KR102584528B1 - Vacuum Plasma Descum and Desmear System with Auto Setting and carrying function for FCBGA Fine pattern PCB - Google Patents

Abstract

The present invention relates to a vacuum plasma device that performs surface treatments such as cleaning, etching, and desmearing of PCBs (printed circuit boards). More specifically, in surface treatment of PCB products, the supply and discharge of PCBs is not performed manually. It relates to a vacuum plasma device capable of automatically supplying and discharging PCBs, which can improve productivity and homogenize products as well as minimize the defect rate of products by continuously performing an automatic process.
The vacuum plasma device capable of automatically supplying and discharging PCBs of the present invention,
A product input unit 10 for supplying PCBs, a vacuum plasma device 20 for cleaning the supplied products, a product discharge unit 30 for discharging the cleaned PCBs, and the product input unit. It consists of an articulated robot (40) for transferring the PCB supplied to (10) to the vacuum plasma device (20) and transferring the PCB that has been cleaned in the vacuum plasma device (20) to the product discharge unit (30). As it becomes,
The product input unit 10 includes a product input port 11 for supplying PCBs from the outside, a loading orthogonal robot 12 for transferring the input PCBs to the loading alignment stage 13, and the loading orthogonal robot. It consists of a loading alignment stage (13) to align the position of the PCB transferred by (12),
The vacuum plasma device 20 cleans the PCB transferred from the product input unit 10 in a vacuum chamber equipped with an electrode assembly and gas, and is used to fix the PCB to the upper left and right sides and lower left and right sides of the vacuum chamber. A jig 22 is provided to support the unit 21 and the fixing unit 21,
The product discharge unit 30 includes a discharge alignment stage 31 for aligning the position of the PCB that has been cleaned in the vacuum plasma device 20, and a discharge orthogonal stage for transferring the aligned PCB to the product discharge port. It consists of a robot (32) and a product outlet (33) for discharging the product transferred by the orthogonal discharge robot (32) to the outside.
The articulated robot 40 inputs the PCB of the loading alignment stage 13 into the vacuum plasma device 20, and inserts the PCB cleaned in the vacuum plasma device 20 into the discharge alignment stage 31. It is characterized in that a picker 41 for adsorbing and fixing the PCB is mounted on an articulated arm capable of rotating 90 degrees.

Description

{Vacuum Plasma Descum and Desmear System with Auto Setting and carrying function for FCBGA Fine pattern PCB}

The present invention relates to a vacuum plasma device that performs surface treatments such as cleaning, etching, and desmearing of PCBs (printed circuit boards). More specifically, in surface treatment of PCB products, the supply and discharge of PCBs is not performed manually. It relates to a vacuum plasma device capable of automatically supplying and discharging PCBs, which can improve productivity and homogenize products as well as minimize the defect rate of products by continuously performing an automatic process.

Recent PCB manufacturing is focused on mass production of high value-added flip chip substrates using special materials containing low dielectric constant/low loss insulating materials such as ABF to cope with high frequency communication.

The most important point in flip chip production is to minimize defects and contamination caused by contact between products.

However, the vacuum plasma device currently in use is of a batch type, so surface treatment has been performed by installing a large number of PCBs directly or using an automatic loading device. During this process, product damage occurred due to contamination and contact with particles, which caused defects. It was difficult to evenly process the entire PCB area, which limited the ability to improve quality. Additionally, the processing time was longer than 20 minutes. There was a problem.

Republic of Korea Patent Registration No. 10- 1415884

The present invention is intended to solve the above problems and improves productivity by automating all processing processes. In surface treatment such as PCB cleaning, uniform processing is possible by processing one sheet at a time rather than in large numbers, and the PCB is processed using vacuum plasma. We aim to provide a vacuum plasma device that prevents PCB damage by using a vacuum adsorption picker when inputting and discharging from the device, prevents PCB separation by using a fixing unit in the vacuum plasma device, and enables uniform processing and stabilization. It has a purpose.

