DE112019002005B4 - Keramik-aluminium-anordnung mit verbindenden gräben - Google Patents

Keramik-aluminium-anordnung mit verbindenden gräben Download PDF

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Publication number
DE112019002005B4
DE112019002005B4 DE112019002005.6T DE112019002005T DE112019002005B4 DE 112019002005 B4 DE112019002005 B4 DE 112019002005B4 DE 112019002005 T DE112019002005 T DE 112019002005T DE 112019002005 B4 DE112019002005 B4 DE 112019002005B4
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Germany
Prior art keywords
arrangement
trenches
ceramic
trench
aluminum material
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Active
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DE112019002005.6T
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German (de)
English (en)
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DE112019002005T5 (de
Inventor
Patrick Margavio
Kurt ENGLISH
Jacob Wilson
Miranda Pizzella
Todd Brooke
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Watlow Electric Manufacturing Co
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Watlow Electric Manufacturing Co
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Publication date
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Publication of DE112019002005T5 publication Critical patent/DE112019002005T5/de
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Publication of DE112019002005B4 publication Critical patent/DE112019002005B4/de
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C04B35/645—Pressure sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/94—Products characterised by their shape
    • C04B2235/945—Products containing grooves, cuts, recesses or protusions
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/963—Surface properties, e.g. surface roughness
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/365—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/592—Aspects relating to the structure of the interlayer whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64—Forming laminates or joined articles comprising grooves or cuts

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112019002005.6T 2018-04-17 2019-04-05 Keramik-aluminium-anordnung mit verbindenden gräben Active DE112019002005B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/955,431 US10882130B2 (en) 2018-04-17 2018-04-17 Ceramic-aluminum assembly with bonding trenches
US15/955,431 2018-04-17
PCT/US2019/025930 WO2019204050A1 (en) 2018-04-17 2019-04-05 Ceramic-aluminum assembly with bonding trenches

Publications (2)

Publication Number Publication Date
DE112019002005T5 DE112019002005T5 (de) 2021-02-25
DE112019002005B4 true DE112019002005B4 (de) 2022-03-10

Family

ID=66248706

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019002005.6T Active DE112019002005B4 (de) 2018-04-17 2019-04-05 Keramik-aluminium-anordnung mit verbindenden gräben

Country Status (7)

Country Link
US (3) US10882130B2 (enExample)
JP (2) JP6924910B2 (enExample)
KR (3) KR102417020B1 (enExample)
CN (1) CN112135806A (enExample)
DE (1) DE112019002005B4 (enExample)
TW (1) TWI709547B (enExample)
WO (1) WO2019204050A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10793772B1 (en) 2020-03-13 2020-10-06 Accelovant Technologies Corporation Monolithic phosphor composite for sensing systems
US11359976B2 (en) 2020-10-23 2022-06-14 Accelovant Technologies Corporation Multipoint surface temperature measurement system and method thereof
CA3137183C (en) 2020-11-05 2024-02-20 Accelovant Technologies Corporation Optoelectronic transducer module for thermographic temperature measurements
CN113828954B (zh) * 2021-10-22 2022-11-01 中国科学院空天信息创新研究院 金属-陶瓷封接方法、金属-陶瓷复合结构

Citations (7)

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US5240671A (en) 1992-06-01 1993-08-31 Microelectronics And Computer Technology Corporation Method of forming recessed patterns in insulating substrates
US5985464A (en) 1996-02-08 1999-11-16 Electrvac, Fabrikation Elektrotechnischer Spezialartikel Gmbh Composite structure, and method of making same
US20030228772A1 (en) 2002-06-05 2003-12-11 Cowans Kenneth W. Lateral temperature equalizing system for large area surfaces during processing
US20060156528A1 (en) 2003-06-13 2006-07-20 Tatsuo Esaki Aluminum nitride conjugate body and method of producing the same
US20130180976A1 (en) 2011-11-30 2013-07-18 Component Re-Engineering Company, Inc. Multi-Layer Plate Device
US20150108203A1 (en) 2011-11-30 2015-04-23 Component Re-Engineering Company, Inc. Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials
US20180374737A1 (en) 2017-06-23 2018-12-27 Watlow Electric Manufacturing Company High temperature heat plate pedestal

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JP3813654B2 (ja) 1995-02-09 2006-08-23 日本碍子株式会社 セラミックスの接合構造およびその製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240671A (en) 1992-06-01 1993-08-31 Microelectronics And Computer Technology Corporation Method of forming recessed patterns in insulating substrates
US5985464A (en) 1996-02-08 1999-11-16 Electrvac, Fabrikation Elektrotechnischer Spezialartikel Gmbh Composite structure, and method of making same
US20030228772A1 (en) 2002-06-05 2003-12-11 Cowans Kenneth W. Lateral temperature equalizing system for large area surfaces during processing
US20060156528A1 (en) 2003-06-13 2006-07-20 Tatsuo Esaki Aluminum nitride conjugate body and method of producing the same
US20130180976A1 (en) 2011-11-30 2013-07-18 Component Re-Engineering Company, Inc. Multi-Layer Plate Device
US20150108203A1 (en) 2011-11-30 2015-04-23 Component Re-Engineering Company, Inc. Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials
US20180374737A1 (en) 2017-06-23 2018-12-27 Watlow Electric Manufacturing Company High temperature heat plate pedestal

Also Published As

Publication number Publication date
CN112135806A (zh) 2020-12-25
DE112019002005T5 (de) 2021-02-25
KR20220098293A (ko) 2022-07-11
WO2019204050A1 (en) 2019-10-24
KR20210158426A (ko) 2021-12-30
TW201943680A (zh) 2019-11-16
JP2021185123A (ja) 2021-12-09
KR102417020B1 (ko) 2022-07-05
KR102343816B1 (ko) 2021-12-28
KR102519075B1 (ko) 2023-04-11
JP2021512845A (ja) 2021-05-20
JP6924910B2 (ja) 2021-08-25
TWI709547B (zh) 2020-11-11
US20190314918A1 (en) 2019-10-17
US20210078092A1 (en) 2021-03-18
KR20210023818A (ko) 2021-03-04
US20200230728A1 (en) 2020-07-23
US10882130B2 (en) 2021-01-05

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