KR20200020578A - manufacturing method of circuit member for self-assembled conductive bonding film - Google Patents

Abstract

The present invention relates to a self-fused conductive connection film and manufacturing method thereof and, more specifically, to a self-fused conductive connection film having the excellent adhesion, low connection resistance, and excellent insulating properties and self-fusing properties and a manufacturing method thereof. The self-fused conductive connection film includes conductive particles, a thermoplastic resin, a thermosetting resin, a curing agent, a flux, and peroxides.

Description

A manufacturing method of a circuit member including a self-bonding conductive connection film {manufacturing method of circuit member for self-assembled conductive bonding film}

The present invention relates to a self-sealing conductive connection film and a method for manufacturing the same, and more particularly, not only has excellent adhesive strength, but also has low connection resistance and excellent self-sealing conductive connection film and its manufacture. It is about a method.

In general, the conductive adhesive may be classified into an anisotropic conductive adhesive and an isotropic conductive adhesive. In particular, an anisotropic conductive film made of an anisotropic conductive adhesive component may be used for electronic components such as semiconductors, for example, flat panel display devices such as LCD, PDP, and EL. Used for mounting. The anisotropic conductive film contains an adhesive component which is cured by conductive powder and heat, and is mainly used for electrical connection of LCD panels and TCP or PCB and TCP.

Such anisotropic conductive adhesive films (ACFs) are useful as one of wiring devices and serve as connection members. Specifically, when describing an anisotropic conductive film (ACF), the anisotropic conductive film is composed of a metal, graphite or similar conductive particles dispersed in a sufficient amount in the adhesive resin and the resin. The anisotropic conductive film is placed between a plurality of circuit members (FPC, IC, ITO Glass, CPT, LCD panel, etc.) to be connected, and then a process of applying heat and pressure is performed. And some of the conductive particles included in the anisotropic conductive film by pressure are formed in the electrode portions of the plurality of circuit members to generate an electrical connection between the circuit members. Cured to bond a plurality of circuit members. In the vertical direction of the direction in which the pressure is applied, conductive particles are distracted from each other to maintain electrical insulation.

As such, anisotropic conductive films have disadvantages such as unstable and high connection resistance, low bonding strength, and ion migration due to relatively low conductivity because only specific contacts are in physical contact. In addition, the conductive particles used in the technology has a disadvantage that the quality control is difficult and expensive because a separate noble metal plating treatment and insulation treatment is required for a polymer elastic ball of uniform size below the required pitch.

Korean Laid-Open Patent No. 2012-0122943 (Published Date: 2012.11.07)

The present invention has been made in view of the above, and the electrical connection between the circuit member (circuit board, semiconductor chip, ITO Class, terminal part of the plastic element substrate, etc.) through the shaving tube due to the effect similar to soldering by molten metal In addition to implementing the present invention, it is an object of the present invention to provide a self-sealing conductive connection film and a method of manufacturing the same.

In order to solve the above problems, the self-sealing conductive connection film of the present invention has a first circuit member having a plurality of first terminals formed on one surface thereof and a second terminal having a plurality of second terminals formed on one surface thereof facing the first terminal. A self-sealing conductive connection film interposed between the circuit members and electrically connecting the first circuit member and the second circuit member to the self-sealing conductive connection film under a temperature of 140 to 200 ° C. and a pressure of 0.01 to 1.0 mPa. The included conductive particles may be melted and self-fused to the first terminal and the second terminal to electrically connect the first circuit member and the second circuit member.

In a preferred embodiment of the present invention, the self-sealing conductive connection film of the present invention may include conductive particles, thermoplastic resins, thermosetting resins, curing agents, fluxes and peroxides.

In one preferred embodiment of the present invention, the conductive particles are a metal having a melting point of 200 ° C or less, bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu ), Zinc (Zn), antimony (Sb), nickel (Ni) and one or more selected from alloys thereof may be included.

In a preferred embodiment of the present invention, it may include one or more selected from ethylenically unsaturated oligomers, acrylic resins, urethane resins, polyester resins, nitrile resins, polyamide resins and phenoxy resins.

In a preferred embodiment of the present invention, the thermosetting resin may include an epoxy resin.

In a preferred embodiment of the present invention, the curing agent may include one or more selected from amine-based curing agent, phenol-based curing agent, mercapto-based curing agent, carboxyl mechanical curing agent and acid anhydride-based curing agent.

In a preferred embodiment of the present invention, the self-adhesive conductive connection film of the present invention, 36 to 90% by weight of the conductive particles, 7.6 to 28.8% by weight of the thermoplastic resin, 5.2 to 19.2% by weight of the thermosetting resin, And from 3.04 to 11.76 weight percent of curing agent, from 4 to 6 weight percent of flux and from 0.16 to 0.24 weight percent of peroxide.

In a preferred embodiment of the present invention, when the self-adhesive conductive connection film of the present invention comprises 36 to 54% by weight of the conductive particles, the thermoplastic resin 19.2 ~ 28.8% by weight, thermosetting resin 12.8 To 19.2% by weight, 7.84 to 11.76% by weight of curing agent, 4 to 6% by weight of flux and 0.16 to 0.24% by weight of peroxide.