The vacuum plasma device capable of automatically supplying and discharging PCBs of the present invention,

A product input unit 10 for supplying PCBs, a vacuum plasma device 20 for cleaning the supplied products, a product discharge unit 30 for discharging the cleaned PCBs, and the product input unit. It consists of an articulated robot (40) for transferring the PCB supplied to (10) to the vacuum plasma device (20) and transferring the PCB that has been cleaned in the vacuum plasma device (20) to the product discharge unit (30). It is characterized by being,

The product input unit 10 includes a product input port 11 for supplying PCBs from the outside, a loading orthogonal robot 12 for transferring the input PCBs to the loading alignment stage 13, and the loading orthogonal robot. It consists of a loading alignment stage (13) to align the position of the PCB transferred by (12),

The vacuum plasma device 20 cleans the PCB transferred from the product input unit 10 in a vacuum chamber equipped with an electrode assembly and gas, and is used to fix the PCB to the upper left and right sides and lower left and right sides of the vacuum chamber. A jig 22 is provided to support the unit 21 and the fixing unit 21,

The product discharge unit 30 includes a discharge alignment stage 31 for aligning the position of the PCB that has been cleaned in the vacuum plasma device 20, and a discharge orthogonal stage for transferring the aligned PCB to the product discharge port. It consists of a robot (32) and a product outlet (33) for discharging the product transferred by the orthogonal discharge robot (32) to the outside.

The articulated robot 40 inputs the PCB of the loading alignment stage 13 into the vacuum plasma device 20, and inserts the PCB cleaned in the vacuum plasma device 20 into the discharge alignment stage 31. It is characterized in that a picker 41 for adsorbing and fixing the PCB is mounted on an articulated arm capable of rotating 90 degrees.

In addition, the product input port 11 of the product input unit 10 has two rows of conveyor lines, and is used to insert a sheet-type box containing a sheet inserted between the PCB or a tray containing a single PCB. It consists of an input line (11-1) and a recovery line (11-2) for separating and recovering the slip inserted between the PCB and the tray,

The orthogonal robot for loading (12) consists of two robots, an orthogonal robot for transferring pcb (12-1) to separate the pcb contained in a slip-type box or pc contained in a tray and transfer it to the alignment stage 13 for loading. , It is characterized by being composed of a retrieval orthogonal robot (12-2) to separate the separate sheets contained in the sheet type box and transfer them to the sheet retrieval box or to retrieve the tray,

The fixing unit 21 of the vacuum plasma device 20 is provided with a ceramic fork 23 rotated by a cylinder rotatable by 90 degrees, and the jig 22 is the picker 41 of the articulated robot 40. It is characterized in that a fork insertion hole (22-1) is formed for inserting the picker fork (42) mounted on the.

The orthogonal discharge robots 32 of the product discharge unit 30 are two robots that transfer the PCBs aligned on the discharge alignment stage 31 to a PCB discharge box or tray waiting at the product discharge port 33. It consists of an orthogonal robot (32-1) for pcb discharge, and an orthogonal robot (32-2) for inserting slip sheets to insert the slip sheets waiting at the product discharge port 33 into the pcb input box,

The product discharge port 33 has two rows of conveyor lines, a PCB discharge line 33-1 where boxes or trays for PCB discharge to be discharged to the outside are waiting, and a PCB discharge line 33-1 where boxes or trays for inserting slip sheets are waiting. It is characterized by being composed of an input line (33-2),

The picker 41 of the articulated robot 40 is equipped with a plurality of tubular suction pads 41-1 on the outside and is equipped with a picker fork 42 to prevent the PCB from coming off. .

According to the present invention,

The processing speed is fast by automating the transfer of products and continuously processing cleaning, etching, and desmearing.

Since there is no need to mount it on a separate window frame or slot in a separate space outside, the work space is reduced, PCB attachment and detachment time is reduced, and automation is easy by connecting with front and rear process equipment, contributing to improved productivity.

When transferring a product, the picker touches the edge of the PCB and automatically transfers it, making it possible to significantly reduce the defect rate.

