KR102421626B1 - self-assembled conductive bonding compound for LED chip bonding having excellent electrical properties, LED chip-circuit board bonding module comprising the same and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a self-fusible conductive connection composition for bonding LED chips having excellent electrical characteristics, an LED chip-circuit board bonding module comprising the same, and a method for manufacturing the same, and more particularly, to 240 to 260 LED chips and circuit boards. It relates to a self-fusible conductive connection composition for bonding an LED chip having excellent electrical properties capable of being electrically, physically and chemically bonded at a temperature of °C, an LED chip-circuit board bonding module comprising the same, and a method for manufacturing the same.

Description

Self-fusible conductive connection composition for bonding LED chips having excellent electrical properties, LED chip-circuit board bonding module including same, and method for manufacturing the same bonding module comprising the same and manufacturing method thereof}

The present invention relates to a self-fusible conductive connection composition for bonding LED chips having excellent electrical characteristics, an LED chip-circuit board bonding module comprising the same, and a method for manufacturing the same, and more particularly, to 240 to 260 LED chips and circuit boards. It relates to a self-fusible conductive connection composition for bonding an LED chip having excellent electrical properties capable of being electrically, physically and chemically bonded at a temperature of °C, an LED chip-circuit board bonding module comprising the same, and a method for manufacturing the same.

In general, as one of the processes of performing a packaging process of a light emitting diode (hereinafter, LED) chip, a process of electrically connecting an LED chip and a substrate or a lead frame is performed, and the LED chip and the substrate Alternatively, a wire bonding method, a soldering method using a solder paste, and a flip chip bonding method (= electrode pad and substrate at the bottom of the LED chip) are methods for electrically connecting lead frames by connecting them. A method of attaching electrodes by thermocompression bonding), etc., are being carried out.

Wire bonding is a method of using gold (Au) to connect an LED chip and a substrate or lead frame in the form of a wire. Gold wire is expensive and micro-sized chips are connected one by one. In terms of the process, there are problems such as a decrease in cost and productivity. Accordingly, in general, the LED chip and the substrate or the lead frame are connected using a soldering method using a solder paste or a flip chip bonding method.

Recently, attempts have been made to connect the substrate and the LED chip by applying an anisotropic conductive film (hereinafter referred to as ACF) using a conductive ball.

ACF is a film made by evenly dispersing several μm-sized conductive balls in a curable resin. When used as a bonding agent for electronic parts, it is placed between the electrodes that require electrical connection and then heated and pressurized to conduct conduction between the electrodes. Electrical connection is realized through the contact point where the ball and the electrode are in physical contact. Therefore, there is a disadvantage in that the electrical characteristics are lowered compared to the solder paste that is connected to the entire area of the electrode.

In addition, ACF is made by plating an expensive metal, gold, on a very small, uniform plastic ball with a size of several μm. It is very expensive compared to the solder paste used. In addition, since ACF is generally used to connect circuits with a width of several millimeters, heating and pressurization equipment is also adapted to it, so there is a disadvantage that new equipment investment is required when applied to the display panel size.

Meanwhile, OLED (Organic Light Emitting Diodes), which has excellent picture quality as well as screen response speed, is currently considered the most promising technology in the display field. This is gaining popularity.

The mini-micro LED has the advantage of being able to implement thinner OLED, higher power efficiency, higher resolution, and improved burn-in phenomenon.

Unlike the aforementioned LED with a chip size of 300 μm or more, the mini-micro LED has a chip size of about 30 to 300 μm, and a very fine pitch of about 20 to 250 μm; The distance between the center line of the formed terminal and the center line of the adjacent terminal) is formed.

In order to electrically connect the mini-micro LED chip and the board, the above-mentioned general soldering paste soldering method (= a method of connecting a board or lead frame by applying a very small amount of paste to the terminals formed on the LED chip) is used. If this is done, there is a problem in that a short occurs because the pitch of the mini-micro LED chip is narrow. In addition, when the mini-micro LED chip and the substrate or lead frame are connected using the flip-chip bonding method, the flip-chip bonding method performs a high-temperature thermocompression bonding process, thereby causing damage to the mini-micro LED chip. there is

Accordingly, there is a need for a connection material and a contact method that can be connected without damage to the LED chip when the mini-micro LED chip having an ultra-fine pitch is connected to the substrate or lead frame.

Korean Patent No. 10-1618878 (published on: June 16, 2011)

The present invention has been devised in view of the above points, and in bonding the LED chip and the circuit board at a temperature of 240 to 260° C. An object of the present invention is to provide a self-fusible conductive connection composition for bonding LED chips having excellent adhesion, an LED chip-circuit board bonding module including the same, and a method for manufacturing the same.

In order to solve the above problems, the self-fusible conductive connection composition for bonding LED chips having excellent electrical properties of the present invention includes a dimer-modified hydrogenated epoxy resin, conductive particles having a melting point of 180 to 230°C, a reducing agent, and a reactive diluent. can

In a preferred embodiment of the present invention, the dimer-modified hydrogenated epoxy resin may include a compound represented by the following formula (1).

[Formula 1]

In Formula 1, R ₁ , R ₂ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group, or a C3-C12 pulverized alkyl group, and E is C3 ~ C30 alkylene group, A ₁ and A ₂ are each independently a hydrogen atom, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, n is a rational number satisfying 1 to 10.

In a preferred embodiment of the present invention, the dimer-modified hydrogenated epoxy resin may include a compound represented by the following formula (2).

이고, A₈는

이며, R₁, R₂, R₃, R₄, R₅, R₆, R₇, R₈, R₉, R₁₀, R₁₁, R₁₂, R₁₃ 및 R₁₄는 각각 독립적으로 수소원자, C1 ~ C12의 직쇄형 알킬기 또는 C3 ~ C12의 분쇄형 알킬기이고, E는 C3 ~ C30의 알킬렌기이며, A₁, A₂, A₃ 및 A₄는 각각 독립적으로 수소원자이고, A₅ 및 A₆은 각각 독립적으로 -CH₂-, -CH₂CH₂-, -CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂- 또는 -CH₂CH₂CH₂CH₂CH₂-이며, n, m 및 l은 각각 독립적으로 1 ~ 10을 만족하는 유리수이다.In Formula 2, A ₇ is

and A ₈ is

and R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom; C1 ~ C12 linear alkyl group or C3 ~ C12 pulverized alkyl group, E is C3 ~ C30 alkylene group, A ₁ , A ₂ , A ₃ and A ₄ are each independently a hydrogen atom, A ₅ and A ₆ is each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ - , n, m and l are each independently a rational number satisfying 1 to 10.

In a preferred embodiment of the present invention, the reducing agent is abietic acid having one or more carboxyl groups, propionic acid, dimethylol propionic acid, oxalic acid acid), malonic acid, maleic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid ( suberic acid), sebacic acid, itaconic acid, citric acid, and at least one selected from activated rosin and inactivated rosin.

In a preferred embodiment of the present invention, the reducing agent may include adipic acid and succinic acid in a weight ratio of 1: 0.71 to 1.07.

In a preferred embodiment of the present invention, the reactive diluent may include an aliphatic epoxy resin.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition contains 6.86 to 10.3% by weight of the dimer-modified hydrogenated epoxy resin, 64.0 to 96.0% by weight of the conductive particles, 5.44 to 8.16% by weight of the reducing agent, and the reactivity with respect to the total weight%. The diluent may be included in an amount of 3.24 to 4.88 wt%.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition may further include a thixotropic agent.

In a preferred embodiment of the present invention, the particle diameter of the conductive particles may be 2 ~ 75㎛.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition can bond the LED chip and the circuit board.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition may be a paste.

On the other hand, the LED chip-circuit board bonding module of the present invention includes at least one LED chip having a plurality of first terminals formed on one surface, a circuit board having a plurality of second terminals formed on one surface opposite to the first terminal, and the LED chip and the self-fusible conductive connection composition of the present invention, which is interposed between the circuit board and electrically connects the LED chip and the circuit board.

In a preferred embodiment of the present invention, the circuit board may be a glass circuit board, a printed circuit board (PCB), a metal printed circuit board (Metal PCB), or a flexible printed circuit board (FPCB).

Furthermore, the method for manufacturing the LED chip-circuit board bonding module of the present invention comprises a first step of preparing at least one LED chip having a plurality of first terminals formed on one surface and a circuit board having a plurality of second terminals formed on one surface thereof, A second step of printing the self-fusible conductive connection composition of the present invention on one surface on which a plurality of second terminals are formed on the circuit board, and disposing a plurality of first terminals of the LED chip to face the plurality of second terminals and a third step of temporarily adhering an LED chip to one surface of the self-fusible conductive connection composition and a fourth step of heat-treating the self-fusible conductive connection composition at a temperature of 240 to 260°C.

The self-fusible conductive connection composition for bonding LED chips having excellent electrical properties of the present invention contains a dimer-modified hydrogenated epoxy resin, so that not only inorganic substrates such as glass, but also metals used for terminals formed on LED chips and circuit boards It has excellent adhesion, printability, dispensing properties, insulation and self-adhesive properties.

In addition, the LED chip-circuit board bonding module of the present invention and a manufacturing method thereof not only implement stable electrical conduction characteristics, but also do not apply pressure to the LED chip, thereby minimizing physical damage applied to the LED chip.

1 schematically shows a method for implementing conduction of a self-assembled conductive bonding compound of the present invention, and conductive particles are melted in a heat treatment process, and the first terminals of an LED chip and a circuit board are manufactured. It is a diagram showing that electrical conduction between the LED chip and the circuit board is made by being dispersed and aggregated at the two terminals, respectively.
2 is a cross-sectional view of an LED chip according to a preferred embodiment of the present invention.
3 is a cross-sectional view of an LED chip-circuit board bonding module according to a preferred embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar components throughout the specification.

Referring to FIG. 1, the method for implementing the conduction of the self-fusible conductive bonding composition for bonding an LED chip having excellent electrical properties of the present invention will be described. ) 100 is a conductive particle (1) melted only by heat treatment without application of pressure, and the molten conductive particle (1) is a first terminal (electrode portion; electrode) 21 of the LED chip 20 . ) and the second terminal (electrode portion; electrode) 11 of the circuit board 10 has an effect of selectively self-welding. At this time, there is no remaining conductive particles 1 in the component parts except for the conductive particles 1 of the self-fusible conductive connection composition 100 of the present invention, so the adhesive strength is excellent, the connection resistance is low, and the insulation is excellent. do.

In addition, referring to Figure 2, the LED chip 20 of the present invention has a chip size (a) of 20 ~ 300㎛, preferably 30 ~ 250㎛, more preferably 40 ~ 200㎛, even more preferably As an LED chip of 40 to 200 μm, the pitch (b) of the LED chip 20 is 10 to 200 μm, preferably 15 to 150 μm, more preferably 20 to 100 μm, still more preferably 20 ~ 70㎛, even more preferably 20 ~ 50㎛ may be. The pitch b indicates a pitch between the center line of the first terminal 21 formed on the LED chip 20 and the center line of the adjacent first terminal 21 .

In addition, the size d of the first terminal 21 formed on the LED chip 20 is 5 to 100 μm, preferably 10 to 100 μm, more preferably 10 to 70 μm, even more preferably 10 to 30 μm. μm. In addition, the height c of the first terminal 21 formed on the LED chip 20 may be 0.1 to 4 μm, preferably 1 to 3 μm.

The self-fusible conductive connection composition for bonding an LED chip of the present invention can bond an LED chip and a circuit board. In addition, the self-fusible conductive connection composition for bonding LED chips of the present invention may have the form of a paste or a film, and preferably may have the form of a paste.

The self-fusible conductive connection composition for bonding LED chips of the present invention includes a dimer-modified hydrogenated epoxy resin and conductive particles.

First, the dimer-modified hydrogenated epoxy resin of the present invention is a resin prepared by reacting and synthesizing a hydrogenated epoxy resin and a dimer. As a result, it has excellent adhesion to not only circuit boards made of organic materials such as PCBs and FPCBs, but also inorganic substrates such as glass, LED chips and metals used for terminals formed on circuit boards, printability, dispensing characteristics, and insulation properties. and excellent self-adhesiveness.

In addition, the dimer-modified hydrogenated epoxy resin of the present invention may include a compound represented by the following formula (1).

[Formula 1]

In Formula 1, R ₁ , R ₂ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group, or a C3-C12 pulverized alkyl group, preferably hydrogen An atom or a C1-C12 straight-chain alkyl group, more preferably a hydrogen atom or a C1-C3 straight-chain alkyl group.

In addition, in Formula 1, E is a C3-C30 alkylene group, preferably a C10-C20 alkylene group, and more preferably a C16-C18 alkylene group.