In a preferred embodiment of the present invention, when the self-adhesive conductive connection film of the present invention comprises 60 to 90% by weight of the conductive particles relative to the total weight%, 7.6 to 11.4% by weight thermoplastic resin, 5.2 thermosetting resin ~ 7.8 weight percent, 3.04-4.56 weight percent of curing agent, 4-6 weight percent of flux and 0.16-0.24 weight percent of peroxide.

In a preferred embodiment of the present invention, the self-adhesive conductive film of the present invention has an adhesive force of 1 to 5 kgf / cm, 0.001 ~ 1 Ω / cm under a temperature of 140 ~ 200 ℃, pressure of 0.01 ~ 1.0 mPa It may have a connection resistance.

On the other hand, the manufacturing method of the self-fusion conductive connection film of the present invention is a first step of preparing a composition of the self-fusion conductive connection film by mixing the conductive particles, thermoplastic resin, thermosetting resin, curing agent, flux (flux) and peroxide And a second step of applying the composition of the self-sealing conductive connection film to one surface of a release film and drying the same to prepare a self-fusion conductive connection film, wherein the drying is below a melting point of the conductive particles. It can be carried out at a temperature of.

In a preferred embodiment of the present invention, the composition of the self-sealing conductive connection film of the present invention is 36 to 90% by weight of the conductive particles, 7.6 to 28.8% by weight of the thermoplastic resin, 5.2 to 19.2% by weight of the thermosetting resin %, 3.04 to 11.76% by weight of curing agent, 4 to 6% by weight of flux and 0.16 to 0.24% by weight of peroxide can be prepared.

In a preferred embodiment of the present invention, the composition of the self-bonding conductive connection film of the present invention is 19.2 to 28.8% by weight, thermosetting, when containing 36 to 54% by weight of the conductive particles relative to the total weight It can be prepared by mixing 12.8 to 19.2% by weight of resin, 7.84 to 11.76% by weight of curing agent, 4 to 6% by weight of flux and 0.16 to 0.24% by weight of peroxide.

In a preferred embodiment of the present invention, the composition of the self-bonding conductive connection film of the present invention is 7.6 to 11.4% by weight of the thermoplastic resin, 60 to 90% by weight, based on the total weight, the thermoplastic resin, thermosetting It can be prepared by mixing 5.2 to 7.8% by weight of resin, 3.04 to 4.56% by weight of curing agent, 4 to 6% by weight of flux and 0.16 to 0.24% by weight of peroxide.

Furthermore, the method for manufacturing a circuit member including the self-sealing conductive connection film of the present invention includes preparing a first circuit member having a plurality of first terminals on one surface and a second circuit member having a plurality of second terminals on one surface. In a first step, the second step of temporarily attaching the self-bonding conductive connecting film of claim 1 to one surface formed with a plurality of first terminals of the first circuit member, the second circuit member facing the plurality of first terminals Arranging the plurality of second terminals to face each other, and temporarily attaching the second circuit member to one surface of the self-sealing conductive connection film and the self-sealing conductive connection film at a temperature of 140 to 200 ° C. and 0.01 to A fourth step of pressing at a pressure of 1.0 mPa may be included.

The self-sealing conductive connection film of the present invention and its manufacturing method not only realize electrical connection between circuit members (circuit board, semiconductor chip, ITO Class, terminal part of plastic element substrate, etc.) through contact conduction by molten metal, It is excellent in the adhesion between the various, low connection resistance, excellent insulation and self-adhesion.

In addition, the present invention is the conductive particles included in the self-fusion conductive connection film is selectively formed only on the electrode terminal portion of the circuit member, the electrical contact due to the overall surface contact (= solder effect) rather than partial connection between the electrode terminal of the circuit member It is remarkably superior in terms of resistance.

1 is a view schematically showing a conductive implementation method of the self-sealing conductive connection film of the present invention, the conductive particles are agglomerated in the electrode portion of the circuit member is a view showing the electrical conduction between the circuit members.
FIG. 2 is a view schematically showing a conduction method of a conventional anisotropic conductive film (ACF), and the electrical conduction between circuit members is made through conductive particles.
3 is a view schematically illustrating a second step of a method of manufacturing a circuit member including a self-sealing conductive connection film of the present invention.
4 is a view schematically illustrating a third step of a method of manufacturing a circuit member including a self-sealing conductive connection film of the present invention.
5 is a view schematically showing a fourth step of a method of manufacturing a circuit member including a self-sealing conductive connection film of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.

In the conventional anisotropic conductive film, the conductive particles constituting the film are connected to the upper and lower electrodes to pursue the inter-circuit conduction by physical contact, but since they are physically contacted only by a specific contact, they are unstable and have high connection resistance due to relatively low conductivity. However, although it had disadvantages such as low bonding strength and ion migration, the self-sealing conductive connection film of the present invention is excellent in self-melting property by using metal agglomeration property, and also has excellent adhesion, connection resistance and insulation property.