By processing one sheet at a time, the entire area can be uniformly cleaned or etched.

1 is a conceptual diagram of the vacuum plasma device of the present invention
Figure 2 is a slip-type box.
Figure 3 is a tray
Figure 4 shows a state in which a fixing unit is mounted on the front of the vacuum chamber of the vertical vacuum plasma device 20.
Figure 5 is a conceptual diagram of a fixing unit mounted on the upper surface of a horizontal vacuum plasma vacuum chamber.
Figure 6 is a detailed view of the fixing unit
Figure 7 is a detailed view of the jig.
Figure 8 is a state diagram when the vacuum suction pad of the picker 41 adsorbs the PCB fixed by the fixing unit in the vacuum chamber.
Figure 9 shows an articulated robot that can rotate 90 degrees and move horizontally or vertically.
Figure 10 shows a PCB picker for adsorbing and fixing a PCB mounted on the end of a multi-joint arm.
Figure 11 is a perspective view showing the configuration of the PCB picker 41.

Hereinafter, the present invention will be described in detail based on the drawings.

Figure 1 shows a conceptual diagram of the vacuum plasma device of the present invention in which a product input unit, a vacuum plasma device, a product discharge unit, and an articulated robot are arranged.

According to Figure 1,

The vacuum plasma device capable of automatically supplying and discharging PCBs of the present invention includes a product input unit 10 for supplying PCBs, a vacuum plasma device 20 for cleaning the supplied products, and a PCB that has been cleaned. The product discharge unit 30 for discharge, the PCB supplied to the product input unit 10 is transferred to the vacuum plasma device 20, and the PCB that has been cleaned in the vacuum plasma device 20 is transferred to the product discharge section. It consists of an articulated robot (40) for transport to (30).

Here, the product input unit 10 is a separate sheet-type box (see Figure 2) containing the PCB to be cleaned by inserting a sheet between the PCBs in units of 20, for example, or a tray-type box containing one PCB ( (see FIG. 3) for supplying from the outside using a product inlet 11 for supplying PCBs from the outside, a loading orthogonal robot 12 for transferring the input PCBs to the loading alignment stage 13, and , It consists of a loading alignment stage 13 for aligning the position of the PCB transferred by the loading orthogonal robot 12 and recognizing the barcode.

In addition, the product input port 11 of the product input unit 10 is equipped with a PCB input line 11-1 for inputting a sheet type box containing a sheet inserted between the PCB or a tray box containing a single PCB. , It consists of two rows of conveyor lines with a recovery line (11-2) for separating and recovering the slip sheets or trays inserted between the PCB.

Here, the reason for inserting a slip between PCBs is to minimize defects and contamination caused by contact between products during transportation.

The loading orthogonal robot (12) is a PCB transfer robot (12-1) for separating the PCB contained in a slip-type box or tray and transferring it to the loading alignment stage (13), and the slip sheet contained in the slip-type box. It consists of two robots, the orthogonal robot (12-2) for separation and transfer to a box for collecting paper or for transferring the tray from which the PCB has been discharged.

The loading alignment stage 13 is aligned at an exact position that the articulated robot can easily access just before inserting the PCB separated during the transfer process into the plasma chamber.

The vacuum plasma device 20 is a device that cleans the PCB transferred from the product input unit 10 in a vacuum chamber equipped with an electrode assembly and gas. It can be used in both known horizontal and vertical types, and improves work efficiency. It is also possible to use two or three vacuum chambers, and since the vacuum plasma device 20 processes thin PCBs while maintaining a vacuum, it is necessary to prevent the PCBs from flowing, especially a vertical vacuum chamber. A device is needed to hold the PCB upright.

In the present invention, in order to prevent the PCB from being separated, the PCB is fixed using a fixing unit mounted on the front of the vacuum chamber, and the fixing unit is firmly supported by a jig.