In addition, in Formula 1, A ₁ and A ₂ are each independently a hydrogen atom.

In addition, in Formula 1, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or - CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, preferably -CH ₂ -, -CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ -.

In addition, in Formula 1, n is a rational number satisfying 1 to 10, preferably 1 to 5.

In addition, the dimer-modified hydrogenated epoxy resin of the present invention may include a compound represented by the following formula (2).

[Formula 2]

이다.In Formula 2, A ₇ is

to be.

이다.In addition, in Formula 2, A ₈ is

to be.

In addition, in Formula 2, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group or a C3-C12 pulverized alkyl group, preferably a hydrogen atom or a C1-C12 straight-chain alkyl group, more preferably a hydrogen atom or a C1-C3 straight-chain alkyl group to be.

In addition, in Formula 2, E is a C3-C30 alkylene group, preferably a C10-C20 alkylene group, and more preferably a C16-C18 alkylene group.

In addition, in Formula 2, A ₁ , A ₂ , A ₃ , and A ₄ are each independently a hydrogen atom.

In addition, in Formula 2, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or - CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, preferably -CH ₂ -, -CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ -.

In addition, in Formula 2, n, m, and l are each independently a rational number satisfying 1 to 10, preferably 1 to 5.

In addition, the compound represented by Formula 2 may most preferably be a compound represented by Formula 2-1 below.

[Formula 2-1]

In Formula 2-1, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom or a C1 to C3 linear alkyl group, E is a C16 to C18 alkylene group, A ₁ , A ₂ , A ₃ and A ₄ are each independently a hydrogen atom, A ₅ and A ₆ are are each independently -CH ₂ -, -CH ₂ CH ₂ -, or -CH ₂ CH ₂ CH ₂ -, and n, m, and l are each independently a rational number satisfying 1 to 5.

In addition, the dimer-modified hydrogenated epoxy resin of the present invention is 6.86 to 10.3% by weight, preferably 7.72 to 9.43% by weight, more preferably 8.15 to 9.01% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention. and if the dimer-modified hydrogenated epoxy resin is contained in an amount of less than 6.86% by weight, there may be a problem in that the self-fusible conductive connection composition of the present invention has a short defect, and exceeds 10.3% by weight. If included, the LED chip-circuit board bonding module including the self-fusible conductive connection composition of the present invention may have a problem in that electrical properties deteriorate and defects occur in fairness.

Next, the conductive particles of the present invention are a material that electrically conducts the LED chip and the circuit board, and has a melting point of 180 to 230°C, preferably a melting point of 190 to 225°C, more preferably a melting point of 210 to 220°C. can have

In addition, the conductive particles of the present invention may be included in an amount of 64.0 to 96.0% by weight, preferably 72.0 to 88.0% by weight, more preferably 76.0 to 84.0% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention. In addition, if the conductive particles are included in an amount of less than 64.0 wt%, there may be a problem of non-conduction, and if it contains more than 96.0 wt%, a problem in which a short occurs may occur.

The conductive particles of the present invention are bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), and alloys thereof. It may include one or more selected from, preferably an alloy of copper (Cu), tin (Sn), and silver (Ag).

In addition, the particle diameter of the conductive particles of the present invention may be 2 ~ 75㎛, preferably 3 ~ 45㎛, more preferably 4 ~ 25㎛, even more preferably 5 ~ 15㎛. If the particle size of the conductive particles is less than 2 μm, the viscosity may increase and printability may occur. If the particle size exceeds 75 μm, the size of the particles is large compared to the LED chip, and if it exceeds, there may be a problem in mounting the LED chip.

On the other hand, the self-fusible conductive connection composition for bonding LED chips of the present invention may further include a reducing agent.

The reducing agent of the present invention may include at least one selected from a rosin-based reducing agent, an organic acid-based reducing agent, a metallic reducing agent, and an amine salt reducing agent, preferably an organic acid-based reducing agent, and more preferably a carboxyl group ( abietic acid, propionic acid, dimethylol propionic acid, oxalic acid, malonic acid, maleic acid having one or more carboxyl groups ), succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid, itaconic acid acid), citric acid, and at least one selected from activated rosin and inactivated rosin, and more preferably succinic acid and adipic acid.

