KR102496680B1 - 디램-기반의 재설정 가능 로직 - Google Patents
디램-기반의 재설정 가능 로직 Download PDFInfo
- Publication number
- KR102496680B1 KR102496680B1 KR1020150179353A KR20150179353A KR102496680B1 KR 102496680 B1 KR102496680 B1 KR 102496680B1 KR 1020150179353 A KR1020150179353 A KR 1020150179353A KR 20150179353 A KR20150179353 A KR 20150179353A KR 102496680 B1 KR102496680 B1 KR 102496680B1
- Authority
- KR
- South Korea
- Prior art keywords
- lookup table
- memory
- reconfigurable
- resettable
- memory array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17748—Structural details of configuration resources
- H03K19/1776—Structural details of configuration resources for memories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17724—Structural details of logic blocks
- H03K19/17728—Reconfigurable logic blocks, e.g. lookup tables
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17736—Structural details of routing resources
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17748—Structural details of configuration resources
- H03K19/17758—Structural details of configuration resources for speeding up configuration or reconfiguration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Logic Circuits (AREA)
- Microcomputers (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462092819P | 2014-12-16 | 2014-12-16 | |
| US201462092825P | 2014-12-16 | 2014-12-16 | |
| US201462092822P | 2014-12-16 | 2014-12-16 | |
| US62/092,822 | 2014-12-16 | ||
| US62/092,819 | 2014-12-16 | ||
| US62/092,825 | 2014-12-16 | ||
| US14/814,503 US9954533B2 (en) | 2014-12-16 | 2015-07-30 | DRAM-based reconfigurable logic |
| US14/814,503 | 2015-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160073324A KR20160073324A (ko) | 2016-06-24 |
| KR102496680B1 true KR102496680B1 (ko) | 2023-02-06 |
Family
ID=56112171
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150179353A Active KR102496680B1 (ko) | 2014-12-16 | 2015-12-15 | 디램-기반의 재설정 가능 로직 |
| KR1020150180208A Active KR102440132B1 (ko) | 2014-12-16 | 2015-12-16 | 재설정 가능 논리 장치 |
| KR1020150180209A Active KR102438730B1 (ko) | 2014-12-16 | 2015-12-16 | 공간 다중화를 지원하는 디램 기초의 재설정 가능 논리 장치 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150180208A Active KR102440132B1 (ko) | 2014-12-16 | 2015-12-16 | 재설정 가능 논리 장치 |
| KR1020150180209A Active KR102438730B1 (ko) | 2014-12-16 | 2015-12-16 | 공간 다중화를 지원하는 디램 기초의 재설정 가능 논리 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9954533B2 (enExample) |
| JP (1) | JP6594762B2 (enExample) |
| KR (3) | KR102496680B1 (enExample) |
| CN (1) | CN105703765B (enExample) |
| TW (1) | TWI649970B (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10013212B2 (en) * | 2015-11-30 | 2018-07-03 | Samsung Electronics Co., Ltd. | System architecture with memory channel DRAM FPGA module |
| US10075168B2 (en) * | 2016-03-05 | 2018-09-11 | XiaMen HaiCun IP Technology LLC | Configurable computing array comprising three-dimensional writable memory |
| US20170323041A1 (en) * | 2016-05-04 | 2017-11-09 | Chengdu Haicun Ip Technology Llc | Simulation Processor with In-Package Look-Up Table |
| US10848158B2 (en) | 2016-02-13 | 2020-11-24 | HangZhou HaiCun Information Technology Co., Ltd. | Configurable processor |
| JP2017169118A (ja) * | 2016-03-17 | 2017-09-21 | 株式会社東芝 | 集積回路および電子機器 |
| CN107346230A (zh) * | 2016-05-04 | 2017-11-14 | 杭州海存信息技术有限公司 | 基于封装内查找表的处理器 |
| US9871020B1 (en) * | 2016-07-14 | 2018-01-16 | Globalfoundries Inc. | Through silicon via sharing in a 3D integrated circuit |
| US11361813B2 (en) | 2016-09-16 | 2022-06-14 | Aspiring Sky Co. Limited | Nonvolatile memory structures with DRAM |
