KR102414392B1 - 열전 테이프 - Google Patents
열전 테이프 Download PDFInfo
- Publication number
- KR102414392B1 KR102414392B1 KR1020197001590A KR20197001590A KR102414392B1 KR 102414392 B1 KR102414392 B1 KR 102414392B1 KR 1020197001590 A KR1020197001590 A KR 1020197001590A KR 20197001590 A KR20197001590 A KR 20197001590A KR 102414392 B1 KR102414392 B1 KR 102414392B1
- Authority
- KR
- South Korea
- Prior art keywords
- thermoelectric
- flexible
- vias
- substrate
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- H01L35/32—
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- H01L35/04—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662353752P | 2016-06-23 | 2016-06-23 | |
| US62/353,752 | 2016-06-23 | ||
| PCT/US2017/037032 WO2017222853A1 (en) | 2016-06-23 | 2017-06-12 | Thermoelectric tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190022651A KR20190022651A (ko) | 2019-03-06 |
| KR102414392B1 true KR102414392B1 (ko) | 2022-06-30 |
Family
ID=59153305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197001590A Active KR102414392B1 (ko) | 2016-06-23 | 2017-06-12 | 열전 테이프 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190181322A1 (enExample) |
| EP (1) | EP3475990B1 (enExample) |
| JP (1) | JP2019525454A (enExample) |
| KR (1) | KR102414392B1 (enExample) |
| CN (1) | CN109478589A (enExample) |
| WO (1) | WO2017222853A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7486949B2 (ja) * | 2017-03-16 | 2024-05-20 | リンテック株式会社 | 熱電変換モジュール用電極材料及びそれを用いた熱電変換モジュール |
| JP7203037B2 (ja) | 2017-03-31 | 2023-01-12 | スリーエム イノベイティブ プロパティズ カンパニー | 固体半導体ダイを含む電子機器 |
| WO2018198001A2 (en) | 2017-04-28 | 2018-11-01 | 3M Innovative Properties Company | Air filtration monitoring based on thermoelectric devices |
| CN111433576B (zh) | 2017-12-08 | 2022-06-28 | 3M创新有限公司 | 差分热电装置 |
| JPWO2021193357A1 (enExample) * | 2020-03-25 | 2021-09-30 | ||
| US20240226876A1 (en) * | 2021-04-26 | 2024-07-11 | The Regents Of The University Of California | Testing devices |
| KR20230055116A (ko) * | 2021-10-18 | 2023-04-25 | 에스케이온 주식회사 | 배터리 셀 및 이를 구비하는 배터리 모듈 |
| KR102726083B1 (ko) * | 2021-11-03 | 2024-11-05 | 엘티메탈 주식회사 | 배터리셀 냉각용 평판형 열전 소자 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060278265A1 (en) * | 2003-05-23 | 2006-12-14 | Martin Ouwerkerk | Method of manufacturing a thermoelectric device and thermoelectric device obtained by means of such a method |
| US20070125413A1 (en) | 2003-12-02 | 2007-06-07 | Olsen Larry C | Thermoelectric devices and applications for the same |
| US20080308140A1 (en) * | 2004-08-17 | 2008-12-18 | The Furukawa Electric Co., Ltd. | Thermo-Electric Cooling Device |
| US20090014046A1 (en) | 2007-07-12 | 2009-01-15 | Industrial Technology Research Institute | Flexible thermoelectric device and manufacturing method thereof |
| JP2016011949A (ja) * | 2014-06-03 | 2016-01-21 | 株式会社デンソー | 質量流量計および速度計 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH413018A (de) * | 1963-04-30 | 1966-05-15 | Du Pont | Thermoelektrischer Generator |
| US6127619A (en) * | 1998-06-08 | 2000-10-03 | Ormet Corporation | Process for producing high performance thermoelectric modules |
| DE10045419B4 (de) * | 2000-09-14 | 2007-12-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines thermoelektrischen Bauelements, thermoelektrisches Bauelement sowie Vorrichtung zur Durchführung des Verfahrens |
| US6611046B2 (en) | 2001-06-05 | 2003-08-26 | 3M Innovative Properties Company | Flexible polyimide circuits having predetermined via angles |
| JP2003262425A (ja) * | 2002-03-11 | 2003-09-19 | Sekisui Plastics Co Ltd | 加熱冷却帯状体および加熱冷却装置 |
| JP4175839B2 (ja) * | 2002-07-10 | 2008-11-05 | 株式会社東芝 | 流路管用熱電変換モジュール |
| JP4345279B2 (ja) * | 2002-09-13 | 2009-10-14 | ソニー株式会社 | 熱電変換装置の製造方法 |
| US6958443B2 (en) * | 2003-05-19 | 2005-10-25 | Applied Digital Solutions | Low power thermoelectric generator |
| JP2005129784A (ja) * | 2003-10-24 | 2005-05-19 | Toshiba Corp | 熱電変換モジュール及びその製造方法、並びに流量測定装置 |
| US7012017B2 (en) | 2004-01-29 | 2006-03-14 | 3M Innovative Properties Company | Partially etched dielectric film with conductive features |
| JP2005217353A (ja) * | 2004-02-02 | 2005-08-11 | Yokohama Teikoki Kk | 熱電半導体素子、熱電変換モジュールおよびその製造方法 |
| KR20070026586A (ko) * | 2004-06-17 | 2007-03-08 | 아르재 가부시키가이샤 | 열전변환 모듈 |
| JP4829552B2 (ja) * | 2004-07-06 | 2011-12-07 | 財団法人電力中央研究所 | 熱電変換モジュール |
