration number: Y2024980057754 |
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Granted publication date: 20240213 Pledgee: Huishang Bank Co.,Ltd. Chuzhou Fenghuang road sub branch Pledgor: Anhui Guangzhi Technology Co.,Ltd. Registration number: Y2024980057754 |