KR102474070B1 - 내진패널과 이를 이용하는 시공방법 - Google Patents
내진패널과 이를 이용하는 시공방법 Download PDFInfo
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- 238000010276 construction Methods 0.000 title claims abstract description 26
- 239000012783 reinforcing fiber Substances 0.000 claims abstract description 107
- 239000010410 layer Substances 0.000 claims abstract description 63
- 239000000203 mixture Substances 0.000 claims abstract description 44
- 239000005011 phenolic resin Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 24
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- 229920001568 phenolic resin Polymers 0.000 claims abstract description 22
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- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 239000005062 Polybutadiene Substances 0.000 claims description 11
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- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
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- 229920002748 Basalt fiber Polymers 0.000 claims description 8
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- 244000043261 Hevea brasiliensis Species 0.000 claims description 7
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- WBQDXWRDENKVSJ-UHFFFAOYSA-N 1-(dichloromethyl)-3-methyl-1-phenylurea Chemical compound CNC(=O)N(C(Cl)Cl)C1=CC=CC=C1 WBQDXWRDENKVSJ-UHFFFAOYSA-N 0.000 claims description 5
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- 239000004843 novolac epoxy resin Substances 0.000 claims description 4
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- 238000009434 installation Methods 0.000 claims description 3
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- 239000011248 coating agent Substances 0.000 description 2
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- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- 241000221535 Pucciniales Species 0.000 description 1
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- 239000004840 adhesive resin Substances 0.000 description 1
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- 230000008901 benefit Effects 0.000 description 1
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- 125000002897 diene group Chemical group 0.000 description 1
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- 238000002156 mixing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- 239000012763 reinforcing filler Substances 0.000 description 1
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- 239000013535 sea water Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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Abstract
Description
도 2는 본원발명인 내진패널의 단면사시도이다.
