KR20100096427A - Pcb transferring apparatus of plasma cleaning units - Google Patents

Pcb transferring apparatus of plasma cleaning units Download PDF

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KR20100096427A
KR20100096427A KR1020090015303A KR20090015303A KR20100096427A KR 20100096427 A KR20100096427 A KR 20100096427A KR 1020090015303 A KR1020090015303 A KR 1020090015303A KR 20090015303 A KR20090015303 A KR 20090015303A KR 20100096427 A KR20100096427 A KR 20100096427A
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pcb
plate
arm
loading
pair
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KR1020090015303A
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Korean (ko)
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KR101058886B1 (en
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백태일
박남선
박윤철
노진명
권기석
이배진
장석이
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주식회사제4기한국
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: A PCB transfer device of a plasma processing device is provided to prevent the damage or contamination of a PCB which has a plasma-processed surface by transferring the PCB without a hitch and friction with a vertically moving cylinder and a horizontally moving cylinder. CONSTITUTION: A loading part(1) is formed in one side and transfers a PCB. An electrode part processes the surface of the transferred PCB with plasma gas. An extraction part exports the PCB which has the processed surface. A PCB picker(4) is fixed to a rail which is installed on a fixed plate and transfers the PCB by attaching or detaching the PCB. The plate loads the PCB. A horizontally moving cylinder(8,8') horizontally transfers the plate. A vertically moving cylinder vertically transfers the plate.

Description

플라즈마 처리장치의 ＰＣＢ 이송장치{PCB TRANSFERRING APPARATUS OF PLASMA CLEANING UNITS}PCC transfer device of plasma processing equipment {PCB TRANSFERRING APPARATUS OF PLASMA CLEANING UNITS}

본 발명은 플라즈마를 발생시켜 PCB(printed circuit board)를 표면처리하는 장치에 관한 것으로서, 보다 상세하게는 승하강실린더와 횡행실린더에 의해 상·하 또는 좌·우 이동이 가능하게 하여 표면처리된 PCB를 자동으로 이송시키는 장치에 관한 것이다.The present invention relates to an apparatus for surface treatment of a printed circuit board (PCB) by generating a plasma, and more particularly, the surface-treated PCB by moving the cylinder up and down or left and right by a lifting cylinder and a transverse cylinder It relates to a device for automatically transporting.

인쇄회로기판(PCB), 반도체 웨이퍼, 칼라 필터 기판, 박막 트랜지스터 기판 등과 같은 기판에 대한 처리는 세정 공정, 식각 공정, 애슁(Ashing)공정, 후속 공정을 위해 기판의 표면 상태를 개질하기 위한 표면처리 과정으로 행해진다. 현재는 표면처리의 방법으로 플라즈마를 이용하는 방법이 널리 이용되고 있는데, 상기 방법은 진공 또는 저압에서 기판을 처리하는 진공 플라즈마 처리방법이 주로 사용되고 있다. 특히 정교함을 요하는 경우에는 플라즈마를 이용하는 표면처리가 효율적이다. Treatment of substrates such as printed circuit boards (PCBs), semiconductor wafers, color filter substrates, thin film transistor substrates, etc., is a surface treatment for modifying the surface state of the substrate for cleaning, etching, ashing, and subsequent processes. The process is done. Currently, a method using a plasma is widely used as a method of surface treatment. The method is mainly a vacuum plasma treatment method for treating a substrate under vacuum or low pressure. Particularly, in the case where sophistication is required, surface treatment using plasma is effective.

플라즈마(Plasma)란 준중성상태에 있는 이온화된 가스를 말하며, 플라즈마 표면처리에서는 전기장에 의해 가속된 이온이 표면처리 과정에 참여하게 된다. 일 반적인 플라즈마 처리장치는 챔버와, 대향 배치되는 상부전극 어셈블리 및 하부전극 어셈블리와, 반응 가스를 챔버에 제공하는 가스공급부와, 플라즈마 발생을 위한 전원공급부로 구성된다. Plasma refers to an ionized gas in a quasi-neutral state. In plasma surface treatment, ions accelerated by an electric field participate in the surface treatment process. In general, the plasma processing apparatus includes a chamber, opposing upper and lower electrode assemblies, a gas supply unit providing a reaction gas to the chamber, and a power supply unit for generating plasma.

최근에는 전자장비를 소형화하기 위해 인쇄회로기판에 반도체칩이 기판에 직접 설치되거나, 반도체칩이 와이어에 의해 기판의 전극에 전기적으로 접속되고 , 반도체칩과 와이어가 수지로 피복되는데, 많은 경우 와이어는 금이 사용되고 금 와이어와의 본딩을 고려하여 기판의 전극이 금으로 도금되어 있다. 회로패턴은 통상 구리로 만들어지고 금이 구리에 직접 본딩(bonding)되지 않기 때문에 금속층이 구리전극에 형성된 다음, 상기 금속층의 표면이 금으로 도금된다. Recently, in order to miniaturize electronic equipment, a semiconductor chip is directly installed on a printed circuit board, or a semiconductor chip is electrically connected to an electrode of the substrate by a wire, and the semiconductor chip and the wire are coated with a resin. Gold is used and the electrode of the substrate is plated with gold in consideration of bonding with the gold wire. Since the circuit pattern is usually made of copper and gold is not directly bonded to copper, a metal layer is formed on the copper electrode, and then the surface of the metal layer is plated with gold.

상기 목적으로 PCB Strip 제품에는 표면에 금도금을 하는데 본딩(bonding)력 향상을 위해 플라즈마를 이용하여 Strip의 표면을 클리닝(cleaning)처리를 한다. For this purpose, the PCB strip product is gold plated on the surface, and the surface of the strip is cleaned using plasma to improve bonding strength.

제1도는 종래 플라즈마 처리장치의 사시도, 제2도는 종래 플라즈마 처리장치의 기판 이송통로를 도시한 개략도, 제3도는 종래 플라즈마 처리장치의 기판 이송 작동과정을 도시한 개략도인데, 종래에 기판(106)은 주로 이송수단을 구성하는 제1아암(115) 및 제2아암(116)에 의해 이송된다. 제2도와 제3도에 도시되어 있듯이, 제1아암(115) 및 제2아암(116)은 단일 타이밍벨트(149)에 고정되고, 서로 일정한 간격을 두고, 이송통로(L)에 평행한 방향으로 일치하여 이동할 수 있다. 하류측으로부터 순차적으로 제1기판(106X)이 표면처리되고, 와이어 본딩 메카니즘(114)에 의해 와이어 본딩되고, 제2기판(106Y)이 시일(seal)공간에서 표면처리되며, 제3기판(106Z)이 아직 표면처리되지 않고 공급매거진(109)에 수용된다. 제2도에 도시된 바와 같이 제1기판(106X)에 와이어 본딩과 제2기판(106Y)에 대한 표면처리가 마무리될 때, 제3a도에 도시된 바와 같이, 제2아암(116)이 제1기판(106X)과 맞물리게 되고, 제1아암(115)이 제2기판(106Y)과 맞물리게 되며, 모터(147)를 구동시켜, 화살표방향(M1)으로 제1기판(106X)을 수용매거진(receiver magazine)(110)에 공급하고, 화살표방향(M1)으로 제2기판(106Y)을 와이어 본딩 메카니즘(114)의 전방 위치로 이동한다. 동시에, 푸시 실린더(111)를 구동시켜, 공급 매거진(109)에서 제3기판(106Z)을 공급한다. 다음 제3b도에 도시되어 있듯이, 제1아암(115) 및 제2아암(116)을 상승시켜 제1아암(115)을 화살표방향(M2)방향으로 제3기판(106Z)의 후단부에 위치시키는 반면, 제2아암(116)을 화살표(M2)방향으로 제2기판(106Y)의 후단부로 위치시킨다. 제3c도에 도시되어 있듯이, 제1아암(115) 및 제2아암(116)을 하강시켜, 각각 제3기판(106Z) 및 제2기판(106Y)과 접촉시키고, 제1아암(115)에 의해서 제3기판(106Z)을 화살표방향(M3)으로 제2의 제2기판(106Y)의 위치에 대응하는 위치로 이동시키는 반면, 제2아암(116)에 의해서는 제2기판(106Y)을 화살표(M3)방향으로 제2도의 제1기판(106X)의 위치에 대응하는 위치로 이동시킨다.1 is a perspective view of a conventional plasma processing apparatus, FIG. 2 is a schematic diagram showing a substrate transfer path of a conventional plasma processing apparatus, and FIG. 3 is a schematic diagram showing a substrate transfer operation process of a conventional plasma processing apparatus. Is mainly conveyed by the first arm 115 and the second arm 116 constituting the conveying means. As shown in FIG. 2 and FIG. 3, the first arm 115 and the second arm 116 are fixed to a single timing belt 149, at regular intervals from each other, and in a direction parallel to the transport passage L. FIG. You can move to match. The first substrate 106X is sequentially surface treated from the downstream side, wire bonded by the wire bonding mechanism 114, the second substrate 106Y is surface treated in the seal space, and the third substrate 106Z. ) Is not yet surface treated and is received in the feed magazine 109. As shown in FIG. 2, when the wire bonding to the first substrate 106X and the surface treatment of the second substrate 106Y are finished, as shown in FIG. 3A, the second arm 116 is removed. The first substrate 106X is engaged, the first arm 115 is engaged with the second substrate 106Y, and the motor 147 is driven to receive the first substrate 106X in the arrow direction M1. receiver magazine) 110, and moves the second substrate 106Y to the front position of the wire bonding mechanism 114 in the arrow direction M1. At the same time, the push cylinder 111 is driven to supply the third substrate 106Z from the supply magazine 109. As shown in FIG. 3B, the first arm 115 and the second arm 116 are raised to position the first arm 115 at the rear end of the third substrate 106Z in the direction of the arrow M2. On the other hand, the second arm 116 is positioned to the rear end of the second substrate 106Y in the direction of the arrow M2. As shown in FIG. 3C, the first arm 115 and the second arm 116 are lowered to contact the third substrate 106Z and the second substrate 106Y, respectively, and contact the first arm 115. Move the third substrate 106Z to a position corresponding to the position of the second second substrate 106Y in the direction of the arrow M3, while the second substrate 106Y is moved by the second arm 116. It moves to the position corresponding to the position of the 1st board | substrate 106X of FIG. 2 in the direction of the arrow M3.

다음에는 제1아암(115) 및 제2아암(116)을 제2도에 도시된 각각의 위치로 복귀시킨다. Next, the first arm 115 and the second arm 116 are returned to their respective positions shown in FIG.

이런 작동을 반복함으로써, 표면처리된 기판이 이송된다. By repeating this operation, the surface treated substrate is transferred.

즉, 종래의 PCB 이송장치는 로딩부에 레일버퍼 공간이 있어서 PCB를 1장씩 레일위에 올려놓고 푸셔후크로 밀어서 챔버에 안착시키는 방식이었다. 즉, 처리될 PCB를 적재플레이트에 적재하면 버퍼 레일을 거쳐 중간레일로 이동한 후 챔버레일 에서 플라즈마 표면처리된다. 그 후에 처리된 PCB를 버퍼 레일로 이동시킨 후 버퍼 레일에서 취출플레이트로 적재하여 외부로 배출시키는 이른바 푸시(Push)식 이송장치였다.  In other words, the conventional PCB transfer device has a rail buffer space in the loading part, so that the PCBs are placed on the rails one by one and pushed to the chamber by pushing with a pusher hook. That is, when the PCB to be processed is loaded on the loading plate, the intermediate surface is moved to the intermediate rail via the buffer rail and the plasma surface treatment is performed on the chamber rail. After that, the processed PCB was moved to a buffer rail, and then loaded on a take-out plate from the buffer rail, which was a so-called push transfer device.

