KR102534927B1 - 열경화성 수지 필름, 제1 보호막 형성용 시트 및 제1 보호막의 형성 방법 - Google Patents

열경화성 수지 필름, 제1 보호막 형성용 시트 및 제1 보호막의 형성 방법 Download PDF

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KR102534927B1
KR102534927B1 KR1020187011892A KR20187011892A KR102534927B1 KR 102534927 B1 KR102534927 B1 KR 102534927B1 KR 1020187011892 A KR1020187011892 A KR 1020187011892A KR 20187011892 A KR20187011892 A KR 20187011892A KR 102534927 B1 KR102534927 B1 KR 102534927B1
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South Korea
Prior art keywords
meth
acrylate
thermosetting resin
forming
protective film
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KR1020187011892A
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English (en)
Korean (ko)
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KR20180080206A (ko
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마사노리 야마기시
아키노리 사토
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린텍 가부시키가이샤
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Publication of KR20180080206A publication Critical patent/KR20180080206A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020187011892A 2015-11-04 2016-11-02 열경화성 수지 필름, 제1 보호막 형성용 시트 및 제1 보호막의 형성 방법 KR102534927B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015217117 2015-11-04
JPJP-P-2015-217117 2015-11-04
PCT/JP2016/082514 WO2017078039A1 (ja) 2015-11-04 2016-11-02 熱硬化性樹脂フィルム、第１保護膜形成用シート及び第１保護膜の形成方法

Publications (2)

Publication Number Publication Date
KR20180080206A KR20180080206A (ko) 2018-07-11
KR102534927B1 true KR102534927B1 (ko) 2023-05-19

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ID=58661932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187011892A KR102534927B1 (ko) 2015-11-04 2016-11-02 열경화성 수지 필름, 제1 보호막 형성용 시트 및 제1 보호막의 형성 방법

Country Status (7)

Country Link
JP (1) JP6381828B2 (ja)
KR (1) KR102534927B1 (ja)
CN (1) CN108140586A (ja)
PH (1) PH12018500799A1 (ja)
SG (1) SG11201803082SA (ja)
TW (1) TWI761317B (ja)
WO (1) WO2017078039A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233377B2 (ja) * 2017-11-17 2023-03-06 リンテック株式会社 熱硬化性樹脂フィルム及び第１保護膜形成用シート
TWI692816B (zh) * 2019-05-22 2020-05-01 友達光電股份有限公司 顯示裝置及其製作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200195A (ja) * 2002-12-16 2004-07-15 Seiko Epson Corp 半導体装置および半導体装置の製造方法
JP2006100784A (ja) 2004-09-02 2006-04-13 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
WO2014013970A1 (ja) * 2012-07-19 2014-01-23 ナガセケムテックス株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置の製造方法
JP2014019813A (ja) * 2012-07-20 2014-02-03 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物、接着フィルム、ダイシングテープ一体型接着フィルム、半導体装置、多層回路基板および電子部品
JP2014189790A (ja) * 2013-03-28 2014-10-06 Nitto Denko Corp 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4170839B2 (ja) 2003-07-11 2008-10-22 日東電工株式会社 積層シート
JP2005229044A (ja) * 2004-02-16 2005-08-25 Seiko Epson Corp 電子部品の製造方法、電子部品および電子機器
JP4179312B2 (ja) * 2004-09-15 2008-11-12 セイコーエプソン株式会社 半導体装置の実装方法、半導体装置
JP2006253277A (ja) * 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd モジュール用半導体素子と、これを用いたモジュールおよび、前記モジュールの製造方法
JP4380684B2 (ja) * 2006-10-20 2009-12-09 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
WO2011033743A1 (ja) * 2009-09-16 2011-03-24 住友ベークライト株式会社 接着フィルム、多層回路基板、電子部品及び半導体装置
CN102842541A (zh) * 2011-06-22 2012-12-26 日东电工株式会社 层叠膜及其使用
JP2013062328A (ja) * 2011-09-12 2013-04-04 Toshiba Corp 半導体装置
TWI443761B (zh) * 2011-09-14 2014-07-01 Manufacturing method for flip chip packaging

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200195A (ja) * 2002-12-16 2004-07-15 Seiko Epson Corp 半導体装置および半導体装置の製造方法
JP2006100784A (ja) 2004-09-02 2006-04-13 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
WO2014013970A1 (ja) * 2012-07-19 2014-01-23 ナガセケムテックス株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置の製造方法
JP2014019813A (ja) * 2012-07-20 2014-02-03 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物、接着フィルム、ダイシングテープ一体型接着フィルム、半導体装置、多層回路基板および電子部品
JP2014189790A (ja) * 2013-03-28 2014-10-06 Nitto Denko Corp 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法

Also Published As

Publication number Publication date
KR20180080206A (ko) 2018-07-11
CN108140586A (zh) 2018-06-08
PH12018500799A1 (en) 2018-10-29
TW201728636A (zh) 2017-08-16
TWI761317B (zh) 2022-04-21
WO2017078039A1 (ja) 2017-05-11
SG11201803082SA (en) 2018-05-30
JPWO2017078039A1 (ja) 2018-02-15
JP6381828B2 (ja) 2018-08-29

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