| US10354716B2 (en) | 2016-09-16 | 2019-07-16 | Aspiring Sky Co. Limited | SRAM based memory structures and methods thereof |
| US10353715B2 (en) | 2016-10-20 | 2019-07-16 | Aspiring Sky Co. Limited | Low power non-volatile SRAM memory systems |
| US10402342B2 (en) * | 2016-10-20 | 2019-09-03 | Aspiring Sky Co., Limited | Re-configurable non-volatile memory structures and systems |
| US10242728B2 (en) * | 2016-10-27 | 2019-03-26 | Samsung Electronics Co., Ltd. | DPU architecture |
| US10732866B2 (en) | 2016-10-27 | 2020-08-04 | Samsung Electronics Co., Ltd. | Scaling out architecture for DRAM-based processing unit (DPU) |
| US10180808B2 (en) * | 2016-10-27 | 2019-01-15 | Samsung Electronics Co., Ltd. | Software stack and programming for DPU operations |
| US9922696B1 (en) | 2016-10-28 | 2018-03-20 | Samsung Electronics Co., Ltd. | Circuits and micro-architecture for a DRAM-based processing unit |
| US10386410B2 (en) * | 2016-12-12 | 2019-08-20 | Samsung Electronics Co., Ltd. | Highly flexible performance counter and system debug module |
| US10489544B2 (en) | 2016-12-14 | 2019-11-26 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips |
| US11625523B2 (en) | 2016-12-14 | 2023-04-11 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips |
| KR102245385B1 (ko) * | 2017-03-28 | 2021-04-27 | 에스케이하이닉스 주식회사 | 자기 소자를 포함하는 lut, 이를 포함하는 fpga 및 기술 매핑 방법 |
| US10447274B2 (en) | 2017-07-11 | 2019-10-15 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells |
| US10957679B2 (en) | 2017-08-08 | 2021-03-23 | iCometrue Company Ltd. | Logic drive based on standardized commodity programmable logic semiconductor IC chips |
| US10630296B2 (en) | 2017-09-12 | 2020-04-21 | iCometrue Company Ltd. | Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells |
| US11119677B2 (en) | 2017-12-15 | 2021-09-14 | Samsung Electronics Co., Ltd. | HBM based memory lookup engine for deep learning accelerator |
| US10628295B2 (en) | 2017-12-26 | 2020-04-21 | Samsung Electronics Co., Ltd. | Computing mechanisms using lookup tables stored on memory |
| US11398453B2 (en) * | 2018-01-09 | 2022-07-26 | Samsung Electronics Co., Ltd. | HBM silicon photonic TSV architecture for lookup computing AI accelerator |
| US10732929B2 (en) * | 2018-01-09 | 2020-08-04 | Samsung Electronics Co., Ltd. | Computing accelerator using a lookup table |
| US10608642B2 (en) * | 2018-02-01 | 2020-03-31 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile radom access memory cells |
| US10623000B2 (en) | 2018-02-14 | 2020-04-14 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US10608638B2 (en) * | 2018-05-24 | 2020-03-31 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US12476637B2 (en) * | 2018-05-24 | 2025-11-18 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US11309334B2 (en) | 2018-09-11 | 2022-04-19 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells |
| US10892011B2 (en) | 2018-09-11 | 2021-01-12 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells |
| US10937762B2 (en) | 2018-10-04 | 2021-03-02 | iCometrue Company Ltd. | Logic drive based on multichip package using interconnection bridge |
| US11616046B2 (en) | 2018-11-02 | 2023-03-28 | iCometrue Company Ltd. | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip |
| US11211334B2 (en) | 2018-11-18 | 2021-12-28 | iCometrue Company Ltd. | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip |
| US10985154B2 (en) | 2019-07-02 | 2021-04-20 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cryptography circuits |
| US11227838B2 (en) | 2019-07-02 | 2022-01-18 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits |
| KR102322727B1 (ko) * | 2019-07-29 | 2021-11-05 | 에스케이하이닉스 주식회사 | 데이터 스왑을 위한 메모리 시스템 및 그 동작방법 |
