KR102509854B1 - 기판 처리 방법, 기판 처리 장치 및 기판 처리 시스템 - Google Patents
기판 처리 방법, 기판 처리 장치 및 기판 처리 시스템 Download PDFInfo
- Publication number
- KR102509854B1 KR102509854B1 KR1020217004619A KR20217004619A KR102509854B1 KR 102509854 B1 KR102509854 B1 KR 102509854B1 KR 1020217004619 A KR1020217004619 A KR 1020217004619A KR 20217004619 A KR20217004619 A KR 20217004619A KR 102509854 B1 KR102509854 B1 KR 102509854B1
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- KR
- South Korea
- Prior art keywords
- nozzle
- substrate
- timing
- processing liquid
- processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018154079A JP7177628B2 (ja) | 2018-08-20 | 2018-08-20 | 基板処理方法、基板処理装置および基板処理システム |
JPJP-P-2018-154079 | 2018-08-20 | ||
PCT/JP2019/026589 WO2020039765A1 (ja) | 2018-08-20 | 2019-07-04 | 基板処理方法、基板処理装置および基板処理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210031952A KR20210031952A (ko) | 2021-03-23 |
KR102509854B1 true KR102509854B1 (ko) | 2023-03-14 |
Family
ID=69593077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217004619A KR102509854B1 (ko) | 2018-08-20 | 2019-07-04 | 기판 처리 방법, 기판 처리 장치 및 기판 처리 시스템 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7177628B2 (ja) |
KR (1) | KR102509854B1 (ja) |
CN (1) | CN112640054A (ja) |
TW (1) | TWI702649B (ja) |
WO (1) | WO2020039765A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3085603B1 (fr) * | 2018-09-11 | 2020-08-14 | Soitec Silicon On Insulator | Procede pour le traitement d'un susbtrat soi dans un equipement de nettoyage monoplaque |
JP2021152762A (ja) * | 2020-03-24 | 2021-09-30 | 株式会社Screenホールディングス | 学習済みモデル生成方法、学習済みモデル、異常要因推定装置、基板処理装置、異常要因推定方法、学習方法、学習装置、及び、学習データ作成方法 |
KR102324162B1 (ko) * | 2020-04-08 | 2021-11-10 | 이지스로직 주식회사 | 포토레지스트 코팅 품질 검사가 가능한 스핀 코터 |
KR102327761B1 (ko) * | 2020-04-08 | 2021-11-19 | 주식회사 이지스로직 | Dvs와 딥러닝을 이용한 스핀 코터의 포토레지스트 코팅 품질 검사 시스템 |
KR102368201B1 (ko) * | 2020-04-08 | 2022-03-02 | 이지스로직 주식회사 | 스핀 코터의 포토레지스트 코팅 품질 검사 시스템 |
US11699595B2 (en) | 2021-02-25 | 2023-07-11 | Applied Materials, Inc. | Imaging for monitoring thickness in a substrate cleaning system |
KR102585478B1 (ko) * | 2021-10-14 | 2023-10-10 | 주식회사 램스 | 딥러닝을 이용한 스핀 코터의 포토레지스트 도포 상태 검사 시스템 |
JP2023127856A (ja) * | 2022-03-02 | 2023-09-14 | 株式会社Screenホールディングス | 基板処理方法、及び基板処理装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273003A (ja) * | 2002-03-15 | 2003-09-26 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2016072344A (ja) * | 2014-09-29 | 2016-05-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3481416B2 (ja) * | 1997-04-07 | 2003-12-22 | 大日本スクリーン製造株式会社 | 基板処理装置及び方法 |
JPH11330041A (ja) * | 1998-05-07 | 1999-11-30 | Dainippon Screen Mfg Co Ltd | エッチング液による基板処理装置 |
JP4601452B2 (ja) * | 2005-02-22 | 2010-12-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2010151925A (ja) * | 2008-12-24 | 2010-07-08 | Hitachi High-Technologies Corp | 基板処理装置、フラットパネルディスプレイの製造装置およびフラットパネルディスプレイ |
JP2009218622A (ja) * | 2009-06-29 | 2009-09-24 | Canon Anelva Corp | 基板処理装置及び基板処理装置における基板位置ずれ補正方法 |
JP6278759B2 (ja) | 2014-03-11 | 2018-02-14 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6251086B2 (ja) * | 2014-03-12 | 2017-12-20 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP2016122681A (ja) * | 2014-12-24 | 2016-07-07 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6635869B2 (ja) * | 2015-06-16 | 2020-01-29 | 東京エレクトロン株式会社 | 処理装置、処理方法および記憶媒体 |
JP6541491B2 (ja) | 2015-07-29 | 2019-07-10 | 株式会社Screenホールディングス | 流下判定方法、流下判定装置および吐出装置 |
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2018
- 2018-08-20 JP JP2018154079A patent/JP7177628B2/ja active Active
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2019
- 2019-06-18 TW TW108120997A patent/TWI702649B/zh active
- 2019-07-04 CN CN201980054879.9A patent/CN112640054A/zh active Pending
- 2019-07-04 WO PCT/JP2019/026589 patent/WO2020039765A1/ja active Application Filing
- 2019-07-04 KR KR1020217004619A patent/KR102509854B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273003A (ja) * | 2002-03-15 | 2003-09-26 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2016072344A (ja) * | 2014-09-29 | 2016-05-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202010003A (zh) | 2020-03-01 |
TWI702649B (zh) | 2020-08-21 |
WO2020039765A1 (ja) | 2020-02-27 |
KR20210031952A (ko) | 2021-03-23 |
JP7177628B2 (ja) | 2022-11-24 |
JP2020031083A (ja) | 2020-02-27 |
CN112640054A (zh) | 2021-04-09 |
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