상기 푸시(Push)식 방식에 의하면 PCB Strip의 걸림과 마찰 등으로 인한 손상 및 오염이 생기는 문제가 있었다.According to the push method, there is a problem in that damage and contamination are caused due to friction and the like of the PCB strip.

본 발명은 상기 문제점을 해결하기 위하여 안출된 것으로서, 로딩부가 레일버퍼 공간이 없이 PCB를 직접 챔버 레일위에 올려놓고 픽업(pick up)방식으로 일정높이까지 올려 정확한 위치에 위치시켜 걸림과 마찰 등이 발생하지 않으면서 자동으로 PCB를 이송시킬 뿐만 아니라 동시에 다수의 PCB를 이송시키는 데 그 목적이 있다. The present invention has been made in order to solve the above problems, the loading part is directly placed on the chamber rail without a rail buffer space and raised to a certain height in a pick-up (pick up) method to be located in the correct position, such as jams and friction occurs It is not only to transfer PCBs automatically but also to transfer multiple PCBs at the same time.

상기 목적을 달성하기 위하여 본 발명은,The present invention to achieve the above object,

일측에 형성되어 PCB를 적재, 이송시키는 로딩부(1)와; 중앙에 형성되어 상기 이송된 PCB를 플라즈마로 표면처리하는 전극부(2)와; 타측에 형성되어 상기 표면처리된 PCB를 반출시키는 취출부(3)로 구성되는 PCB 이송장치에 있어서, 상기 로딩부(1)와 취출부(3)에는 고정판(22)상에 부설된 레일(41)에 고정되어 PCB를 흡착 또는 탈착시켜 이송시키는 PCB피커(4)가 포함되는 것을 특징으로 하는 PCB 이송장치를 제공한다.A loading part 1 formed on one side to load and transfer the PCB; An electrode part 2 formed at the center to surface-treat the transferred PCB with plasma; In the PCB transfer device formed on the other side and composed of a take-out portion (3) for carrying out the surface-treated PCB, the rail 41 is provided on the fixing plate 22 in the loading portion (1) and take-out portion (3) It is fixed to the) provides a PCB transfer device characterized in that it comprises a PCB picker (4) for transporting the adsorption or detachment PCB.

또한, 본 발명은 상기 로딩부(1)와 취출부(3)는, PCB를 적재하는 플레이트(5,6)와; 상기 플레이트를 좌우로 이동시키는 횡행실린더(8,8′)와; 상기 플레이트를 승하강시키는 승하강실린더(7,7´)가 더 포함되는 것을 특징으로 하는 PCB 이송장치를 제공한다.In addition, the present invention, the loading unit (1) and take-out unit (3), the plate (5, 6) for loading the PCB; A transverse cylinder (8, 8 ') for moving the plate left and right; It provides a PCB transfer device, characterized in that it further comprises a lifting cylinder (7, 7 ') for lifting the plate.

게다가, 본 발명은 상기 PCB피커(4)는 고정판(22)상에 부설된 레일(41)상에 서 좌우로 이동하는 횡행이동판(23)과; 상기 횡행이동판(23)상에 수직으로 형성된 상하레일(25)을 승하강되는 승하강이동판(24)과; 상기 승하강이동판(24)의 일측에 고정 결합된 제1아암(26)과; 상기 승하강이동판(24)에 이동가능하도록 결합되면서 제1아암(26)의 내측에 형성된 제2아암(27)과; 상기 한 쌍의 아암의 내측에 부설된 한 쌍의 PCB가이드(39)와 결합된 패드브라켓(38)과 연결되어 PCB를 비접촉식으로 진공 흡착 또는 탈착하는 다수의 진공패드(32)로 구성되는 것을 특징으로 하는 PCB 이송장치를 제공한다.In addition, the present invention, the PCB picker (4) is a transverse moving plate (23) which moves from side to side on the rail (41) laid on the fixed plate (22); An elevating plate 24 for elevating the up and down rails 25 formed vertically on the transverse plate 23; A first arm 26 fixedly coupled to one side of the elevating plate 24; A second arm (27) formed inside the first arm (26) while being movably coupled to the elevating plate (24); It is composed of a plurality of vacuum pads 32 which are connected to the pad bracket 38 coupled to the pair of PCB guides 39 attached to the inside of the pair of arms to vacuum adsorption or detachment of the PCB in a non-contact manner. Provides a PCB transfer device.

나아가, 본 발명은 상기 한 쌍의 아암의 내부에 길이방향으로 형성된 제1회전봉(33)과 상기 제1회전봉(33)과 수직방향으로 교차형성되는 제2회전봉(30)과; 상기 제1회전봉(33)과 제2회전봉(30)이 교차되는 곳에는 수직으로 치합되는 한 쌍의 헬리컬기어(31)와; 상기 헬리컬기어(31)를 작동시키는 폭조절모터(29)로 구성되는 폭조절장치(28)를 더 포함하는 것을 특징으로 하는 PCB 이송장치를 제공한다.Furthermore, the present invention includes a first rotary rod (33) formed in the longitudinal direction inside the pair of arms and a second rotary rod (30) formed in a vertical direction with the first rotary rod (33); A pair of helical gears 31 vertically engaged where the first rotating rod 33 and the second rotating rod 30 cross each other; It provides a PCB transfer device, characterized in that it further comprises a width adjusting device 28 composed of a width adjusting motor 29 for operating the helical gear (31).

뿐만 아니라, 본 발명은 상기 제2아암(27)을 관통하는 볼스크류(36)와; 상기 볼스크류(36)의 일측에 결합되어 상기 볼스크류(36)를 작동시키는 길이조절모터(35)로 구성되는 길이조절장치(34)를 더 포함하는 것을 특징으로 하는 PCB 이송장치를 제공한다.In addition, the present invention includes a ball screw 36 penetrating the second arm 27; It is coupled to one side of the ball screw 36 provides a PCB transfer device further comprises a length adjusting device (34) consisting of a length adjusting motor (35) for operating the ball screw (36).

본 발명은 상·하 또는 좌·우 이동시키는 실린더에 의해 PCB를 이송할 때 걸림과 마찰이 없이 PCB를 이송시켜 플라즈마로 표면처리된 PCB 등의 기판의 손상 및 오염이 없게 하는 효과를 제공할 뿐만 아니라 다수개의 PCB를 동시에 이송할 수 있으며 다양한 크기의 PCB를 이송할 수 있는 효과를 제공한다.The present invention provides the effect of avoiding damage and contamination of the substrate such as the PCB surface-treated by plasma transfer the PCB without jamming and friction when transferring the PCB by the cylinder to move up, down or left and right. In addition, multiple PCBs can be transferred at the same time and provide the effect of transferring PCBs of various sizes.

본 발명은 플라즈마 처리하는 PCB이송장치에 관한 것인데, 특히 승하강실린더(7,7′) 또는 횡행실린더(8,8′)에 의해 플라즈마 클리닝된 PCB를 이송하는 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PCB transfer apparatus for plasma treatment, and more particularly, to an apparatus for transferring a plasma cleaned PCB by a lifting cylinder (7,7 ') or a transverse cylinder (8,8').

이하에서는 도면을 참조하여 상세하게 설명한다.Hereinafter, with reference to the drawings will be described in detail.

제4도는 본 발명 플라즈마 처리장치를 도시한 것인데 4a도는 정면도, 4b도는 평면도, 4c도는 측면도를 도시한 것이다. 본 발명은 상기 목적을 위해 PCB를 플라즈마 처리를 위해 레일(41)상에 안착시키는 역할을 담당하는 로딩부(1)와, 상기 로딩부(1)에 의해 안착된 PCB를 레일(41)을 통해 이송된 PCB를 플라즈마 처리하는 전극부(2)와, 상기 플라즈마 처리된 PCB를 반출시키는 역할을 하는 취출부(3)로 대분된다.4 shows a plasma processing apparatus of the present invention, in which 4a is a front view, 4b is a top view, and 4c is a side view. The present invention is a loading unit (1) which serves to seat the PCB on the rail 41 for plasma processing for the above purpose, and the PCB seated by the loading unit (1) through the rail 41 It is divided into the electrode part 2 which plasma-processes the conveyed PCB, and the extraction part 3 which serves to carry out the said plasma-processed PCB.

상기 로딩부(1)는 PCB 이송장치의 좌측부에 형성되어 있는데, 상기 로딩부(1)는 상기 PCB 이송장치의 좌측 하부에 위치한 PCB를 적재하기 위한 좌·우 또는 상·하 이동이 가능한 적재플레이트(5)와 상기 적재플레이트(5)의 하부에 횡으로 형성된 횡행실린더(8)와 상기 적재플레이트(5)의 하단부에 설치되어 상·하 이동이 가능하도록 하는 승하강실린더(7)와 상기 레일(41)상에 위치한 PCB를 이송하는 PCB피커(4)로 구성되어 있다.The loading unit 1 is formed on the left side of the PCB transfer apparatus, and the loading unit 1 is a loading plate capable of moving left, right or up and down for loading a PCB located on the lower left side of the PCB transfer apparatus. (5) and the horizontal cylinder (8) formed in the lower portion of the loading plate (5) and the lifting cylinder (7) and the rail installed in the lower end of the loading plate (5) to enable the up and down movement It consists of a PCB picker (4) for transporting the PCB located on the (41).