The self-sealing conductive connection film of the present invention is interposed between a first circuit member having a plurality of first terminals formed on one surface and a second circuit member having a plurality of second terminals formed on one surface facing the first terminal. The circuit member and the second circuit member are self-sealing conductive connection films that electrically connect, and the first and second terminals are formed by melting conductive particles contained in the self-sealing conductive connection film of the present invention under a predetermined temperature and pressure. Self-fusion can be performed to electrically connect the first circuit member and the second circuit member.

Specifically, referring to FIG. 1, a plurality of second terminals 21 are disposed on one surface of the first circuit member 10 and the first terminal 11 on which the prepared first terminals 11 are formed. In a state where the self-fusion conductive connection film 100 of the present invention is interposed between the formed second circuit members 20, when a predetermined temperature (= heat) and a predetermined pressure are applied, the self-fusion conductive connection film of the present invention ( The electroconductive particle 1 contained in 100 is melted and fused only to the 1st terminal 11 and the 2nd terminal 12 by self-coagulation force. In other words, the conductive particles 1 are melted and fused only to the first terminal 11 and the second terminal 12, so that the first circuit member through the partial connection of the first terminal 11 and the second terminal 12. Rather than electrically connecting the 10 and the second circuit member 20, the surface contact is made exclusively to the first terminal 11 and the second terminal 12, so that the first circuit member 10 and the second circuit member 20 are not electrically connected. By electrically connecting the circuit member 20, not only has a significantly better adhesion and insulation than conventional anisotropic conductive film, but also has a significantly low connection resistance.

Meanwhile, referring to FIG. 2, the electrical conduction method between the circuit members using the existing anisotropic conductive film will be described. The first circuit member 30 and the first terminal 31 on which the plurality of prepared first terminals 31 are formed are described. In the state where the existing anisotropic conductive film 200 is interposed between the second circuit member 40 on which a plurality of second terminals 41 are formed on one surface thereof, when heat and pressure are applied, the existing anisotropic conductive film 200 The conductive particles 2 contained in the) are conductive balls, which are not melted unlike the conductive particles of the present invention and are broken by pressure, thereby partially connecting the first terminal 31 and the second terminal 42. Done. In other words, the self-sealing conductive connection film of the present invention electrically connects the circuit members through surface contact, but the existing anisotropic conductive film electrically connects the circuit members through the point contact, resulting in relatively low conductivity. It is unstable and has high connection resistance, low bonding strength and ion migration.

On the other hand, when the conductive particles contained in the self-sealing conductive connection film of the present invention is melted under a predetermined temperature and a constant pressure and self-fused to the first terminal and the second terminal to electrically connect the first circuit member and the second circuit member. The temperature of 140 ~ 200 ℃, preferably 150 ~ 190 ℃, more preferably may be 160 ~ 180 ℃, if the temperature is less than 140 ℃ conductive particles contained in the self-fusion conductive connection film of the present invention is There may be a problem that does not melt, and if it exceeds 200 ℃ there may be a problem that causes damage to the circuit member.

In addition, when the conductive particles included in the self-sealing conductive connection film of the present invention are melted under a predetermined temperature and a constant pressure to self-fusion to the first terminal and the second terminal to electrically connect the first circuit member and the second circuit member. The pressure of may be 0.01 to 1.0 mPa, preferably 0.1 to 0.6 mPa, more preferably 0.15 to 0.4 mPa, if the pressure is less than 0.01 mPa, there may be a problem in the self-fusion, if it exceeds 1.0 mPa There may be a problem that the conductive particles are leaked to the site not subjected to pressure.

Furthermore, the self-fusion conductive connection film of the present invention may include conductive particles, a thermoplastic resin, a thermosetting resin, a curing agent, a flux, and a peroxide.

First, the conductive particles of the present invention is a material that electrically conducts a plurality of circuit boards, a melting point of 200 ° C. or lower, preferably 110 to 170 ° C., and more preferably 120 to 120 ° C. It may have a melting point of 160 ℃, if the melting point exceeds 200 ℃ by the process temperature requires a temperature of 200 ℃ or more, there may be a problem that may cause damage to the circuit member.

In addition, the conductive particles of the present invention are bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni) and these It may include one or more selected from alloys, preferably one or more selected from an alloy of bismuth (Bi), tin (Sn) and silver (Ag) and an alloy of bismuth (Bi) and tin (Sn) It may include, and more preferably may include an alloy of bismuth (Bi) and tin (Sn).

In addition, when the conductive particles of the present invention include an alloy of bismuth (Bi) and tin (Sn), the bismuth and tin in a weight ratio of 1: 1.10 to 1.66, preferably 1: 1.24 to 1.52 weight ratio, more preferably 1 : 1.31 to 1.45 may be included in the weight ratio.

 The electroconductive particle of this invention may be spherical, and the particle diameter of electroconductive particle may be 1-100 micrometers, Preferably it is 1-70 micrometers, More preferably, it is 1-50 micrometers on the basis of D50. If the particle diameter of the conductive particles is less than 1 μm, a problem of self fusion may occur, and if it exceeds 100 μm, there may be a problem of dispersibility.

Next, the thermoplastic resin of the present invention is a resin which can be deformed by applying heat again after being molded by applying heat, and is an ethylenically unsaturated oligomer, an acrylic resin, a urethane resin, a polyester resin, a nitrile resin, and a polyamide. It may include one or more selected from system resins and phenoxy resins.

Specifically, the thermoplastic resin of the present invention may include a first thermoplastic resin and a second thermoplastic resin, and the first thermoplastic resin and the second thermoplastic resin may have a weight ratio of 1: 1.6 to 2.6, preferably 1: 1.8 to 2.4. It may have a weight ratio of 1: 2.05 to 2.25, more preferably, if the weight ratio is less than 1.6, there may be a problem of self-fusion, and if it exceeds 2.6 weight ratio, there may be a problem of adhesion. In this case, the first thermoplastic resin of the present invention may include a compound having a radical polymerization reaction by a peroxide including a double bond, and preferably include one or more selected from an acrylic oligomer and an ethylene-unsaturated oligomer. More preferably urethane acrylate, and even more preferably, the viscosity is 1,000 to 11,000 mPa? Es (25 ° C.), preferably 3,000 to 9,000 mPa? Es (25 ° C.). In addition, the weight average molecular weight (Mw) may include a urethane acrylate of 7,000 to 27,000, preferably 12,000 to 22,000.

In addition, the second thermoplastic resin of the present invention may include at least one selected from a urethane resin, a polyester resin, a nitrile resin, and a polyamide resin, and may preferably include a polyamide resin.

Next, the thermosetting resin of the present invention is a resin that does not become soft even after applying heat after forming a shape by applying heat, and may include an epoxy resin, and preferably a bisphenol A type epoxy resin and a bisphenol F type epoxy At least one of resins, cresol novolac epoxy resins, phenol novolac epoxy resins, naphthalene epoxy resins, and dicyclopentadiene (DCPD) type epoxy resins may be included, and more preferably, bisphenol A type epoxy resins are used. More preferably epoxy equivalent 160 to 210 g / eq, preferably 170 to 200 g / eq, viscosity 9,500 to 15,500 cps (25 ° C.), preferably 11,500 to 13,500 cps (25 ° C), the weight average molecular weight (Mw) may include a bisphenol A epoxy resin of 348 to 524, preferably 392 to 480, more preferably 414 to 458.

Next, the curing agent of the present invention may include at least one selected from an amine curing agent, a phenolic curing agent, a mercapto curing agent, a carboxyl mechanical curing agent and an acid anhydride curing agent, preferably may include an amine curing agent. More preferably, an amine adduct-based latent curing agent mixed with a portion of the epoxy resin. At this time, the amine adduct-based latent curing agent is a curing agent having a long pot life and a short curing time, and the addition amount is 15 to 25 phr based on a liquid epoxy resin having an epoxy equivalent of 190 g / eq. , Curing conditions may be 20 to 40 minutes at a temperature of 70 ~ 110 ℃, pot life 15 to 45 days.

Next, the flux of the present invention is a reducing agent capable of reducing and removing surface foreign substances such as oxides on the surface of the conductive particles and the surface of the circuit member in which the self-fusion conductive connection film of the present invention is interposed. It may include one or more selected from the group compounds, amine salt compounds and metallic compounds, preferably may comprise a rosin compound in the organic acid compound.

Finally, the peroxide is a material that acts as a radical initiation by heat, and may include any peroxide as long as it can be used for radical initiation. Preferably, the peroxide is suitable for the process temperature required for carrying out the method of manufacturing a circuit member. It may include, more preferably t-butyl peroxy-2-ethylhexanoate (t-Butyl peroxy-2-ethylhexanoate).

The self-adhesive conductive connection film of the present invention is 36 to 90% by weight of the conductive particles, 7.6 to 28.8% by weight of the thermoplastic resin, 5.2 to 19.2% by weight of the thermosetting resin, 3.04 to 11.76% by weight of the curing agent, flux 4 to 6 weight percent and 0.16 to 0.24 weight percent peroxide.

Specifically, the self-adhesive conductive connection film of the present invention comprises 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight relative to the total weight. And, the thermoplastic resin may include 19.2 to 28.8% by weight, preferably 21.6 to 26.4% by weight, more preferably 22.8 to 25.2% by weight.

In addition, when the self-adhesive conductive connection film of the present invention comprises 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight, based on the total weight by weight, The thermosetting resin may include 12.8 to 19.2% by weight, preferably 14.4 to 17.6% by weight, and more preferably 15.2 to 16.8% by weight.

In addition, when the self-adhesive conductive connection film of the present invention comprises 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight, based on the total weight by weight, The curing agent may comprise 7.84 to 11.76% by weight, preferably 8.82 to 10.78% by weight, more preferably 9.31 to 10.29% by weight.

In addition, when the self-adhesive conductive connection film of the present invention comprises 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight, based on the total weight by weight, The flux may comprise 4 to 6% by weight, preferably 4.5 to 5.5% by weight, more preferably 4.75 to 5.25% by weight.

