KR102533946B1 - 도전성 기판 - Google Patents

도전성 기판 Download PDF

Info

Publication number
KR102533946B1
KR102533946B1 KR1020187007909A KR20187007909A KR102533946B1 KR 102533946 B1 KR102533946 B1 KR 102533946B1 KR 1020187007909 A KR1020187007909 A KR 1020187007909A KR 20187007909 A KR20187007909 A KR 20187007909A KR 102533946 B1 KR102533946 B1 KR 102533946B1
Authority
KR
South Korea
Prior art keywords
layer
blackening
copper
blackening layer
metal layer
Prior art date
Application number
KR1020187007909A
Other languages
English (en)
Korean (ko)
Other versions
KR20180061171A (ko
Inventor
도모하루 와타나베
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20180061171A publication Critical patent/KR20180061171A/ko
Application granted granted Critical
Publication of KR102533946B1 publication Critical patent/KR102533946B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/087—Oxides of copper or solid solutions thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
KR1020187007909A 2015-09-30 2016-09-26 도전성 기판 KR102533946B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015195199 2015-09-30
JPJP-P-2015-195199 2015-09-30
PCT/JP2016/078245 WO2017057262A1 (ja) 2015-09-30 2016-09-26 導電性基板

Publications (2)

Publication Number Publication Date
KR20180061171A KR20180061171A (ko) 2018-06-07
KR102533946B1 true KR102533946B1 (ko) 2023-05-17

Family

ID=58427471

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187007909A KR102533946B1 (ko) 2015-09-30 2016-09-26 도전성 기판

Country Status (5)

Country Link
JP (1) JP6687033B2 (zh)
KR (1) KR102533946B1 (zh)
CN (1) CN108027688B (zh)
TW (1) TWI730988B (zh)
WO (1) WO2017057262A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110545996B (zh) * 2017-04-17 2021-12-31 住友金属矿山株式会社 导电性基板
JP7323293B2 (ja) * 2019-02-12 2023-08-08 日東電工株式会社 導電性フィルムおよびタッチパネル
CN112735634B (zh) * 2021-01-11 2023-03-14 江苏软讯科技有限公司 一种具有金属网格的导电膜及其生产工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013129183A (ja) 2011-11-22 2013-07-04 Toray Ind Inc 積層体
WO2015064664A1 (ja) 2013-10-31 2015-05-07 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
JP2015153666A (ja) * 2014-02-17 2015-08-24 住友金属鉱山株式会社 細線パターンの形成方法、及び導電性基板の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002367428A (ja) * 2001-06-04 2002-12-20 Asahi Glass Co Ltd 着色透明導電膜形成用塗布液、着色透明導電膜付き基体およびその製造方法、ならびに表示装置
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP5192767B2 (ja) * 2006-09-28 2013-05-08 富士フイルム株式会社 導電膜の製造方法
WO2009078283A1 (ja) * 2007-12-14 2009-06-25 Ulvac, Inc. タッチパネル、タッチパネルの製造方法
JP5739742B2 (ja) * 2010-11-04 2015-06-24 日東電工株式会社 透明導電性フィルムおよびタッチパネル
JP5914036B2 (ja) * 2011-04-20 2016-05-11 日東電工株式会社 導電性積層フィルムの製造方法
TWI554475B (zh) * 2011-12-09 2016-10-21 Nippon Catalytic Chem Ind A compound, a metal oxide particle, a method for producing the same, and a method for producing the same
JP5781428B2 (ja) * 2011-12-20 2015-09-24 日東電工株式会社 導電性フィルムおよび導電性フィルムロール
JP5531029B2 (ja) * 2012-01-05 2014-06-25 日東電工株式会社 導電性フィルム及び導電性フィルムロール
JP5826656B2 (ja) * 2012-02-06 2015-12-02 日東電工株式会社 導電性フィルムロールの製造方法
JP2013206315A (ja) 2012-03-29 2013-10-07 Toppan Printing Co Ltd フィルム状タッチパネルセンサー及びその製造方法
KR20150013293A (ko) * 2012-07-04 2015-02-04 닛뽕소다 가부시키가이샤 기능성 반사 방지 적층체
JP2014073642A (ja) * 2012-10-05 2014-04-24 Nippon Electric Glass Co Ltd 透明導電性ガラス基板、及びタッチパネル
JP6107637B2 (ja) * 2013-12-16 2017-04-05 住友金属鉱山株式会社 導電性基板の製造方法
JP2015164030A (ja) * 2014-01-31 2015-09-10 住友金属鉱山株式会社 導電性基板、積層導電性基板、導電性基板の製造方法、及び積層導電性基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013129183A (ja) 2011-11-22 2013-07-04 Toray Ind Inc 積層体
WO2015064664A1 (ja) 2013-10-31 2015-05-07 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
JP2015153666A (ja) * 2014-02-17 2015-08-24 住友金属鉱山株式会社 細線パターンの形成方法、及び導電性基板の製造方法

Also Published As

Publication number Publication date
JP6687033B2 (ja) 2020-04-22
CN108027688A (zh) 2018-05-11
TWI730988B (zh) 2021-06-21
CN108027688B (zh) 2021-04-13
WO2017057262A1 (ja) 2017-04-06
KR20180061171A (ko) 2018-06-07
TW201726381A (zh) 2017-08-01
JPWO2017057262A1 (ja) 2018-08-16

Similar Documents

Publication Publication Date Title
KR102390079B1 (ko) 도전성 기판
WO2015115528A1 (ja) 導電性基板、積層導電性基板、導電性基板の製造方法、及び積層導電性基板の製造方法
KR102533946B1 (ko) 도전성 기판
TWI712506B (zh) 積層體基板、積層體基板之製造方法、導電性基板、及導電性基板之製造方法
JP6823363B2 (ja) 導電性基板、導電性基板の製造方法
TWI655570B (zh) Conductive substrate, laminated conductive substrate, method for producing conductive substrate, and method for producing laminated conductive substrate
KR102537748B1 (ko) 도전성 기판
KR102383919B1 (ko) 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법
JP6417964B2 (ja) 積層体基板、配線基板ならびにそれらの製造方法
JP6500746B2 (ja) 導電性基板の製造方法
KR102544424B1 (ko) 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법
KR20180044891A (ko) 도전성 기판 및 도전성 기판 제조방법
KR102365980B1 (ko) 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant