KR102397238B1 - 접착제 조성물 및 접속체 - Google Patents

접착제 조성물 및 접속체 Download PDF

Info

Publication number
KR102397238B1
KR102397238B1 KR1020177035152A KR20177035152A KR102397238B1 KR 102397238 B1 KR102397238 B1 KR 102397238B1 KR 1020177035152 A KR1020177035152 A KR 1020177035152A KR 20177035152 A KR20177035152 A KR 20177035152A KR 102397238 B1 KR102397238 B1 KR 102397238B1
Authority
KR
South Korea
Prior art keywords
circuit
adhesive composition
meth
adhesive
radically polymerizable
Prior art date
Application number
KR1020177035152A
Other languages
English (en)
Korean (ko)
Other versions
KR20180017015A (ko
Inventor
스나오 구도우
도루 후지나와
도시유키 야나가와
아키히로 이토
도모키 모리지리
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼와덴코머티리얼즈가부시끼가이샤 filed Critical 쇼와덴코머티리얼즈가부시끼가이샤
Publication of KR20180017015A publication Critical patent/KR20180017015A/ko
Application granted granted Critical
Publication of KR102397238B1 publication Critical patent/KR102397238B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
KR1020177035152A 2015-06-10 2015-06-10 접착제 조성물 및 접속체 KR102397238B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/066776 WO2016199252A1 (ja) 2015-06-10 2015-06-10 接着剤組成物及び接続体

Publications (2)

Publication Number Publication Date
KR20180017015A KR20180017015A (ko) 2018-02-20
KR102397238B1 true KR102397238B1 (ko) 2022-05-11

Family

ID=57503366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177035152A KR102397238B1 (ko) 2015-06-10 2015-06-10 접착제 조성물 및 접속체

Country Status (4)

Country Link
JP (1) JP6645499B2 (zh)
KR (1) KR102397238B1 (zh)
CN (1) CN107636107B (zh)
WO (1) WO2016199252A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102576670B1 (ko) * 2019-09-27 2023-09-11 주식회사 엘지화학 점착제 조성물, 이를 이용하여 제조된 편광판 및 디스플레이 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101100507B1 (ko) * 2007-05-09 2011-12-29 히다치 가세고교 가부시끼가이샤 필름상 회로 접속 재료 및 회로 부재의 접속 구조
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
JP2013170267A (ja) 2012-02-23 2013-09-02 Hitachi Cable Ltd 接着剤、接着剤ワニス、接着フィルム及び配線フィルム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
JPH0597963A (ja) * 1991-10-04 1993-04-20 Three Bond Co Ltd 硬化性樹脂組成物
JP3587859B2 (ja) 1997-03-31 2004-11-10 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造及び接続方法
JP2008208229A (ja) * 2007-02-27 2008-09-11 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物並びに熱伝導性感圧接着性シート及びその製造方法
JP5292838B2 (ja) * 2007-08-30 2013-09-18 日立化成株式会社 接着剤、及び回路部材の接続構造体
JP5251393B2 (ja) * 2008-03-28 2013-07-31 日立化成株式会社 接着剤組成物、回路接続用接着剤及びそれを用いた接続体
JP5298977B2 (ja) * 2008-03-28 2013-09-25 日立化成株式会社 接着剤組成物、回路接続用接着剤、接続体及び半導体装置
JP5516163B2 (ja) * 2009-07-14 2014-06-11 東亞合成株式会社 活性エネルギー線硬化型接着剤組成物
JP5594359B2 (ja) * 2010-03-25 2014-09-24 日立化成株式会社 接着剤組成物及びその使用、並びに、回路部材の接続構造体及びその製造方法
JP5504225B2 (ja) * 2010-08-31 2014-05-28 積水化学工業株式会社 異方性導電材料及び接続構造体
KR20150005516A (ko) * 2012-04-25 2015-01-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101100507B1 (ko) * 2007-05-09 2011-12-29 히다치 가세고교 가부시끼가이샤 필름상 회로 접속 재료 및 회로 부재의 접속 구조
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
JP2013170267A (ja) 2012-02-23 2013-09-02 Hitachi Cable Ltd 接着剤、接着剤ワニス、接着フィルム及び配線フィルム

Also Published As

Publication number Publication date
WO2016199252A1 (ja) 2016-12-15
JPWO2016199252A1 (ja) 2018-03-29
JP6645499B2 (ja) 2020-02-14
CN107636107A (zh) 2018-01-26
CN107636107B (zh) 2021-01-05
KR20180017015A (ko) 2018-02-20

Similar Documents

Publication Publication Date Title
KR102329065B1 (ko) 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체
JP5867508B2 (ja) 回路接続材料及び接続体
KR102478959B1 (ko) 접착제 조성물 및 접속체
JP6307966B2 (ja) 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体
KR101379152B1 (ko) 접착제 조성물, 회로 접속 구조체, 반도체 장치 및 태양 전지 모듈
KR102397238B1 (ko) 접착제 조성물 및 접속체
JP6417675B2 (ja) 接着剤組成物及び接続体
JP2022000530A (ja) 接着剤組成物及び構造体
JP2018184607A (ja) 接着剤組成物及び接続体
KR102467385B1 (ko) 접속 구조체, 회로 접속 부재 및 접착제 조성물
KR102376223B1 (ko) 접착제 조성물, 이방 도전성 접착제 조성물, 회로 접속 재료 및 접속체
WO2023228729A1 (ja) 接着剤組成物、回路接続材料、及び接続体
TWI685554B (zh) 接著劑組成物及連接體
WO2022186016A1 (ja) 回路接続用接着フィルム及び接続体
TWI690580B (zh) 接著劑組成物、異向導電性接著劑組成物、電路連接材料及連接體
TWI570208B (zh) 電路連接材料及連接體
JP2011157557A (ja) 接着剤、回路接続用接着剤、接続体及び半導体装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant