KR102355782B1 - self-assembled conductive bonding compound for LED chip bonding having excellent adhesion, LED chip-circuit board bonding module comprising the same and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a self-fusible conductive connection composition for bonding an LED chip having excellent adhesion, an LED chip-circuit substrate bonding module comprising the same, and a manufacturing method thereof, and more specifically, to a self-fusible conductive connection composition for bonding an LED chip having excellent adhesion, which can electrically, physically and chemically bond an LED chip and a circuit substrate at the temperature of 170 to 200℃, an LED chip-circuit substrate bonding module comprising the same, and a manufacturing method thereof.

Description

Self-fusible conductive bonding composition for bonding LED chips having excellent adhesion, LED chip-circuit board bonding module comprising same, and method for manufacturing the same comprising the same and manufacturing method thereof}

The present invention relates to a self-fusible conductive connection composition for bonding LED chips having excellent adhesive strength, an LED chip-circuit board bonding module comprising the same, and a method for manufacturing the same, and more particularly, to a LED chip and a circuit board at 170 to 200 ° C. It relates to a self-fusible conductive connection composition for bonding an LED chip having excellent adhesion that can be electrically, physically and chemically bonded at a temperature of , an LED chip-circuit board bonding module including the same, and a method for manufacturing the same.

In general, as one of the processes of performing a packaging process of a light emitting diode (hereinafter, LED) chip, a process of electrically connecting an LED chip and a substrate or a lead frame is performed, and the LED chip and the substrate Alternatively, a wire bonding method, a soldering method using a solder paste, and a flip chip bonding method (= electrode pad and substrate at the bottom of the LED chip) are methods for electrically connecting lead frames by connecting them. method of attaching the electrodes by thermocompression bonding), etc. are being carried out.

Wire bonding is a method of using gold (Au) to connect an LED chip and a substrate or lead frame in the form of a wire. Gold wire is expensive, and micro-sized chips are connected one by one. In terms of the process, there are problems such as a decrease in cost and productivity. Accordingly, in general, the LED chip and the substrate or the lead frame are connected using a soldering method or a flip chip bonding method using a solder paste.

Recently, attempts have been made to connect the substrate and the LED chip by applying an anisotropic conductive film (hereinafter referred to as ACF) using a conductive ball.

ACF is a film made by evenly dispersing conductive balls with a size of several μm in a curable resin. When used as a bonding agent for electronic parts, it is placed between the electrodes that require electrical connection, and then heated and pressed to conduct conduction by placing it between the electrodes. Electrical connection is realized through the contact point where the ball and the electrode are in physical contact. Therefore, there is a disadvantage in that the electrical characteristics are lowered compared to the solder paste that is connected to the entire area of the electrode.

In addition, ACF is made by plating an expensive metal, gold, on a very small, uniform plastic ball with a size of several μm. It is very expensive compared to the solder paste used. In addition, in general, ACF is used to connect circuits with a width of several mm, so heating and pressurization equipment is also tailored to it, so there is a disadvantage that new equipment investment is required when applied to the display panel size.

Meanwhile, OLED (Organic Light Emitting Diodes), which has excellent picture quality as well as screen response speed, is currently considered the most promising technology in the display field. This is gaining popularity.

The mini-micro LED has the advantage of being able to implement thinner OLED, higher power efficiency, higher resolution, and improved burning in phenomenon.

Unlike the aforementioned LED with a chip size of 300 μm or more, the mini-micro LED has a chip size of about 30 to 300 μm, and a very fine pitch of about 20 to 250 μm; The distance between the center line of the formed terminal and the center line of the adjacent terminal) is formed.

In order to electrically connect the mini-micro LED chip and the board, the above-mentioned general soldering paste soldering method (= a method of connecting the board or lead frame by applying a very small amount of paste to the terminals formed on the LED chip) is used. If this is done, there is a problem in that a short occurs because the pitch of the mini-micro LED chip is narrow. In addition, when the mini-micro LED chip and the substrate or lead frame are connected using the flip chip bonding method, damage to the mini-micro LED chip occurs because the flip chip bonding method performs a high-temperature thermocompression bonding process. there is

Accordingly, there is a need for a connection material and a contact method that can be connected without damage to the LED chip when the mini-micro LED chip having an ultra-fine pitch is connected to a substrate or a lead frame.

Korean Patent No. 10-1618878 (published on: June 16, 2011)

The present invention has been devised in view of the above points, and in bonding the LED chip and the circuit board at a temperature of 170 to 200°C, not only has excellent adhesion but also excellent electrical properties, printability, insulation and self-contained properties. An object of the present invention is to provide a self-fusible conductive connection composition for bonding LED chips having excellent adhesion, an LED chip-circuit board bonding module including the same, and a method for manufacturing the same.

In order to solve the above problems, the self-fusible conductive connection composition for bonding LED chips having excellent adhesion of the present invention includes an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups, conductive particles having a melting point of 100 to 160°C, and a reducing agent. can

In a preferred embodiment of the present invention, the organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin may include a compound represented by the following formula (1).