In addition, when the self-adhesive conductive connection film of the present invention comprises 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight, based on the total weight by weight, Peroxide may be included in 0.16 to 0.24% by weight, preferably 0.18 to 0.22% by weight, more preferably 0.19 to 0.21% by weight.

On the other hand, when the self-adhesive conductive connection film of the present invention comprises 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight relative to the total weight, At a temperature of 140 to 200 ° C, preferably 150 to 190 ° C, more preferably 160 to 180 ° C, 0.01 to 1.0 mPa, preferably 0.1 to 0.6 mPa, more preferably 0.15 to 0.4 mPa, 1 It may have an adhesive force of ˜5 kgf / cm, preferably an adhesive force of 1.1 to 2.0 kgf / cm, a connection resistance of 0.001 to 1 dl / cm, preferably a connection resistance of 0.8 to 1 dl / cm.

Further, when the self-adhesive conductive connection film of the present invention comprises 60 to 90% by weight, preferably 67.5 to 82.5% by weight, more preferably 71.25 to 78.75% by weight relative to the total weight, The thermoplastic resin may be included in an amount of 7.6 to 11.4% by weight, preferably 8.55 to 10.45% by weight, and more preferably 9.02 to 9.98% by weight.

In addition, when the self-adhesive conductive connection film of the present invention comprises 60 to 90% by weight, preferably 67.5 to 82.5% by weight, more preferably 71.25 to 78.75% by weight relative to the total weight, The thermosetting resin may include 5.2 to 7.8 wt%, preferably 5.85 to 7.15 wt%, more preferably 6.17 to 6.83 wt%.

In addition, when the self-adhesive conductive connection film of the present invention comprises 60 to 90% by weight, preferably 67.5 to 82.5% by weight, more preferably 71.25 to 78.75% by weight relative to the total weight, The curing agent may comprise 3.04 to 4.56% by weight, preferably 3.42 to 4.18% by weight, more preferably 3.61 to 3.99% by weight.

In addition, when the self-adhesive conductive connection film of the present invention comprises 60 to 90% by weight, preferably 67.5 to 82.5% by weight, more preferably 71.25 to 78.75% by weight relative to the total weight, The flux may comprise 4 to 6% by weight, preferably 4.5 to 5.5% by weight, more preferably 4.75 to 5.25% by weight.

In addition, when the self-adhesive conductive connection film of the present invention comprises 60 to 90% by weight, preferably 67.5 to 82.5% by weight, more preferably 71.25 to 78.75% by weight relative to the total weight, Peroxide may be included in 0.16 to 0.24% by weight, preferably 0.18 to 0.22% by weight, more preferably 0.19 to 0.21% by weight.

On the other hand, when the self-adhesive conductive connection film of the present invention comprises 60 to 90% by weight, preferably 67.5 to 82.5% by weight, more preferably 71.25 to 78.75% by weight relative to the total weight, At a temperature of 140 to 200 ° C, preferably 150 to 190 ° C, more preferably 160 to 180 ° C, 0.01 to 1.0 mPa, preferably 0.1 to 0.6 mPa, more preferably 0.15 to 0.4 mPa, 1 It may have an adhesive force of ˜5 kgf / cm, preferably an adhesive force of 1.5 to 2.3 kgf / cm, a connection resistance of 0.001 to 1 dl / cm, and preferably a connection resistance of 0.8 to 1 dl / cm. In particular, under a temperature of 160 ~ 180 ℃, pressure of 0.27 ~ 0.33 mPa, it can have an adhesive force of 1.5 ~ 2.3 kgf / cm, connection resistance of 0.8 ~ 0.95 dl / cm.

Furthermore, the method for manufacturing the self-sealing conductive connection film of the present invention includes first to third steps.

First, in the first step of the method for producing a self-melting conductive connection film of the present invention, the conductive particles, a thermoplastic resin, a thermosetting resin, a curing agent, a flux, and a peroxide are mixed to prepare a composition of the self-melting conductive connection film. can do.

At this time, the composition of the prepared self-bonding conductive connection film is 36 to 90% by weight of the conductive particles, 7.6 to 28.8% by weight of the thermoplastic resin, 5.2 to 19.2% by weight of the thermosetting resin, 3.04 to 11.76% by weight of the curing agent It can be prepared by mixing 4 to 6 wt% flux and 0.16 to 0.24 wt% peroxide.

Specifically, the composition of the prepared self-bonding conductive connection film is 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight relative to the total weight When the thermoplastic resin is 19.2 to 28.8% by weight, preferably 21.6 to 26.4% by weight, more preferably 22.8 to 25.2% by weight, thermosetting resin 12.8 to 19.2% by weight, preferably 14.4 to 17.6% by weight, more preferably 15.2 to 16.8% by weight, hardener 7.84 to 11.76% by weight, preferably 8.82 to 10.78% by weight, more preferably 9.31 to 10.29% by weight, flux 4 to 6% by weight, preferably 4.5 to 5.5% by weight, more preferably Preferably, 4.75 to 5.25% by weight, peroxide 0.16 to 0.24% by weight, preferably 0.18 to 0.22% by weight, more preferably 0.19 to 0.21% by weight can be prepared by mixing.

