KR102417020B1 - 본딩 트렌치를 갖는 세라믹-알루미늄 조립체 - Google Patents

본딩 트렌치를 갖는 세라믹-알루미늄 조립체 Download PDF

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KR102417020B1
KR102417020B1 KR1020217042076A KR20217042076A KR102417020B1 KR 102417020 B1 KR102417020 B1 KR 102417020B1 KR 1020217042076 A KR1020217042076 A KR 1020217042076A KR 20217042076 A KR20217042076 A KR 20217042076A KR 102417020 B1 KR102417020 B1 KR 102417020B1
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assembly
trench
aluminum material
solid aluminum
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KR20210158426A (ko
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패트릭 마르가비오
커트 잉글리쉬
제이콥 윌슨
미란다 피젤라
토드 브룩
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와틀로 일렉트릭 매뉴팩츄어링 컴파니
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Priority to KR1020227022478A priority Critical patent/KR102519075B1/ko
Publication of KR20210158426A publication Critical patent/KR20210158426A/ko
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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/19Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64Burning or sintering processes
    • C04B35/645Pressure sintering
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/94Products characterised by their shape
    • C04B2235/945Products containing grooves, cuts, recesses or protusions
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/963Surface properties, e.g. surface roughness
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/121Metallic interlayers based on aluminium
    • CCHEMISTRY; METALLURGY
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/343Alumina or aluminates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/345Refractory metal oxides
    • C04B2237/348Zirconia, hafnia, zirconates or hafnates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/365Silicon carbide
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/366Aluminium nitride
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59Aspects relating to the structure of the interlayer
    • C04B2237/592Aspects relating to the structure of the interlayer whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64Forming laminates or joined articles comprising grooves or cuts

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020217042076A 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체 Active KR102417020B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227022478A KR102519075B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15/955,431 US10882130B2 (en) 2018-04-17 2018-04-17 Ceramic-aluminum assembly with bonding trenches
US15/955,431 2018-04-17
PCT/US2019/025930 WO2019204050A1 (en) 2018-04-17 2019-04-05 Ceramic-aluminum assembly with bonding trenches
KR1020207033061A KR102343816B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207033061A Division KR102343816B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227022478A Division KR102519075B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체

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Publication Number Publication Date
KR20210158426A KR20210158426A (ko) 2021-12-30
KR102417020B1 true KR102417020B1 (ko) 2022-07-05

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KR1020217042076A Active KR102417020B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체
KR1020227022478A Active KR102519075B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체
KR1020207033061A Active KR102343816B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체

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KR1020207033061A Active KR102343816B1 (ko) 2018-04-17 2019-04-05 본딩 트렌치를 갖는 세라믹-알루미늄 조립체

Country Status (7)

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US (3) US10882130B2 (enExample)
JP (2) JP6924910B2 (enExample)
KR (3) KR102417020B1 (enExample)
CN (1) CN112135806A (enExample)
DE (1) DE112019002005B4 (enExample)
TW (1) TWI709547B (enExample)
WO (1) WO2019204050A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10793772B1 (en) 2020-03-13 2020-10-06 Accelovant Technologies Corporation Monolithic phosphor composite for sensing systems
US11359976B2 (en) 2020-10-23 2022-06-14 Accelovant Technologies Corporation Multipoint surface temperature measurement system and method thereof
CA3137183C (en) 2020-11-05 2024-02-20 Accelovant Technologies Corporation Optoelectronic transducer module for thermographic temperature measurements
CN113828954B (zh) * 2021-10-22 2022-11-01 中国科学院空天信息创新研究院 金属-陶瓷封接方法、金属-陶瓷复合结构

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Also Published As

Publication number Publication date
DE112019002005B4 (de) 2022-03-10
CN112135806A (zh) 2020-12-25
DE112019002005T5 (de) 2021-02-25
KR20220098293A (ko) 2022-07-11
WO2019204050A1 (en) 2019-10-24
KR20210158426A (ko) 2021-12-30
TW201943680A (zh) 2019-11-16
JP2021185123A (ja) 2021-12-09
KR102343816B1 (ko) 2021-12-28
KR102519075B1 (ko) 2023-04-11
JP2021512845A (ja) 2021-05-20
JP6924910B2 (ja) 2021-08-25
TWI709547B (zh) 2020-11-11
US20190314918A1 (en) 2019-10-17
US20210078092A1 (en) 2021-03-18
KR20210023818A (ko) 2021-03-04
US20200230728A1 (en) 2020-07-23
US10882130B2 (en) 2021-01-05

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