[Formula 1]

이고, R₁₅ 및 R₁₆은 각각 독립적으로 수소원자, C1 ~ C12의 직쇄형 알킬기 또는 C3 ~ C12의 분쇄형 알킬기이며, R₁₇은

또는

이고, R₁₈은 수소원자, C1 ~ C12의 직쇄형 알킬기 또는 C3 ~ C12의 분쇄형 알킬기이며, G₁ 및 G₂는 각각 독립적으로 -CH₂-, -CH₂CH₂-, -CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂CH₂- 또는 -CH₂CH₂CH₂CH₂CH₂CH₂-이고, A₅ 및 A₆은 각각 독립적으로 -CH₂-, -CH₂CH₂-, -CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂- 또는 -CH₂CH₂CH₂CH₂CH₂-이며, n은 1 ~ 10을 만족하는 유리수이다.In Formula 1, R ₁ , R ₂ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group, or a C3-C12 pulverized alkyl group, and E is C3 ~ C30 is an alkylene group, and A ₁ and A ₂ are each independently

and R ₁₅ and R ₁₆ are each independently a hydrogen atom, a C1 to C12 straight-chain alkyl group, or a C3 to C12 pulverized alkyl group, and R ₁₇ is

or

and R ₁₈ is a hydrogen atom, a C1 to C12 linear alkyl group or a C3 to C12 pulverized alkyl group, and G ₁ and G ₂ are each independently —CH ₂ —, —CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, n is a rational number satisfying 1 to 10.

In a preferred embodiment of the present invention, the organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin may include a compound represented by the following formula (2).

[Formula 2]

이고, A₈는

이며, R₁, R₂, R₃, R₄, R₅, R₆, R₇, R₈, R₉, R₁₀, R₁₁, R₁₂, R₁₃ 및 R₁₄는 각각 독립적으로 수소원자, C1 ~ C12의 직쇄형 알킬기 또는 C3 ~ C12의 분쇄형 알킬기이고, E는 C3 ~ C30의 알킬렌기이며, A₁, A₂, A₃ 및 A₄는 각각 독립적으로

이고, R₁₅ 및 R₁₆은 각각 독립적으로 수소원자, C1 ~ C12의 직쇄형 알킬기 또는 C3 ~ C12의 분쇄형 알킬기이며, R₁₇은

또는

이고, R₁₈은 수소원자, C1 ~ C12의 직쇄형 알킬기 또는 C3 ~ C12의 분쇄형 알킬기이며, G₁ 및 G₂는 각각 독립적으로 -CH₂-, -CH₂CH₂-, -CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂CH₂- 또는 -CH₂CH₂CH₂CH₂CH₂CH₂-이고, A₅ 및 A₆은 각각 독립적으로 -CH₂-, -CH₂CH₂-, -CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂- 또는 -CH₂CH₂CH₂CH₂CH₂-이며, n, m 및 l은 각각 독립적으로 1 ~ 10을 만족하는 유리수이다.In Formula 2, A ₇ is

and A ₈ is

and R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom; C1 ~ C12 linear alkyl group or C3 ~ C12 pulverized alkyl group, E is C3 ~ C30 alkylene group, A ₁ , A ₂ , A ₃ and A ₄ are each independently

and R ₁₅ and R ₁₆ are each independently a hydrogen atom, a C1 to C12 straight-chain alkyl group, or a C3 to C12 pulverized alkyl group, and R ₁₇ is

or

and R ₁₈ is a hydrogen atom, a C1 to C12 linear alkyl group or a C3 to C12 pulverized alkyl group, and G ₁ and G ₂ are each independently —CH ₂ —, —CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, n, m, and l are each independently a rational number satisfying 1 to 10.

In a preferred embodiment of the present invention, the reducing agent is abietic acid, oxalic acid, malonic acid, maleic acid having one or more carboxyl groups. , succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid, itaconic acid ), citric acid, may include at least one selected from activated rosin and inactivated rosin.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition contains 13.4 to 20.1 wt% of an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups, 62.0 to 93.0 wt% of conductive particles, and 4.2 to 6.3 wt% of the reducing agent, based on the total weight% It may be included in weight %.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition may further include at least one selected from a thixotropic agent and a catalyst.

In a preferred embodiment of the present invention, the particle diameter of the conductive particles may be 2 ~ 75㎛.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition can bond the LED chip and the circuit board.

In a preferred embodiment of the present invention, the self-fusible conductive connection composition may be a paste.

On the other hand, the LED chip-circuit board bonding module of the present invention includes at least one LED chip having a plurality of first terminals formed on one surface, a circuit board having a plurality of second terminals formed on one surface opposite to the first terminal, and the LED chip and the It is interposed between the circuit board and may include the self-fusible conductive connection composition of the present invention for electrically connecting the LED chip and the circuit board.

In a preferred embodiment of the present invention, the circuit board may be a glass circuit board, a printed circuit board (PCB), a metal printed circuit board (Metal PCB), or a flexible printed circuit board (FPCB).

Furthermore, the method for manufacturing the LED chip-circuit board bonding module of the present invention comprises a first step of preparing at least one LED chip having a plurality of first terminals formed on one surface and a circuit board having a plurality of second terminals formed on one surface thereof, A second step of printing the self-fusible conductive connection composition of the present invention on one side of the circuit board on which the plurality of second terminals are formed, facing the plurality of second terminals and disposing the plurality of first terminals of the LED chip to face each other , a third step of temporarily adhering the LED chip to one surface of the self-fusible conductive connection composition and a fourth step of heat-treating the self-fusible conductive connection composition at a temperature of 170 to 200°C.

The self-fusible conductive connection composition for bonding LED chips with excellent adhesion of the present invention contains an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups, and is used for terminals formed on LED chips and circuit boards as well as inorganic substrates such as glass. It has excellent adhesion to metal, and excellent printability, dispensing properties, insulation and self-adhesive properties.

In addition, the LED chip-circuit board bonding module of the present invention and a manufacturing method thereof not only implement stable electrical conduction characteristics, but also do not apply pressure to the LED chip, thereby minimizing physical damage applied to the LED chip.

1 schematically shows a method for implementing conduction of a self-assembled conductive bonding compound of the present invention, and conductive particles are melted during a heat treatment process, and first terminals of an LED chip and a circuit board are manufactured. It is a diagram showing that electrical conduction is made between the LED chip and the circuit board by being dispersed and aggregated at the two terminals, respectively.
2 is a cross-sectional view of an LED chip according to a preferred embodiment of the present invention.
3 is a cross-sectional view of an LED chip-circuit board bonding module according to a preferred embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily carry out the present invention. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar elements throughout the specification.

Referring to FIG. 1, the method for implementing the conduction of the self-fusible conductive bonding composition for bonding an LED chip having excellent adhesion of the present invention will be described. In (100), conductive particles (1) are melted only by heat treatment without application of pressure, and the molten conductive particles (1) are first terminal (electrode portion; electrode) 21 of the LED chip 20 . and the effect of selectively self-welding only to the second terminal (electrode portion; electrode) 11 of the circuit board 10 occurs. At this time, there is no remaining conductive particles (1) in the component parts except for the conductive particles (1) of the self-fusible conductive connection composition 100 of the present invention, so the adhesive strength is excellent, the connection resistance is low and the insulation is excellent do.

In addition, referring to Figure 2, the LED chip 20 of the present invention has a chip size (a) of 20 ~ 300㎛, preferably 30 ~ 250㎛, more preferably 40 ~ 200㎛, even more preferably As an LED chip of 40 to 200 μm, the pitch (b) of the LED chip 20 is 10 to 200 μm, preferably 15 to 150 μm, more preferably 20 to 100 μm, still more preferably 20 ~ 70㎛, even more preferably 20 ~ 50㎛ may be. The pitch b represents a pitch between the center line of the first terminal 21 formed on the LED chip 20 and the center line of the adjacent first terminal 21 .

In addition, the size (d) of the first terminal 21 formed on the LED chip 20 is 5 ~ 100㎛, preferably 10 ~ 100㎛, more preferably 10 ~ 70㎛, even more preferably 10 ~ 30 μm. In addition, the height c of the first terminal 21 formed on the LED chip 20 may be 0.1 to 4 μm, preferably 1 to 3 μm.

The self-fusible conductive connection composition for bonding an LED chip of the present invention can bond an LED chip and a circuit board. In addition, the self-fusible conductive connection composition for bonding LED chips of the present invention may have the form of a paste or a film, and preferably may have a form of a paste.

The self-fusible conductive connection composition for bonding LED chips of the present invention includes an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups and conductive particles.

First, the alkoxysilane-modified hydrogenated epoxy resin containing an organofunctional group of the present invention is a resin prepared by reacting and synthesizing a hydrogenated epoxy resin, a dimer, and an alkoxysilane containing an organic functional group. The self-fusible conductive connection composition contains an alkoxysilane-modified hydrogenated epoxy resin containing an organofunctional group, so that not only circuit boards made of organic materials such as PCBs and FPCBs, but also inorganic substrates such as glass, LED chips and circuit boards It may have excellent adhesion to the metal used for the terminal formed in the , and excellent printability, dispensing characteristics, insulation and self-adhesive properties.

In addition, the organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin of the present invention may include a compound represented by the following formula (1).

[Formula 1]

In Formula 1, R ₁ , R ₂ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group, or a C3-C12 pulverized alkyl group, preferably hydrogen An atom or a C1-C12 straight-chain alkyl group, more preferably a hydrogen atom or a C1-C3 straight-chain alkyl group.

In addition, in Formula 1, E is a C3-C30 alkylene group, preferably a C10-C20 alkylene group, and more preferably a C16-C18 alkylene group.

이다.In addition, in Formula 1, A ₁ and A ₂ are each independently

to be.

In addition, in Formula 1, R ₁₅ and R ₁₆ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group or a C3-C12 pulverized alkyl group, preferably a hydrogen atom or a C1-C12 straight-chain alkyl group, More preferably, it is a hydrogen atom or a C1-C3 straight-chain alkyl group.