In addition, the composition of the prepared self-adhesive conductive connection film, when containing the conductive particles 36 to 54% by weight, preferably 40.5 to 49.5% by weight, more preferably 42.75 to 47.25% by weight relative to the total weight , 7.6 to 11.4 wt% of thermoplastic resin, preferably 8.55 to 10.45 wt%, more preferably 9.02 to 9.98 wt%, thermosetting resin 5.2 to 7.8 wt%, preferably 5.85 to 7.15 wt%, more preferably 6.17 To 6.83% by weight, curing agent 3.04 to 4.56% by weight, preferably 3.42 to 4.18% by weight, more preferably 3.61 to 3.99% by weight, flux 4 to 6% by weight, preferably 4.5 to 5.5% by weight, more preferably Can be prepared by mixing 4.75 to 5.25 wt%, peroxide 0.16 to 0.24 wt%, preferably 0.18 to 0.22 wt%, more preferably 0.19 to 0.21 wt%.

Next, in the second step of the method for producing a self-fusion conductive connection film of the present invention, the composition of the self-fusion conductive connection film prepared in the first step is applied to one surface of a release film, and dried to self-fusion conductive connection film. Films can be produced.

At this time, the drying may be carried out at a temperature below the melting point (melting point) of the conductive particles, preferably may be carried out at 60 ~ 130 ℃.

On the other hand, the method for manufacturing a circuit member comprising a self-fusion conductive connection film of the present invention comprises a first step to a fourth step. In this case, the circuit member may be a terminal portion of a circuit board, a semiconductor chip, an ITO class, or a plastic element substrate.

First, the first step of the method for manufacturing a circuit member including the self-sealing conductive connection film of the present invention is a first circuit member having a plurality of first terminals formed on one surface and a second second terminal formed on the one surface The circuit member can be prepared.

Next, the second step of the method for manufacturing a circuit member including the self-sealing conductive connection film of the present invention will be described with reference to FIG. 3, wherein the plurality of first terminals 11 of the first circuit member 10 are described. The self-sealing conductive connection film 100 of the present invention may be temporarily bonded to one surface of the formed body. At this time, the temporary adhesion may be carried out at a temperature of 15 ~ 80 ℃, preferably at a temperature of 40 ~ 70 ℃.

Next, a third step of the method for manufacturing a circuit member including the self-sealing conductive connection film of the present invention will be described with reference to FIG. 4. The second circuit member is opposed to the plurality of first terminals 11. The plurality of second terminals 21 of 20 may be disposed to face each other, and the second circuit member 20 may be temporarily bonded to one surface of the self-sealing conductive connection film 100 of the present invention. At this time, the temporary adhesion may be carried out at a temperature of 15 ~ 80 ℃, preferably at a temperature of 40 ~ 70 ℃.

Lastly, the fourth step of the method for manufacturing a circuit member including the self-sealing conductive connection film of the present invention will be described with reference to FIG. 5, wherein the self-melting conductive connection film 100 is 140 to 200 ° C., preferably. Preferably it can be pressed at a temperature of 150 to 190 ℃, more preferably 160 to 180 ℃ and a pressure of 0.01 to 1.0 mPa, preferably 0.1 to 0.6 mPa, more preferably 0.15 to 0.4 mPa. In other words, the conductive particles 1 included in the self-fusion conductive connection film 100 are melted by applying a constant temperature and a predetermined pressure to the circuit members 10 and 20 including the self-fusion conductive connection film 100. Self-fusion can be efficiently carried out to the plurality of first terminals 11 and the second terminal 21, the self-sealing conductive connection film 100 is to the first circuit member 10 and the second circuit member 20 It can adhere by excellent adhesive force. At this time, the self-sealing conductive connection film 100 of the present invention is a thickness (a) of 1 ~ 100㎛, preferably a thickness (a) of 10 ~ 70㎛, more preferably a thickness of 20 ~ 60㎛ ( may have a).

In addition, the temperature and pressure of the fourth step may be performed using a hot bar equipment, and the hot bar equipment may melt the conductive particles in the self-sealing conductive connection film of the present invention. If it is a means capable of applying a constant pressure, it is not particularly limited.

The present invention has been described above with reference to the embodiments, which are merely exemplary and are not intended to limit the embodiments of the present invention, and those skilled in the art to which the embodiments of the present invention belong may have the essential characteristics of the present invention. It will be appreciated that various modifications and applications not illustrated above are possible without departing from the scope of the invention. For example, each component specifically shown in the embodiment of the present invention may be modified. And differences relating to these modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Example 1 Preparation of Self-Adhesive Conductive Connection Film

(1) 45% by weight of conductive particles having a melting point of 139 ° C, 8% by weight of urethane acrylate as the first thermoplastic resin, and polyamide-based resin 16 as the second thermoplastic resin, based on the total weight% as shown in Table 1 below. Wt%, 16 wt% bisphenol A type epoxy resin as thermosetting resin, 9.8 wt% amine adduct type latent curing agent as curing agent, 5 wt% flux, t-butyl peroxy-2-ethylhexano as peroxide 0.2 wt% of t-Butyl peroxy-2-ethylhexanoate was mixed to prepare a composition of a self-sealing conductive connection film.