| US11887930B2 (en) | 2019-08-05 | 2024-01-30 | iCometrue Company Ltd. | Vertical interconnect elevator based on through silicon vias |
| US11637056B2 (en) | 2019-09-20 | 2023-04-25 | iCometrue Company Ltd. | 3D chip package based on through-silicon-via interconnection elevator |
| US11600526B2 (en) | 2020-01-22 | 2023-03-07 | iCometrue Company Ltd. | Chip package based on through-silicon-via connector and silicon interconnection bridge |
| US11403111B2 (en) | 2020-07-17 | 2022-08-02 | Micron Technology, Inc. | Reconfigurable processing-in-memory logic using look-up tables |
| US11355170B1 (en) | 2020-12-16 | 2022-06-07 | Micron Technology, Inc. | Reconfigurable processing-in-memory logic |
| US12176278B2 (en) | 2021-05-30 | 2024-12-24 | iCometrue Company Ltd. | 3D chip package based on vertical-through-via connector |
| US12112792B2 (en) | 2021-08-10 | 2024-10-08 | Micron Technology, Inc. | Memory device for wafer-on-wafer formed memory and logic |
| US12268012B2 (en) | 2021-09-24 | 2025-04-01 | iCometrue Company Ltd. | Multi-output look-up table (LUT) for use in coarse-grained field-programmable-gate-array (FPGA) integrated-circuit (IC) chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002538652A (ja) * | 1999-02-25 | 2002-11-12 | ザイリンクス インコーポレイテッド | 多目的論理/メモリ回路を具備するfpga形態特定可能論理ブロック |
| JP2004529576A (ja) | 2001-05-16 | 2004-09-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 再構成可能な論理デバイス |
| US20140244981A1 (en) | 2013-02-26 | 2014-08-28 | Fujitsu Semiconductor Limited | Processor and control method for processor |
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| EP0689712A4 (en) * | 1993-03-17 | 1997-05-28 | Zycad Corp | CONFIGURABLE FIELDS WITH DIRECT ACCESS MEMORY ARRANGEMENT |
| US5689195A (en) * | 1995-05-17 | 1997-11-18 | Altera Corporation | Programmable logic array integrated circuit devices |
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-
2015
- 2015-07-30 US US14/814,503 patent/US9954533B2/en active Active
- 2015-08-27 US US14/838,348 patent/US9503095B2/en not_active Expired - Fee Related
- 2015-08-27 US US14/838,347 patent/US9577644B2/en active Active
- 2015-12-15 KR KR1020150179353A patent/KR102496680B1/ko active Active
- 2015-12-16 CN CN201510944660.XA patent/CN105703765B/zh active Active
- 2015-12-16 KR KR1020150180208A patent/KR102440132B1/ko active Active
- 2015-12-16 KR KR1020150180209A patent/KR102438730B1/ko active Active
- 2015-12-16 TW TW104142212A patent/TWI649970B/zh active
- 2015-12-16 JP JP2015245493A patent/JP6594762B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002538652A (ja) * | 1999-02-25 | 2002-11-12 | ザイリンクス インコーポレイテッド | 多目的論理/メモリ回路を具備するfpga形態特定可能論理ブロック |
| JP2004529576A (ja) | 2001-05-16 | 2004-09-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 再構成可能な論理デバイス |
| US20140244981A1 (en) | 2013-02-26 | 2014-08-28 | Fujitsu Semiconductor Limited | Processor and control method for processor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102438730B1 (ko) | 2022-08-31 |
| TWI649970B (zh) | 2019-02-01 |
| KR20160073335A (ko) | 2016-06-24 |
| TW201633718A (zh) | 2016-09-16 |
| KR20160073334A (ko) | 2016-06-24 |
| US20160173103A1 (en) | 2016-06-16 |
| KR102440132B1 (ko) | 2022-09-05 |
| CN105703765A (zh) | 2016-06-22 |
| US9577644B2 (en) | 2017-02-21 |
| US20160173101A1 (en) | 2016-06-16 |
| CN105703765B (zh) | 2020-10-09 |
| US9954533B2 (en) | 2018-04-24 |
| KR20160073324A (ko) | 2016-06-24 |
| JP2016123092A (ja) | 2016-07-07 |
| JP6594762B2 (ja) | 2019-10-23 |
| US20160173102A1 (en) | 2016-06-16 |
| US9503095B2 (en) | 2016-11-22 |
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