KR102538550B1 - 운반 링 - Google Patents
운반 링 Download PDFInfo
- Publication number
- KR102538550B1 KR102538550B1 KR1020197023693A KR20197023693A KR102538550B1 KR 102538550 B1 KR102538550 B1 KR 102538550B1 KR 1020197023693 A KR1020197023693 A KR 1020197023693A KR 20197023693 A KR20197023693 A KR 20197023693A KR 102538550 B1 KR102538550 B1 KR 102538550B1
- Authority
- KR
- South Korea
- Prior art keywords
- section
- ring
- shaped body
- heat transfer
- thermal conductivity
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017101648.1A DE102017101648A1 (de) | 2017-01-27 | 2017-01-27 | Transportring |
DE102017101648.1 | 2017-01-27 | ||
DE102017115416 | 2017-07-10 | ||
DE102017115416.7 | 2017-07-10 | ||
PCT/EP2018/051827 WO2018138197A1 (de) | 2017-01-27 | 2018-01-25 | Transportring |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190111999A KR20190111999A (ko) | 2019-10-02 |
KR102538550B1 true KR102538550B1 (ko) | 2023-05-30 |
Family
ID=61148198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197023693A KR102538550B1 (ko) | 2017-01-27 | 2018-01-25 | 운반 링 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20190390336A1 (de) |
EP (1) | EP3574127A1 (de) |
JP (1) | JP7107949B2 (de) |
KR (1) | KR102538550B1 (de) |
CN (1) | CN110536976B (de) |
TW (1) | TWI749159B (de) |
WO (1) | WO2018138197A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018113400A1 (de) * | 2018-06-06 | 2019-12-12 | Aixtron Se | CVD Reaktor mit Tragring zum Substrathandhaben |
DE102019105913A1 (de) | 2019-03-08 | 2020-09-10 | Aixtron Se | Suszeptoranordnung eines CVD-Reaktors |
DE102020117645A1 (de) * | 2020-07-03 | 2022-01-05 | Aixtron Se | Transportring für einen CVD-Reaktor |
EP4306286A1 (de) | 2021-03-11 | 2024-01-17 | Dic Corporation | Entfärbungsverfahren, entfärbungsmittel zur verwendung in diesem entfärbungsverfahren und kunststoffsubstratrückgewinnungsverfahren damit |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130291798A1 (en) | 2011-01-14 | 2013-11-07 | Wonik Ip Co., Ltd. | Thin film deposition apparatus and substrate treatment system including the same |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6106625A (en) * | 1997-12-02 | 2000-08-22 | Applied Materials, Inc. | Reactor useful for chemical vapor deposition of titanium nitride |
US6079356A (en) * | 1997-12-02 | 2000-06-27 | Applied Materials, Inc. | Reactor optimized for chemical vapor deposition of titanium |
TW484187B (en) * | 2000-02-14 | 2002-04-21 | Tokyo Electron Ltd | Apparatus and method for plasma treatment |
WO2003079404A2 (en) * | 2002-03-12 | 2003-09-25 | Tokyo Electron Limited | An improved substrate holder for plasma processing |
JP4216541B2 (ja) * | 2002-06-13 | 2009-01-28 | 日鉱金属株式会社 | 気相成長装置 |
DE102004058521A1 (de) | 2004-12-04 | 2006-06-14 | Aixtron Ag | Verfahren und Vorrichtung zum Abscheiden von dicken Gallium-Nitrit-Schichten auf einem Saphirsubstrat und zugehörigen Substrathalter |
TWI354320B (en) * | 2006-02-21 | 2011-12-11 | Nuflare Technology Inc | Vopor phase deposition apparatus and support table |
JP4451455B2 (ja) | 2006-02-21 | 2010-04-14 | 株式会社ニューフレアテクノロジー | 気相成長装置及び支持台 |