또는

, 바람직하게는

이다. In addition, in Formula 1, R ₁₇ is

or

, preferably

to be.

In addition, in Formula 1, R ₁₈ is a hydrogen atom, a C1-C12 straight-chain alkyl group or a C3-C12 pulverized alkyl group, preferably a hydrogen atom or a C1-C12 straight-chain alkyl group, more preferably a hydrogen atom or a C1-C3 straight-chain alkyl group.

In addition, in Formula 1, G ₁ and G ₂ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ -, - CH ₂ CH ₂ CH 2 CH ₂ CH ₂ CH ₂ — or —CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ —, preferably —CH ₂ CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ CH ₂ — or —CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ —.

In addition, in Formula 1, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or - CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ —, preferably —CH ₂ —, —CH ₂ CH ₂ — or —CH ₂ CH ₂ CH ₂ —.

In addition, in Formula 1, n is a rational number satisfying 1 to 10, preferably 1 to 5.

In addition, the organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin of the present invention may include a compound represented by the following formula (2).

[Formula 2]

이다.In Formula 2, A ₇ is

to be.

이다.In addition, in Formula 2, A ₈ is

to be.

In addition, in Formula 2, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group or a C3-C12 pulverized alkyl group, preferably a hydrogen atom or a C1-C12 straight-chain alkyl group, more preferably a hydrogen atom or a C1-C3 straight-chain alkyl group to be.

In addition, in Formula 2, E is a C3-C30 alkylene group, preferably a C10-C20 alkylene group, and more preferably a C16-C18 alkylene group.

이다.In addition, in Formula 2, A ₁ , A ₂ , A ₃ and A ₄ are each independently

to be.

In addition, in Formula 2, R ₁₅ and R ₁₆ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group or a C3-C12 pulverized alkyl group, preferably a hydrogen atom or a C1-C12 straight-chain alkyl group, More preferably, it is a hydrogen atom or a C1-C3 straight-chain alkyl group.

또는

, 바람직하게는

이다. In addition, in Formula 2, R ₁₇ is

or

, preferably

to be.

In addition, in Formula 2, R ₁₈ is a hydrogen atom, a C1-C12 straight-chain alkyl group or a C3-C12 pulverized alkyl group, preferably a hydrogen atom or a C1-C12 straight-chain alkyl group, more preferably a hydrogen atom or a C1-C3 straight-chain alkyl group.

In addition, in Formula 2, G ₁ and G ₂ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ -, - CH ₂ CH ₂ CH 2 CH ₂ CH ₂ CH ₂ — or —CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ —, preferably —CH ₂ CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ CH ₂ — or —CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ —.

In addition, in Formula 2, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or - CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ —, preferably —CH ₂ —, —CH ₂ CH ₂ — or —CH ₂ CH ₂ CH ₂ —.

In addition, in Formula 2, n, m, and l are each independently a rational number satisfying 1 to 10, preferably 1 to 5.

In addition, the compound represented by Formula 2 may most preferably be a compound represented by Formula 2-1 below.

[Formula 2-1]

이고, R₁₅ 및 R₁₆은 각각 독립적으로 수소원자 또는 C1 ~ C3의 직쇄형 알킬기이며, R₁₇은

이고, R₁₈은 수소원자 또는 C1 ~ C12의 직쇄형 알킬기, 더욱 바람직하게는 수소원자 또는 C1 ~ C3의 직쇄형 알킬기이며, G₁ 및 G₂는 각각 독립적으로 -CH₂CH₂CH₂-, -CH₂CH₂CH₂CH₂- 또는 -CH₂CH₂CH₂CH₂CH₂-이고, A₅ 및 A₆은 각각 독립적으로 -CH₂-, -CH₂CH₂- 또는 -CH₂CH₂CH₂-이며, n, m 및 l은 각각 독립적으로 1 ~ 5을 만족하는 유리수이다.In Formula 2-1, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom or a C1 to C3 linear alkyl group, E is a C16 to C18 alkylene group, and A ₁ , A ₂ , A ₃ and A ₄ are each independently

and R ₁₅ and R ₁₆ are each independently a hydrogen atom or a C1 to C3 straight-chain alkyl group, and R ₁₇ is

and R ₁₈ is a hydrogen atom or a C1 to C12 linear alkyl group, more preferably a hydrogen atom or a C1 to C3 linear alkyl group, and G ₁ and G ₂ are each independently —CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ -, and n, m, and l are each independently a rational number satisfying 1 to 5.

In addition, the organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin of the present invention is 13.4 to 20.1% by weight, preferably 15.0 to 18.5% by weight, more preferably 15.9% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention. It may be included in an amount of ~ 17.6% by weight, and if the alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups is included in an amount of less than 13.4% by weight, there may be a problem that the self-fusible conductive connection composition of the present invention may have a short defect. And, if it contains more than 20.01% by weight, there may be a problem in that the LED chip-circuit board bonding module including the self-fusible conductive connection composition of the present invention may have a problem in that electrical properties deteriorate and defects occur in fairness.

Next, the conductive particles of the present invention are a material that electrically conducts the LED chip and the circuit board, and has a melting point of 100 to 160°C, preferably a melting point of 110 to 150°C, more preferably a melting point of 130 to 145°C. can have

In addition, the conductive particles of the present invention may include 62.0 to 93.0% by weight, preferably 69.7 to 85.3% by weight, more preferably 73.6 to 81.4% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention. There may be, and if the conductive particles are included in less than 62.0 wt%, there may be a problem of non-conduction, and if it contains more than 93.0 wt%, a problem in which a short occurs may occur.

The conductive particles of the present invention are bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), and alloys thereof. may include at least one selected from among, preferably, at least one selected from an alloy of bismuth (Bi), tin (Sn), and silver (Ag), and an alloy of bismuth (Bi) and tin (Sn) and, more preferably, an alloy of bismuth (Bi) and tin (Sn).

As the conductive particles of the present invention, when an alloy of bismuth (Bi), tin (Sn) and silver (Ag) is included, 58.2 to 87.4 parts by weight of tin, preferably 65.5 to 80.1 parts by weight, based on 100 parts by weight of bismuth , more preferably 69.1 to 76.5 parts by weight. In addition, when an alloy of bismuth (Bi), tin (Sn) and silver (Ag) is included as the conductive particles, with respect to 100 parts by weight of bismuth, 0.41 to 0.63 parts by weight, preferably 0.46 to 0.58 parts by weight, More preferably, it may contain 0.49 to 0.55 parts by weight.

On the other hand, when the conductive particle of the present invention contains an alloy of bismuth (Bi) and tin (Sn), bismuth and tin are in a weight ratio of 1: 0.57 to 0.87, preferably 1: 0.65 to 0.8 by weight, more preferably 1: It may be included in a weight ratio of 0.68 to 0.77.

In addition, the particle size of the conductive particles of the present invention may be 2 ~ 75㎛, preferably 3 ~ 45㎛, more preferably 4 ~ 25㎛, still more preferably 5 ~ 15㎛. If the particle size of the conductive particles is less than 2㎛, the viscosity may increase and printability problems may occur.

On the other hand, the self-fusible conductive connection composition for bonding LED chips of the present invention may further include a reducing agent.

The reducing agent of the present invention may include at least one selected from a rosin-based reducing agent, an organic acid-based reducing agent, a metallic reducing agent, and an amine salt reducing agent, preferably an organic acid-based reducing agent, and more preferably a carboxyl group ( abietic acid, oxalic acid, malonic acid, maleic acid, succinic acid, glutaric acid, selected from adipic acid, pimelic acid, suberic acid, sebacic acid, itaconic acid, citric acid, activated rosin and inactivated rosin It may include one or more, more preferably one or more of succinic acid, glutaric acid, and adipic acid having two or more carboxyl groups It may include, and even more preferably may include adipic acid (adipic acid).

The reducing agent of the present invention may be included in an amount of 4.2 to 6.3% by weight, preferably 4.7 to 5.8% by weight, more preferably 4.9 to 5.6% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention, If the reducing agent is included in an amount of less than 4.2 wt%, there may be an electrical problem due to no reduction, and if it is included in an amount exceeding 6.3 wt%, the viscosity may increase as well as a problem of aging.

Furthermore, the self-fusible conductive connection composition for bonding LED chips of the present invention may further include at least one selected from a thixotropic agent and a catalyst, and preferably further include a thixotropic agent and a catalyst.

The thixotropic agent of the present invention is a material that may be included to improve printability, and is 0.2 to 0.4 wt%, preferably 0.29 to 0.37 wt%, more preferably based on the total weight% of the self-fusible conductive connection composition of the present invention may be included in an amount of 0.31 to 0.35 wt%.

In addition, the thixotropic agent of the present invention is hydrogenated castor oil (hydrogenated castor oil), carnauba wax (carnauba wax), candelilla wax (Candelilla wax), amide wax (amide wax), acrylate oligomer (acrylate oligomer) and silica It may include one or more selected from the group consisting of Silica compounds, and preferably include hydrogenated castor oil.

The catalyst of the present invention may be included in an amount of 0.13 to 0.21% by weight, preferably 0.15 to 0.19% by weight, more preferably 0.16 to 0.18% by weight, based on the total weight% of the self-fusible conductive connection composition of the present invention.

In addition, the catalyst of the present invention may include at least one selected from an amine-based curing accelerator, a boron trifluoride-amine complex curing accelerator, a 3-phenyl-phosphine-based curing accelerator, a phenol-based curing accelerator, and an imidazole-based curing accelerator, Preferably 1H-imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole , 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-4,5-di Hydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-undecylimidazolium-trimellitate, 1-cyanoethyl-2phenyl may include at least one selected from imidazolium-trimellitate and modified products thereof, most preferably 2-phenyl-4,5-dihydroxymethylimidazole (2-phenyl-4,5- dihydroxymethylimidazole).

In addition, after heat treatment of the self-fusible conductive connection composition for bonding LED chips of the present invention at a temperature of 170 ~ 200 ℃, it may have an adhesive force of 2 ~ 4 kgf / cm.

