KR102563505B9 - Led 디바이스 및 그 제조 방법 - Google Patents
Led 디바이스 및 그 제조 방법Info
- Publication number
- KR102563505B9 KR102563505B9 KR1020210130972A KR20210130972A KR102563505B9 KR 102563505 B9 KR102563505 B9 KR 102563505B9 KR 1020210130972 A KR1020210130972 A KR 1020210130972A KR 20210130972 A KR20210130972 A KR 20210130972A KR 102563505 B9 KR102563505 B9 KR 102563505B9
- Authority
- KR
- South Korea
- Prior art keywords
- led
- manufacturing
- same
- led device
- led led
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210130972A KR102563505B1 (ko) | 2021-10-01 | 2021-10-01 | Led 디바이스 및 그 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210130972A KR102563505B1 (ko) | 2021-10-01 | 2021-10-01 | Led 디바이스 및 그 제조 방법 |
Publications (3)
Publication Number | Publication Date |
---|---|
KR20230047753A KR20230047753A (ko) | 2023-04-10 |
KR102563505B1 KR102563505B1 (ko) | 2023-08-03 |
KR102563505B9 true KR102563505B9 (ko) | 2024-02-16 |
Family
ID=85984747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020210130972A KR102563505B1 (ko) | 2021-10-01 | 2021-10-01 | Led 디바이스 및 그 제조 방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR102563505B1 (ko) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101469972B1 (ko) * | 2007-10-17 | 2014-12-05 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
KR101721846B1 (ko) | 2015-12-30 | 2017-04-03 | (재)한국나노기술원 | 디스플레이용 초소형 질화물계 발광 다이오드 어레이의 제조방법 및 그에 의해 제조된 디스플레이용 초소형 질화물계 발광 다이오드 어레이 |
KR101806339B1 (ko) * | 2016-06-28 | 2017-12-08 | 한국광기술원 | 투명 디스플레이용 마이크로 led의 제조방법 및 이를 이용한 투명 디스플레이용 마이크로 led |
KR102422386B1 (ko) * | 2017-04-21 | 2022-07-20 | 주식회사 루멘스 | 마이크로 led 디스플레이 장치 및 그 제조방법 |
-
2021
- 2021-10-01 KR KR1020210130972A patent/KR102563505B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102563505B1 (ko) | 2023-08-03 |
KR20230047753A (ko) | 2023-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
G170 | Re-publication after modification of scope of protection [patent] |