| JP3879769B1 (ja) * | 2006-02-22 | 2007-02-14 | 株式会社村田製作所 | 熱電変換モジュールおよびその製造方法 |
| US20080142068A1 (en) * | 2006-12-18 | 2008-06-19 | American Power Conversion Corporation | Direct Thermoelectric chiller assembly |
| JP5228160B2 (ja) * | 2008-04-24 | 2013-07-03 | 株式会社アセット・ウィッツ | 熱電変換モジュールならびにその製造方法および熱電発電システム |
| WO2011019078A1 (ja) * | 2009-08-13 | 2011-02-17 | 独立行政法人産業技術総合研究所 | フレキシブル熱電発電デバイスの高速製造方法 |
| JP5626830B2 (ja) * | 2009-10-23 | 2014-11-19 | 国立大学法人大阪大学 | 熱電変換モジュール及び熱電変換モジュール作製方法 |
| US9601677B2 (en) * | 2010-03-15 | 2017-03-21 | Laird Durham, Inc. | Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces |
| WO2012061184A1 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device and method of making |
| WO2013114854A1 (ja) * | 2012-02-03 | 2013-08-08 | 日本電気株式会社 | 有機熱電発電素子およびその製造方法 |
| US20130218241A1 (en) * | 2012-02-16 | 2013-08-22 | Nanohmics, Inc. | Membrane-Supported, Thermoelectric Compositions |
| JP2014007376A (ja) * | 2012-05-30 | 2014-01-16 | Denso Corp | 熱電変換装置 |
| JP6035970B2 (ja) * | 2012-08-03 | 2016-11-30 | 富士通株式会社 | 熱電変換デバイス及びその製造方法 |
| JP5984748B2 (ja) * | 2013-07-01 | 2016-09-06 | 富士フイルム株式会社 | 熱電変換素子および熱電変換モジュール |
| KR102235118B1 (ko) * | 2013-09-25 | 2021-04-01 | 린텍 가부시키가이샤 | 열 전도성 접착 시트, 그의 제조 방법 및 그것을 사용한 전자 디바이스 |
| KR101580041B1 (ko) * | 2014-04-07 | 2015-12-23 | 홍익대학교 산학협력단 | 신축성 열전모듈 |
-
2017
- 2017-06-12 WO PCT/US2017/037032 patent/WO2017222853A1/en not_active Ceased
- 2017-06-12 JP JP2018567092A patent/JP2019525454A/ja active Pending
- 2017-06-12 EP EP17732674.1A patent/EP3475990B1/en not_active Not-in-force
- 2017-06-12 KR KR1020197001590A patent/KR102414392B1/ko active Active
- 2017-06-12 US US16/310,697 patent/US20190181322A1/en not_active Abandoned
- 2017-06-12 CN CN201780038242.1A patent/CN109478589A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060278265A1 (en) * | 2003-05-23 | 2006-12-14 | Martin Ouwerkerk | Method of manufacturing a thermoelectric device and thermoelectric device obtained by means of such a method |
| US20070125413A1 (en) | 2003-12-02 | 2007-06-07 | Olsen Larry C | Thermoelectric devices and applications for the same |
| US20080308140A1 (en) * | 2004-08-17 | 2008-12-18 | The Furukawa Electric Co., Ltd. | Thermo-Electric Cooling Device |
| US20090014046A1 (en) | 2007-07-12 | 2009-01-15 | Industrial Technology Research Institute | Flexible thermoelectric device and manufacturing method thereof |
| JP2016011949A (ja) * | 2014-06-03 | 2016-01-21 | 株式会社デンソー | 質量流量計および速度計 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190022651A (ko) | 2019-03-06 |
| WO2017222853A1 (en) | 2017-12-28 |
| JP2019525454A (ja) | 2019-09-05 |
| CN109478589A (zh) | 2019-03-15 |
| US20190181322A1 (en) | 2019-06-13 |
| EP3475990A1 (en) | 2019-05-01 |
| EP3475990B1 (en) | 2020-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20190117 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| AMND | Amendment | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20200417 Comment text: Request for Examination of Application |
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| E902 | Notification of reason for refusal | ||
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Comment text: Notification of reason for refusal Patent event date: 20210215 Patent event code: PE09021S01D |
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Comment text: Final Notice of Reason for Refusal Patent event date: 20210819 Patent event code: PE09021S02D |
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Patent event date: 20220222 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20210819 Comment text: Final Notice of Reason for Refusal Patent event code: PE06011S02I Patent event date: 20210215 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
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Patent event date: 20220407 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20220324 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20220222 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20210414 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20200417 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
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Comment text: Registration of Establishment Patent event date: 20220624 Patent event code: PR07011E01D |
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