(2) The composition of the prepared self-bonding conductive connection film was applied to one surface of the release film and dried at 80 ° C. for 5 minutes to prepare a self-fusion conductive connection film.

Example 2 Preparation of Self-Sealing Conductive Connection Film

(1) 75% by weight of conductive particles having a melting point of 139 ° C, 3% by weight of urethane acrylate as the first thermoplastic resin, and polyamide-based resin as the second thermoplastic resin 6.5, based on the total weight% as shown in Table 1 below. % By weight, 6.5% by weight of bisphenol A type epoxy resin as thermosetting resin, 3.8% by weight of amine adduct-based latent curing agent as curing agent, 5% by weight of flux, t-butyl peroxy-2-ethylhexano as peroxide 0.2 wt% of t-Butyl peroxy-2-ethylhexanoate was mixed to prepare a composition of a self-sealing conductive connection film.

(2) The composition of the prepared self-bonding conductive connection film was applied to one surface of the release film and dried at 80 ° C. for 5 minutes to prepare a self-fusion conductive connection film.

Comparative Example 1 Manufacture of Conductive Connection Film

(1) 45% by weight of conductive particles (7GNM8-NiC, JCI USA Inc.), 9% by weight of urethane acrylate as the first thermoplastic resin, and poly as the second thermoplastic resin relative to the total weight as shown in Table 1 below. 18% by weight amide resin, 18% by weight bisphenol A type epoxy resin as thermosetting resin, 9.8% by weight amine adduct-based latent curing agent as hardener, t-butyl peroxy-2-ethylhexanoate as peroxide (t-Butyl peroxy-2-ethylhexanoate) 0.2 wt% was mixed to prepare a composition of a conductive connection film.

(2) The composition of the prepared conductive connection film was applied to one surface of a release film and dried at 80 ° C. for 5 minutes to prepare a conductive connection film.

Comparative Example 2: Preparation of a Conductive Connection Film

(1) 75% by weight of the conductive particles (7GNM8-NiC, JCI USA Inc.) conductive particles, 4% by weight of urethane acrylate as the first thermoplastic resin, and the second thermoplastic resin to the total weight% as shown in Table 1 below. 8% by weight of polyamide-based resin, 8% by weight of bisphenol A type epoxy resin as thermosetting resin, 4.8% by weight of amine adduct-based latent curing agent as hardener, and t-butyl peroxy-2-ethylhexa 0.2 wt% of noate (t-Butyl peroxy-2-ethylhexanoate) was mixed to prepare a composition of a conductive connection film.

(2) The composition of the prepared conductive connection film was applied to one surface of a release film and dried at 80 ° C. for 5 minutes to prepare a conductive connection film.

Comparative Example 3 Preparation of the Conductive Connection Film

(1) 75% by weight of conductive particles (Sn58Bi, Duksan Hi-Metal) having a melting point of 139 ° C, 5% by weight of polyester resin (SNT, Nicigo) as thermoplastic resin, and bisphenol A type epoxy as thermosetting resin 5% by weight of resin (YD011, Kukdo Chemical), 0.5% by weight of 4,4'-diaminodiphenylsulfone as hardener, 0.5% by weight of curing accelerator (C11Z-A, Shikoku), flux 14 The wt% was mixed to prepare a composition of the conductive connection film.

(2) The composition of the prepared conductive connection film was applied to one surface of a release film and dried at 80 ° C. for 5 minutes to prepare a conductive connection film.

Experimental Example 1

The self-fusion conductive connection films prepared in Examples 1 and 2 and the conductive connection films prepared in Comparative Examples 1 to 3 were evaluated based on the following physical property evaluation methods, and the results are shown in Table 2. .

(1) Connection resistance measurement (Ω / cm), insulation measurement

The self-fusion conductive connection films prepared in Examples 1 to 2 and the conductive connection films prepared in Comparative Examples 1 to 3 were each prepared with a first circuit board (terminal 100 μm, terminal distance 100 μm, and terminal height 35 μm). 35 formed) and the release film is removed after the temporary adhesion at a temperature of 60 ℃, and then the second self-adhesive conductive connection film prepared in Examples 1 and 2 and the second surface on one surface of the conductive connection film prepared in Comparative Examples 1 to 3 The circuit board (same as the first circuit board) was temporarily bonded at a temperature of 60 ° C.

Thereafter, at a temperature of 170 ° C., 0.15 mPa, 0.2 mPa, 0.25 mPa, After 10 seconds of pressing at 0.3 mPa and 0.4 mPa, respectively, the resistance of 35 terminals was measured using a resistance meter (HIOKI 3244-60 CARD HiTESTER), and the average resistance was calculated. However, in the case of non-contact failure even in only one of the 35 terminals, the connection resistance is indicated as ∞.