In addition, the self-fusible conductive connection composition for bonding LED chips of the present invention may have a connection resistance of 0.1 to 1 Ω/cm after heat treatment at a temperature of 170 to 200° C.

Furthermore, the present invention provides an LED chip-circuit board bonding module comprising the self-fusible conductive connection composition for bonding an LED chip of the present invention.

Referring to FIG. 3 , the LED chip-circuit board bonding module of the present invention is at least one LED chip 20 having a plurality of first terminals 21 formed on one surface thereof, and facing the first terminal 21 . A circuit board 10 having a plurality of second terminals 11 formed on one surface thereof and interposed between the LED chip 20 and the circuit board 10 to electrically connect the LED chip 20 and the circuit board 10 It may include a self-fusible conductive connection composition 100 .

At this time, the LED chip 20 may be the LED chip 20 described in FIG. 2 mentioned above, and the circuit board 10 is a glass circuit board, a printed circuit board (PCB), a metal printed circuit board (Metal PCB). Alternatively, it may be a flexible printed circuit board (FPCB). At this time, silicon, zinc, aluminum, copper, etc. may be used as a material that can be used as a metal printed circuit board (Metal PCB).

On the other hand, the method of manufacturing the LED chip-circuit board bonding module of the present invention includes the first to fourth steps.

First, the first step of the method for manufacturing the LED chip-circuit board bonding module of the present invention is to prepare at least one LED chip having a plurality of first terminals formed on one surface and a circuit board having a plurality of second terminals formed on one surface. can

Next, in the second step of the method for manufacturing the LED chip-circuit board bonding module of the present invention, the self-fusible conductive connection composition of the present invention may be printed on one surface on which a plurality of second terminals of the circuit board are formed. At this time, the printing may be performed at a temperature of 20 ~ 30 ℃, preferably at a temperature of 23 ~ 27 ℃.

Next, in the third step of the method for manufacturing the LED chip-circuit board bonding module of the present invention, the plurality of first terminals of the LED chip are disposed to face the plurality of second terminals, and the self-fusible conductive connection composition An LED chip can be temporarily attached to one side. At this time, the temporary adhesion may be performed at a temperature of 20 ~ 30 ℃, preferably at a temperature of 23 ~ 27 ℃.

Finally, in the fourth step of the method for manufacturing the LED chip-circuit board bonding module of the present invention, the self-fusible conductive connection composition may be heat-treated. Heat treatment using a heating tool, 170 ~ 200 ℃, preferably 170 ~ 190 ℃ 0.5 minutes ~ 15 minutes, preferably 1 ~ 10 minutes, more preferably by heating for 2 ~ 8 minutes can be done If the heat treatment temperature is less than 170 ℃, there may be a problem that the conductive particles are not fused, and if it exceeds 200 ℃, the adhesive strength may be reduced due to overcuring of the resin.

The heating tool is not particularly limited as long as it is a means capable of melting the conductive particles by applying heat to the self-fusible conductive connection composition of the present invention, and may include, for example, a heating oven or a reflow drying stage.

In the above, the present invention has been mainly described with respect to the embodiment, but this is only an example and does not limit the embodiment of the present invention. It can be seen that various modifications and applications not exemplified above are possible without departing from the scope. For example, each component specifically shown in the embodiment of the present invention can be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Example 1: Preparation of self-fusible conductive connection composition for bonding LED chip

16.75 wt% of an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups, conductive particles having a melting point of 139°C (particle diameter: 5 to 15㎛, an alloy containing Sn and Bi in a 42:58 weight ratio) 77.5 wt%, adiph as a reducing agent Acid 5.25% by weight, thixotropic agent, hydrogenated castor oil, 0.33% by weight, catalyst, 2-phenyl-4,5-dihydroxymethylimidazole, 0.17 A self-fusible conductive connection composition having a paste form after insulation treatment was prepared by mixing the weight %.

In this case, a compound represented by the following formula 1-1 was used as an alkoxysilane-modified hydrogenated epoxy resin containing an organic functional group.

[Formula 1-1]

(* 표시는 O와 결합되는 결합부위를 뜻한다.)이며, R₁₅ 및 R₁₆은 메틸기이고, R₁₇은

(* 표시는 Si와 결합되는 결합부위를 뜻한다.)이며, R₁₈은 수소원자이고, G₁는 -CH₂CH₂CH₂-이며, A₅ 및 A₆은 -CH₂-이고, n은 1을 만족하는 유리수이다.In Formula 1-1, R ₁ and R ₂ are hydrogen atoms, R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are methyl groups, E is a C17 alkylene group, and A ₁ and A ₂ are

(* indicates a binding site bonded to O), R ₁₅ and R ₁₆ are methyl groups, and R ₁₇ is

(* indicates a bonding site bonded to Si), R ₁₈ is a hydrogen atom, G ₁ is -CH ₂ CH ₂ CH ₂ -, A ₅ and A ₆ are -CH ₂ -, n is a rational number satisfying 1.

