KR102503808B1 - 정전식 압력 감지용 다층 구조체 - Google Patents

정전식 압력 감지용 다층 구조체 Download PDF

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Publication number
KR102503808B1
KR102503808B1 KR1020177024733A KR20177024733A KR102503808B1 KR 102503808 B1 KR102503808 B1 KR 102503808B1 KR 1020177024733 A KR1020177024733 A KR 1020177024733A KR 20177024733 A KR20177024733 A KR 20177024733A KR 102503808 B1 KR102503808 B1 KR 102503808B1
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South Korea
Prior art keywords
sensor pads
electronic
electronic circuit
flexible
multilayer structure
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KR1020177024733A
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English (en)
Korean (ko)
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KR20170134346A (ko
Inventor
카리 세베린칸가스
미코 헤이키넨
자르모 사스키
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택토텍 오와이
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/103—Measuring devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
    • A61B5/1036—Measuring load distribution, e.g. podologic studies
    • A61B5/1038—Measuring plantar pressure during gait
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/103—Measuring devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
    • A61B5/11—Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
    • A61B5/112—Gait analysis
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6802—Sensor mounted on worn items
    • A61B5/6804—Garments; Clothes
    • A61B5/6807—Footwear
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Pathology (AREA)
  • Veterinary Medicine (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Public Health (AREA)
  • Biophysics (AREA)
  • General Health & Medical Sciences (AREA)
  • Dentistry (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physiology (AREA)
  • Manufacturing & Machinery (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
KR1020177024733A 2015-04-02 2016-04-01 정전식 압력 감지용 다층 구조체 Active KR102503808B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/677,075 2015-04-02
US14/677,075 US10234340B2 (en) 2015-04-02 2015-04-02 Multilayer structure for capacitive pressure sensing
PCT/FI2016/050204 WO2016156669A1 (en) 2015-04-02 2016-04-01 Multilayer structure for capacitive pressure sensing

Publications (2)

Publication Number Publication Date
KR20170134346A KR20170134346A (ko) 2017-12-06
KR102503808B1 true KR102503808B1 (ko) 2023-02-23

Family

ID=57003949

Family Applications (1)

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KR1020177024733A Active KR102503808B1 (ko) 2015-04-02 2016-04-01 정전식 압력 감지용 다층 구조체

Country Status (7)

