SG10202007641QA - Electronic device and method of manufacturing the same - Google Patents

Electronic device and method of manufacturing the same

Info

Publication number
SG10202007641QA
SG10202007641QA SG10202007641QA SG10202007641QA SG10202007641QA SG 10202007641Q A SG10202007641Q A SG 10202007641QA SG 10202007641Q A SG10202007641Q A SG 10202007641QA SG 10202007641Q A SG10202007641Q A SG 10202007641QA SG 10202007641Q A SG10202007641Q A SG 10202007641QA
Authority
SG
Singapore
Prior art keywords
manufacturing
same
electronic device
electronic
Prior art date
Application number
SG10202007641QA
Inventor
Jung Yoo Si
Original Assignee
Sk Hynix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sk Hynix Inc filed Critical Sk Hynix Inc
Publication of SG10202007641QA publication Critical patent/SG10202007641QA/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • H10B63/84Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays
    • H10B63/845Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays the switching components being connected to a common vertical conductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/823Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1659Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/003Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30Resistive cell, memory material aspects
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/71Three dimensional array
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/73Array where access device function, e.g. diode function, being merged with memorizing function of memory element
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/78Array wherein the memory cells of a group share an access device, all the memory cells of the group having a common electrode and the access device being not part of a word line or a bit line driver
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
SG10202007641QA 2019-12-26 2020-08-11 Electronic device and method of manufacturing the same SG10202007641QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190175654A KR20210083049A (en) 2019-12-26 2019-12-26 Electronic device and method for manufacturing electronic device

Publications (1)

Publication Number Publication Date
SG10202007641QA true SG10202007641QA (en) 2021-07-29

Family

ID=76507638

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202007641QA SG10202007641QA (en) 2019-12-26 2020-08-11 Electronic device and method of manufacturing the same

Country Status (4)

Country Link
US (3) US11362139B2 (en)
KR (1) KR20210083049A (en)
CN (1) CN113053945B (en)
SG (1) SG10202007641QA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11744167B2 (en) * 2020-11-27 2023-08-29 Samsung Electronics Co., Ltd. Semiconductor apparatus including a phase change material layer having a first and a second chalcogen layer

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872963B2 (en) 2002-08-08 2005-03-29 Ovonyx, Inc. Programmable resistance memory element with layered memory material
KR101482814B1 (en) 2007-07-25 2015-01-14 인터몰레큘러 인코퍼레이티드 Multistate nonvolatile memory elements
US9006793B2 (en) * 2010-07-01 2015-04-14 Panasonic Intellectual Property Management Co., Ltd. Non-volatile memory cell, non-volatile memory cell array, and method of manufacturing the same
US10546998B2 (en) 2013-02-05 2020-01-28 Micron Technology, Inc. Methods of forming memory and methods of forming vertically-stacked structures
KR20160022046A (en) * 2014-08-19 2016-02-29 에스케이하이닉스 주식회사 Electronic device
US10074694B2 (en) * 2015-07-24 2018-09-11 Toshiba Memory Corporation Memory device and method for manufacturing the same
KR102616038B1 (en) * 2016-08-19 2023-12-21 에스케이하이닉스 주식회사 Semiconductor device and manufacturing method of the same
US10424374B2 (en) 2017-04-28 2019-09-24 Micron Technology, Inc. Programming enhancement in self-selecting memory
KR20190013347A (en) * 2017-08-01 2019-02-11 에스케이하이닉스 주식회사 Semiconductor device and manufacturing method thereof
US10249683B1 (en) * 2017-12-15 2019-04-02 Sandisk Technologies Llc Three-dimensional phase change memory arrays and methods of manufacturing the same
WO2019118931A1 (en) * 2017-12-16 2019-06-20 Hsu Fu Chang 3d vertical memory array cell structures with individual selectors and processes
KR102512794B1 (en) * 2018-01-17 2023-03-23 에스케이하이닉스 주식회사 Electronic device
US10797107B2 (en) * 2018-02-27 2020-10-06 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor memory device including phase change material layers and method for manufacturing thereof
JP2019169591A (en) * 2018-03-23 2019-10-03 東芝メモリ株式会社 Semiconductor storage device
US10381559B1 (en) * 2018-06-07 2019-08-13 Sandisk Technologies Llc Three-dimensional phase change memory array including discrete middle electrodes and methods of making the same
US10700128B1 (en) * 2018-12-21 2020-06-30 Micron Technology, Inc. Three-dimensional memory array

Also Published As

Publication number Publication date
US20210202576A1 (en) 2021-07-01
CN113053945B (en) 2024-04-30
US11362139B2 (en) 2022-06-14
CN113053945A (en) 2021-06-29
US20220285439A1 (en) 2022-09-08
KR20210083049A (en) 2021-07-06
US20230284459A1 (en) 2023-09-07

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