Examples 2 to 5: Preparation of self-fusible conductive connection composition for bonding LED chips

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, a self-fusible conductive connection composition was prepared by varying the weight percent of the organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin and conductive particles to be mixed as shown in Table 1 below.

Example 6: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using glutaric acid, not adipic acid, as a reducing agent.

Comparative Example 1: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a bisphenol A-type epoxy resin (YD128, Kukdo Chemical) was used instead of an organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin to prepare a self-fusible conductive connection composition.

Comparative Example 2: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using a bisphenol F-type epoxy resin (YDF-170, Kukdo Chemical), not an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups.

Comparative Example 3: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using an NBR-modified epoxy resin (KR-415, Kukdo Chemical) instead of an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups.

Comparative Example 4: Preparation of self-fusible conductive connection composition for bonding LED chip

A self-fusible conductive connection composition was prepared in the same manner as in Example 1. However, unlike Example 1, a self-fusible conductive connection composition was prepared using a CTBN-modified epoxy resin (KR-170, Kukdo Chemical), not an organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin.

Experimental Example 1

The self-fusible conductive connection compositions prepared in Examples 1 to 6 and Comparative Examples 1 to 4 were evaluated based on the following physical property evaluation methods, respectively, and the results are shown in Table 2.

(1) Manufacturing of LED chip-circuit board bonding module

LED chip having two first terminals formed on one surface (size of the LED chip: 125 μm, size of the first terminal: 50 μm, the distance between the center line of the first terminal formed on the LED chip and the center line of the adjacent first terminal (pitch) ): 75 μm, first terminal height: 1 μm) and a circuit board with two second terminals on one side (size of the circuit board: 4 cm, size of the second terminal: 50 μm, the second terminal formed on the circuit board The distance (pitch) between the center line and the center line of the adjacent second terminal: 75 µm, the height of the second terminal: 8 µm) was prepared.

Each of the self-fusible conductive connection compositions prepared in Examples 1 to 6 and Comparative Examples 1 to 4 were printed to a thickness of 50 μm on a circuit board, and then the first terminal of the LED chip was connected to the second terminal of the circuit board to face the second terminal. The LED chips were temporarily adhered to one side of each of the self-fusible conductive connection compositions prepared in Examples 1 to 6 and Comparative Examples 1 to 4 by facing them. Thereafter, the LED chip-circuit board bonding module was manufactured by heat treatment (curing and self-sealing) for 8 minutes in a reflow oven at 180°C.

(2) Connection resistance measurement (Ω/cm)

A test current of 1 mA was applied to each of the manufactured LED chip-circuit board bonding modules in a 4-probe method using a measuring instrument (Keithley 2000 Multimeter) to measure the initial connection resistance, and the average value was calculated.

(3) Adhesion measurement (kgf/cm)

Adhesive strength was measured by measuring the shear strength at a rate of 0.5 mm/sec using a Dage4000 (Nordson Co.) device for each of the manufactured LED chip-circuit board bonding modules.

(4) Insulation measurement

Using a multi-tester (HIOKI, 3244-60 CARD HITESTER) for each of the manufactured LED chip-circuit board bonding module, electrical conduction between terminals was checked and insulation was measured.

(5) Self-adhesiveness measurement

Using a multi-tester (HIOKI, 3244-60 CARD HITESTER) for each of the manufactured LED chip-circuit board bonding modules, check the electrical conduction of the terminals of the LED chip and circuit board connected by the composition and confirm with a high-magnification microscope. Self-adhesiveness was measured.

(6) Measurement of printability

Printability was measured by visually (or under a microscope) checking the appearance of each of the manufactured LED chip-circuit board bonding modules.

(7) Viscosity measurement

Using Malcom's PCU-205, the viscosity of the self-fusible conductive connection pastes prepared in Examples 1 to 6 and Comparative Examples 1 to 4 was measured in a temperature range of 25° C. according to the JIS measurement method.

(8) Time-dependent measurement

After each of the self-fusible conductive connection compositions prepared in Examples 1 to 6 and Comparative Examples 1 to 4 were left at room temperature for one day, the appearance was checked with the naked eye (or a microscope), and Examples 1 to left at room temperature for one day. Using each of the self-fusible conductive connection compositions prepared in 6 and Comparative Examples 1 to 4, the appearance and self-adhesiveness in the manufacturing process of the LED chip-circuit board bonding module were visually (or microscopically) checked to ensure chronological properties. was measured.

As can be seen in Table 2 above, the self-fusible conductive connection composition for LED chip bonding prepared in Example 1 has connection resistance, insulation, It was confirmed that not only the self-adhesive property was excellent, but also the adhesive strength was excellent.

