KR102422589B1 - 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 - Google Patents

절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 Download PDF

Info

Publication number
KR102422589B1
KR102422589B1 KR1020197024263A KR20197024263A KR102422589B1 KR 102422589 B1 KR102422589 B1 KR 102422589B1 KR 1020197024263 A KR1020197024263 A KR 1020197024263A KR 20197024263 A KR20197024263 A KR 20197024263A KR 102422589 B1 KR102422589 B1 KR 102422589B1
Authority
KR
South Korea
Prior art keywords
particle
particles
insulating
conductive
adhesive layer
Prior art date
Application number
KR1020197024263A
Other languages
English (en)
Korean (ko)
Other versions
KR20190109471A (ko
Inventor
도시미츠 모리야
히로유키 이자와
구니히코 아카이
다카유키 이치무라
마사루 다나카
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼와덴코머티리얼즈가부시끼가이샤 filed Critical 쇼와덴코머티리얼즈가부시끼가이샤
Publication of KR20190109471A publication Critical patent/KR20190109471A/ko
Application granted granted Critical
Publication of KR102422589B1 publication Critical patent/KR102422589B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020197024263A 2017-01-27 2018-01-25 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 KR102422589B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017013456 2017-01-27
JPJP-P-2017-013456 2017-01-27
PCT/JP2018/002350 WO2018139552A1 (ja) 2017-01-27 2018-01-25 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法

Publications (2)

Publication Number Publication Date
KR20190109471A KR20190109471A (ko) 2019-09-25
KR102422589B1 true KR102422589B1 (ko) 2022-07-18

Family

ID=62978025

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197024263A KR102422589B1 (ko) 2017-01-27 2018-01-25 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법

Country Status (5)

Country Link
JP (1) JP7077963B2 (zh)
KR (1) KR102422589B1 (zh)
CN (2) CN110214353B (zh)
TW (2) TWI804485B (zh)
WO (1) WO2018139552A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007537570A (ja) * 2004-05-12 2007-12-20 チェイル インダストリーズ インコーポレイテッド 絶縁導電性微粒子及びこれを含有する異方導電性接着フィルム
JP2013016357A (ja) * 2011-07-04 2013-01-24 Hitachi Chem Co Ltd 絶縁被覆導電粒子及び異方導電性接着フィルム
JP2014207224A (ja) 2013-03-21 2014-10-30 積水化学工業株式会社 接続構造体の製造方法及び接続構造体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100025089A1 (en) * 2004-01-07 2010-02-04 Jun Taketatsu Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
JP4380327B2 (ja) * 2004-01-07 2009-12-09 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
US20060280912A1 (en) 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
KR100722493B1 (ko) * 2005-09-02 2007-05-28 제일모직주식회사 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름
KR101063710B1 (ko) * 2006-09-26 2011-09-07 히다치 가세고교 가부시끼가이샤 이방 도전성 접착제 조성물, 이방 도전성 필름, 회로 부재의 접속 구조, 및 피복 입자의 제조 방법
JP5151920B2 (ja) * 2008-02-05 2013-02-27 日立化成工業株式会社 導電粒子及び導電粒子の製造方法
JP4862921B2 (ja) * 2008-07-01 2012-01-25 日立化成工業株式会社 回路接続材料、回路接続構造体及びその製造方法
JP2013014692A (ja) * 2011-07-04 2013-01-24 Hitachi Chemical Co Ltd 異方導電性接着フィルム及び絶縁被覆導電粒子
WO2013108740A1 (ja) * 2012-01-19 2013-07-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR102095826B1 (ko) * 2012-07-03 2020-04-01 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
KR20150032335A (ko) * 2012-07-13 2015-03-25 후루카와 덴키 고교 가부시키가이샤 집전체, 전극 구조체, 비수전해질 전지 또는 축전 부품
JP6289831B2 (ja) 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
JP6661969B2 (ja) * 2014-10-28 2020-03-11 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JP6458503B2 (ja) * 2015-01-13 2019-01-30 デクセリアルズ株式会社 異方性導電フィルム、その製造方法及び接続構造体
JP6935702B2 (ja) 2016-10-24 2021-09-15 デクセリアルズ株式会社 異方性導電フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007537570A (ja) * 2004-05-12 2007-12-20 チェイル インダストリーズ インコーポレイテッド 絶縁導電性微粒子及びこれを含有する異方導電性接着フィルム
JP2013016357A (ja) * 2011-07-04 2013-01-24 Hitachi Chem Co Ltd 絶縁被覆導電粒子及び異方導電性接着フィルム
JP2014207224A (ja) 2013-03-21 2014-10-30 積水化学工業株式会社 接続構造体の製造方法及び接続構造体

Also Published As

Publication number Publication date
CN113053562B (zh) 2023-03-31
KR20190109471A (ko) 2019-09-25
WO2018139552A1 (ja) 2018-08-02
TW201834091A (zh) 2018-09-16
JP7077963B2 (ja) 2022-05-31
TWI804485B (zh) 2023-06-11
CN110214353B (zh) 2021-04-02
CN110214353A (zh) 2019-09-06
CN113053562A (zh) 2021-06-29
JPWO2018139552A1 (ja) 2019-11-14
TW202326880A (zh) 2023-07-01

Similar Documents

Publication Publication Date Title
JP4674096B2 (ja) 導電性微粒子及び異方性導電材料
TWI498405B (zh) An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure
CN103124999B (zh) 导电性粒子、各向异性导电材料及连接结构体
JP6333552B2 (ja) 導電性粒子、導電材料及び接続構造体
JP4640531B2 (ja) 導電粒子
CN110000372A (zh) 导电性粒子、导电材料及连接结构体
CN103782351B (zh) 导电性粒子、导电材料及连接结构体
JP6326867B2 (ja) 接続構造体の製造方法及び接続構造体
TW201423766A (zh) 附絕緣性粒子之導電性粒子、導電材料及連接構造體
JP2014026971A (ja) 導電性粒子、導電材料及び接続構造体
TW202045626A (zh) 樹脂粒子、導電性粒子、導電材料及連接構造體
KR102422589B1 (ko) 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
TW201217482A (en) Adhesive film, and connection structure and connecting method for circuit member
CN107615466B (zh) 连接结构体的制造方法、导电性粒子、导电膜及连接结构体
KR20200080337A (ko) 접속 재료
JP5796232B2 (ja) 導電性粒子、異方性導電材料及び接続構造体
JP5323147B2 (ja) 導電性微粒子及び異方性導電材料
CN114207025A (zh) 树脂粒子、导电性粒子、导电材料以及连接结构体
KR102674579B1 (ko) 절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체
TWI822753B (zh) 附帶絕緣性粒子之導電性粒子、附帶絕緣性粒子之導電性粒子之製造方法、導電材料及連接結構體
JP6333610B2 (ja) 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6398416B2 (ja) 接続構造体の製造方法及び接続構造体
JP2014026970A (ja) 導電性粒子、導電材料及び接続構造体
JP2021089894A (ja) 異方導電性フィルム及び接続構造体

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant