KR102562158B1 - 높은 종횡비 패턴을 위한 구리 전착 용액 및 공정 - Google Patents

높은 종횡비 패턴을 위한 구리 전착 용액 및 공정 Download PDF

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Publication number
KR102562158B1
KR102562158B1 KR1020197020176A KR20197020176A KR102562158B1 KR 102562158 B1 KR102562158 B1 KR 102562158B1 KR 1020197020176 A KR1020197020176 A KR 1020197020176A KR 20197020176 A KR20197020176 A KR 20197020176A KR 102562158 B1 KR102562158 B1 KR 102562158B1
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South Korea
Prior art keywords
copper
concentration
electrolyte
pattern
solution
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KR1020197020176A
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Korean (ko)
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KR20190097129A (ko
Inventor
로리안 를리지우
벵상 메벨렉
미카일루 티앙
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아베니
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H01L21/76877—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020197020176A 2016-12-29 2017-12-26 높은 종횡비 패턴을 위한 구리 전착 용액 및 공정 Active KR102562158B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1663525 2016-12-29
FR1663525A FR3061601B1 (fr) 2016-12-29 2016-12-29 Solution d'electrodeposition de cuivre et procede pour des motifs de facteur de forme eleve
PCT/EP2017/084580 WO2018122216A1 (en) 2016-12-29 2017-12-26 Copper electrodeposition solution and process for high aspect ratio patterns

Publications (2)

Publication Number Publication Date
KR20190097129A KR20190097129A (ko) 2019-08-20
KR102562158B1 true KR102562158B1 (ko) 2023-08-01

Family

ID=59579658

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197020176A Active KR102562158B1 (ko) 2016-12-29 2017-12-26 높은 종횡비 패턴을 위한 구리 전착 용액 및 공정

Country Status (9)

Country Link
US (1) US10883185B2 (https=)
EP (1) EP3562975A1 (https=)
JP (1) JP7138108B2 (https=)
KR (1) KR102562158B1 (https=)
CN (1) CN110168146B (https=)
FR (1) FR3061601B1 (https=)
IL (1) IL267531A (https=)
TW (1) TWI737880B (https=)
WO (1) WO2018122216A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110724983B (zh) * 2019-10-12 2022-02-08 天津大学 一种利用脉冲电沉积法制备纳米铜包覆碳化钨核壳结构粉体的方法
CN111041533B (zh) * 2019-12-31 2021-06-29 苏州清飙科技有限公司 电镀纯钴用电镀液及其应用
CN111244547B (zh) * 2020-01-21 2021-09-17 四川虹微技术有限公司 一种含芳香肟类添加剂的电解液及其制备方法和用途
US12070609B2 (en) * 2020-07-30 2024-08-27 Medtronic, Inc. Electrical component and method of forming same
JP7788009B2 (ja) * 2022-04-05 2025-12-17 マクダーミッド エンソン インコーポレイテッド ボトムアップ銅電気めっきのためのアクセラレータを含む電解質
JP2025137155A (ja) * 2024-03-08 2025-09-19 三菱マテリアル株式会社 酸性電解銅めっき液

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013091820A (ja) * 2011-10-24 2013-05-16 Kanto Chem Co Inc 銅層および／または銅合金層を含む金属膜用エッチング液組成物およびそれを用いたエッチング方法
US20150159291A1 (en) * 2013-12-09 2015-06-11 Alchimer Copper electrodeposition bath containing an electrochemically inert cation
US20150218724A1 (en) * 2012-09-24 2015-08-06 Alchimer Electrolyte and process for electroplating copper onto a barrier layer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897151B2 (en) * 2002-11-08 2005-05-24 Wayne State University Methods of filling a feature on a substrate with copper nanocrystals
US6897152B2 (en) 2003-02-05 2005-05-24 Enthone Inc. Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
JP4650275B2 (ja) * 2004-08-10 2011-03-16 日立金属株式会社 銅めっき被膜を表面に有する希土類系永久磁石
FR2890983B1 (fr) 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
FR2890984B1 (fr) * 2005-09-20 2009-03-27 Alchimer Sa Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal.
US7579274B2 (en) 2006-02-21 2009-08-25 Alchimer Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
CN101275255A (zh) * 2007-12-20 2008-10-01 广州市二轻工业科学技术研究所 一种碱性无氰镀铜的维护方法
EP2305856A1 (en) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
KR101493358B1 (ko) * 2013-07-16 2015-02-13 한국생산기술연구원 무전해 구리도금액을 이용한 구리 도금층 형성방법
US9869026B2 (en) * 2014-07-15 2018-01-16 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013091820A (ja) * 2011-10-24 2013-05-16 Kanto Chem Co Inc 銅層および／または銅合金層を含む金属膜用エッチング液組成物およびそれを用いたエッチング方法
US20150218724A1 (en) * 2012-09-24 2015-08-06 Alchimer Electrolyte and process for electroplating copper onto a barrier layer
US20150159291A1 (en) * 2013-12-09 2015-06-11 Alchimer Copper electrodeposition bath containing an electrochemically inert cation

Also Published As

Publication number Publication date
CN110168146A (zh) 2019-08-23
FR3061601A1 (fr) 2018-07-06
EP3562975A1 (en) 2019-11-06
TWI737880B (zh) 2021-09-01
IL267531A (en) 2019-08-29
JP7138108B2 (ja) 2022-09-15
KR20190097129A (ko) 2019-08-20
US20180363158A1 (en) 2018-12-20
TW201833390A (zh) 2018-09-16
CN110168146B (zh) 2024-01-09
FR3061601B1 (fr) 2022-12-30
JP2020503459A (ja) 2020-01-30
WO2018122216A1 (en) 2018-07-05
US10883185B2 (en) 2021-01-05

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KR102206291B1 (ko) 구리를 장벽 층 상에 전기도금하기 위한 전해질 및 프로세스
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