도 7은 한 쌍의 PCB피커(4)의 사시도이고, 도 8은 PCB피커(4)의 확대 사시도인데, 상기 PCB피커(4)는 상기 플라즈마 처리장치의 전면에 형성된 프레임(21)상 에 설치되는 고정판(22)과, 상기 고정판(22) 위를 좌·우 이동하도록 된 횡행이동판(23)과, 상기 횡행이동판(23)의 위에 상기 횡행이동판(23)과 수직으로 설치되어 상·하 이동가능한 승하강이동판(24)과, 상기 승하강이동판(24)의 일측에 상기 승하강이동판(24)과 수직으로 설치되어 PCB를 진공으로 흡착 또는 탈착가능한 한 쌍의 아암으로 구성되어 있다. 상기 한 쌍의 아암은 제1아암(26)과 제2아암(27)으로 구분되는데 상기 한 쌍의 아암은 길이방향으로 평행을 이루면서 형성되어 있고, 상기 제1아암(26)은 외측에 형성되어 있고, 상기 승하강이동판(24)에 결합형성되어 있으며 상기 제2아암(27)은 내측에 형성되어 있고, 볼스크류(36)에 결합된 채로 지지되어 좌·우 이동이 가능하도록 형성되어 있다. 상기 횡행이동판(23)에는 한 쌍의 PCB피커(4)가 상기 고정판(22) 위에 설치된 레일 위를 이동하도록 구동하는 한 쌍의 구동모터(37)가 고정판(22) 하부에 설치되어 있고, 상기 제1아암(26)과 제2아암(27)에는 각각의 아암의 하부를 관통하여 일정한 간격으로 이격되어 고정형성된 다수의 비접촉식 진공패드(32)가 하방으로 돌출형성되어 있으며, 상기 한 쌍의 아암의 내부중앙부에 길이 방향으로 형성된 한 쌍의 제1회전봉(33)과 상기 한 쌍의 제1회전봉(33)과 직각으로 교차형성되면서 상기 한 쌍의 아암을 관통하는 제2회전봉(30)이 결합되어 다양한 폭을 갖는 PCB를 이송하도록 하는 폭조절장치(28)가 구비되어 있다. 또한 상기 교차형성부에는 한 쌍의 헬리컬기어(31)가 상기 회전봉(30,33)의 외주면을 감싸면서 수직교차하여 형성되어 있다. 7 is a perspective view of a pair of PCB picker 4, Figure 8 is an enlarged perspective view of the PCB picker 4, the PCB picker 4 is installed on the frame 21 formed on the front of the plasma processing apparatus It is installed on the fixed plate 22, the transverse plate 23 to move the left and right on the fixed plate 22, and the transverse plate 23 perpendicular to the transverse plate 23 A movable movable plate 24 which is movable downward and a pair of arms which are installed on one side of the movable movable plate 24 perpendicular to the elevator movable plate 24 so as to adsorb or detach the PCB by vacuum. Consists of. The pair of arms are divided into a first arm 26 and a second arm 27. The pair of arms are formed in parallel in the longitudinal direction, and the first arm 26 is formed outside. It is coupled to the lifting plate 24, the second arm 27 is formed on the inside, is supported while being coupled to the ball screw 36 is formed so as to move left and right. . The transverse moving plate 23 is provided with a pair of drive motors 37 for driving a pair of PCB pickers 4 to move on a rail installed on the fixed plate 22, and below the fixed plate 22. The first and second arms 26 and 27 have a plurality of non-contact vacuum pads 32 which are fixedly spaced apart at regular intervals through the lower portions of the arms and protrude downward. The second rotary bar 30 penetrating the pair of arms while being formed to cross at a right angle with the pair of first rotating rod 33 and the pair of first rotating rod 33 formed in the longitudinal direction in the inner central portion of the arm A width adjusting device 28 is provided that is coupled to transfer PCBs having various widths. In addition, a pair of helical gears 31 are formed on the cross-section to vertically cross the outer circumferential surfaces of the rotating rods 30 and 33.

또한 한 쌍의 아암의 일측에는 상기 아암간의 간격을 조절하기 위한 길이조절장치(34)가 제2아암(27)에 설치되어 있는데, 이는 승하강이동판(24)과 평행하게 설치된 볼스크류(36)와 상기 볼스크류(36)의 일측에 결합된 길이조절모터로 구성되어 있다. In addition, one side of the pair of arms is provided with a length adjusting device 34 for adjusting the distance between the arms on the second arm 27, which is a ball screw 36 installed in parallel with the elevating plate (24) ) And the length adjustment motor coupled to one side of the ball screw (36).

도9는 본 발명의 비접촉식 진공패드(32)가 PCB를 흡착한 상태를 나타내는 상태도인데, 아암의 하부에 돌출된 비접촉식 진공패드(32)와 상기 비접촉식 진공패드(32)의 상방으로 결합되어 지지하는 "L"형상의 패드브라켓(38)과 상기 패드브라켓(38)의 일측면에 결합되어 비접촉식 진공패드(32)와 거의 동일한 위치까지 돌출형성되어 PCB의 과도한 움직임을 제한하는 PCB가이드(39)가 아암의 하부에 형성되어 있는 것을 나타낸 것이다. FIG. 9 is a state diagram showing a state in which the non-contact vacuum pad 32 of the present invention adsorbs the PCB. The non-contact vacuum pad 32 protruding from the lower portion of the arm is coupled to and supported above the non-contact vacuum pad 32. The PCB guide 39, which is connected to one side of the pad bracket 38 and the pad bracket 38 of the “L” shape and protrudes to the same position as the non-contact vacuum pad 32, restricts excessive movement of the PCB. It shows what is formed in the lower part of an arm.

또한 상기 전극부(2)는 로딩부(1)로부터 이송된 PCB의 표면을 처리하는 장치로서 전극부(2)의 중앙에 전극(10)과, 상기 전극을 이용하여 플라즈마 표면처리하기 위한 장치(도면 미표시)와, 상기 전극의 상부에 위치하는 챔버(9)와, 상기 챔버를 승하강 시키기 위한 챔버 승하강 장치(도면 미표시)로 구성된다. 이 때 전극의 하부에는 다양한 폭을 갖는 PCB를 표면처리하기 위한 폭조절이 가능한 장치가 구비될 수도 있다. In addition, the electrode unit 2 is a device for processing the surface of the PCB transferred from the loading unit 1, the electrode 10 in the center of the electrode unit 2, and an apparatus for plasma surface treatment using the electrode ( Not shown), a chamber 9 positioned above the electrode, and a chamber lifting device (not shown) for raising and lowering the chamber. At this time, the lower portion of the electrode may be provided with a device capable of adjusting the width for treating the PCB having a variety of widths.

그리고 상기 취출부(3)는 플라즈마 처리장치의 우측부에 설치되는데, 플라즈마 처리된 PCB를 이송하기 위해 레일(41)상에 위치한 PCB피커(4)와, 상기 플라즈마 처리된 PCB를 배출시키기 위한 취출플레이트(6)가 상기 피커의 우측 하부에 위치하고 상기 취출플레이트(6)에는 적재플레이트(5)와 마찬가지로 승하강실린더(7′)와 횡행실린더(8′)가 구비되어 있다. And the extraction unit 3 is installed on the right side of the plasma processing apparatus, the PCB picker 4 located on the rail 41 to transfer the plasma-treated PCB and the extraction for discharging the plasma-processed PCB The plate 6 is located at the lower right side of the picker, and the ejection plate 6 is provided with a lifting cylinder 7 'and a transverse cylinder 8' similarly to the loading plate 5.

