KR102536919B1 - 높은 가로세로 비를 갖는 유리 웨이퍼 - Google Patents
높은 가로세로 비를 갖는 유리 웨이퍼 Download PDFInfo
- Publication number
- KR102536919B1 KR102536919B1 KR1020197027352A KR20197027352A KR102536919B1 KR 102536919 B1 KR102536919 B1 KR 102536919B1 KR 1020197027352 A KR1020197027352 A KR 1020197027352A KR 20197027352 A KR20197027352 A KR 20197027352A KR 102536919 B1 KR102536919 B1 KR 102536919B1
- Authority
- KR
- South Korea
- Prior art keywords
- glass wafer
- less
- equal
- major surface
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011521 glass Substances 0.000 title claims abstract description 308
- 230000003287 optical effect Effects 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 13
- 230000003746 surface roughness Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 312
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 52
- 239000000463 material Substances 0.000 description 14
- 229910010413 TiO 2 Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 239000006117 anti-reflective coating Substances 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000007730 finishing process Methods 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- -1 silsesquioxane Polymers 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 230000004083 survival effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- AIRCTMFFNKZQPN-UHFFFAOYSA-N AlO Inorganic materials [Al]=O AIRCTMFFNKZQPN-UHFFFAOYSA-N 0.000 description 1
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910005793 GeO 2 Inorganic materials 0.000 description 1
- 229910004140 HfO Inorganic materials 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920000491 Polyphenylsulfone Polymers 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 210000001072 colon Anatomy 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C1/00—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/30—Doped silica-based glasses containing metals
- C03C2201/40—Doped silica-based glasses containing metals containing transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn
- C03C2201/42—Doped silica-based glasses containing metals containing transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn containing titanium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/70—Properties of coatings
- C03C2217/73—Anti-reflective coatings with specific characteristics
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/70—Properties of coatings
- C03C2217/73—Anti-reflective coatings with specific characteristics
- C03C2217/732—Anti-reflective coatings with specific characteristics made of a single layer
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Glass Compositions (AREA)
- Surface Treatment Of Glass (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762463320P | 2017-02-24 | 2017-02-24 | |
| US62/463,320 | 2017-02-24 | ||
| PCT/US2018/019421 WO2018156894A1 (en) | 2017-02-24 | 2018-02-23 | High aspect ratio glass wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190117018A KR20190117018A (ko) | 2019-10-15 |
| KR102536919B1 true KR102536919B1 (ko) | 2023-05-25 |
Family
ID=61599639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197027352A Active KR102536919B1 (ko) | 2017-02-24 | 2018-02-23 | 높은 가로세로 비를 갖는 유리 웨이퍼 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10935698B2 (enExample) |
| EP (1) | EP3585743A1 (enExample) |
| JP (2) | JP7594857B2 (enExample) |
| KR (1) | KR102536919B1 (enExample) |
| CN (1) | CN110461784A (enExample) |
| TW (1) | TWI771375B (enExample) |
| WO (1) | WO2018156894A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115332356A (zh) | 2016-04-13 | 2022-11-11 | 株式会社半导体能源研究所 | 半导体装置及包括该半导体装置的显示装置 |
| WO2020045417A1 (ja) * | 2018-08-31 | 2020-03-05 | Agc株式会社 | 光学ガラスおよび光学部品 |
| US12037282B2 (en) | 2018-11-01 | 2024-07-16 | Corning Incorporated | Strengthened glass articles with reduced delayed breakage and methods of making the same |
| EP3924771B1 (en) | 2019-02-14 | 2024-03-27 | Magic Leap, Inc. | Biased total thickness variations in waveguide display substrates |
| US11279614B2 (en) | 2019-06-28 | 2022-03-22 | Analog Devices, Inc. | Low-parasitic capacitance MEMS inertial sensors and related methods |
| WO2021055547A2 (en) * | 2019-09-17 | 2021-03-25 | Google Llc | Suppressing scattering of light transmitted through oled displays |
| JP7003178B2 (ja) * | 2020-04-21 | 2022-01-20 | Hoya株式会社 | 円盤状ガラス基板の製造方法、薄板ガラス基板の製造方法、導光板の製造方法及び円盤状ガラス基板 |
