KR102392651B9 - 열전소자 - Google Patents

열전소자

Info

Publication number
KR102392651B9
KR102392651B9 KR1020200152752A KR20200152752A KR102392651B9 KR 102392651 B9 KR102392651 B9 KR 102392651B9 KR 1020200152752 A KR1020200152752 A KR 1020200152752A KR 20200152752 A KR20200152752 A KR 20200152752A KR 102392651 B9 KR102392651 B9 KR 102392651B9
Authority
KR
South Korea
Prior art keywords
thermoelectric element
thermoelectric
Prior art date
Application number
KR1020200152752A
Other languages
English (en)
Other versions
KR102392651B1 (ko
KR20200131794A (ko
Inventor
노명래
이종민
조용상
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Publication of KR20200131794A publication Critical patent/KR20200131794A/ko
Priority to KR1020220051423A priority Critical patent/KR102596839B1/ko
Application granted granted Critical
Publication of KR102392651B1 publication Critical patent/KR102392651B1/ko
Publication of KR102392651B9 publication Critical patent/KR102392651B9/ko

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
KR1020200152752A 2018-04-04 2020-11-16 열전소자 KR102392651B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220051423A KR102596839B1 (ko) 2018-04-04 2022-04-26 열전소자

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20180039307 2018-04-04
KR1020180039307 2018-04-04
KR1020200035660A KR102249018B1 (ko) 2018-04-04 2020-03-24 열전소자

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020200035660A Division KR102249018B1 (ko) 2018-04-04 2020-03-24 열전소자

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220051423A Division KR102596839B1 (ko) 2018-04-04 2022-04-26 열전소자

Publications (3)

Publication Number Publication Date
KR20200131794A KR20200131794A (ko) 2020-11-24
KR102392651B1 KR102392651B1 (ko) 2022-05-02
KR102392651B9 true KR102392651B9 (ko) 2023-03-23

Family

ID=68171788

Family Applications (5)

Application Number Title Priority Date Filing Date
KR1020190036097A KR102095243B1 (ko) 2018-04-04 2019-03-28 열전소자
KR1020200035660A KR102249018B1 (ko) 2018-04-04 2020-03-24 열전소자
KR1020200152752A KR102392651B1 (ko) 2018-04-04 2020-11-16 열전소자
KR1020220051423A KR102596839B1 (ko) 2018-04-04 2022-04-26 열전소자
KR1020230145502A KR20230153977A (ko) 2018-04-04 2023-10-27 열전소자

Family Applications Before (2)

Application Number Title Priority Date Filing Date
KR1020190036097A KR102095243B1 (ko) 2018-04-04 2019-03-28 열전소자
KR1020200035660A KR102249018B1 (ko) 2018-04-04 2020-03-24 열전소자

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020220051423A KR102596839B1 (ko) 2018-04-04 2022-04-26 열전소자
KR1020230145502A KR20230153977A (ko) 2018-04-04 2023-10-27 열전소자

Country Status (5)

Country Link
US (1) US20210050504A1 (ko)
EP (2) EP3764410B1 (ko)
JP (2) JP7442456B2 (ko)
KR (5) KR102095243B1 (ko)
CN (4) CN117460386A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210088980A (ko) 2020-01-07 2021-07-15 엘지이노텍 주식회사 열전소자
KR20210122605A (ko) * 2020-04-01 2021-10-12 엘지이노텍 주식회사 열전소자
KR20210122606A (ko) * 2020-04-01 2021-10-12 엘지이노텍 주식회사 열전 소자
KR20220013223A (ko) * 2020-07-24 2022-02-04 엘지이노텍 주식회사 열전 소자
KR20220032284A (ko) * 2020-09-07 2022-03-15 엘지이노텍 주식회사 열전 모듈 및 이를 포함하는 발전 장치
WO2022131395A1 (ko) * 2020-12-16 2022-06-23 엘티메탈 주식회사 열전 변환 모듈
KR102473032B1 (ko) 2021-01-18 2022-12-01 전주대학교 산학협력단 열전소자 유닛
KR20230139705A (ko) * 2022-03-28 2023-10-05 주식회사 세진이에스 발전 모듈

