KR102441649B1 - 보호막 형성용 복합 시트 - Google Patents

보호막 형성용 복합 시트 Download PDF

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Publication number
KR102441649B1
KR102441649B1 KR1020187023558A KR20187023558A KR102441649B1 KR 102441649 B1 KR102441649 B1 KR 102441649B1 KR 1020187023558 A KR1020187023558 A KR 1020187023558A KR 20187023558 A KR20187023558 A KR 20187023558A KR 102441649 B1 KR102441649 B1 KR 102441649B1
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KR
South Korea
Prior art keywords
protective film
forming
meth
film
group
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KR1020187023558A
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English (en)
Korean (ko)
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KR20190002423A (ko
Inventor
아키노리 사토
요이치 이나오
Original Assignee
린텍 가부시키가이샤
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Publication of KR20190002423A publication Critical patent/KR20190002423A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Inorganic Insulating Materials (AREA)
KR1020187023558A 2016-04-28 2017-04-25 보호막 형성용 복합 시트 KR102441649B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-092032 2016-04-28
JP2016092032 2016-04-28
PCT/JP2017/016280 WO2017188213A1 (ja) 2016-04-28 2017-04-25 保護膜形成用複合シート

Publications (2)

Publication Number Publication Date
KR20190002423A KR20190002423A (ko) 2019-01-08
KR102441649B1 true KR102441649B1 (ko) 2022-09-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187023558A KR102441649B1 (ko) 2016-04-28 2017-04-25 보호막 형성용 복합 시트

Country Status (5)

Country Link
JP (1) JP6929835B2 (ja)
KR (1) KR102441649B1 (ja)
CN (1) CN108778731A (ja)
TW (1) TWI731964B (ja)
WO (1) WO2017188213A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111466015B (zh) * 2018-03-23 2023-08-29 琳得科株式会社 固晶膜、切割固晶片及半导体芯片的制造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214288A (ja) 2002-12-27 2004-07-29 Lintec Corp チップ用保護膜形成用シート
JP2008143104A (ja) 2006-12-12 2008-06-26 Bridgestone Corp 塗膜形成用転写シート及びそれを用いた被覆塗膜の形成方法
JP2011516658A (ja) 2008-03-31 2011-05-26 ヘンケル コーポレイション 多層ｕｖ硬化性接着剤フィルム
JP2011204806A (ja) 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
JP2011228451A (ja) 2010-04-19 2011-11-10 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
JP2012191048A (ja) 2011-03-11 2012-10-04 Nitto Denko Corp 保護フィルム付きダイシングフィルム
WO2014155756A1 (ja) * 2013-03-26 2014-10-02 リンテック株式会社 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
JP2014189564A (ja) 2013-03-26 2014-10-06 Lintec Corp 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
WO2016027888A1 (ja) 2014-08-22 2016-02-25 リンテック株式会社 保護膜形成用シートおよび保護膜付き半導体チップの製造方法
WO2016068042A1 (ja) 2014-10-29 2016-05-06 リンテック株式会社 保護膜形成フィルムおよび保護膜形成用複合シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144433B1 (ja) 1970-02-02 1976-11-29
JP3097619B2 (ja) * 1997-10-02 2000-10-10 日本電気株式会社 電界放射冷陰極の製造方法
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2010031183A (ja) 2008-07-30 2010-02-12 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5144433B2 (ja) * 2008-08-28 2013-02-13 古河電気工業株式会社 チップ保護用フィルム
JP5475350B2 (ja) * 2009-07-02 2014-04-16 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214288A (ja) 2002-12-27 2004-07-29 Lintec Corp チップ用保護膜形成用シート
JP2008143104A (ja) 2006-12-12 2008-06-26 Bridgestone Corp 塗膜形成用転写シート及びそれを用いた被覆塗膜の形成方法
JP2011516658A (ja) 2008-03-31 2011-05-26 ヘンケル コーポレイション 多層ｕｖ硬化性接着剤フィルム
JP2011204806A (ja) 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
JP2011228451A (ja) 2010-04-19 2011-11-10 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
JP2012191048A (ja) 2011-03-11 2012-10-04 Nitto Denko Corp 保護フィルム付きダイシングフィルム
WO2014155756A1 (ja) * 2013-03-26 2014-10-02 リンテック株式会社 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
JP2014189564A (ja) 2013-03-26 2014-10-06 Lintec Corp 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
WO2016027888A1 (ja) 2014-08-22 2016-02-25 リンテック株式会社 保護膜形成用シートおよび保護膜付き半導体チップの製造方法
WO2016068042A1 (ja) 2014-10-29 2016-05-06 リンテック株式会社 保護膜形成フィルムおよび保護膜形成用複合シート

Also Published As

Publication number Publication date
WO2017188213A1 (ja) 2017-11-02
JP6929835B2 (ja) 2021-09-01
CN108778731A (zh) 2018-11-09
TW201741421A (zh) 2017-12-01
JPWO2017188213A1 (ja) 2019-03-07
KR20190002423A (ko) 2019-01-08
TWI731964B (zh) 2021-07-01

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