KR102454404B1 - 반도체 디바이스 내의 인덕터 구조 - Google Patents

반도체 디바이스 내의 인덕터 구조 Download PDF

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Publication number
KR102454404B1
KR102454404B1 KR1020177036627A KR20177036627A KR102454404B1 KR 102454404 B1 KR102454404 B1 KR 102454404B1 KR 1020177036627 A KR1020177036627 A KR 1020177036627A KR 20177036627 A KR20177036627 A KR 20177036627A KR 102454404 B1 KR102454404 B1 KR 102454404B1
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KR
South Korea
Prior art keywords
traces
trace
subset
inductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020177036627A
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English (en)
Korean (ko)
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KR20180020160A (ko
Inventor
웨이-밍 조
영규 송
종-훈 이
정호 윤
상조 최
샤오난 장
Original Assignee
퀄컴 인코포레이티드
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Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20180020160A publication Critical patent/KR20180020160A/ko
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Publication of KR102454404B1 publication Critical patent/KR102454404B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F27/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F2027/2809—

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Filters And Equalizers (AREA)
  • Coils Of Transformers For General Uses (AREA)
KR1020177036627A 2015-06-22 2016-06-06 반도체 디바이스 내의 인덕터 구조 Expired - Fee Related KR102454404B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/746,652 2015-06-22
US14/746,652 US9576718B2 (en) 2015-06-22 2015-06-22 Inductor structure in a semiconductor device
PCT/US2016/036079 WO2016209602A1 (en) 2015-06-22 2016-06-06 Inductor structure in a semiconductor device

Publications (2)

Publication Number Publication Date
KR20180020160A KR20180020160A (ko) 2018-02-27
KR102454404B1 true KR102454404B1 (ko) 2022-10-12

Family

ID=56137580

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177036627A Expired - Fee Related KR102454404B1 (ko) 2015-06-22 2016-06-06 반도체 디바이스 내의 인덕터 구조

Country Status (6)

Country Link
US (1) US9576718B2 (enExample)
EP (1) EP3311389B1 (enExample)
JP (1) JP6832873B2 (enExample)
KR (1) KR102454404B1 (enExample)
CN (1) CN107787514B (enExample)
WO (1) WO2016209602A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111934070B (zh) * 2020-06-24 2021-10-22 西安理工大学 一种应用于6g通信的三维发夹滤波器
CN112103048A (zh) * 2020-08-04 2020-12-18 西安理工大学 一种基于tsv的嵌套式变压器
US11728293B2 (en) * 2021-02-03 2023-08-15 Qualcomm Incorporated Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090912A1 (en) 2005-10-20 2007-04-26 Sheng-Yuan Lee Embedded inductor and application thereof
US20080231402A1 (en) 2007-03-22 2008-09-25 Industrial Technology Research Institute Inductor devices
US20130187743A1 (en) * 2012-01-19 2013-07-25 Industrial Technology Research Institute Inductor structure

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6549112B1 (en) 1996-08-29 2003-04-15 Raytheon Company Embedded vertical solenoid inductors for RF high power application
US6291872B1 (en) 1999-11-04 2001-09-18 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional type inductor for mixed mode radio frequency device
US6535098B1 (en) * 2000-03-06 2003-03-18 Chartered Semiconductor Manufacturing Ltd. Integrated helix coil inductor on silicon
TWI226647B (en) * 2003-06-11 2005-01-11 Via Tech Inc Inductor formed between two layout layers
KR100688858B1 (ko) 2004-12-30 2007-03-02 삼성전기주식회사 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법
US7088215B1 (en) * 2005-02-07 2006-08-08 Northrop Grumman Corporation Embedded duo-planar printed inductor
US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
KR100723032B1 (ko) 2005-10-19 2007-05-30 삼성전자주식회사 고효율 인덕터, 인덕터의 제조방법 및 인덕터를 이용한패키징 구조
US7498918B2 (en) 2006-04-04 2009-03-03 United Microelectronics Corp. Inductor structure
US8368501B2 (en) * 2006-06-29 2013-02-05 Intel Corporation Integrated inductors
US7884452B2 (en) * 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Semiconductor power device package having a lead frame-based integrated inductor
EP2281292B1 (en) * 2008-05-29 2016-08-10 ST-Ericsson SA Radio frequency eight-shaped balun
US7948346B2 (en) 2008-06-30 2011-05-24 Alpha & Omega Semiconductor, Ltd Planar grooved power inductor structure and method
US9275791B2 (en) * 2012-08-31 2016-03-01 Qualcomm Incorporated Systems and methods for decoupling multiple wireless charging transmitters
US9196414B2 (en) * 2012-10-17 2015-11-24 Covidien Lp Planar transformers having reduced termination losses
US20150371764A1 (en) * 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090912A1 (en) 2005-10-20 2007-04-26 Sheng-Yuan Lee Embedded inductor and application thereof
US20080231402A1 (en) 2007-03-22 2008-09-25 Industrial Technology Research Institute Inductor devices
US20130187743A1 (en) * 2012-01-19 2013-07-25 Industrial Technology Research Institute Inductor structure

Also Published As

Publication number Publication date
EP3311389A1 (en) 2018-04-25
JP6832873B2 (ja) 2021-02-24
CN107787514A (zh) 2018-03-09
EP3311389B1 (en) 2020-02-19
US9576718B2 (en) 2017-02-21
US20160372253A1 (en) 2016-12-22
JP2018529216A (ja) 2018-10-04
CN107787514B (zh) 2020-03-13
KR20180020160A (ko) 2018-02-27
WO2016209602A1 (en) 2016-12-29

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