FR3076174B1 - Dispositif electronique enrobe - Google Patents

Dispositif electronique enrobe Download PDF

Info

Publication number
FR3076174B1
FR3076174B1 FR1762711A FR1762711A FR3076174B1 FR 3076174 B1 FR3076174 B1 FR 3076174B1 FR 1762711 A FR1762711 A FR 1762711A FR 1762711 A FR1762711 A FR 1762711A FR 3076174 B1 FR3076174 B1 FR 3076174B1
Authority
FR
France
Prior art keywords
electronic device
electronic
electronic components
coated electronic
reinforcing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1762711A
Other languages
English (en)
Other versions
FR3076174A1 (fr
Inventor
Sylvain Rispal
Denis Audoly
Ali Alex Chami
Norbert Grunert
Alexandre Tissiere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TRAXXS
Original Assignee
TRAXXS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRAXXS filed Critical TRAXXS
Priority to FR1762711A priority Critical patent/FR3076174B1/fr
Priority to PCT/EP2018/086262 priority patent/WO2019122167A1/fr
Priority to EP18830474.5A priority patent/EP3729919A1/fr
Publication of FR3076174A1 publication Critical patent/FR3076174A1/fr
Application granted granted Critical
Publication of FR3076174B1 publication Critical patent/FR3076174B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • A—HUMAN NECESSITIES
    • A43—FOOTWEAR
    • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
    • A43B3/00—Footwear characterised by the shape or the use
    • A43B3/34—Footwear characterised by the shape or the use with electrical or electronic arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention a pour objet un dispositif (10) électronique comprenant une carte électronique (100) sur laquelle sont montés des composants électroniques (100B) reliés électriquement par un circuit électrique (100A). Le dispositif (10) comprend un élément de renfort (200) réalisé en un matériau fibreux s'étendant sur lesdits composants électroniques (100B). Les composants électroniques (110B) de la carte électronique (100) et l'élément de renfort (200) sont enrobés intégralement dans une résine dite « d'enrobage » (300).
FR1762711A 2017-12-21 2017-12-21 Dispositif electronique enrobe Active FR3076174B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1762711A FR3076174B1 (fr) 2017-12-21 2017-12-21 Dispositif electronique enrobe
PCT/EP2018/086262 WO2019122167A1 (fr) 2017-12-21 2018-12-20 Dispositif électronique enrobé et son procédé de fabrication
EP18830474.5A EP3729919A1 (fr) 2017-12-21 2018-12-20 Dispositif électronique enrobé et son procédé de fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1762711 2017-12-21
FR1762711A FR3076174B1 (fr) 2017-12-21 2017-12-21 Dispositif electronique enrobe

Publications (2)

Publication Number Publication Date
FR3076174A1 FR3076174A1 (fr) 2019-06-28
FR3076174B1 true FR3076174B1 (fr) 2020-01-24

Family

ID=61750339

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1762711A Active FR3076174B1 (fr) 2017-12-21 2017-12-21 Dispositif electronique enrobe

Country Status (3)

Country Link
EP (1) EP3729919A1 (fr)
FR (1) FR3076174B1 (fr)
WO (1) WO2019122167A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5349532B2 (ja) * 2011-05-20 2013-11-20 パナソニック株式会社 部品内蔵モジュールの製造方法
FR3011411B1 (fr) * 2013-09-27 2015-10-16 Traxxs Dispositif de geolocalisation
US20150116958A1 (en) * 2013-10-28 2015-04-30 Apple Inc. Circuit board modules having mechanical features
US10234340B2 (en) * 2015-04-02 2019-03-19 Tactotek Oy Multilayer structure for capacitive pressure sensing

Also Published As

Publication number Publication date
FR3076174A1 (fr) 2019-06-28
EP3729919A1 (fr) 2020-10-28
WO2019122167A1 (fr) 2019-06-27

Similar Documents

Publication Publication Date Title
EP3850922A4 (fr) Ensemble de carte de circuit imprimé et dispositif électronique comprenant ce dernier
ATE414118T1 (de) Lichtempfindliche dielektrische harzzusammensetzungen und ihre verwendungen
DE502006005143D1 (de) Brusthaube mit Widerstandsheizelement aus Kunststoff
EP3755126A4 (fr) Plaque de connexion, ensemble carte de circuit imprimé et dispositif électronique
SG11201903855PA (en) Thermally conductive paste and electronic device
FR3075466B1 (fr) Couvercle de boitier de circuit electronique
FR3076174B1 (fr) Dispositif electronique enrobe
FR3055943B1 (fr) Cablage d'une source lumineuse de haute resolution
EP3383148A3 (fr) Barrière adhésive de dispositif électrique
EP3972489A4 (fr) Dispositif électronique comprenant un élément de connexion électroconducteur
SG11202010388SA (en) Cannabinoid receptor type 1 (cb1) binding proteins and uses thereof
PL412959A1 (pl) Obudowa do elementów elektrycznych i elektronicznych
EP3800355A4 (fr) Pompe à eau électronique et ensemble boîtier associé
FR3027769B1 (fr) Element pour le developpement de la faune ou de la flore aquatique, et dispositif d'habitat artificiel comprenant au moins un tel element
FR2890246B1 (fr) Appareil de connexion de borne.
FR2925776B1 (fr) Agencement pour le raccordement securise d'un dispositif electronique
FR3038437B1 (fr) Ressort de contact pour un dispositif d'affichage ainsi que dispositif d'affichage et son procede de fabrication
FR3077511B1 (fr) Dispositif d'injection de charge d'une unite fcc.
FR3079623B1 (fr) Capot pour dispositif electronique et procede de fabrication
FR3042905B1 (fr) Dispositif et systeme microelectromecanique avec transducteur resistif a faible impedance
FR3084521B1 (fr) Procede de protection d'un module de circuit integre et dispositif correspondant
PL127259U1 (pl) Układ kamery ze źródłem światła na elastycznym laminacie
DE602008003648D1 (de) Abgeschirmte Verbindung von zwei Klemmen durch Kontakt zwischen zwei ebenen Schnittstellen
PL127121U1 (pl) Elektroniczny jednomodułowy przekaźnik czasowy z dżojstikiem
PL421470A1 (pl) Plomba zabezpieczająca

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20190628

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8