JP6594762B2 - Dram基盤の再構成可能なロジック装置及び方法 - Google Patents
Dram基盤の再構成可能なロジック装置及び方法 Download PDFInfo
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- JP6594762B2 JP6594762B2 JP2015245493A JP2015245493A JP6594762B2 JP 6594762 B2 JP6594762 B2 JP 6594762B2 JP 2015245493 A JP2015245493 A JP 2015245493A JP 2015245493 A JP2015245493 A JP 2015245493A JP 6594762 B2 JP6594762 B2 JP 6594762B2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17748—Structural details of configuration resources
- H03K19/1776—Structural details of configuration resources for memories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17724—Structural details of logic blocks
- H03K19/17728—Reconfigurable logic blocks, e.g. lookup tables
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17736—Structural details of routing resources
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17748—Structural details of configuration resources
- H03K19/17758—Structural details of configuration resources for speeding up configuration or reconfiguration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Logic Circuits (AREA)
- Microcomputers (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462092822P | 2014-12-16 | 2014-12-16 | |
| US201462092825P | 2014-12-16 | 2014-12-16 | |
| US201462092819P | 2014-12-16 | 2014-12-16 | |
| US62/092825 | 2014-12-16 | ||
| US62/092819 | 2014-12-16 | ||
| US62/092822 | 2014-12-16 | ||
| US14/814,503 US9954533B2 (en) | 2014-12-16 | 2015-07-30 | DRAM-based reconfigurable logic |
| US14/814503 | 2015-07-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016123092A JP2016123092A (ja) | 2016-07-07 |
| JP2016123092A5 JP2016123092A5 (enExample) | 2019-01-31 |
| JP6594762B2 true JP6594762B2 (ja) | 2019-10-23 |
Family
ID=56112171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015245493A Active JP6594762B2 (ja) | 2014-12-16 | 2015-12-16 | Dram基盤の再構成可能なロジック装置及び方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9954533B2 (enExample) |
| JP (1) | JP6594762B2 (enExample) |
| KR (3) | KR102496680B1 (enExample) |
| CN (1) | CN105703765B (enExample) |
| TW (1) | TWI649970B (enExample) |
Families Citing this family (46)
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| US20170322906A1 (en) * | 2016-05-04 | 2017-11-09 | Chengdu Haicun Ip Technology Llc | Processor with In-Package Look-Up Table |
| US10075168B2 (en) * | 2016-03-05 | 2018-09-11 | XiaMen HaiCun IP Technology LLC | Configurable computing array comprising three-dimensional writable memory |
| JP2017169118A (ja) * | 2016-03-17 | 2017-09-21 | 株式会社東芝 | 集積回路および電子機器 |
| CN107346352A (zh) * | 2016-05-04 | 2017-11-14 | 杭州海存信息技术有限公司 | 基于封装内查找表的仿真处理器 |
| US9871020B1 (en) * | 2016-07-14 | 2018-01-16 | Globalfoundries Inc. | Through silicon via sharing in a 3D integrated circuit |
| US11361813B2 (en) | 2016-09-16 | 2022-06-14 | Aspiring Sky Co. Limited | Nonvolatile memory structures with DRAM |
| US10559344B2 (en) | 2016-09-16 | 2020-02-11 | Aspiring Sky Co. Limited | Hybrid non-volatile memory devices with static random access memory (SRAM) array and non-volatile memory (NVM) array |
| US10353715B2 (en) | 2016-10-20 | 2019-07-16 | Aspiring Sky Co. Limited | Low power non-volatile SRAM memory systems |
| US10402342B2 (en) * | 2016-10-20 | 2019-09-03 | Aspiring Sky Co., Limited | Re-configurable non-volatile memory structures and systems |
| US10732866B2 (en) | 2016-10-27 | 2020-08-04 | Samsung Electronics Co., Ltd. | Scaling out architecture for DRAM-based processing unit (DPU) |
| US10180808B2 (en) * | 2016-10-27 | 2019-01-15 | Samsung Electronics Co., Ltd. | Software stack and programming for DPU operations |
| US10242728B2 (en) * | 2016-10-27 | 2019-03-26 | Samsung Electronics Co., Ltd. | DPU architecture |
| US9922696B1 (en) | 2016-10-28 | 2018-03-20 | Samsung Electronics Co., Ltd. | Circuits and micro-architecture for a DRAM-based processing unit |
| US10386410B2 (en) * | 2016-12-12 | 2019-08-20 | Samsung Electronics Co., Ltd. | Highly flexible performance counter and system debug module |
| US11625523B2 (en) | 2016-12-14 | 2023-04-11 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips |
| TWI892242B (zh) | 2016-12-14 | 2025-08-01 | 成真股份有限公司 | 標準大宗商品化現場可編程邏輯閘陣列(fpga)積體電路晶片組成之邏輯驅動器 |
| KR102245385B1 (ko) * | 2017-03-28 | 2021-04-27 | 에스케이하이닉스 주식회사 | 자기 소자를 포함하는 lut, 이를 포함하는 fpga 및 기술 매핑 방법 |
| US10447274B2 (en) | 2017-07-11 | 2019-10-15 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells |
| US10957679B2 (en) | 2017-08-08 | 2021-03-23 | iCometrue Company Ltd. | Logic drive based on standardized commodity programmable logic semiconductor IC chips |
| US10630296B2 (en) | 2017-09-12 | 2020-04-21 | iCometrue Company Ltd. | Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells |
| US11119677B2 (en) | 2017-12-15 | 2021-09-14 | Samsung Electronics Co., Ltd. | HBM based memory lookup engine for deep learning accelerator |
| US10628295B2 (en) * | 2017-12-26 | 2020-04-21 | Samsung Electronics Co., Ltd. | Computing mechanisms using lookup tables stored on memory |
| US10732929B2 (en) * | 2018-01-09 | 2020-08-04 | Samsung Electronics Co., Ltd. | Computing accelerator using a lookup table |
| US11398453B2 (en) * | 2018-01-09 | 2022-07-26 | Samsung Electronics Co., Ltd. | HBM silicon photonic TSV architecture for lookup computing AI accelerator |
| US10608642B2 (en) | 2018-02-01 | 2020-03-31 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile radom access memory cells |
| US10623000B2 (en) | 2018-02-14 | 2020-04-14 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US10608638B2 (en) * | 2018-05-24 | 2020-03-31 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US12476637B2 (en) * | 2018-05-24 | 2025-11-18 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US10892011B2 (en) | 2018-09-11 | 2021-01-12 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells |
| US11309334B2 (en) | 2018-09-11 | 2022-04-19 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells |
| US10937762B2 (en) | 2018-10-04 | 2021-03-02 | iCometrue Company Ltd. | Logic drive based on multichip package using interconnection bridge |
| US11616046B2 (en) | 2018-11-02 | 2023-03-28 | iCometrue Company Ltd. | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip |
| US11211334B2 (en) | 2018-11-18 | 2021-12-28 | iCometrue Company Ltd. | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip |
| US11227838B2 (en) | 2019-07-02 | 2022-01-18 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits |
| US10985154B2 (en) | 2019-07-02 | 2021-04-20 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cryptography circuits |
| KR102322727B1 (ko) | 2019-07-29 | 2021-11-05 | 에스케이하이닉스 주식회사 | 데이터 스왑을 위한 메모리 시스템 및 그 동작방법 |
| US11887930B2 (en) | 2019-08-05 | 2024-01-30 | iCometrue Company Ltd. | Vertical interconnect elevator based on through silicon vias |
| US11637056B2 (en) | 2019-09-20 | 2023-04-25 | iCometrue Company Ltd. | 3D chip package based on through-silicon-via interconnection elevator |
| US11600526B2 (en) | 2020-01-22 | 2023-03-07 | iCometrue Company Ltd. | Chip package based on through-silicon-via connector and silicon interconnection bridge |
| US11403111B2 (en) * | 2020-07-17 | 2022-08-02 | Micron Technology, Inc. | Reconfigurable processing-in-memory logic using look-up tables |
| US11355170B1 (en) | 2020-12-16 | 2022-06-07 | Micron Technology, Inc. | Reconfigurable processing-in-memory logic |
| US12176278B2 (en) | 2021-05-30 | 2024-12-24 | iCometrue Company Ltd. | 3D chip package based on vertical-through-via connector |
| US12112792B2 (en) | 2021-08-10 | 2024-10-08 | Micron Technology, Inc. | Memory device for wafer-on-wafer formed memory and logic |
| US12268012B2 (en) | 2021-09-24 | 2025-04-01 | iCometrue Company Ltd. | Multi-output look-up table (LUT) for use in coarse-grained field-programmable-gate-array (FPGA) integrated-circuit (IC) chip |
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| JP5994679B2 (ja) * | 2013-02-26 | 2016-09-21 | 株式会社ソシオネクスト | 処理装置、及び処理装置の制御方法 |
| US9425800B2 (en) * | 2013-04-02 | 2016-08-23 | Taiyo Yuden Co., Ltd. | Reconfigurable logic device |
| CN104575595B (zh) * | 2014-12-12 | 2017-07-07 | 杭州华澜微电子股份有限公司 | 非易失性随机存取的存储装置 |
-
2015
- 2015-07-30 US US14/814,503 patent/US9954533B2/en active Active
- 2015-08-27 US US14/838,348 patent/US9503095B2/en not_active Expired - Fee Related
- 2015-08-27 US US14/838,347 patent/US9577644B2/en active Active
- 2015-12-15 KR KR1020150179353A patent/KR102496680B1/ko active Active
- 2015-12-16 KR KR1020150180208A patent/KR102440132B1/ko active Active
- 2015-12-16 JP JP2015245493A patent/JP6594762B2/ja active Active
- 2015-12-16 CN CN201510944660.XA patent/CN105703765B/zh active Active
- 2015-12-16 TW TW104142212A patent/TWI649970B/zh active
- 2015-12-16 KR KR1020150180209A patent/KR102438730B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160073335A (ko) | 2016-06-24 |
| TW201633718A (zh) | 2016-09-16 |
| US20160173101A1 (en) | 2016-06-16 |
| KR102438730B1 (ko) | 2022-08-31 |
| KR102496680B1 (ko) | 2023-02-06 |
| TWI649970B (zh) | 2019-02-01 |
| KR20160073334A (ko) | 2016-06-24 |
| CN105703765B (zh) | 2020-10-09 |
| US9577644B2 (en) | 2017-02-21 |
| CN105703765A (zh) | 2016-06-22 |
| KR20160073324A (ko) | 2016-06-24 |
| US20160173103A1 (en) | 2016-06-16 |
| KR102440132B1 (ko) | 2022-09-05 |
| US9503095B2 (en) | 2016-11-22 |
| US9954533B2 (en) | 2018-04-24 |
| JP2016123092A (ja) | 2016-07-07 |
| US20160173102A1 (en) | 2016-06-16 |
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