In addition, if the resistance is not measured by using a resistance measuring instrument (HIOKI 3244-60 CARD HiTESTER), whether current flows between the terminal formed on the first circuit board and the terminal adjacent to the first circuit board and the terminal formed on the second circuit board. If measured, the insulation was measured by marking X.

(2) Self-adhesiveness measurement

The self-fusion conductive connection films prepared in Examples 1 to 2 and the conductive connection films prepared in Comparative Examples 1 to 3 were each prepared with a first circuit board (terminal 100 μm, terminal distance 100 μm, and terminal height 35 μm). 35 formed) and the release film is removed after the temporary adhesion at a temperature of 60 ℃, and then the second self-adhesive conductive connection film prepared in Examples 1 and 2 and the second surface on one surface of the conductive connection film prepared in Comparative Examples 1 to 3 The circuit board (same as the first circuit board) was temporarily bonded at a temperature of 60 ° C.

Thereafter, at a temperature of 170 ° C., 0.15 mPa, 0.2 mPa, 0.25 mPa, After pressing for 10 seconds at a pressure of 0.3 mPa and 0.4 mPa, respectively, the self-sealing conductive connection film prepared in Examples 1 to 2 and Comparative Example 1 on the terminals of the first circuit board and the terminals of the second circuit board using a microscope. It was visually confirmed whether the conductive particles included in the conductive connection film prepared in ~ 3 were melted and self-fused. When the self-fusion was made, ○, the self-fusion was not indicated by X.

(3) Adhesive force measurement (kgf / cm)

The self-fusion conductive connection films prepared in Examples 1 to 2 and the conductive connection films prepared in Comparative Examples 1 to 3 were each prepared with a first circuit board (terminal 100 μm, terminal distance 100 μm, and terminal height 35 μm). 35 formed) and the release film is removed after the temporary adhesion at a temperature of 60 ℃, and then the second self-adhesive conductive connection film prepared in Examples 1 and 2 and the second surface on one surface of the conductive connection film prepared in Comparative Examples 1 to 3 The circuit board (same as the first circuit board) was temporarily bonded at a temperature of 60 ° C.

Thereafter, at a temperature of 170 ° C., 0.15 mPa, 0.2 mPa, 0.25 mPa, It pressed for 10 second by the pressure of 0.3 mPa and 0.4 mPa, respectively.

Subsequently, the self-fusion type conductive connection film prepared in Examples 1 and 2 and the conductive connection film prepared in Comparative Examples 1 to 3 were loaded using a 10TM load cell using a UTM measuring machine (Universal Testing Machine, Hounsfield, H5KT model). After the installation, the grip (grip) is installed to finish the preparation of the measurement and the self-fusion-type conductive connection film prepared in Examples 1 and 2 and the conductive connection film prepared in Comparative Examples 1 to 3 bite on the grip (grip) Afterwards, the degree of peel strength of the film was measured as an adhesive force at a speed of 20 mm / min at an angle of 180 ° in a tensile test speed.

Referring to Table 2, the self-sealing conductive connection film prepared in Examples 1 to 2 is not only excellent in self-melting and insulating properties, but also lower in connection resistance than the conductive connection film prepared in Comparative Examples 1 to 3. It was confirmed that the adhesion was excellent.

On the other hand, the conductive connection film prepared in Comparative Example 3 is in an overpressure state from the crimping pressure is 0.25mPa or more, the components contained in the conductive connection film is missing, the physical properties can not be measured.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

1, 2: electroconductive particle
10, 30: first circuit member
11, 31: First terminal
20, 40: second circuit member
21, 41: Second terminal
100: self-sealing conductive connection film
200: anisotropic conductive film

Claims (3)

A first step of preparing a first circuit member having a plurality of first terminals formed on one surface thereof and a second circuit member having a plurality of second terminals formed formed on one surface thereof;
A second step of temporarily bonding the self-sealing conductive connection film of claim 1 to a surface on which a plurality of first terminals of the first circuit member are formed;
A third step of disposing the plurality of second terminals of the second circuit member to face the plurality of first terminals, and temporarily attaching the second circuit member to one surface of the self-sealing conductive connection film; And
A fourth step of pressing the self-fusion conductive connection film at a temperature of 140 to 200 ° C. and a pressure of 0.01 to 1.0 mPa;
Method of manufacturing a circuit member comprising a self-fusion conductive connection film comprising a.
The method of claim 1,
The self-fusion conductive connection film is a method for manufacturing a circuit member comprising a self-fusion conductive connection film, characterized in that it comprises a conductive particle, a thermoplastic resin, a thermosetting resin, a curing agent, a flux (flux) and a peroxide.
The method of claim 2,
The self-sealing conductive connection film is 36 to 90% by weight of the conductive particles, 7.6 to 28.8% by weight thermoplastic resin, 5.2 to 19.2% by weight thermosetting resin, 3.04 to 11.76% by weight hardener, flux 4 to 6% by weight Method for producing a circuit member comprising a self-sealing conductive connection film, characterized in that it comprises a% and 0.16 to 0.24% by weight peroxide.

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