In addition, when the reducing agent of the present invention contains adipic acid and succinic acid, adipic acid and succinic acid are in a weight ratio of 1: 0.71 to 1.07, preferably 1: 0.8 to 0.98 by weight, more preferably 1: 0.84 to 0.94 by weight. In addition, if adipic acid and succinic acid are included in a weight ratio of less than 1: 0.71, there may be a problem of lack of self-aggregation due to lack of reducing power. There may be problems with the occurrence.

In addition, the reducing agent of the present invention may be included in an amount of 5.44 to 8.16% by weight, preferably 6.12 to 7.48% by weight, more preferably 6.46 to 7.14% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention. And, if the reducing agent is included in less than 5.44% by weight, there may be an electrical problem because reduction is not possible, and if it contains more than 8.16% by weight, the viscosity may increase as well as the problem of aging.

Furthermore, the self-fusible conductive connection composition for bonding LED chips of the present invention may further include a reactive diluent.

The reactive diluent of the present invention is a material that controls viscosity while maintaining the shape and printability of the paste, and may include an aliphatic epoxy resin as the reactive diluent of the present invention.

The aliphatic epoxy resin of the present invention preferably has an epoxy equivalent of 200 to 1000 g/eq, sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl Ether, triglycidyl tris (2-hydroxyethyl) isocyanurate, glycerol polyglycidyl ether, trimethylolpropane polyglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexane Diol diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and at least one selected from derivatives thereof, and specific examples include EX-611, EX-612, EX512, EX-521, EX-411, EX-421, EX-, which are EX series manufactured by Nagase Chemical. 301, EX-313, EX-314, EX-321, EX-211, EX-212, EX-252, EX-821, EX-830, EX-831, EX-841, EX-920, EX-921, EX-931 and the like, EPODIL 748, EPODIL 750, etc. manufactured by AIR PRODUCT may be included.

In addition, the reactive diluent of the present invention may be included in an amount of 3.24 to 4.88% by weight, preferably 3.65 to 4.47% by weight, more preferably 3.85 to 4.27% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention. Also, if the reactive diluent is included in an amount of less than 3.24 wt%, there may be a problem in printability due to a viscosity increase, and if it is included in an amount exceeding 4.88 wt%, the viscosity may be too low to cause a phase separation problem of the paste.

On the other hand, the self-fusible conductive connection composition for bonding LED chips of the present invention may further include a thixotropic agent.

The thixotropic agent of the present invention is a material that may be included to improve printability, and based on the total weight of the self-fusible conductive connection composition of the present invention, 0.44 to 0.68 wt%, preferably 0.50 to 0.62 wt%, more preferably may be included in an amount of 0.53 to 0.59 wt%.

In addition, the thixotropic agent of the present invention is hydrogenated castor oil (hydrogenated castor oil), carnauba wax (carnauba wax), candelilla wax (Candelilla wax), amide wax (amide wax), acrylate oligomer (acrylate oligomer) and silica It may include at least one selected from the group consisting of Silica compounds, and preferably may include carnauba wax.

In addition, after heat treatment of the self-fusible conductive connection composition for bonding LED chips of the present invention at a temperature of 240 to 260° C., it may have an adhesive strength of 2 to 4 kgf/cm.

In addition, the self-fusible conductive connection composition for bonding LED chips of the present invention may have a connection resistance of 0.1 to 1 Ω/cm after heat treatment at a temperature of 240 to 260° C.

Furthermore, the present invention provides a LED chip-circuit board bonding module comprising the self-fusible conductive connection composition for bonding an LED chip of the present invention.

Referring to FIG. 3 , the LED chip-circuit board bonding module of the present invention is at least one LED chip 20 having a plurality of first terminals 21 formed on one surface thereof, and facing the first terminal 21 . A circuit board 10 having a plurality of second terminals 11 formed on one surface thereof and interposed between the LED chip 20 and the circuit board 10 to electrically connect the LED chip 20 and the circuit board 10 It may include a self-fusible conductive connection composition 100 .

At this time, the LED chip 20 may be the LED chip 20 described in FIG. 2 mentioned above, and the circuit board 10 is a glass circuit board, a printed circuit board (PCB), a metal printed circuit board (Metal PCB). Alternatively, it may be a flexible printed circuit board (FPCB). In this case, silicon, zinc, aluminum, copper, etc. may be used as a material that can be used as a metal printed circuit board (Metal PCB).