상기 구성요소들의 구체적인 작동원리를 살펴보면,Looking at the specific operating principle of the components,

적재플레이트(5)에 적재된 PCB를 횡행실린더(8)에 의해 전극부(2)의 좌측면 하부까지 이동시킨 후 승하강실린더(7)에 의해 PCB를 레일근처까지 올린다. 이 때 횡행실린더(8)는 LM가이드를 주로 사용하며, 승하강실린더(7)는 스텝핑모터를 주로 사용한다. 상기 승하강실린더(7)에 의해 상향이동되면 PCB피커(4)의 비접촉식 진공패드(32)가 작동하여 PCB를 진공흡착하여 PCB피커(4)에 의해 레일상에서 전극부(2)로 이송된다. 상기 과정이 끝나면 PCB피커(4)는 원래의 위치로 위치하여 다음 처리할 PCB를 이송할 준비를 한다. 상기 전극부(2)로 이송되면 챔버(9)가 하강하여 플라즈마 처리할 준비를 하고 덮개(Door)로 덮은 다음 진공펌프(11)를 가동시켜 전극부(2)내를 진공상태로 만든 다음 PCB의 표면의 이물질을 제거하는 플라즈마 표면처리가 시작된다. 상기 플라즈마 표면처리가 끝난 다음 전극의 덮개가 열리고 취출부(3)의 PCB피커(4)가 레일을 따라 전극부(2)로 이동하여 PCB피커(4)의 하부에 돌출형성된 비접촉식 진공패드(32)로 상기 처리된 PCB를 흡착한 후 전극부(2)의 우측으로 이동한 후 취출플레이트(6)에 적재한다. 취출플레이트(6)상에 놓여진 PCB는 승하강실린더(7′)에 의해 하부로 이동되고 다시 횡행실린더(8′)에 의해 전극부의 우측 하부로 이동시켜 외부로 배출된다. 이 때 로딩부의 적재플레이트(5)는 승하강실린더(7)에 의해 적재되어 있는 PCB가 하나씩 이송될 때마다 PCB의 두께만큼 상승하고, 취출부의 취출플레이트(6)는 취출플레이트에 PCB가 하나씩 적재될 때마다 승하강실린더(7′)에 의해 PCB의 두께만큼 하강한다.The PCB loaded on the loading plate 5 is moved to the lower left side of the electrode part 2 by the transverse cylinder 8 and then the PCB is raised to the vicinity of the rail by the lifting cylinder 7. At this time, the transverse cylinder 8 mainly uses an LM guide, and the lifting cylinder 7 mainly uses a stepping motor. When moved up and down by the elevating cylinder (7), the non-contact vacuum pad 32 of the PCB picker (4) is operated to vacuum the PCB is transferred to the electrode portion 2 on the rail by the PCB picker (4). After the process is completed, the PCB picker (4) is located in the original position to prepare to transfer the PCB to be processed next. When transferred to the electrode unit 2, the chamber 9 descends to prepare for plasma treatment, covers with a lid, and then operates the vacuum pump 11 to make the inside of the electrode unit 2 in a vacuum state, and then to a PCB. Plasma surface treatment is started to remove foreign matter on the surface. After the plasma surface treatment is finished, the electrode cover is opened and the PCB picker 4 of the extraction unit 3 moves to the electrode unit 2 along the rail to protrude in the lower portion of the PCB picker 4 32. After adsorbing the processed PCB with), it is moved to the right side of the electrode unit 2 and loaded on the take-out plate 6. The PCB placed on the take-out plate 6 is moved downward by the elevating cylinder 7 'and again by the transverse cylinder 8' to the lower right of the electrode portion and discharged to the outside. At this time, the loading plate 5 of the loading unit rises by the thickness of the PCB every time the PCB loaded by the elevating cylinder 7 is transferred one by one, and the ejection plate 6 of the ejection unit is loaded one by one on the ejection plate. Every time it is lowered by the lifting cylinder 7 'by the thickness of the PCB.

이 때 길이조절장치(34)와 폭조절장치(29)를 이용하여 처리되는 PCB의 크기에 맞게 조절한다. 상기 길이조절장치의 작동원리를 살펴보면,At this time, using the length adjusting device 34 and the width adjusting device 29 to adjust to the size of the PCB to be processed. Looking at the operating principle of the length adjustment device,

길이조절모터(35)의 작동에 의해 상기 길이조절모터(35)에 설치된 볼스크류(36)가 회전하게 되는데, 상기 볼스크류(36)는 볼트와 너트의 결합으로 되어 있는데 상기 볼스크류(36)의 회전에 의해 제1아암(26)은 고정된 채로 제2아암(27)만이 좌·우로 이동하게 되어 제1아암(26)과 제2아암(27)간의 간격이 조절되게 된다. The ball screw 36 installed in the length control motor 35 is rotated by the operation of the length adjustment motor 35, the ball screw 36 is a combination of bolts and nuts, the ball screw 36 By the rotation of the first arm 26 is fixed, only the second arm 27 is moved to the left and right, so that the distance between the first arm 26 and the second arm 27 is adjusted.

또한 상기 폭조절장치(28)의 작동원리를 살펴보면, 폭조절모터(29)의 작동에 의해 상기 폭조절모터(29)와 일체로 형성된 제2회전봉(30)이 회전하게 되는데, 상기 제2회전봉(30)의 외주면을 감싸면서 치합형성되어 수직교차하는 두 쌍의 헬리컬기어(31)가 서로 맞물려 회전하면서 한 쌍의 아암이 길이방향으로 동시에 전·후진 운동을 하면서 PCB의 크기에 맞도록 진공패드(32)의 위치를 조절하게 된다. 즉, 다수의 비접촉식 진공패드(32)간의 간격은 일정하게 유지한 채로 PCB의 폭방향으로 중앙부에 각각의 비접촉식 진공패드(32)가 위치하도록 동시에 앞으로 당겨서 좁은 폭을 갖는 PCB를 진공흡탈착하게 하거나 동시에 뒤로 밀어 큰 폭을 갖는 PCB를 진공흡탈착하게 한다. In addition, looking at the operating principle of the width adjusting device 28, the second rotating rod 30 formed integrally with the width adjusting motor 29 is rotated by the operation of the width adjusting motor 29, the second rotating rod Two pairs of helical gears 31 engaged with each other and vertically intersecting while surrounding the outer circumferential surface of the 30 are engaged with each other to rotate, while the pair of arms move forward and backward simultaneously in the longitudinal direction to fit the size of the PCB. The position of 32 will be adjusted. That is, while keeping the distance between the plurality of non-contact vacuum pads 32 constant, each non-contact vacuum pad 32 in the center in the width direction of the PCB at the same time pulled forward at the same time to vacuum suction or detach the PCB having a narrow width or At the same time, it pushes back to allow vacuum-adsorption of a large width PCB.

또한, 상기 비접촉식 진공패드(32)의 상측에 고정형성된 "L"형상의 패드브라켓(38)과 상기 패드브라켓(38)의 측면에 PCB가이드(39)가 고정결합되어 PCB의 과도한 움직임을 제한한다. In addition, the L-shaped pad bracket 38 fixedly formed on the upper side of the non-contact vacuum pad 32 and the PCB guide 39 are fixedly coupled to the side of the pad bracket 38 to limit excessive movement of the PCB. .

적재플레이트(5)에 적재된 PCB를 모두 처리하면 승하강실린더(7)가 하강한 후, 횡행실린더(8)에 의해 좌측으로 이동하여 다음 처리될 PCB를 적재한 후 상기 과정을 반복하면서 PCB의 표면처리와 동시에 처리된 PCB에 손상을 가하지 않으면서 이송할 수 있게 된다. When the PCB loaded on the loading plate 5 is processed, the lifting cylinder 7 is lowered, then moved to the left side by the transverse cylinder 8 to load the next PCB to be processed, and then the above process is repeated. Simultaneously with the surface treatment it can be transported without damaging the processed PCB.

제1도는 종래 플라즈마 처리장치의 사시도,1 is a perspective view of a conventional plasma processing apparatus,

제2도는 종래 플라즈마 처리장치의 기판 이송통로를 도시한 개략도2 is a schematic diagram showing a substrate transfer path of a conventional plasma processing apparatus.

제3도는 종래 플라즈마 처리장치의 기판 이송 작동과정을 도시한 개략도,3 is a schematic diagram showing a substrate transfer operation of a conventional plasma processing apparatus;

제4도는 본 발명 플라즈마 처리장치를 정면도, 평면도, 측면도,4 is a front view, a plan view, a side view of the plasma processing apparatus of the present invention;

제5도는 볼 발명 플라즈마 처리장치의 사시도,5 is a perspective view of a ball invention plasma processing apparatus,

제6도는 본 발명 플라즈마 처리장치의 측면도,6 is a side view of the plasma processing apparatus of the present invention;

제7도는 본 발명 PCB피커의 사시도,7 is a perspective view of the PCB picker of the present invention,

제8도는 본 발명 PCB피커의 확대도,8 is an enlarged view of the PCB picker of the present invention,

제9도는 본 발명 비접촉식 진공패드가 PCB를 흡착한 상태를 나타내는 상태도이다. 9 is a state diagram showing a state in which the non-contact vacuum pad of the present invention adsorbs the PCB.

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1: 로딩부, 2: 전극부 1: loading part, 2: electrode part

3: 취출부 4: PCB피커 3: ejection part 4: PCB picker

5: 적재플레이트 6: 취출플레이트5: loading plate 6: ejection plate

7,7′: 승하강실린더 8,8′: 횡행실린더 7,7 ': lifting cylinder 8,8': traversing cylinder

9: 챔버 10: 전극9: chamber 10: electrode

11: 진공펌프 21: 프레임 11: vacuum pump 21: frame

22: 고정판 23: 횡행이동판 22: fixed plate 23: transverse moving plate

24: 승하강이동판 25: 상하레일 24: lifting plate 25: up and down rail

26:제1아암 27: 제2아암 26: first arm 27: second arm

28: 폭조절장치 29: 폭조절모터 28: width adjustment device 29: width adjustment motor

30: 제2회전봉 31: 헬리컬기어 30: second rotating rod 31: helical gear

32: 비접촉식 진공패드 33: 제1회전봉 32: non-contact vacuum pad 33: first rotating rod

34: 길이조절장치 35: 길이조절모터 34: length adjusting device 35: length adjusting motor

36: 볼스크류 37: 구동모터 36: Ball screw 37: Drive motor

38: 패드브라켓 39: PCB가이드 38: Pad Bracket 39: PCB Guide

41: 레일 41: rail

106: 기판 106X: 제1기판106: substrate 106X: first substrate

106Y: 제2기판 106Z: 제3기판106Y: Second Board 106Z: Third Board

109: 공급 매거진 110: 수용 매거진109: supply magazine 110: acceptance magazine

111: 푸시 실린더 113:표면처리부111: push cylinder 113: surface treatment unit

114: 본딩 메카니즘 115: 제1아암 116: 제2아암 147: 모터 149: 타이밍벨트114: bonding mechanism 115: first arm 116: second arm 147: motor 149: timing belt