Figure 4 shows a state diagram showing a fixing unit mounted on the front of the vacuum chamber of the vertical vacuum plasma device 20, and Figure 5 shows a conceptual diagram showing a fixing unit mounted on the top of the horizontal vacuum plasma vacuum chamber. Figure 6 shows a detailed view of the fixing unit, and Figure 7 shows a detailed view of the jig.

As shown in Figures 4 and 5, four fixing units 21 are mounted on the upper left and right sides and lower left and right sides of the vacuum chamber,

As shown in Figure 6, the fixing unit 21 includes a cylinder 21-1 rotating 90 degrees, a power transmission shaft 21-2 connected to the cylinder, and a ceramic insulation mounted on the end of the power transmission shaft. It consists of a fork (21-3),

As shown in Figure 7, the fixing jig 22 has a picker fork 42 installed to prevent the PCB from coming off when the vacuum suction pad of the picker 41 mounted on the multi-joint arm adsorbs the PCB, thereby stably holding the PCB. PCB picker fork insertion holes are formed at four places on the inner surface of the jig 22 for adsorption.

A state diagram when the vacuum suction pad of the picker 41 mounted on the articulated arm adsorbs the PCB fixed by the fixing unit in the vacuum chamber is shown in Figure 8. When the vacuum suction pad of the picker adsorbs the PCB, the picker fork 42 is inserted into the picker fork insertion hole of the jig 22 to fix the PCB. When the PCB is fixed to the picker, the fixing unit of the vacuum chamber is released and the PCB is finally ejected from the vacuum chamber.

The product discharge unit 30 is for discharging the PCB that has been cleaned in the vacuum plasma device 20 to the outside. As shown in FIG. 1, it includes an alignment stage for discharging (to align the position of the PCB that has been cleaned). 31), a discharging orthogonal robot 32 for transferring the aligned PCB to the product discharging port, and a product discharging port 33 for discharging the product transferred by the discharging orthogonal robot 32 to the outside. It consists of:

The discharge alignment stage 31 of the product discharge unit 30 is aligned at an exact position where the articulated robot can easily access and place the PCB cleaned in the vacuum chamber to the outside.

The orthogonal robots 32 for discharging are two robots, and are orthogonal robots for discharging PCBs to transfer the PCBs aligned on the alignment stage 31 for discharging to a box or tray for discharging PCBs waiting at the product discharge port 33. It consists of (32-1) and an orthogonal robot (32-2) for inserting the sheet or tray waiting at the product discharge port (33) into the PCB input box,

The product discharge port 33 has two rows of conveyor lines, a PCB discharge line 33-1 where boxes or trays for PCB discharge to be discharged to the outside are waiting, and a PCB discharge line 33-1 where boxes or trays for inserting slip sheets are waiting. It is characterized by being composed of an input line (33-2).

As shown in Figure 1, the articulated robot 40 adsorbs the PCB seated on the loading alignment stage 13, inserts it into the vacuum plasma device 20, and cleans it in the vacuum plasma device 20. It is used to adsorb the completed PCB and place it on the alignment stage 31 for discharge, and is located in the center of the device.

Figure 9 shows an articulated robot 40 capable of rotating 90 degrees, Figure 10 shows a PCB picker 41 for adsorbing and fixing a PCB mounted on the end of an articulated arm, and Figure 11 shows a PCB picker. A vacuum suction pad (41-1) mounted at (41) and a picker fork (42) operated by a pneumatic cylinder are shown.

As shown in Figures 10 and 11, the picker 41 of the articulated robot 40 is equipped with a plurality of tubular suction pads 41-1 on the outside, and prevents the adsorbed PCB from coming off during transport. Four picker forks (42) are mounted on the top and bottom on the left and right sides, and are designed to fix and release the PCB by rotating it 90 degrees by a pneumatic cylinder.

Below, the operating process of the vacuum plasma device of the present invention configured as described above will be described.

First, the worker places the sheet type box (see Figure 2) or tray (see Figure 3) into which the PCB is inserted onto the PCB input line (11-1) of the product input port (11), and collects the sheet sheet into the recovery line (11-2). Place a box or tray on top and perform the work. All operations are performed automatically by an automatic control system that inputs the operation process.

