JP6832873B2 - 半導体デバイスにおけるインダクタ構造 - Google Patents

半導体デバイスにおけるインダクタ構造 Download PDF

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Publication number
JP6832873B2
JP6832873B2 JP2017565978A JP2017565978A JP6832873B2 JP 6832873 B2 JP6832873 B2 JP 6832873B2 JP 2017565978 A JP2017565978 A JP 2017565978A JP 2017565978 A JP2017565978 A JP 2017565978A JP 6832873 B2 JP6832873 B2 JP 6832873B2
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JP
Japan
Prior art keywords
trace
traces
subset
inductor
inductor structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2017565978A
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English (en)
Japanese (ja)
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JP2018529216A5 (enExample
JP2018529216A (ja
Inventor
ウエイ−ミン・ジョウ
ヨン・キョ・ソン
ジョン−フン・イ
ジュン・ホ・ユン
サンジョ・チェ
シャオナン・ジャン
Original Assignee
クアルコム，インコーポレイテッド
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Publication of JP2018529216A publication Critical patent/JP2018529216A/ja
Publication of JP2018529216A5 publication Critical patent/JP2018529216A5/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Filters And Equalizers (AREA)
  • Coils Of Transformers For General Uses (AREA)
JP2017565978A 2015-06-22 2016-06-06 半導体デバイスにおけるインダクタ構造 Expired - Fee Related JP6832873B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/746,652 2015-06-22
US14/746,652 US9576718B2 (en) 2015-06-22 2015-06-22 Inductor structure in a semiconductor device
PCT/US2016/036079 WO2016209602A1 (en) 2015-06-22 2016-06-06 Inductor structure in a semiconductor device

Publications (3)

Publication Number Publication Date
JP2018529216A JP2018529216A (ja) 2018-10-04
JP2018529216A5 JP2018529216A5 (enExample) 2019-06-20
JP6832873B2 true JP6832873B2 (ja) 2021-02-24

Family

ID=56137580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017565978A Expired - Fee Related JP6832873B2 (ja) 2015-06-22 2016-06-06 半導体デバイスにおけるインダクタ構造

Country Status (6)

Country Link
US (1) US9576718B2 (enExample)
EP (1) EP3311389B1 (enExample)
JP (1) JP6832873B2 (enExample)
KR (1) KR102454404B1 (enExample)
CN (1) CN107787514B (enExample)
WO (1) WO2016209602A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111934070B (zh) * 2020-06-24 2021-10-22 西安理工大学 一种应用于6g通信的三维发夹滤波器
CN112103048A (zh) * 2020-08-04 2020-12-18 西安理工大学 一种基于tsv的嵌套式变压器

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6549112B1 (en) 1996-08-29 2003-04-15 Raytheon Company Embedded vertical solenoid inductors for RF high power application
US6291872B1 (en) 1999-11-04 2001-09-18 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional type inductor for mixed mode radio frequency device
US6535098B1 (en) * 2000-03-06 2003-03-18 Chartered Semiconductor Manufacturing Ltd. Integrated helix coil inductor on silicon
TWI226647B (en) * 2003-06-11 2005-01-11 Via Tech Inc Inductor formed between two layout layers
KR100688858B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법
US7088215B1 (en) * 2005-02-07 2006-08-08 Northrop Grumman Corporation Embedded duo-planar printed inductor
US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
KR100723032B1 (ko) 2005-10-19 2007-05-30 삼성전자주식회사 고효율 인덕터, 인덕터의 제조방법 및 인덕터를 이용한패키징 구조
TWI264021B (en) 2005-10-20 2006-10-11 Via Tech Inc Embedded inductor and the application thereof
US7498918B2 (en) 2006-04-04 2009-03-03 United Microelectronics Corp. Inductor structure
US8368501B2 (en) * 2006-06-29 2013-02-05 Intel Corporation Integrated inductors
TWI347616B (en) * 2007-03-22 2011-08-21 Ind Tech Res Inst Inductor devices
US7884452B2 (en) * 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Semiconductor power device package having a lead frame-based integrated inductor
CN102084439A (zh) * 2008-05-29 2011-06-01 意法爱立信有限公司 8字形射频平衡变换器
US7948346B2 (en) 2008-06-30 2011-05-24 Alpha & Omega Semiconductor, Ltd Planar grooved power inductor structure and method
TWI442422B (zh) 2012-01-19 2014-06-21 Ind Tech Res Inst 電感結構
US9275791B2 (en) * 2012-08-31 2016-03-01 Qualcomm Incorporated Systems and methods for decoupling multiple wireless charging transmitters
US9196414B2 (en) * 2012-10-17 2015-11-24 Covidien Lp Planar transformers having reduced termination losses
US20150371764A1 (en) * 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor

Also Published As

Publication number Publication date
JP2018529216A (ja) 2018-10-04
EP3311389A1 (en) 2018-04-25
KR102454404B1 (ko) 2022-10-12
CN107787514A (zh) 2018-03-09
US9576718B2 (en) 2017-02-21
US20160372253A1 (en) 2016-12-22
WO2016209602A1 (en) 2016-12-29
CN107787514B (zh) 2020-03-13
EP3311389B1 (en) 2020-02-19
KR20180020160A (ko) 2018-02-27

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