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JPH11168245A (ja) * 1997-12-04 1999-06-22 Yazaki Corp 熱電変換装置
JP4121679B2 (ja) 1998-11-18 2008-07-23 株式会社小松製作所 温度調節器及びその製造方法
JP3570345B2 (ja) * 1999-06-15 2004-09-29 ヤマハ株式会社 熱電モジュール
US6444893B1 (en) * 1999-06-15 2002-09-03 Yamaha Corporation High-converting efficiency large-mechanical strength thermoelectric module
JP2002280621A (ja) * 2001-01-15 2002-09-27 Furukawa Electric Co Ltd:The レーザーモジュール、ペルチェモジュールおよびペルチェモジュール一体型ヒートスプレッダー
US6826916B2 (en) * 2001-04-24 2004-12-07 The Furukawa Electric Co., Ltd. Laser module, Peltier module, and Peltier module integrated heat spreader
JP2003046147A (ja) * 2001-08-02 2003-02-14 Matsushita Refrig Co Ltd 熱電素子モジュール及びその製造方法
TWI255001B (en) * 2001-12-13 2006-05-11 Matsushita Electric Ind Co Ltd Metal wiring substrate, semiconductor device and the manufacturing method thereof
JP2003243563A (ja) * 2001-12-13 2003-08-29 Matsushita Electric Ind Co Ltd 金属配線基板と半導体装置及びその製造方法
JP4116814B2 (ja) 2002-04-25 2008-07-09 京セラ株式会社 熱電素子モジュールならびに半導体素子収納用パッケージおよび半導体モジュール
JP2005340565A (ja) * 2004-04-27 2005-12-08 Kyocera Corp 熱電交換モジュール用セラミック基板
JP2007035974A (ja) * 2005-07-27 2007-02-08 Aisin Seiki Co Ltd 熱電変換装置
US20090236087A1 (en) * 2008-03-19 2009-09-24 Yamaha Corporation Heat exchange device
KR100999506B1 (ko) * 2008-09-09 2010-12-09 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US20110290293A1 (en) * 2010-05-26 2011-12-01 Samsung Electro-Mechanics Co. Thermoelectric module and method for manufacturing the same
JP2012044133A (ja) * 2010-08-18 2012-03-01 Samsung Electro-Mechanics Co Ltd 熱電モジュール及びその製造方法
KR20130009442A (ko) * 2011-07-15 2013-01-23 삼성전기주식회사 열전 모듈
KR20130009443A (ko) * 2011-07-15 2013-01-23 삼성전기주식회사 열전 모듈
KR20130035016A (ko) * 2011-09-29 2013-04-08 삼성전기주식회사 열전 모듈
WO2014064755A1 (ja) * 2012-10-22 2014-05-01 富士通株式会社 半導体装置、半導体装置の製造方法及び熱電発電電子機器
JP5956608B2 (ja) * 2012-11-29 2016-07-27 京セラ株式会社 熱電モジュール
JP6297025B2 (ja) * 2013-03-21 2018-03-20 国立大学法人長岡技術科学大学 熱電変換素子
JP5931790B2 (ja) * 2013-03-29 2016-06-08 富士フイルム株式会社 熱電発電モジュール
KR102111604B1 (ko) * 2014-05-13 2020-05-15 엘지이노텍 주식회사 열전환장치
JP6430781B2 (ja) * 2014-10-29 2018-11-28 京セラ株式会社 熱電モジュール
KR20160117944A (ko) * 2015-04-01 2016-10-11 엘지이노텍 주식회사 열전모듈 및 이를 포함하는 열전환장치
KR102304713B1 (ko) * 2015-04-24 2021-09-24 엘지이노텍 주식회사 열전모듈 및 이를 포함하는 열전환장치
WO2019092876A1 (ja) * 2017-11-13 2019-05-16 株式会社朝日Ｆｒ研究所 熱電変換装置

Also Published As

Publication number Publication date
KR20190116066A (ko) 2019-10-14
KR102249018B1 (ko) 2021-05-07
KR20200034983A (ko) 2020-04-01
US20210050504A1 (en) 2021-02-18
KR102596839B1 (ko) 2023-11-02
KR102095243B1 (ko) 2020-04-01
CN117460387A (zh) 2024-01-26
EP3764410A1 (en) 2021-01-13
EP3764410B1 (en) 2023-11-08
CN112041996A (zh) 2020-12-04
EP4277454A2 (en) 2023-11-15
JP2021520627A (ja) 2021-08-19
JP7442456B2 (ja) 2024-03-04
EP4277454A3 (en) 2024-01-10
CN117460386A (zh) 2024-01-26
KR102392651B1 (ko) 2022-05-02
EP3764410A4 (en) 2021-12-08
KR102596839B9 (ko) 2024-02-08
CN117460385A (zh) 2024-01-26
KR20230153977A (ko) 2023-11-07
KR20200131794A (ko) 2020-11-24
JP2024056966A (ja) 2024-04-23
CN112041996B (zh) 2023-11-24
KR20220057508A (ko) 2022-05-09

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E701 Decision to grant or registration of patent right
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