When the work is performed, the conveyor line 11-1 of the product input port 11 operates and the slip-type box or tray is transferred to the XY robot zone. When the slip-type box or tray arrives, the PCB in the box is transferred to the 12-1) separates, changes direction, and transfers to the alignment stage (13) for loading. At this time, when the PCB is separated, the orthogonal robot (12-2) operates to separate the sheets or trays remaining in the sheet type box, transfers them to the sheet collection box or tray in the recovery line (11-2), and then returns to the original position. Go back to

The PCB transferred to the loading alignment stage (13) is aligned to the correct position so that the arm of the articulated robot can absorb it.

When the PCB is accurately aligned on the loading alignment stage 13, the articulated robot 40 operates to adsorb the PCB with the picker 41 attached to the arm of the robot and transfers it to the plasma device 20.

At this time, the PCB adsorption is carried out by holding the outer edge of the PCB with a plurality of vacuum suction pads (41-1) installed on the outer side of the picker (41) to facilitate product transfer, and four picker forks (42) installed on the outer side secure the PCB. This prevents the product from falling due to malfunction of the vacuum suction pad (41-1) when placed vertically.

When the PCB adsorbed on the picker 41 transferred to the vacuum plasma device 20 is input into the vacuum chamber, the 90-degree rotation cylinder 21-1 of the fixing unit 21 operates and the power transmission shaft 21-2 rotates, and the insulating ceramic fork (21-3) connected to it also rotates to press the pcb. When the PCB is fixed, the vacuum on the vacuum suction pad (41-1) of the picker (41) is released, the picker fork (42) is also released, and the picker (42) returns to its original position.

Once this work is completed, the chamber door rises and closes, and the vacuum pump operates to vacuum the chamber. When a certain degree of vacuum is reached, gas is injected through the gas inlet installed in the chamber door, and plasma treatment proceeds.

At this time, the electrode structure and gas injection method of the plasma vacuum chamber are structured to allow coolant to flow through the rod-shaped and plate-shaped electrodes of the company's patented plasma electrode assembly, and can be used either horizontally or vertically.

When cleaning is completed in the plasma device 20, the fixing unit 21 and the ceramic fork 21-3 are opened, and the picker 41 of the articulated robot 40 adsorbs the cleaned PCB and discharges it from the product discharge section. After transferring to the alignment stage (31), release the vacuum to align the PCB to the correct position.

The PCB located on the discharging alignment stage 31 is put into the pcb discharging box or tray waiting in the pcb discharging line 33-1 by the discharging orthogonal robot 32-1, and the pcb discharging box or tray is placed on the discharging alignment stage 31. When input, the insert robot (32-2) adsorbs the slip sheet from the sheet input box waiting in the input line (33-2) and puts it into the PCB discharge box or into the tray and returns it to its original position.

As this process continues to be repeated, cleaning of numerous PCBs is automatically completed.

The vacuum plasma device of the present invention has a lower defect rate during attachment and detachment and higher processing uniformity compared to existing batch-type vacuum plasma devices, making it suitable for processing fine circuit PCB substrates such as precise and uniform FCBGA substrates.

10: Product input section
11: Product input port
11-1: PCB input line (11-1)
11-2: Recovery line (11-2)
12: Cartesian robot for loading
12-1: Cartesian robot for pcb transfer (12-1)
12-2: Orthogonal robot for recovery
13: Alignment stage for loading
20: Vacuum plasma device
21: Fixing unit
21-1: Cylinder for 90 degree rotation
21-2: Power transmission shaft
21-3: Ceramic fork
22: Fixing jig
22-1: Picker fork insertion hole
30: Product discharge unit
31: Alignment stage for discharge
32: Cartesian robot for discharge
32-1: Cartesian robot for pcb discharge (32-1)
32-2: Cartesian robot for input
33: Product outlet
33-1: PCB discharge line
33-2: Input line
40: Articulated robot
41: picker
41-1: Vacuum suction pad
42: Picker fork

