TWI799496B - 長條積層體、其製造方法及印刷配線板 - Google Patents

長條積層體、其製造方法及印刷配線板 Download PDF

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Publication number
TWI799496B
TWI799496B TW108101811A TW108101811A TWI799496B TW I799496 B TWI799496 B TW I799496B TW 108101811 A TW108101811 A TW 108101811A TW 108101811 A TW108101811 A TW 108101811A TW I799496 B TWI799496 B TW I799496B
Authority
TW
Taiwan
Prior art keywords
manufacturing
wiring board
printed wiring
laminated body
long laminated
Prior art date
Application number
TW108101811A
Other languages
English (en)
Other versions
TW201936377A (zh
Inventor
笠井渉
細田朋也
山邊敦美
Original Assignee
日商Ａｇｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ａｇｃ股份有限公司 filed Critical 日商Ａｇｃ股份有限公司
Publication of TW201936377A publication Critical patent/TW201936377A/zh
Application granted granted Critical
Publication of TWI799496B publication Critical patent/TWI799496B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
TW108101811A 2018-01-18 2019-01-17 長條積層體、其製造方法及印刷配線板 TWI799496B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2018006772 2018-01-18
JP2018-006772 2018-01-18
JP2018078253 2018-04-16
JP2018-078253 2018-04-16
JP2018-163696 2018-08-31
JP2018163696 2018-08-31

Publications (2)

Publication Number Publication Date
TW201936377A TW201936377A (zh) 2019-09-16
TWI799496B true TWI799496B (zh) 2023-04-21

Family

ID=67301484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108101811A TWI799496B (zh) 2018-01-18 2019-01-17 長條積層體、其製造方法及印刷配線板

Country Status (6)

Country Link
US (1) US11632859B2 (zh)
JP (1) JP7234944B2 (zh)
KR (1) KR102660542B1 (zh)
CN (1) CN111629894B (zh)
TW (1) TWI799496B (zh)
WO (1) WO2019142790A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382926B2 (ja) * 2018-06-01 2023-11-17 株式会社クラレ 熱可塑性液晶ポリマー成形体とその製造方法
US11453204B2 (en) 2019-09-10 2022-09-27 Advanced Copper Foil Inc. Poly-supported copper foil
TWI780648B (zh) * 2020-04-03 2022-10-11 日商旭化成股份有限公司 感光性元件、及抗蝕圖案之形成方法
CN112218435B (zh) * 2020-10-13 2021-12-24 中山市木林森电子有限公司 扁平导线接触式导通线路板制作方法
TW202241696A (zh) * 2021-04-22 2022-11-01 達邁科技股份有限公司 用於軟性覆金屬箔基板之聚醯亞胺複合膜
CN115368608B (zh) * 2021-05-07 2024-02-09 达迈科技股份有限公司 用于软性覆金属箔基板之聚酰亚胺复合膜
WO2023145345A1 (ja) * 2022-01-31 2023-08-03 富士フイルム株式会社 積層体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101284910A (zh) * 2007-04-12 2008-10-15 大金工业株式会社 水性分散体的制造方法、水性分散体、氟树脂涂料组合物及涂布物品
TW201527482A (zh) * 2013-11-29 2015-07-16 Asahi Glass Co Ltd 接著薄膜及撓性金屬積層板
TW201730011A (zh) * 2012-09-24 2017-09-01 新日鐵住金化學股份有限公司 聚亞醯胺積層體及其製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
US6284657B1 (en) * 2000-02-25 2001-09-04 Chartered Semiconductor Manufacturing Ltd. Non-metallic barrier formation for copper damascene type interconnects
JP4647954B2 (ja) 2004-08-13 2011-03-09 新日鐵化学株式会社 フレキシブルプリント配線板用積層体の製造方法
TWI461119B (zh) 2009-01-20 2014-11-11 Toyoboseki Kabushikikaisha 多層氟樹脂膜及印刷配線板
EP2886589A4 (en) * 2013-09-30 2016-06-08 Lg Chemical Ltd MOLD METAL LAMINATE AND PROCESS FOR PRODUCING THE SAME
JP2016087799A (ja) 2014-10-29 2016-05-23 東レ・デュポン株式会社 高周波回路基板用の長尺状積層体及びその製造方法
EP3730297A3 (en) * 2014-11-26 2020-12-16 Mitsubishi Chemical Corporation Resin laminate film, method for manufacturing same, and melamine decorative panel
CN107107475B (zh) * 2014-12-26 2019-03-12 Ａｇｃ株式会社 层叠板和柔性印刷基板的制造方法
JP2017002115A (ja) * 2015-06-04 2017-01-05 Ａｐｃ株式会社 フッ素樹脂フィルム、積層体及び積層体の製造方法
JP2017136755A (ja) 2016-02-03 2017-08-10 東レ・デュポン株式会社 低誘電多層ポリイミドフィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101284910A (zh) * 2007-04-12 2008-10-15 大金工业株式会社 水性分散体的制造方法、水性分散体、氟树脂涂料组合物及涂布物品
TW201730011A (zh) * 2012-09-24 2017-09-01 新日鐵住金化學股份有限公司 聚亞醯胺積層體及其製造方法
TW201527482A (zh) * 2013-11-29 2015-07-16 Asahi Glass Co Ltd 接著薄膜及撓性金屬積層板

Also Published As

Publication number Publication date
CN111629894B (zh) 2022-06-03
KR102660542B1 (ko) 2024-04-24
US11632859B2 (en) 2023-04-18
CN111629894A (zh) 2020-09-04
TW201936377A (zh) 2019-09-16
US20200329558A1 (en) 2020-10-15
JP7234944B2 (ja) 2023-03-08
WO2019142790A1 (ja) 2019-07-25
JPWO2019142790A1 (ja) 2021-01-28
KR20200110314A (ko) 2020-09-23

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