Specifically, compared to the self-fusible conductive connection composition for bonding LED chips prepared in Example 1, the self-fusible conductive connection composition for bonding LED chips prepared in Comparative Example 1 has significantly poorer aging properties as well as lower adhesive strength. and the self-fusible conductive connection composition for LED chip bonding prepared in Comparative Example 2 has not only a remarkably lowered adhesive strength, but also poor self-adhesiveness, printability and aging properties, and the LED chip bonding composition prepared in Comparative Examples 3 and 4 It was confirmed that the self-fusible conductive connection composition for self-welding had remarkably poor printability, making it impossible to measure connection resistance, adhesion, insulation and self-adhesiveness.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

1: conductive particles
10: circuit board
11: second terminal
20: LED chip
21: first terminal
100: self-fusible conductive connection composition

Claims (12)

an organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin; Conductive particles having a melting point of 100 ~ 160 ℃; and reducing agents; A self-fusible conductive connection composition comprising:
The self-fusible conductive connection composition comprises 13.4 to 20.1 wt% of an alkoxysilane-modified hydrogenated epoxy resin containing organic functional groups, 62.0 to 93.0 wt% of conductive particles, and 4.2 to 6.3 wt% of a reducing agent with respect to the total weight% A self-fusible conductive connection composition for bonding LED chips with excellent adhesion.
According to claim 1,
The organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin is a self-fusible conductive connection composition for bonding LED chips having excellent adhesion, characterized in that it includes a compound represented by the following formula (1);
[Formula 1]

In Formula 1, R ₁ , R ₂ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom, a C1-C12 straight-chain alkyl group, or a C3-C12 pulverized alkyl group, and E is C3 ~ C30 is an alkylene group, and A ₁ and A ₂ are each independently

and R ₁₅ and R ₁₆ are each independently a hydrogen atom, a C1 to C12 straight-chain alkyl group, or a C3 to C12 pulverized alkyl group, and R ₁₇ is

or

and R ₁₈ is a hydrogen atom, a C1 to C12 linear alkyl group or a C3 to C12 pulverized alkyl group, and G ₁ and G ₂ are each independently —CH ₂ —, —CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, n is a rational number satisfying 1 to 10.
According to claim 1,
The organic functional group-containing alkoxysilane-modified hydrogenated epoxy resin is a self-fusible conductive connection composition for LED chip bonding excellent in adhesion, characterized in that it comprises a compound represented by the following formula (2);
[Formula 2]

In Formula 2, A ₇ is

and A ₈ is

and R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ are each independently a hydrogen atom; C1 ~ C12 linear alkyl group or C3 ~ C12 pulverized alkyl group, E is C3 ~ C30 alkylene group, A ₁ , A ₂ , A ₃ and A ₄ are each independently

and R ₁₅ and R ₁₆ are each independently a hydrogen atom, a C1 to C12 straight-chain alkyl group, or a C3 to C12 pulverized alkyl group, and R ₁₇ is

or

and R ₁₈ is a hydrogen atom, a C1 to C12 linear alkyl group or a C3 to C12 pulverized alkyl group, and G ₁ and G ₂ are each independently —CH ₂ —, —CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, A ₅ and A ₆ are each independently -CH ₂ -, -CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ -, -CH ₂ CH ₂ CH ₂ CH ₂ - or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -, n, m, and l are each independently a rational number satisfying 1 to 10.
According to claim 1,
The reducing agent has at least one carboxyl group, abietic acid, oxalic acid, malonic acid, maleic acid, succinic acid, glutar glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid, itaconic acid, citric acid, activation A self-fusible conductive connection composition for bonding LED chips with excellent adhesion, comprising at least one selected from rosin and inactivated rosin.
delete According to claim 1,
The self-fusible conductive connection composition is a thixotropic agent; and catalysts; Self-fusible conductive connection composition for bonding LED chips with excellent adhesion, characterized in that it further comprises at least one selected from among.
According to claim 1,
The conductive particles have a particle diameter of 2 to 75 μm.
According to claim 1,
The self-fusible conductive connection composition is a self-fusible conductive connection composition for bonding LED chips having excellent adhesion, characterized in that it bonds an LED chip and a circuit board.
According to claim 1,
The self-fusible conductive connection composition is a self-fusible conductive connection composition for bonding LED chips having excellent adhesion, characterized in that it is a paste.
at least one LED chip having a plurality of first terminals formed on one surface thereof;
a circuit board having a plurality of second terminals formed on one surface opposite to the first terminal; and
The self-fusible conductive connection composition of any one of claims 1 to 4 and 6 to 9, which is interposed between the LED chip and the circuit board to electrically connect the LED chip and the circuit board;
LED chip comprising a - circuit board bonding module.
11. The method of claim 10,
The circuit board is a glass circuit board, a printed circuit board (PCB), a metal printed circuit board (Metal PCB), or a flexible printed circuit board (FPCB) LED chip-circuit board bonding module, characterized in that.
A first step of preparing at least one LED chip having a plurality of first terminals formed on one surface and a circuit board having a plurality of second terminals formed on one surface thereof;
A second step of printing the self-fusible conductive connection composition of any one of claims 1 to 4 and 6 to 9 on one surface of the circuit board on which a plurality of second terminals are formed;
a third step of disposing a plurality of first terminals of the LED chip to face the plurality of second terminals and temporarily adhering the LED chip to one surface of the self-fusible conductive connection composition; and
a fourth step of heat-treating the self-fusible conductive connection composition at a temperature of 170 to 200°C;
A method for manufacturing an LED chip-circuit board bonding module comprising a.

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