KR102439617B1 - 본딩 헤드 및 이를 갖는 본딩 장치 - Google Patents

본딩 헤드 및 이를 갖는 본딩 장치 Download PDF

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Publication number
KR102439617B1
KR102439617B1 KR1020170080984A KR20170080984A KR102439617B1 KR 102439617 B1 KR102439617 B1 KR 102439617B1 KR 1020170080984 A KR1020170080984 A KR 1020170080984A KR 20170080984 A KR20170080984 A KR 20170080984A KR 102439617 B1 KR102439617 B1 KR 102439617B1
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KR
South Korea
Prior art keywords
heating
block
plate
vacuum
chip
Prior art date
Application number
KR1020170080984A
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English (en)
Korean (ko)
Other versions
KR20190001271A (ko
Inventor
남성용
김민기
정인영
Original Assignee
주식회사 미코세라믹스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 미코세라믹스 filed Critical 주식회사 미코세라믹스
Priority to KR1020170080984A priority Critical patent/KR102439617B1/ko
Priority to TW107118327A priority patent/TWI760499B/zh
Priority to PCT/KR2018/006275 priority patent/WO2019004620A1/ko
Publication of KR20190001271A publication Critical patent/KR20190001271A/ko
Application granted granted Critical
Publication of KR102439617B1 publication Critical patent/KR102439617B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
KR1020170080984A 2017-06-27 2017-06-27 본딩 헤드 및 이를 갖는 본딩 장치 KR102439617B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020170080984A KR102439617B1 (ko) 2017-06-27 2017-06-27 본딩 헤드 및 이를 갖는 본딩 장치
TW107118327A TWI760499B (zh) 2017-06-27 2018-05-29 焊接頭及具有其的焊接裝置
PCT/KR2018/006275 WO2019004620A1 (ko) 2017-06-27 2018-06-01 본딩 헤드 및 이를 갖는 본딩 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170080984A KR102439617B1 (ko) 2017-06-27 2017-06-27 본딩 헤드 및 이를 갖는 본딩 장치

Publications (2)

Publication Number Publication Date
KR20190001271A KR20190001271A (ko) 2019-01-04
KR102439617B1 true KR102439617B1 (ko) 2022-09-05

Family

ID=64741676

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170080984A KR102439617B1 (ko) 2017-06-27 2017-06-27 본딩 헤드 및 이를 갖는 본딩 장치

Country Status (3)

Country Link
KR (1) KR102439617B1 (zh)
TW (1) TWI760499B (zh)
WO (1) WO2019004620A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI768640B (zh) * 2020-09-08 2022-06-21 旺矽科技股份有限公司 金屬載具及晶圓承載裝置
CN112992730B (zh) * 2021-02-04 2022-06-14 中国电子科技集团公司第二十四研究所 半密闭共晶贴片装置及共晶贴片方法
KR102435062B1 (ko) * 2021-12-20 2022-08-22 주식회사 미코세라믹스 본딩 헤드 및 이를 포함하는 본딩 장치
CN114446833B (zh) * 2022-01-25 2023-03-24 北京北方华创微电子装备有限公司 承载装置及半导体工艺设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078299A (ja) * 2001-09-06 2003-03-14 Toshiba Corp ステージ装置、実装装置ならびに電気部品の製造方法
JP2003209142A (ja) 2002-01-17 2003-07-25 Sony Corp ボンディングヘッドおよび実装装置
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置
KR100978697B1 (ko) * 2002-04-30 2010-08-30 토레 엔지니어링 가부시키가이샤 본딩방법 및 그 장치
JP2012015255A (ja) * 2010-06-30 2012-01-19 Shinkawa Ltd 電子部品実装装置及び電子部品実装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993460B2 (en) * 2003-06-30 2011-08-09 Lam Research Corporation Substrate support having dynamic temperature control
KR101150251B1 (ko) * 2010-01-09 2012-06-12 주식회사 리빙케어 냉각 제어를 이용한 웨이퍼 다이싱용 척 장치
JP2011243860A (ja) * 2010-05-20 2011-12-01 Renesas Electronics Corp 半導体装置の製造方法
US8177862B2 (en) * 2010-10-08 2012-05-15 Taiwan Semiconductor Manufacturing Co., Ltd Thermal compressive bond head
KR20120040368A (ko) * 2010-10-19 2012-04-27 에스케이하이닉스 주식회사 와이어 본딩 장치용 히터블록
JP6088835B2 (ja) * 2012-09-28 2017-03-01 東京応化工業株式会社 貼合装置および貼り合わせ方法
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
JP6452449B2 (ja) * 2015-01-06 2019-01-16 東京エレクトロン株式会社 載置台及び基板処理装置
US9576928B2 (en) * 2015-02-27 2017-02-21 Kulicke And Soffa Industries, Inc. Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078299A (ja) * 2001-09-06 2003-03-14 Toshiba Corp ステージ装置、実装装置ならびに電気部品の製造方法
JP2003209142A (ja) 2002-01-17 2003-07-25 Sony Corp ボンディングヘッドおよび実装装置
KR100978697B1 (ko) * 2002-04-30 2010-08-30 토레 엔지니어링 가부시키가이샤 본딩방법 및 그 장치
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置
JP2012015255A (ja) * 2010-06-30 2012-01-19 Shinkawa Ltd 電子部品実装装置及び電子部品実装方法

Also Published As

Publication number Publication date
TWI760499B (zh) 2022-04-11
KR20190001271A (ko) 2019-01-04
WO2019004620A1 (ko) 2019-01-03
TW201906062A (zh) 2019-02-01

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