DE102010000554A1 (de) * | 2009-03-16 | 2010-09-30 | Aixtron Ag | MOCVD-Reaktor mit einer örtlich verschieden an ein Wärmeableitorgan angekoppelten Deckenplatte |
JP5430192B2 (ja) * | 2009-03-19 | 2014-02-26 | 東京エレクトロン株式会社 | 温度調節装置、温度調節方法、基板処理装置及び対向電極 |
DE102009043848A1 (de) * | 2009-08-25 | 2011-03-03 | Aixtron Ag | CVD-Verfahren und CVD-Reaktor |
DE102009044276A1 (de) * | 2009-10-16 | 2011-05-05 | Aixtron Ag | CVD-Reaktor mit auf einem mehrere Zonen aufweisenden Gaspolster liegenden Substrathalter |
JP2011151263A (ja) * | 2010-01-22 | 2011-08-04 | Tokyo Electron Ltd | エッチング方法、エッチング装置及びリング部材 |
JP5719599B2 (ja) * | 2011-01-07 | 2015-05-20 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5732941B2 (ja) * | 2011-03-16 | 2015-06-10 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマエッチング方法 |
US9385017B2 (en) * | 2012-08-06 | 2016-07-05 | Nordson Corporation | Apparatus and methods for handling workpieces of different sizes |
US9425077B2 (en) * | 2013-03-15 | 2016-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor apparatus with transportable edge ring for substrate transport |
US10167571B2 (en) | 2013-03-15 | 2019-01-01 | Veeco Instruments Inc. | Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems |
DE102013012082A1 (de) * | 2013-07-22 | 2015-01-22 | Aixtron Se | Vorrichtung zum thermischen Behandeln eines Halbleitersubstrates, insbesondere zum Aufbringen einer Beschichtung |
JP6442296B2 (ja) * | 2014-06-24 | 2018-12-19 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
JP6345030B2 (ja) * | 2014-08-11 | 2018-06-20 | 東京エレクトロン株式会社 | プラズマ処理装置及びフォーカスリング |
US10770324B2 (en) * | 2014-11-26 | 2020-09-08 | VON ARDENNE Asset GmbH & Co. KG | Substrate holding device, substrate transport device, processing arrangement and method for processing a substrate |
JP2017028074A (ja) * | 2015-07-22 | 2017-02-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
KR102581226B1 (ko) * | 2016-12-23 | 2023-09-20 | 삼성전자주식회사 | 플라즈마 처리 장치 |
JP6974088B2 (ja) * | 2017-09-15 | 2021-12-01 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
-
2018
- 2018-01-25 KR KR1020197023693A patent/KR102538550B1/ko active IP Right Grant
- 2018-01-25 US US16/480,596 patent/US20190390336A1/en active Pending
- 2018-01-25 CN CN201880016038.4A patent/CN110536976B/zh active Active
- 2018-01-25 JP JP2019540344A patent/JP7107949B2/ja active Active
- 2018-01-25 TW TW107102746A patent/TWI749159B/zh active
- 2018-01-25 WO PCT/EP2018/051827 patent/WO2018138197A1/de unknown
- 2018-01-25 EP EP18702640.6A patent/EP3574127A1/de active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130291798A1 (en) | 2011-01-14 | 2013-11-07 | Wonik Ip Co., Ltd. | Thin film deposition apparatus and substrate treatment system including the same |
Also Published As
Publication number | Publication date |
---|---|
JP7107949B2 (ja) | 2022-07-27 |
US20190390336A1 (en) | 2019-12-26 |
EP3574127A1 (de) | 2019-12-04 |
TW201840898A (zh) | 2018-11-16 |
CN110536976B (zh) | 2022-03-15 |
JP2020506290A (ja) | 2020-02-27 |
WO2018138197A1 (de) | 2018-08-02 |
TWI749159B (zh) | 2021-12-11 |
KR20190111999A (ko) | 2019-10-02 |
CN110536976A (zh) | 2019-12-03 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |