KR102394995B1 - 고순도 분배 유닛 - Google Patents

고순도 분배 유닛 Download PDF

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Publication number
KR102394995B1
KR102394995B1 KR1020170102401A KR20170102401A KR102394995B1 KR 102394995 B1 KR102394995 B1 KR 102394995B1 KR 1020170102401 A KR1020170102401 A KR 1020170102401A KR 20170102401 A KR20170102401 A KR 20170102401A KR 102394995 B1 KR102394995 B1 KR 102394995B1
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South Korea
Prior art keywords
bladder
chamber
fluid
dispensing
elongated
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KR1020170102401A
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English (en)
Korean (ko)
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KR20180018444A (ko
Inventor
안톤 제이. 데빌리어스
로드니 엘 로비슨
로날드 나스만
데이비드 트라비스
제임즈 그루테고드
노만 에이 주니어 재콥슨
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도쿄엘렉트론가부시키가이샤
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Publication of KR20180018444A publication Critical patent/KR20180018444A/ko
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    • H01L21/67017—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0409—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material the pumps being driven by a hydraulic or a pneumatic fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/047—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • H01L21/6715—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/08—Apparatus to be carried on or by a person, e.g. of knapsack type
    • B05B9/0805—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material
    • B05B9/0838—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Fluid Mechanics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Hydraulic Motors (AREA)
  • Flow Control (AREA)
  • Control Of Fluid Pressure (AREA)
KR1020170102401A 2016-08-11 2017-08-11 고순도 분배 유닛 Active KR102394995B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373724P 2016-08-11 2016-08-11
US62/373,724 2016-08-11

Publications (2)

Publication Number Publication Date
KR20180018444A KR20180018444A (ko) 2018-02-21
KR102394995B1 true KR102394995B1 (ko) 2022-05-04

Family

ID=61158829

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170102401A Active KR102394995B1 (ko) 2016-08-11 2017-08-11 고순도 분배 유닛

Country Status (5)

Country Link
US (1) US10712663B2 (https=)
JP (1) JP6948875B2 (https=)
KR (1) KR102394995B1 (https=)
CN (1) CN107728430B (https=)
TW (1) TWI760354B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
US10682663B2 (en) 2018-10-31 2020-06-16 The Boeing Company Methods for dispensing flowable materials
US11383211B2 (en) * 2019-04-29 2022-07-12 Tokyo Electron Limited Point-of-use dynamic concentration delivery system with high flow and high uniformity
CN111468325A (zh) * 2020-06-05 2020-07-31 余祥红 一种能够自动增压的汽车喷漆装置
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
JP7578535B2 (ja) * 2021-04-15 2024-11-06 株式会社コガネイ 液体供給装置
TWI876256B (zh) * 2022-02-14 2025-03-11 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法

Citations (2)

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KR101391070B1 (ko) * 2010-09-28 2014-04-30 가부시키가이샤 고가네이 약액 공급 장치
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor

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US2467150A (en) 1943-11-12 1949-04-12 Carl H Nordell Valve
US2517820A (en) 1948-08-10 1950-08-08 American Cyanamid Co Fluid-pressure controller
BE491946A (https=) 1949-01-04 1900-01-01
US4195810A (en) 1978-03-31 1980-04-01 Lavin Aaron M Pinch valve
US4442954A (en) 1982-07-30 1984-04-17 National Instrument Company, Inc. Self-pressurizing pinch valve
JPS60171582U (ja) * 1984-04-20 1985-11-13 トキコ株式会社 塗布ガン装置
JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
US4867208A (en) * 1988-02-04 1989-09-19 Fitzgerald Robert M Apparatus for storing and dispensing fluid under pressure
FR2651552B1 (fr) 1989-09-01 1991-12-06 Cit Alcatel Vanne et dispositifs utilisant ladite vanne.
JPH09303302A (ja) * 1996-05-13 1997-11-25 Morikawa Sangyo Kk 流体の一時貯留器及びそれを用いた流体の一時貯留装置
KR100754342B1 (ko) 1999-10-18 2007-09-03 인터그레이티드 디자인즈 엘.피. 유체 분배 방법 및 장치
JP2002021715A (ja) * 2000-07-10 2002-01-23 Matsushita Electric Ind Co Ltd 流体供給装置及び流体供給方法
KR100865601B1 (ko) * 2000-10-23 2008-10-27 피 페턴트, 인크. 유체 분배기 및 유체 분배기 충진 방법
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KR101391070B1 (ko) * 2010-09-28 2014-04-30 가부시키가이샤 고가네이 약액 공급 장치
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor

Also Published As

Publication number Publication date
US10712663B2 (en) 2020-07-14
KR20180018444A (ko) 2018-02-21
US20180046082A1 (en) 2018-02-15
CN107728430A (zh) 2018-02-23
CN107728430B (zh) 2022-10-21
JP2018026137A (ja) 2018-02-15
TW201818518A (zh) 2018-05-16
JP6948875B2 (ja) 2021-10-13
TWI760354B (zh) 2022-04-11

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