KR102553014B1 - 칩의 제조 방법 - Google Patents

칩의 제조 방법 Download PDF

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Publication number
KR102553014B1
KR102553014B1 KR1020180062571A KR20180062571A KR102553014B1 KR 102553014 B1 KR102553014 B1 KR 102553014B1 KR 1020180062571 A KR1020180062571 A KR 1020180062571A KR 20180062571 A KR20180062571 A KR 20180062571A KR 102553014 B1 KR102553014 B1 KR 102553014B1
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KR
South Korea
Prior art keywords
workpiece
holding
divided
dividing
modified layer
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KR1020180062571A
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English (en)
Korean (ko)
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KR20180133214A (ko
Inventor
요시아키 요도
진얀 자오
Original Assignee
가부시기가이샤 디스코
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Publication of KR20180133214A publication Critical patent/KR20180133214A/ko
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Publication of KR102553014B1 publication Critical patent/KR102553014B1/ko
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    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H01L21/324—
    • H01L21/76—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
KR1020180062571A 2017-06-05 2018-05-31 칩의 제조 방법 Active KR102553014B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-111044 2017-06-05
JP2017111044A JP6855127B2 (ja) 2017-06-05 2017-06-05 チップの製造方法

Publications (2)

Publication Number Publication Date
KR20180133214A KR20180133214A (ko) 2018-12-13
KR102553014B1 true KR102553014B1 (ko) 2023-07-06

Family

ID=64540366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180062571A Active KR102553014B1 (ko) 2017-06-05 2018-05-31 칩의 제조 방법

Country Status (4)

Country Link
JP (1) JP6855127B2 (https=)
KR (1) KR102553014B1 (https=)
CN (1) CN108987341B (https=)
TW (1) TWI742276B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12525453B2 (en) * 2019-04-19 2026-01-13 Tokyo Electron Limited Processing apparatus and processing method
JP7405365B2 (ja) * 2020-01-31 2023-12-26 国立大学法人東海国立大学機構 レーザ加工方法、半導体部材製造方法、及び、レーザ加工装置
JP7427189B2 (ja) * 2020-01-31 2024-02-05 国立大学法人東海国立大学機構 レーザ加工方法、半導体部材製造方法、及び、レーザ加工装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012054275A (ja) 2010-08-31 2012-03-15 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2013135026A (ja) 2011-12-26 2013-07-08 Disco Abrasive Syst Ltd ウェーハの加工方法
JP2013152987A (ja) 2012-01-24 2013-08-08 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2013165229A (ja) 2012-02-13 2013-08-22 Disco Abrasive Syst Ltd 光デバイスウェーハの分割方法
JP2013236001A (ja) * 2012-05-10 2013-11-21 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014086611A (ja) 2012-10-25 2014-05-12 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
JP2015126088A (ja) 2013-12-26 2015-07-06 株式会社ディスコ ウェーハの分割方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
TWI256674B (en) * 2005-10-14 2006-06-11 Advanced Semiconductor Eng Method for dicing a wafer
JP5791866B2 (ja) 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
JP2016092207A (ja) * 2014-11-05 2016-05-23 株式会社ディスコ フレームユニットの製造方法
JP6456766B2 (ja) * 2015-05-08 2019-01-23 株式会社ディスコ ウエーハの加工方法
JP6576212B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012054275A (ja) 2010-08-31 2012-03-15 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2013135026A (ja) 2011-12-26 2013-07-08 Disco Abrasive Syst Ltd ウェーハの加工方法
JP2013152987A (ja) 2012-01-24 2013-08-08 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2013165229A (ja) 2012-02-13 2013-08-22 Disco Abrasive Syst Ltd 光デバイスウェーハの分割方法
JP2013236001A (ja) * 2012-05-10 2013-11-21 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014086611A (ja) 2012-10-25 2014-05-12 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
JP2015126088A (ja) 2013-12-26 2015-07-06 株式会社ディスコ ウェーハの分割方法

Also Published As

Publication number Publication date
KR20180133214A (ko) 2018-12-13
CN108987341A (zh) 2018-12-11
TW201903880A (zh) 2019-01-16
JP2018206965A (ja) 2018-12-27
TWI742276B (zh) 2021-10-11
JP6855127B2 (ja) 2021-04-07
CN108987341B (zh) 2024-03-01

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