JP2018510023A5 - - Google Patents

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Publication number
JP2018510023A5
JP2018510023A5 JP2017551173A JP2017551173A JP2018510023A5 JP 2018510023 A5 JP2018510023 A5 JP 2018510023A5 JP 2017551173 A JP2017551173 A JP 2017551173A JP 2017551173 A JP2017551173 A JP 2017551173A JP 2018510023 A5 JP2018510023 A5 JP 2018510023A5
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JP
Japan
Prior art keywords
film
sensor pads
electronic circuit
millimeters
multilayer structure
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JP2017551173A
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English (en)
Japanese (ja)
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JP6837441B2 (ja
JP2018510023A (ja
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Priority claimed from US14/677,075 external-priority patent/US10234340B2/en
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Publication of JP2018510023A publication Critical patent/JP2018510023A/ja
Publication of JP2018510023A5 publication Critical patent/JP2018510023A5/ja
Application granted granted Critical
Publication of JP6837441B2 publication Critical patent/JP6837441B2/ja
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JP2017551173A 2015-04-02 2016-04-01 静電容量圧力感知のための多層構造体 Active JP6837441B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/677,075 2015-04-02
US14/677,075 US10234340B2 (en) 2015-04-02 2015-04-02 Multilayer structure for capacitive pressure sensing
PCT/FI2016/050204 WO2016156669A1 (en) 2015-04-02 2016-04-01 Multilayer structure for capacitive pressure sensing

Publications (3)

Publication Number Publication Date
JP2018510023A JP2018510023A (ja) 2018-04-12
JP2018510023A5 true JP2018510023A5 (https=) 2020-07-30
JP6837441B2 JP6837441B2 (ja) 2021-03-03

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ID=57003949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017551173A Active JP6837441B2 (ja) 2015-04-02 2016-04-01 静電容量圧力感知のための多層構造体

Country Status (7)

Country Link
US (1) US10234340B2 (https=)
EP (1) EP3278192B1 (https=)
JP (1) JP6837441B2 (https=)
KR (1) KR102503808B1 (https=)
CN (1) CN107430418B (https=)
TW (1) TW201710867A (https=)
WO (1) WO2016156669A1 (https=)

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GB2567405B (en) * 2017-06-29 2022-07-20 Nurvv Ltd A force sensitive resistor
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US10119869B1 (en) * 2017-12-21 2018-11-06 Tactotek Oy Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device
FR3076174B1 (fr) * 2017-12-21 2020-01-24 Traxxs Dispositif electronique enrobe
CN112399818B (zh) * 2018-05-03 2024-06-14 Aag可穿戴技术私人有限公司 电子补片
TWI853828B (zh) 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法
US10485094B1 (en) * 2018-08-27 2019-11-19 Tactotek Oy Multilayer structure with embedded sensing functionalities and related method of manufacture
US10946612B2 (en) * 2018-08-27 2021-03-16 Tactotek Oy Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
US11166363B2 (en) 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
CN110324973B (zh) * 2019-08-07 2022-10-28 深圳市恒翊科技有限公司 覆膜注塑成型的电路结构体及其制作方法
WO2021034784A1 (en) 2019-08-16 2021-02-25 Poltorak Technologies, LLC Device and method for medical diagnostics
US11357103B1 (en) * 2020-01-21 2022-06-07 Signetik, LLC System-in-package cellular assembly
US12429414B2 (en) * 2020-01-31 2025-09-30 Kidde Fire Protection, Llc Method for manufacturing a detector
US11982514B2 (en) 2021-01-07 2024-05-14 XARPIE Labs LLP Interchangeable rifle scope devices for displaying virtual shooting targets thereon
CN113017603A (zh) * 2021-02-26 2021-06-25 刘辰然 一种足底触点压力传感器步态识别装置
CN114088259A (zh) * 2021-12-03 2022-02-25 广东粤港澳大湾区黄埔材料研究院 一种鞋垫柔性传感器及其制备方法

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