Claims (5)

일측에 형성되어 PCB를 적재, 이송시키는 로딩부(1)와;A loading part 1 formed on one side to load and transfer the PCB; 중앙에 형성되어 상기 이송된 PCB를 플라즈마로 표면처리하는 전극부(2)와;An electrode part 2 formed at the center to surface-treat the transferred PCB with plasma; 타측에 형성되어 상기 표면처리된 PCB를 반출시키는 취출부(3)로 구성되는 PCB 이송장치에 있어서,In the PCB transfer device formed on the other side and composed of a take-out portion (3) for carrying out the surface-treated PCB, 상기 로딩부(1)와 취출부(3)에는 고정판(22)상에 부설된 레일(41)에 고정되어 PCB를 흡착 또는 탈착시켜 이송시키는 PCB피커(4)가 포함되는 것을 특징으로 하는 PCB 이송장치.PCB loading, characterized in that the loading section (1) and the take-out section (3) includes a PCB picker (4) is fixed to the rail (41) installed on the fixed plate 22 to transfer or absorb or detach the PCB Device. 제1항에 있어서,The method of claim 1, 상기 로딩부(1)와 취출부(3)는, PCB를 적재하는 플레이트(5,6)와;The loading unit 1 and the extraction unit 3 include plates 5 and 6 for mounting a PCB; 상기 플레이트를 좌우로 이동시키는 횡행실린더(8,8′)와;A transverse cylinder (8, 8 ') for moving the plate left and right; 상기 플레이트를 승하강시키는 승하강실린더(7,7´)가 더 포함되는 것을 특징으로 하는 PCB 이송장치.PCB transfer apparatus, characterized in that it further comprises a lifting cylinder (7,7 ') to raise and lower the plate. 제1항에 있어서,The method of claim 1, 상기 PCB피커(4)는 고정판(22)상에 부설된 레일(41)상에서 좌우로 이동하는 횡행이동판(23)과;The PCB picker (4) is a transverse moving plate (23) which moves from side to side on the rail (41) attached to the fixed plate (22); 상기 횡행이동판(23)상에 수직으로 형성된 상하레일(25)을 승하강되는 승하 강이동판(24)과;An elevating plate 24 for elevating an up and down rail 25 formed vertically on the transverse plate 23; 상기 승하강이동판(24)의 일측에 고정 결합된 제1아암(26)과;A first arm 26 fixedly coupled to one side of the elevating plate 24; 상기 승하강이동판(24)에 이동가능하도록 결합되면서 제1아암(26)의 내측에 형성된 제2아암(27)과;A second arm (27) formed inside the first arm (26) while being movably coupled to the elevating plate (24); 상기 한 쌍의 아암의 내측에 부설된 한 쌍의 PCB가이드(39)와 결합된 패드브라켓(38)과 연결되어 PCB를 비접촉식으로 진공 흡착 또는 탈착하는 다수의 비접촉식 진공패드(32)로 구성되는 것을 특징으로 하는 PCB 이송장치.It is composed of a plurality of non-contact vacuum pads 32 which are connected to the pad bracket 38 coupled to the pair of PCB guides 39 attached to the inside of the pair of arms to vacuum adsorption or detachment of the PCB in a non-contact manner. PCB feeder characterized in. 제3항에 있어서,The method of claim 3, 상기 한 쌍의 아암의 내부에 길이방향으로 형성된 제1회전봉(33)과 상기 제1회전봉(33)과 수직방향으로 교차형성되는 제2회전봉(30)과; 상기 제1회전봉(33)과 제2회전봉(30)이 교차되는 곳에는 수직으로 치합되는 한 쌍의 헬리컬기어(31)와; 상기 헬리컬기어(31)를 작동시키는 폭조절모터(29)로 구성되는 폭조절장치(28)를 더 포함하는 것을 특징으로 하는 PCB 이송장치. A first rotary rod (33) formed in the longitudinal direction inside the pair of arms and a second rotary rod (30) formed perpendicularly to the first rotary rod (33); A pair of helical gears 31 vertically engaged where the first rotating rod 33 and the second rotating rod 30 cross each other; PCB transfer apparatus further comprises a width adjusting device (28) consisting of a width adjusting motor (29) for operating the helical gear (31). 제3항에 있어서 또는 제4항에 있어서,The method according to claim 3 or 4, 상기 제2아암(27)을 관통하는 볼스크류(36)와; 상기 볼스크류(36)의 일측에 결합되어 상기 볼스크류(36)를 작동시키는 길이조절모터(35)로 구성되는 길이조절장치(34)를 더 포함하는 것을 특징으로 하는 PCB 이송장치.A ball screw 36 penetrating the second arm 27; PCB transfer apparatus further comprises a length adjusting device (34) coupled to one side of the ball screw (36), the length adjusting motor (35) operating the ball screw (36).
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KR101354062B1 (en) * 2012-07-20 2014-01-24 주식회사제4기한국 Apparatus for supplying window frame into plasma chamber of plasma processing machine
CN110876860A (en) * 2019-11-22 2020-03-13 深圳市洋浦科技有限公司 Vacuum defoaming machine
CN110876860B (en) * 2019-11-22 2024-05-31 深圳市洋浦科技有限公司 Vacuum bubble removing machine
CN115245929A (en) * 2021-04-27 2022-10-28 上海恒和广码科技有限公司 Non-contact type cleaning machine
KR102584528B1 (en) * 2022-10-17 2023-10-05 주식회사제4기한국 Vacuum Plasma Descum and Desmear System with Auto Setting and carrying function for FCBGA Fine pattern PCB

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