| CN114180826A (zh) * | 2020-09-14 | 2022-03-15 | 肖特股份有限公司 | 低光损耗玻璃制品 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019461A (ja) * | 2005-04-27 | 2007-01-25 | Disco Abrasive Syst Ltd | ウェーハの加工方法及びウェーハ |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7112359B2 (en) * | 2001-08-22 | 2006-09-26 | Inphase Technologies, Inc. | Method and apparatus for multilayer optical articles |
| US7086927B2 (en) | 2004-03-09 | 2006-08-08 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
| CN100501932C (zh) * | 2005-04-27 | 2009-06-17 | 株式会社迪斯科 | 半导体晶片及其加工方法 |
| US7928026B2 (en) | 2005-06-30 | 2011-04-19 | Corning Incorporated | Synthetic silica material with low fluence-dependent-transmission and method of making the same |
| US20070082179A1 (en) * | 2005-10-07 | 2007-04-12 | Wade James J | Method and apparatus for forming optical articles |
| US7691730B2 (en) | 2005-11-22 | 2010-04-06 | Corning Incorporated | Large area semiconductor on glass insulator |
| DE102006032047A1 (de) * | 2006-07-10 | 2008-01-24 | Schott Ag | Verfahren zur Herstellung optoelektronischer Bauelemente und damit hergestellte Erzeugnisse |
| US20080179755A1 (en) * | 2007-01-31 | 2008-07-31 | International Business Machines Corporation | Structure and method for creating reliable deep via connections in a silicon carrier |
| US8062986B2 (en) | 2007-07-27 | 2011-11-22 | Corning Incorporated | Fused silica having low OH, OD levels and method of making |
| US7920342B2 (en) * | 2008-07-01 | 2011-04-05 | Aptina Imaging Corporation | Over-molded glass lenses and method of forming the same |
| JP5091066B2 (ja) | 2008-09-11 | 2012-12-05 | 富士フイルム株式会社 | 固体撮像装置の製造方法 |
| JP5436876B2 (ja) * | 2009-02-02 | 2014-03-05 | 株式会社ディスコ | 研削方法 |
| JP5060571B2 (ja) * | 2010-03-08 | 2012-10-31 | 株式会社大川金型設計事務所 | ウェーハホルダフレームの製造方法 |
| WO2012056807A1 (ja) * | 2010-10-25 | 2012-05-03 | 日本碍子株式会社 | セラミックス材料、積層体、半導体製造装置用部材及びスパッタリングターゲット部材 |
| US8859103B2 (en) | 2010-11-05 | 2014-10-14 | Joseph Eugene Canale | Glass wafers for semiconductor fabrication processes and methods of making same |
| US9227295B2 (en) * | 2011-05-27 | 2016-01-05 | Corning Incorporated | Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer |
| DE102012103077B4 (de) * | 2012-04-10 | 2017-06-22 | Schott Ag | Infrarot-absorbierender Glas-Wafer und Verfahren zu dessen Herstellung |
| EP2858106B1 (en) | 2012-05-30 | 2019-05-08 | Olympus Corporation | Method for producing semiconductor apparatus |
| JP6395600B2 (ja) | 2012-05-30 | 2018-09-26 | オリンパス株式会社 | 撮像装置の製造方法および半導体装置の製造方法 |
| US9221289B2 (en) * | 2012-07-27 | 2015-12-29 | Apple Inc. | Sapphire window |
| JP2014151376A (ja) | 2013-02-05 | 2014-08-25 | Seiko Instruments Inc | ウエハ研磨方法及び電子デバイス製造方法 |
| KR102166947B1 (ko) * | 2013-04-30 | 2020-10-19 | 코닝 인코포레이티드 | 공핍층 및 공핍층 상에 제작된 다결정질-실리콘 tft를 갖는 유리 |
| US9966293B2 (en) * | 2014-09-19 | 2018-05-08 | Infineon Technologies Ag | Wafer arrangement and method for processing a wafer |
| JP6827934B2 (ja) | 2015-01-20 | 2021-02-10 | ショット グラス テクノロジーズ (スゾウ) カンパニー リミテッドSchott Glass Technologies (Suzhou) Co., Ltd. | 高いuv透過率および耐ソラリゼーション性を示す低cteガラス |
| KR102508645B1 (ko) * | 2015-03-10 | 2023-03-10 | 니폰 덴키 가라스 가부시키가이샤 | 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판 |
-
2018
- 2018-02-22 TW TW107105940A patent/TWI771375B/zh active
- 2018-02-23 US US15/903,787 patent/US10935698B2/en active Active
- 2018-02-23 KR KR1020197027352A patent/KR102536919B1/ko active Active
- 2018-02-23 CN CN201880013996.6A patent/CN110461784A/zh active Pending
- 2018-02-23 JP JP2019545991A patent/JP7594857B2/ja active Active
- 2018-02-23 EP EP18709891.8A patent/EP3585743A1/en active Pending
- 2018-02-23 WO PCT/US2018/019421 patent/WO2018156894A1/en not_active Ceased
-
2022
- 2022-12-26 JP JP2022208047A patent/JP2023040087A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019461A (ja) * | 2005-04-27 | 2007-01-25 | Disco Abrasive Syst Ltd | ウェーハの加工方法及びウェーハ |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018156894A1 (en) | 2018-08-30 |
| EP3585743A1 (en) | 2020-01-01 |
| JP2020511383A (ja) | 2020-04-16 |
| US20180246257A1 (en) | 2018-08-30 |
| TW201834223A (zh) | 2018-09-16 |
| TWI771375B (zh) | 2022-07-21 |
| JP2023040087A (ja) | 2023-03-22 |
| JP7594857B2 (ja) | 2024-12-05 |
| CN110461784A (zh) | 2019-11-15 |
| US10935698B2 (en) | 2021-03-02 |
| KR20190117018A (ko) | 2019-10-15 |
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