Claims (6)

A product input unit 10 for supplying PCBs, a vacuum plasma device 20 for cleaning the supplied products, a product discharge unit 30 for discharging the cleaned PCBs, and the product input unit. It consists of an articulated robot (40) for transferring the PCB supplied to (10) to the vacuum plasma device (20) and transferring the PCB that has been cleaned in the vacuum plasma device (20) to the product discharge unit (30). In the vacuum plasma device,
The product input unit 10 includes a product input port 11 for supplying PCBs from the outside, a loading Cartesian robot 12 for transferring the input PCBs to the loading alignment stage 13, and the loading Cartesian robot ( It consists of a loading alignment stage (13) to align the position of the PCB transferred by 12),
The product input port 11 of the product input unit 10 has two rows of conveyor lines, and is a PCB input line for inputting a sheet type box containing a sheet inserted between the PCB or a tray containing a single PCB. It consists of (11-1) and a recovery line (11-2) for separating and recovering the slip inserted between the pcb and the pcb or recovering the tray,
The orthogonal robots 12 for loading are two robots, and the orthogonal robot 12-1 for transferring pcb is used to separate pcb contained in a slip-type box or pcb contained in a tray and transfer them to the alignment stage 13 for loading. A vacuum plasma device capable of automatically supplying and discharging PCBs, characterized in that it consists of a retrieval orthogonal robot (12-2) for separating the separate sheets contained in a sheet type box and transferring them to a sheet retrieval box or recovering the tray.
delete delete According to paragraph 1,
The vacuum plasma device 20 cleans the PCB transferred from the product input unit 10 in a vacuum chamber equipped with an electrode assembly and gas, and is used to fix the PCB to the upper left and right sides and lower left and right sides of the vacuum chamber. A jig 22 is provided to support the unit 21 and the fixing unit 21,
The fixing unit 21 of the vacuum plasma device 20 includes a ceramic fork 23 rotated by a cylinder capable of rotating 90 degrees horizontally or vertically, and the jig 22 is connected to the articulated robot. A vacuum plasma device capable of automatically supplying and discharging PCBs, characterized in that a fork insertion hole (22-1) is formed for inserting the picker fork (42) mounted on the picker (41) of (40).
According to paragraph 1,
The product discharge unit 30 includes a discharge alignment stage 31 for aligning the position of the PCB that has been cleaned in the vacuum plasma device 20, and a discharge orthogonal stage for transferring the aligned PCB to the product discharge port. It consists of a robot 32 and a product discharge port 33 for discharging the product transported by the discharge orthogonal robot 32 to the outside.
The orthogonal discharge robots 32 of the product discharge unit 30 are two robots, and transfer the PCBs aligned on the discharge alignment stage 31 to a PCB discharge box or tray waiting at the product discharge port 33. It consists of an orthogonal robot (32-1) for discharging pcb, and an orthogonal robot (32-2) for inserting the sheet waiting at the product discharge port 33 into the pcb input box or tray,
The product discharge port 33 has two rows of conveyor lines, a PCB discharge line 33-1 where boxes or trays for discharging PCBs for discharge to the outside are waiting, and a box or tray for inserting slip sheets is waiting for them. A vacuum plasma device capable of automatically supplying and discharging PCBs, characterized by consisting of an input line (33-2)
According to paragraph 1,
The articulated robot 40 inputs the PCB of the loading alignment stage 13 into the vacuum plasma device 20, and inserts the PCB cleaned in the vacuum plasma device 20 into the discharge alignment stage 31. For seating, a picker 41 for adsorbing and fixing the PCB is mounted on a multi-joint arm capable of rotating 90 degrees,
The picker 41 of the articulated robot 40 is equipped with a plurality of tubular suction pads 41-1 on the outside and is equipped with a picker fork 42 to prevent the PCB from leaving. Vacuum plasma device capable of automatically supplying and discharging PCBs