KR102557493B1 - 구리 합금 박막, 구리 합금 박막의 사용역할이 완료된 후의 보호층과 제조방법 - Google Patents

구리 합금 박막, 구리 합금 박막의 사용역할이 완료된 후의 보호층과 제조방법 Download PDF

Info

Publication number
KR102557493B1
KR102557493B1 KR1020227040031A KR20227040031A KR102557493B1 KR 102557493 B1 KR102557493 B1 KR 102557493B1 KR 1020227040031 A KR1020227040031 A KR 1020227040031A KR 20227040031 A KR20227040031 A KR 20227040031A KR 102557493 B1 KR102557493 B1 KR 102557493B1
Authority
KR
South Korea
Prior art keywords
copper
thin film
alloy thin
copper alloy
protective layer
Prior art date
Application number
KR1020227040031A
Other languages
English (en)
Korean (ko)
Other versions
KR20230078953A (ko
Inventor
시아오징 왕
즈펑 딩
수지에 리
하이롱 장
지아쉰 순
닝 리우
루이 리우
Original Assignee
지앙수 유니버시티 오브 사이언스 앤드 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지앙수 유니버시티 오브 사이언스 앤드 테크놀로지 filed Critical 지앙수 유니버시티 오브 사이언스 앤드 테크놀로지
Publication of KR20230078953A publication Critical patent/KR20230078953A/ko
Application granted granted Critical
Publication of KR102557493B1 publication Critical patent/KR102557493B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020227040031A 2021-11-25 2022-06-20 구리 합금 박막, 구리 합금 박막의 사용역할이 완료된 후의 보호층과 제조방법 KR102557493B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202111412832.0A CN114058897B (zh) 2021-11-25 2021-11-25 铜合金薄膜、基于铜合金薄膜服役后的保护层和制备方法
CN202111412832.0 2021-11-25
PCT/CN2022/099670 WO2023093011A1 (zh) 2021-11-25 2022-06-20 铜合金薄膜、基于铜合金薄膜服役后的保护层和制备方法

Publications (2)

Publication Number Publication Date
KR20230078953A KR20230078953A (ko) 2023-06-05
KR102557493B1 true KR102557493B1 (ko) 2023-07-19

Family

ID=80276577

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227040031A KR102557493B1 (ko) 2021-11-25 2022-06-20 구리 합금 박막, 구리 합금 박막의 사용역할이 완료된 후의 보호층과 제조방법

Country Status (3)

Country Link
KR (1) KR102557493B1 (zh)
CN (1) CN114058897B (zh)
WO (1) WO2023093011A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114058897B (zh) * 2021-11-25 2022-05-17 江苏科技大学 铜合金薄膜、基于铜合金薄膜服役后的保护层和制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1807675A (zh) 2006-02-23 2006-07-26 上海交通大学 单靶磁控溅射Cu1－xCrx合金薄膜的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3710022B2 (ja) * 1997-07-28 2005-10-26 日立金属株式会社 電極膜形成用Ｃｕ系スパッタリングターゲットおよびその製造方法
JP4794802B2 (ja) * 2002-11-21 2011-10-19 Ｊｘ日鉱日石金属株式会社 銅合金スパッタリングターゲット及び半導体素子配線
CN102747332A (zh) * 2011-04-21 2012-10-24 鸿富锦精密工业（深圳）有限公司 镀膜件的制备方法及由该方法制得的镀膜件
CN102691040B (zh) * 2012-05-29 2014-05-28 重庆理工大学 超高强度铝合金表面合金化的处理方法
CN114058897B (zh) * 2021-11-25 2022-05-17 江苏科技大学 铜合金薄膜、基于铜合金薄膜服役后的保护层和制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1807675A (zh) 2006-02-23 2006-07-26 上海交通大学 单靶磁控溅射Cu1－xCrx合金薄膜的方法

Also Published As

Publication number Publication date
WO2023093011A1 (zh) 2023-06-01
CN114058897A (zh) 2022-02-18
KR20230078953A (ko) 2023-06-05
CN114058897B (zh) 2022-05-17

Similar Documents

Publication Publication Date Title
JP4143073B2 (ja) 低磁気ヒステリシス損失の二軸配向性金属テープ及びその製造方法
JP5706045B2 (ja) 電解銅箔とその製造方法
KR102557493B1 (ko) 구리 합금 박막, 구리 합금 박막의 사용역할이 완료된 후의 보호층과 제조방법
KR101270770B1 (ko) 인쇄회로기판의 도금방법
Yang et al. Analyses and design for electrochemical migration suppression by alloying indium into silver
Zhu et al. Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives
Chiang et al. Effects of Thiourea and Allyl Thioura on the electrodeposition and microstructures of copper from methanesulfonic acid baths
JP5676443B2 (ja) 電子回路及びその形成方法並びに電子回路形成用銅張積層板
JP4805409B2 (ja) 電気電子部品用複合材料およびそれを用いた電気電子部品
Malekpouri et al. Electrodeposition and superconductivity of rhenium-iron alloy films from water-in-salt electrolytes
JP6086531B2 (ja) 銀めっき材
KR100872622B1 (ko) 기재상에 주석-은-구리 3원합금 박막을 형성하는 방법
JP6450300B2 (ja) ルテニウムを含む積層めっき被覆材及びその製造方法
US20220259754A1 (en) Twinned copper layer, substrate having the same and method for preparing the same
CN114481220A (zh) 一种利用三氯化铈细化电沉积铜晶粒的方法
CN101320643B (zh) 电触片的制造方法
TWI645750B (zh) 複合金屬箔、具有載體之複合金屬箔、及使用此等所得之貼金屬積層板及印刷配線板
JP6649915B2 (ja) ルテニウムを含む積層めっき被覆材
JP2011091114A (ja) 配線回路基板およびその製法
CN111876760A (zh) 一种印刷电路板用化学镀银液及电路板的制备方法
JP7556592B2 (ja) ナノ双晶Ｃｕ－Ｎｉ合金層及びそれを製造する方法
JP7213390B1 (ja) 銀めっき皮膜及び該銀めっき皮膜を備えた電気接点
JP2013209708A (ja) 黒色被膜製品
JPS6380412A (ja) 電気回路板用Ｃｕ系基材及びその製造方法
JP6230732B2 (ja) 導電性条材およびその製造方法

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right