On the other hand, the method of manufacturing the LED chip-circuit board bonding module of the present invention includes the first to fourth steps.

First, the first step of the method for manufacturing the LED chip-circuit board bonding module of the present invention is to prepare at least one LED chip having a plurality of first terminals formed on one surface and a circuit board having a plurality of second terminals formed on one surface. can

Next, the second step of the method for manufacturing the LED chip-circuit board bonding module of the present invention may print the self-fusible conductive connection composition of the present invention on one surface on which a plurality of second terminals of the circuit board are formed. At this time, the printing may be performed at a temperature of 20 ~ 30 ℃, preferably at a temperature of 23 ~ 27 ℃.

Next, in the third step of the method for manufacturing the LED chip-circuit board bonding module of the present invention, a plurality of first terminals of the LED chip are disposed to face the plurality of second terminals, and a self-fusible conductive connection composition An LED chip can be temporarily attached to one side. At this time, the temporary adhesion may be carried out at a temperature of 20 ~ 30 ℃, preferably at a temperature of 23 ~ 27 ℃.

Finally, the fourth step of the method for manufacturing the LED chip-circuit board bonding module of the present invention may heat-treat the self-fusible conductive connection composition. Heat treatment using a heating tool (Heating tool), 240 ~ 260 ℃, preferably 245 ~ 255 ℃ 0.5 minutes ~ 15 minutes, preferably 1 ~ 10 minutes, more preferably by heating for 3 ~ 8 minutes can be done If the heat treatment temperature is less than 240 ℃, there may be a problem that the conductive particles are not fused, and if it exceeds 260 ℃, the adhesive strength may be reduced due to overcuring or deterioration of the resin.

The heating tool is not particularly limited as long as it is a means capable of melting conductive particles by applying heat to the self-fusible conductive connection composition of the present invention, and may include, for example, a heating oven or a reflow drying stage.

In the above, the present invention has been mainly described with respect to the embodiment, but this is only an example and does not limit the embodiment of the present invention. It can be seen that various modifications and applications not exemplified above are possible without departing from the scope. For example, each component specifically shown in the embodiment of the present invention can be implemented by modification. And the differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Example 1: Preparation of self-fusible conductive connection composition for bonding LED chip

8.58 wt% of dimer-modified hydrogenated epoxy resin, 80.0 wt% of conductive particles having a melting point of 217°C (particle diameter: 5-15 μm, Sn3.0%Ag0.5%Cu (SAC305)), 3.6 wt% of adipic acid as a reducing agent , 3.2 wt% of succinic acid as a reducing agent, 4.06 wt% of an aliphatic epoxy resin as a reactive diluent (Nagase Chemical Co., EX-920), and 0.56 wt% of carnauba wax as a thixotropic agent are mixed and insulated. A fusion-bonded conductive connection composition was prepared.

In this case, a compound represented by the following formula 1-1 was used as the dimer-modified hydrogenated epoxy resin.

[Formula 1-1]

In Formula 1-1, R ₁ and R ₂ are hydrogen atoms, R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are methyl groups, E is a C17 alkylene group, and A ₁ and A ₂ are hydrogen atoms. , A ₅ and A ₆ are —CH ₂ —, and n is a rational number satisfying 1.

Examples 2 to 5: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, a self-fusible conductive connection composition was prepared by varying the weight % of the dimer-modified hydrogenated epoxy resin and conductive particles to be mixed as shown in Table 1 below.

Examples 6 to 9: Preparation of self-fusible conductive connection composition for bonding LED chips

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, as shown in Table 2 below, a self-fusible conductive connection composition was prepared by varying the weight percent of adipic acid and succinic acid mixed with the reducing agent.

Comparative Example 1: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using a bisphenol A-type epoxy resin (YD128, Kukdo Chemical), not a dimer-modified hydrogenated epoxy resin.

Comparative Example 2: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using a bisphenol F-type epoxy resin (YDF-170, Kukdo Chemical), not a dimer-modified hydrogenated epoxy resin.

Comparative Example 3: Preparation of self-fusible conductive connection composition for bonding LED chips

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using an NBR-modified epoxy resin (KR-415, Kukdo Chemical), not a dimer-modified epoxy resin.

Comparative Example 4: Preparation of self-fusible conductive connection composition for bonding LED chips

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using a CTBN-modified epoxy resin (KR-170, Kukdo Chemical) instead of a dimer-modified epoxy resin.

Experimental Example 1

The self-fusible conductive connection compositions prepared in Examples 1 to 9 and Comparative Examples 1 to 4 were evaluated based on the following physical property evaluation methods, respectively, and the results are shown in Table 3.

(1) Manufacturing of LED chip-circuit board bonding module

An LED chip having two first terminals formed on one surface (size of the LED chip: 125 µm, size of the first terminal: 50 µm, the distance between the center line of the first terminal formed on the LED chip and the center line of the adjacent first terminal (pitch) ): 75 μm, first terminal height: 1 μm) and a circuit board having two second terminals on one side (size of the circuit board: 4 cm, size of the second terminal: 50 μm, the second terminal formed on the circuit board The distance between the center line and the center line of the adjacent second terminal (pitch: 75 μm, the height of the second terminal: 8 μm) was prepared.

Each of the self-fusible conductive connection compositions prepared in Examples 1 to 9 and Comparative Examples 1 to 4 were printed on a circuit board to a thickness of 50 μm, and then the first terminal of the LED chip was connected to the second terminal of the circuit board to face the second terminal. The LED chips were temporarily adhered to one side of each of the self-fusible conductive connection compositions prepared in Examples 1 to 9 and Comparative Examples 1 to 4 by facing them. Thereafter, heat treatment (curing and self-fusion) was performed in a reflow oven at 250° C. for 8 minutes to prepare an LED chip-circuit board bonding module.

(2) Connection resistance measurement (Ω/cm)

A test current of 1 mA was applied in a 4-probe method to each of the manufactured LED chip-circuit board bonding modules using a measuring device (Keithley 2000 Multimeter) to measure the initial connection resistance, and the average value was calculated.

(3) Adhesion measurement (kgf/cm)

Adhesive strength was measured by measuring the shear strength at a rate of 0.5 mm/sec using a Dage4000 (Nordson Co.) device for each of the manufactured LED chip-circuit board bonding modules.

(4) Insulation measurement

Using a multi-tester (HIOKI, 3244-60 CARD HITESTER) for each of the manufactured LED chip-circuit board bonding modules, electrical conduction between terminals was checked and insulation was measured.

(5) Self-adhesiveness measurement

Using a multi-tester (HIOKI, 3244-60 CARD HITESTER) for each of the manufactured LED chip-circuit board bonding modules, the presence or absence of electrical conduction of the terminals of the LED chip and circuit board connected by the composition was checked and confirmed with a high-magnification microscope. Self-adhesiveness was measured.

(6) Measurement of printability

The appearance of each of the manufactured LED chip-circuit board bonding module was checked with the naked eye (or under a microscope) to measure printability.

(7) Viscosity measurement

Using Malcom's PCU-205, the viscosity of the self-fusible conductive connection pastes prepared in Examples 1 to 9 and Comparative Examples 1 to 4 was measured in a temperature range of 25° C. according to the JIS measurement method.

(8) Time-lapse measurement

After each of the self-fusible conductive connection compositions prepared in Examples 1 to 9 and Comparative Examples 1 to 4 were left at room temperature for one day, the appearance was checked with the naked eye (or microscope), and Examples 1 to 4 were left at room temperature for one day. 9 and Comparative Examples 1 to 4 by using each of the self-fusible conductive connection compositions prepared in each of the appearance and self-adhesiveness in the manufacturing process of the LED chip-circuit board bonding module visually (or microscope) to check the chronological was measured.

As can be seen in Table 3, the self-fusible conductive connection composition for LED chip bonding prepared in Example 1 has connection resistance, insulation, It was confirmed that not only the self-adhesive property was excellent, but also the adhesive strength was excellent.

Specifically, compared to the self-fusible conductive connection composition for bonding LED chips prepared in Example 1, the self-fusible conductive connection compositions for bonding LED chips prepared in Comparative Examples 1 and 2 not only significantly lowered the adhesive strength, but also It was confirmed that the self-adhesiveness was lowered, and the self-fusible conductive connection compositions for bonding LED chips prepared in Comparative Examples 3 and 4 had remarkably poor printability, making it impossible to measure connection resistance, adhesion, insulation and self-adhesiveness.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

1: conductive particles
10: circuit board
11: second terminal
20: LED chip
21: first terminal
100: self-fusible conductive connection composition

Claims (14)

dimer-modified hydrogenated epoxy resin; Conductive particles having a melting point of 180 ~ 230 ℃; reducing agent; and reactive diluents; including,
The dimer-modified hydrogenated epoxy resin is a self-fusible conductive connection composition for bonding LED chips having excellent electrical properties, characterized in that it comprises a compound represented by the following formula (1) or a compound represented by the following formula (2);
[Formula 1]

[Formula 2]

In Formula 1, R ₁ , R ₂ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group, or a C3-C12 pulverized alkyl group, and E is C3 ~ C30 alkylene group, A ₁ and A ₂ are each independently a hydrogen atom, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, n is a rational number satisfying 1 to 10,
In Formula 2, A ₇ is

and A ₈ is

and R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom; C1 ~ C12 straight chain alkyl group or C3 ~ C12 pulverized alkyl group, E is C3 ~ C30 alkylene group, A ₁ , A ₂ , A ₃ and A ₄ are each independently a hydrogen atom, A ₅ and A ₆ is each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ - , n, m, and l are each independently a rational number satisfying 1 to 10.
delete delete According to claim 1,
The reducing agent is abietic acid having one or more carboxyl groups, propionic acid, dimethylol propionic acid, oxalic acid, malonic acid) , maleic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid ), itaconic acid, citric acid, self-fusible conductive connection composition for bonding LED chips with excellent electrical properties, characterized in that it contains at least one selected from among activated rosin and deactivated rosin.
5. The method of claim 4,
The reducing agent contains adipic acid and succinic acid in a weight ratio of 1: 0.71 to 1.07. A self-fusible conductive connection composition for bonding LED chips having excellent electrical properties.
According to claim 1,
The reactive diluent includes an aliphatic epoxy resin, and a self-fusible conductive connection composition for bonding an LED chip having excellent electrical properties.
According to claim 1,
The self-fusible conductive connection composition comprises 6.86 to 10.3 wt% of a dimer-modified hydrogenated epoxy resin, 64.0 to 96.0 wt% of conductive particles, 5.44 to 8.16 wt% of a reducing agent, and 3.24 to 4.88 wt% of a reactive diluent with respect to the total weight% A self-fusible conductive connection composition for bonding LED chips with excellent electrical characteristics.
According to claim 1,
The self-fusible conductive connection composition for LED chip bonding excellent electrical properties, characterized in that it further comprises a thixotropic agent.
According to claim 1,
The conductive particles have a particle diameter of 2 to 75 μm, and a self-fusible conductive connection composition for bonding LED chips having excellent electrical properties.
According to claim 1,
The self-fusible conductive connection composition is a self-fusible conductive connection composition for bonding LED chips having excellent electrical properties, characterized in that it bonds an LED chip and a circuit board.
According to claim 1,
The self-fusible conductive connection composition is a self-fusible conductive connection composition for bonding LED chips having excellent electrical properties, characterized in that it is a paste.
at least one LED chip having a plurality of first terminals formed on one surface thereof;
a circuit board having a plurality of second terminals formed on one surface opposite to the first terminal; and
The self-fusible conductive connection composition according to any one of claims 1 to 11, which is interposed between the LED chip and the circuit board to electrically connect the LED chip and the circuit board;
LED chip comprising a - circuit board bonding module.
13. The method of claim 12,
The circuit board is a glass circuit board, a printed circuit board (PCB), a metal printed circuit board (Metal PCB), or a flexible printed circuit board (FPCB) LED chip-circuit board bonding module, characterized in that.
A first step of preparing at least one LED chip having a plurality of first terminals formed on one surface and a circuit board having a plurality of second terminals formed on one surface thereof;
A second step of printing the self-fusible conductive connection composition of any one of claims 1 and 4 to 11 on one surface of the circuit board on which a plurality of second terminals are formed;
a third step of disposing a plurality of first terminals of the LED chip to face the plurality of second terminals and temporarily adhering the LED chip to one surface of the self-fusible conductive connection composition; and
a fourth step of heat-treating the self-fusible conductive connection composition at a temperature of 240 to 260°C;
A method for manufacturing an LED chip-circuit board bonding module comprising a.

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