KR102559680B1 - 감광성 수지 조성물 - Google Patents

감광성 수지 조성물 Download PDF

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Publication number
KR102559680B1
KR102559680B1 KR1020180035461A KR20180035461A KR102559680B1 KR 102559680 B1 KR102559680 B1 KR 102559680B1 KR 1020180035461 A KR1020180035461 A KR 1020180035461A KR 20180035461 A KR20180035461 A KR 20180035461A KR 102559680 B1 KR102559680 B1 KR 102559680B1
Authority
KR
South Korea
Prior art keywords
resin composition
photosensitive resin
mass
component
less
Prior art date
Application number
KR1020180035461A
Other languages
English (en)
Korean (ko)
Other versions
KR20180109755A (ko
Inventor
마사히로 가라카와
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20180109755A publication Critical patent/KR20180109755A/ko
Application granted granted Critical
Publication of KR102559680B1 publication Critical patent/KR102559680B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020180035461A 2017-03-28 2018-03-27 감광성 수지 조성물 KR102559680B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017063437A JP6677203B2 (ja) 2017-03-28 2017-03-28 感光性樹脂組成物、感光性フィルム、支持体付き感光性フィルム、プリント配線板及び半導体装置
JPJP-P-2017-063437 2017-03-28

Publications (2)

Publication Number Publication Date
KR20180109755A KR20180109755A (ko) 2018-10-08
KR102559680B1 true KR102559680B1 (ko) 2023-07-27

Family

ID=63864230

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180035461A KR102559680B1 (ko) 2017-03-28 2018-03-27 감광성 수지 조성물

Country Status (3)

Country Link
JP (1) JP6677203B2 (ja)
KR (1) KR102559680B1 (ja)
TW (1) TWI774740B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111665685A (zh) * 2019-03-08 2020-09-15 株式会社田村制作所 感光性树脂组合物
JP7111186B2 (ja) * 2019-11-18 2022-08-02 東レ株式会社 感光性樹脂組成物、感光性樹脂シート、中空構造体、硬化物、中空構造体の製造方法、電子部品、及び弾性波フィルター

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006335807A (ja) 2005-05-31 2006-12-14 Taiyo Ink Mfg Ltd 絶縁性硬化性樹脂組成物及びその硬化物
WO2009125806A1 (ja) 2008-04-10 2009-10-15 リンテック株式会社 エネルギー線硬化性層用樹脂組成物および貫通孔形成用シート
JP2010205127A (ja) 2009-03-05 2010-09-16 Nec Corp ラック収容機器管理システム及びラック収容機器管理方法
JP2012133364A (ja) 2010-12-21 2012-07-12 Dongwoo Fine-Chem Co Ltd スペーサー形成用感光性樹脂組成物、これを用いて製造された表示装置用スペーサー及びこれを備えた表示装置
WO2013161756A1 (ja) 2012-04-23 2013-10-31 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法
JP2015011265A (ja) 2013-07-01 2015-01-19 日立化成株式会社 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法
WO2016006264A1 (ja) 2014-07-10 2016-01-14 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001312054A (ja) * 2000-05-01 2001-11-09 Dainippon Ink & Chem Inc レジスト用エネルギー線硬化型樹脂組成物
TW200710571A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Curable resin composition and cured object obtained therefrom
JPWO2011089987A1 (ja) * 2010-01-20 2013-05-23 コニシ株式会社 難燃性湿気硬化型樹脂組成物、この組成物を含む難燃性湿気硬化型接着剤及びこの接着剤を用いた接着方法
WO2012090532A1 (ja) 2010-12-28 2012-07-05 太陽インキ製造株式会社 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
CN103748516A (zh) * 2011-08-10 2014-04-23 日立化成株式会社 感光性树脂组合物、感光性薄膜、永久抗蚀剂以及永久抗蚀剂的制造方法
JP5660692B2 (ja) * 2013-12-02 2015-01-28 太陽ホールディングス株式会社 感光性ドライフィルム及びそれを用いた積層構造体
JP6345947B2 (ja) * 2014-02-27 2018-06-20 株式会社タムラ製作所 感光性樹脂組成物
JP2015106160A (ja) * 2015-01-19 2015-06-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006335807A (ja) 2005-05-31 2006-12-14 Taiyo Ink Mfg Ltd 絶縁性硬化性樹脂組成物及びその硬化物
WO2009125806A1 (ja) 2008-04-10 2009-10-15 リンテック株式会社 エネルギー線硬化性層用樹脂組成物および貫通孔形成用シート
JP2010205127A (ja) 2009-03-05 2010-09-16 Nec Corp ラック収容機器管理システム及びラック収容機器管理方法
JP2012133364A (ja) 2010-12-21 2012-07-12 Dongwoo Fine-Chem Co Ltd スペーサー形成用感光性樹脂組成物、これを用いて製造された表示装置用スペーサー及びこれを備えた表示装置
WO2013161756A1 (ja) 2012-04-23 2013-10-31 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法
JP2015011265A (ja) 2013-07-01 2015-01-19 日立化成株式会社 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法
WO2016006264A1 (ja) 2014-07-10 2016-01-14 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板

Also Published As

Publication number Publication date
JP6677203B2 (ja) 2020-04-08
TW201841931A (zh) 2018-12-01
KR20180109755A (ko) 2018-10-08
JP2018165795A (ja) 2018-10-25
TWI774740B (zh) 2022-08-21

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