도 3은 본원발명인 내진패널의 일구성인 고정패치의 평면과 단면을 나타내는 도면이다.
도 4는 본원발명인 내진패널과 이를 이용하는 시공방법의 적절한 실시예로서 내진패널을 일부 겹쳐가며 접착한 것을 나타낸 개념도이다.
도 5는 겹쳐진 내진패널의 영역과 기타 고정이 필요한 곳에 고정패치를 부착한 것을 나타낸 개념도이다.
도 6은 고정패치의 중앙부에 고정홀을 타공하고 고정앵커를 설치하는 것을 나타낸 개념도이다.
함량(중량%) | 실시예1 | 비교예1 | 비교예2 | 비교예3 | 비교예4 |
페놀 레진 | 58 | 60 | 60 | 58 | 59 |
실리카 | 22 | 18 | 22 | 22 | 22 |
천연고무 | 9 | 9 | 9 | 6 | 9 |
변성 부타디엔 고무 | 5 | 6 | 2 | 7 | 6 |
실란 커플링제 | 3 | 4 | 4 | 4 | 1 |
아연산화물 | 2.4 | 2.4 | 2.4 | 2.4 | 2.4 |
스테아르산 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 |
구분
(N/mm^2) |
실시예1 | 비교예1 | 비교예2 | 비교예3 | 비교예4 |
인장강도 | 530 | 486 | 512 | 528 | 485 |
압축강도 | 588 | 480 | 533 | 578 | 499 |
휨강도 | 23962 | 21303 | 22320 | 23990 | 21950 |
최종파단 | 538 | 342 | 496 | 533 | 368 |
함량(중량%) | 실시예2 | 비교예1 | 비교예2 | 비교예3 | 비교예4 |
페놀노볼락에폭시 수지 | 43 | 43 | 42 | 42 | 43 |
비스페놀 A 에폭시 수지 | 45 | 45 | 43 | 43 | 45 |
불포화폴리에에스테 | 4 | 3 | 5 | 5 | 5 |
디시안디아마이드 | 3 | 3 | 5 | 2 | 3 |
디클로로페닐디메틸우레아 | 2 | 3 | 2 | 5 | 2 |
탄산칼슘 | 3 | 3 | 3 | 3 | 2 |
구분
(N/mm^2) |
실시예2 | 비교예1 | 비교예2 | 비교예3 | 비교예4 |
인장강도 | 820 | 620 | 722 | 842 | 822 |
압축강도 | 982 | 850 | 870 | 856 | 810 |
휨강도 | 42366 | 37523 | 39922 | 38826 | 39080 |
최종파단 | 832 | 657 | 812 | 806 | 799 |
200 : 함침 강화섬유층 210 : 함침 강화섬유
300 : 함침층 400 : 접착층
500 : 고정패치 510 : 패치 강화섬유
520 : 에폭시 접착층
Claims (5)
- 유리섬유사 또는 현무암 섬유사가 길게 배열된 복수의 단일뭉치로 구성된 베이스 강화섬유 100 중량부에 페놀수지 조성물이 200 ~ 230 중량부로 구성되되, 상기 베이스 강화섬유는 페놀수지 조성물의 중앙부에 위치하여 길이방향으로 배열하고, 횡방향으로 유리섬유사 단일뭉치 사이의 일정간격(N)을 유지하면서 배열하되, 최우측 및 최좌측의 베이스 강화섬유로부터 각각의 말단까지의 길이는 상기 일정간격(N)의 1/2 길이인 베이스층;
탄소섬유 또는 아라미드 섬유에서 선택된 1이상의 섬유의 복수의 단일뭉치로 구성된 함침 강화섬유 100중량부에 함침재 조성물 80 ~ 120 중량부로 구성되되, 상기 함침 강화섬유는 상기 베이스 강화섬유에 겹쳐지도록 배열하고, 베이스 강화섬유 위에 배열된 함침 강화섬유 사이에 함침 강화섬유가 더 배열되도록 하되 최우측 및 최좌측의 함침 강화섬유로부터 각각의 말단까지의 길이는 상기 일정간격(N)의 1/2 길이인 함침 강화섬유층;
상기 함침 강화섬유층의 상부, 측면부와 베이스층 측면부를 상기 함침재 조성물로 함침하여 코팅된 함침층; 및
상기 베이스층 하부에 에폭시계 접착제로 도포하여 구성되는 접착층;으로 구성되되,
상기 페놀수지 조성물은 페놀 레진 55 ~ 60 중량 %, 실리카 20 ~ 25 중량 %, 천연고무 5 ~ 9 중량 %, 변성 부타디엔 고무 3 ~ 6 중량 %, 실란 커플링제(TESPT) 2 ~ 4 중량 %, 아연산화물 1 ~ 3 중량 %, 스테아르산 0.1 ~ 0.7 중량 % 로 구성되며,
상기 함침재 조성물은 페놀노볼락에폭시 수지 40 ~ 45 중량 %, 비스페놀 A 에폭시 수지 42 ~ 48 중량 %, 불포화폴리에스테르 4 ~ 8 중량 %, 디시안디아마이드 2 ~ 4 중량 %, 디클로로페닐디메틸우레아 2 ~ 4 중량 %, 탄산칼슘 3 ~ 6 중량 %로 구성된 내진패널. - 삭제
- 삭제
- 청구항 1의 내진패널을 이용하는 시공방법에 있어서,
상기 시공방법은
상기 내진패널을 시공장소에 접착층을 이용하여 고정하되, 각각의 내진패널은 각각 말단으로부터 일정간격(N)의 1/2 길이만큼 겹쳐 고정하는 고정 단계;
내진패널의 겹쳐지는 곳과 고정이 필요한 곳으로서 내진패널의 강화섬유가 배치되지 않은 곳을 선정하여 고정패치를 부착하는 고정패치 부착단계;
부착된 고정패치 중앙에 앵커홀을 시공하고 고정앵커를 설치하는 고정앵커 설치단계; 및
내진패널 안쪽으로 균열이나 공동이 형성되는 곳에 에폭시로 충진하는 에폭시 충진 단계; 로 구성되되,
상기 고정패치는 정사각형태로서 중앙부를 비워두고 우물정자 형태로 강화섬유 뭉치로 이뤄진 패치 강화섬유가 배치된 것을 상기 함침재 조성물로 함침에 의해 둘러싸되, 하부에 에폭시 접착층이 형성된 것을 특징으로 하는 내진패널을 이용하는 시공방법. - 삭제
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