JP2018529216A5 - - Google Patents

Download PDF

Info

Publication number
JP2018529216A5
JP2018529216A5 JP2017565978A JP2017565978A JP2018529216A5 JP 2018529216 A5 JP2018529216 A5 JP 2018529216A5 JP 2017565978 A JP2017565978 A JP 2017565978A JP 2017565978 A JP2017565978 A JP 2017565978A JP 2018529216 A5 JP2018529216 A5 JP 2018529216A5
Authority
JP
Japan
Prior art keywords
trace
conducting
current
layer
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017565978A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018529216A (ja
JP6832873B2 (ja
Filing date
Publication date
Priority claimed from US14/746,652 external-priority patent/US9576718B2/en
Application filed filed Critical
Publication of JP2018529216A publication Critical patent/JP2018529216A/ja
Publication of JP2018529216A5 publication Critical patent/JP2018529216A5/ja
Application granted granted Critical
Publication of JP6832873B2 publication Critical patent/JP6832873B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017565978A 2015-06-22 2016-06-06 半導体デバイスにおけるインダクタ構造 Expired - Fee Related JP6832873B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/746,652 2015-06-22
US14/746,652 US9576718B2 (en) 2015-06-22 2015-06-22 Inductor structure in a semiconductor device
PCT/US2016/036079 WO2016209602A1 (en) 2015-06-22 2016-06-06 Inductor structure in a semiconductor device

Publications (3)

Publication Number Publication Date
JP2018529216A JP2018529216A (ja) 2018-10-04
JP2018529216A5 true JP2018529216A5 (enExample) 2019-06-20
JP6832873B2 JP6832873B2 (ja) 2021-02-24

Family

ID=56137580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017565978A Expired - Fee Related JP6832873B2 (ja) 2015-06-22 2016-06-06 半導体デバイスにおけるインダクタ構造

Country Status (6)

Country Link
US (1) US9576718B2 (enExample)
EP (1) EP3311389B1 (enExample)
JP (1) JP6832873B2 (enExample)
KR (1) KR102454404B1 (enExample)
CN (1) CN107787514B (enExample)
WO (1) WO2016209602A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111934070B (zh) * 2020-06-24 2021-10-22 西安理工大学 一种应用于6g通信的三维发夹滤波器
CN112103048A (zh) * 2020-08-04 2020-12-18 西安理工大学 一种基于tsv的嵌套式变压器

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6549112B1 (en) 1996-08-29 2003-04-15 Raytheon Company Embedded vertical solenoid inductors for RF high power application
US6291872B1 (en) 1999-11-04 2001-09-18 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional type inductor for mixed mode radio frequency device
US6535098B1 (en) * 2000-03-06 2003-03-18 Chartered Semiconductor Manufacturing Ltd. Integrated helix coil inductor on silicon
TWI226647B (en) * 2003-06-11 2005-01-11 Via Tech Inc Inductor formed between two layout layers
KR100688858B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법
US7088215B1 (en) * 2005-02-07 2006-08-08 Northrop Grumman Corporation Embedded duo-planar printed inductor
US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
KR100723032B1 (ko) 2005-10-19 2007-05-30 삼성전자주식회사 고효율 인덕터, 인덕터의 제조방법 및 인덕터를 이용한패키징 구조
TWI264021B (en) 2005-10-20 2006-10-11 Via Tech Inc Embedded inductor and the application thereof
US7498918B2 (en) 2006-04-04 2009-03-03 United Microelectronics Corp. Inductor structure
US8368501B2 (en) * 2006-06-29 2013-02-05 Intel Corporation Integrated inductors
TWI347616B (en) * 2007-03-22 2011-08-21 Ind Tech Res Inst Inductor devices
US7884452B2 (en) * 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Semiconductor power device package having a lead frame-based integrated inductor
CN102084439A (zh) * 2008-05-29 2011-06-01 意法爱立信有限公司 8字形射频平衡变换器
US7948346B2 (en) 2008-06-30 2011-05-24 Alpha & Omega Semiconductor, Ltd Planar grooved power inductor structure and method
TWI442422B (zh) 2012-01-19 2014-06-21 Ind Tech Res Inst 電感結構
US9275791B2 (en) * 2012-08-31 2016-03-01 Qualcomm Incorporated Systems and methods for decoupling multiple wireless charging transmitters
US9196414B2 (en) * 2012-10-17 2015-11-24 Covidien Lp Planar transformers having reduced termination losses
US20150371764A1 (en) * 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor

Similar Documents

Publication Publication Date Title
EP3657916A4 (en) STRUCTURE INCLUDING ELECTRO-CONDUCTIVE REGIONS, ITS PRODUCTION PROCESS, LAMINATE, ITS PRODUCTION PROCESS AND COPPER WIRING
TWI799496B (zh) 長條積層體、其製造方法及印刷配線板
WO2013126308A8 (en) High current, low equivalent series resistance printed circuit board coil for power transfer application
EP3491082A4 (en) COPPER INK AND CONDUCTABLE SOLDERABLE COPPER COUNTERS MADE THEREOF
EA201800149A1 (ru) Способ изготовления нагревательного элемента, нагревательный элемент, изготовленный по настоящему способу, и способ его применения
TWI456600B (zh) 積體變壓器
EP3036422A4 (en) HIGH-PERFORMANCE CONVERGENT-DIVERGENTE NOZZLE
JP2015525462A5 (enExample)
JP2017046381A5 (enExample)
FI20165628A (fi) Sydänelementti magneettista komponenttia varten ja menetelmä sen valmistamiseksi
JP2018529216A5 (enExample)
EP3460080A4 (en) COPPER ALLOY WIRE MATERIAL
IN2014DE03433A (enExample)
EP2829960A3 (en) Touch screen panel and fabricating method thereof
EP3613150A4 (en) EXPANDABLE MILLIMETRIC WAVE NETWORKS WITH LARGE OPENINGS ACHIEVED BY MILLIMETRIC WAVE DIELECTRIC WAVE GUIDES
JP2018006450A5 (enExample)
JP2015123198A5 (enExample)
EP3526453A4 (en) OBD BASED ON MAGNETIC CIRCUIT FEEDBACK
JP2017110293A5 (enExample)
EP3550043A4 (en) COPPER ALLOY MACHINE WIRE
JP2015115342A5 (enExample)
EP3882322A4 (en) CONDUCTIVE SUBSTRATE WITH METAL WIRING, METHOD OF MAKING THE CONDUCTIVE SUBSTRATE AND METAL INK FOR MAKING A METAL WIRING
FR3016727B1 (fr) Procede de fabrication d'un conducteur electrique en cuivre et nanotubes de carbone
TWI799447B (zh) 配線電路基板、其製造方法及攝像裝置
KR101987989B9 (ko) 관통형 전극 제조 방법 및 그 방법에 의해 제조되는 관통형 전극