Country Link
US (1) US10234340B2 (https=)
EP (1) EP3278192B1 (https=)
JP (1) JP6837441B2 (https=)
KR (1) KR102503808B1 (https=)
CN (1) CN107430418B (https=)
TW (1) TW201710867A (https=)
WO (1) WO2016156669A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
KR20170027642A (ko) * 2015-09-02 2017-03-10 남기연 정보 비콘이 내장되는 접착 직물
US11179103B2 (en) * 2016-04-29 2021-11-23 Sanko Tekstil Isletmeleri San. Ve Tic. A.S. Wearable step counter system
US10912513B2 (en) * 2016-05-26 2021-02-09 Wearsense Llc Pressure and vacuum sensors, systems, and associated methods with a plurality of layers of a dielectric material
GB2557419B (en) * 2016-10-07 2020-04-01 Jaguar Land Rover Ltd Control unit
US10624415B2 (en) * 2017-05-09 2020-04-21 Chih-Hua Hsieh Insole with heat generating system
US20180342142A1 (en) * 2017-05-25 2018-11-29 Michael Stephen LAU Concealed location tracking device for tracking location of a user and method thereof
GB2567405B (en) * 2017-06-29 2022-07-20 Nurvv Ltd A force sensitive resistor
CN107562269B (zh) * 2017-08-28 2020-04-17 京东方科技集团股份有限公司 压力触控结构和显示装置
US10119869B1 (en) * 2017-12-21 2018-11-06 Tactotek Oy Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device
FR3076174B1 (fr) * 2017-12-21 2020-01-24 Traxxs Dispositif electronique enrobe
CN112399818B (zh) * 2018-05-03 2024-06-14 Aag可穿戴技术私人有限公司 电子补片
TWI853828B (zh) 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法
US10485094B1 (en) * 2018-08-27 2019-11-19 Tactotek Oy Multilayer structure with embedded sensing functionalities and related method of manufacture
US10946612B2 (en) * 2018-08-27 2021-03-16 Tactotek Oy Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
US11166363B2 (en) 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
CN110324973B (zh) * 2019-08-07 2022-10-28 深圳市恒翊科技有限公司 覆膜注塑成型的电路结构体及其制作方法
WO2021034784A1 (en) 2019-08-16 2021-02-25 Poltorak Technologies, LLC Device and method for medical diagnostics
US11357103B1 (en) * 2020-01-21 2022-06-07 Signetik, LLC System-in-package cellular assembly
US12429414B2 (en) * 2020-01-31 2025-09-30 Kidde Fire Protection, Llc Method for manufacturing a detector
US11982514B2 (en) 2021-01-07 2024-05-14 XARPIE Labs LLP Interchangeable rifle scope devices for displaying virtual shooting targets thereon
CN113017603A (zh) * 2021-02-26 2021-06-25 刘辰然 一种足底触点压力传感器步态识别装置
CN114088259A (zh) * 2021-12-03 2022-02-25 广东粤港澳大湾区黄埔材料研究院 一种鞋垫柔性传感器及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140174205A1 (en) * 2012-12-20 2014-06-26 SmartMove, Inc. System And Insole For Measuring Information From The Foot Of A User And Related Method Of Providing Same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05161724A (ja) * 1991-12-16 1993-06-29 Hidekazu Takahashi 運動情報を収集する靴の中敷
US7631382B2 (en) * 2003-03-10 2009-12-15 Adidas International Marketing B.V. Intelligent footwear systems
US7189103B1 (en) * 2005-12-07 2007-03-13 Avocent Corporation Wire comb overlying spark gap
US20080202251A1 (en) * 2007-02-27 2008-08-28 Iee International Electronics & Engineering S.A. Capacitive pressure sensor
US20090073130A1 (en) * 2007-09-17 2009-03-19 Apple Inc. Device having cover with integrally formed sensor
US7739791B2 (en) 2007-10-26 2010-06-22 Delphi Technologies, Inc. Method of producing an overmolded electronic module with a flexible circuit pigtail
US8381601B2 (en) * 2008-05-05 2013-02-26 John F. Stumpf Transducer matrix film
US7735383B2 (en) * 2008-06-24 2010-06-15 Synaptics Incorporated Balanced resistance capacitive sensing apparatus
FI121862B (fi) * 2008-10-24 2011-05-13 Valtion Teknillinen Järjestely kosketusnäyttöä varten ja vastaava valmistusmenetelmä
US8797756B2 (en) * 2010-09-21 2014-08-05 Biotronik Se & Co. Kg Integrated overmolded interconnect tab for surface-mounted circuits
US9036359B2 (en) * 2010-10-15 2015-05-19 Leonovo Innovations Limited (Hong Kong) Component built-in module, electronic device including same, and method for manufacturing component built-in module
DE102011012458A1 (de) 2011-02-25 2012-08-30 Moticon Gmbh Sohle mit Sensor
CN103251170B (zh) 2012-02-16 2015-09-02 安德润普科技开发（深圳）有限公司 一种压力监测鞋
US20140135954A1 (en) * 2012-11-13 2014-05-15 John M. Vranish Balance-assist shoe
CN105380342A (zh) * 2015-10-14 2016-03-09 上海交通大学 一种基于电容式压力传感器的智能鞋垫系统

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140174205A1 (en) * 2012-12-20 2014-06-26 SmartMove, Inc. System And Insole For Measuring Information From The Foot Of A User And Related Method Of Providing Same

Also Published As

Publication number Publication date
CN107430418B (zh) 2021-09-03
EP3278192A1 (en) 2018-02-07
JP6837441B2 (ja) 2021-03-03
KR20170134346A (ko) 2017-12-06
US20160290878A1 (en) 2016-10-06
US10234340B2 (en) 2019-03-19
CN107430418A (zh) 2017-12-01
EP3278192A4 (en) 2019-01-02
EP3278192B1 (en) 2023-03-29
JP2018510023A (ja) 2018-04-12
WO2016156669A1 (en) 2016-10-06
TW201710867A (zh) 2017-03-16

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