GB201909147D0 - Thermoelectric device - Google Patents

Thermoelectric device

Info

Publication number
GB201909147D0
GB201909147D0 GBGB1909147.9A GB201909147A GB201909147D0 GB 201909147 D0 GB201909147 D0 GB 201909147D0 GB 201909147 A GB201909147 A GB 201909147A GB 201909147 D0 GB201909147 D0 GB 201909147D0
Authority
GB
United Kingdom
Prior art keywords
thermoelectric device
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1909147.9A
Other versions
GB2585045A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to GB1909147.9A priority Critical patent/GB2585045A/en
Publication of GB201909147D0 publication Critical patent/GB201909147D0/en
Priority to PCT/GB2020/051540 priority patent/WO2020260881A1/en
Publication of GB2585045A publication Critical patent/GB2585045A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
GB1909147.9A 2019-06-25 2019-06-25 Thermoelectric device Withdrawn GB2585045A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1909147.9A GB2585045A (en) 2019-06-25 2019-06-25 Thermoelectric device
PCT/GB2020/051540 WO2020260881A1 (en) 2019-06-25 2020-06-25 Method of forming a thermoelectric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1909147.9A GB2585045A (en) 2019-06-25 2019-06-25 Thermoelectric device

Publications (2)

Publication Number Publication Date
GB201909147D0 true GB201909147D0 (en) 2019-08-07
GB2585045A GB2585045A (en) 2020-12-30

Family

ID=67511749

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1909147.9A Withdrawn GB2585045A (en) 2019-06-25 2019-06-25 Thermoelectric device

Country Status (2)

Country Link
GB (1) GB2585045A (en)
WO (1) WO2020260881A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102504359B1 (en) * 2021-01-18 2023-02-28 연세대학교 산학협력단 Flexible Thermoelectric Device having Radiative Cooling Part and Making Method of the Radiative Cooling Part
CN114335065B (en) * 2021-12-09 2022-10-25 武汉大学 Thermoelectric array display and preparation method thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3372472A (en) * 1962-05-22 1968-03-12 Carrier Corp Method for forming a thermoelectric module
US4907060A (en) * 1987-06-02 1990-03-06 Nelson John L Encapsulated thermoelectric heat pump and method of manufacture
US5209786A (en) * 1990-10-09 1993-05-11 Thermo Electron Technologies Corporation Integrity-enhanced thermoelectrics
SE9801798A0 (en) * 1998-05-20 1999-11-21 Termogen Ab Thermoelectric device
US6127619A (en) * 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
JP2003008087A (en) * 2001-04-18 2003-01-10 Suzuki Sogyo Co Ltd Thermoelectric element module and its manufacturing method
JP2006332188A (en) * 2005-05-24 2006-12-07 Toyota Motor Corp Thermoelectric power generation module
US20090184829A1 (en) * 2008-01-22 2009-07-23 Rivers Jr Cecil Temperature sensor
JP5264307B2 (en) * 2008-06-11 2013-08-14 株式会社朝日Ｆｒ研究所 Thermoelectric converter
KR101139837B1 (en) * 2009-10-15 2012-04-30 주식회사 제펠 Apparatus of manufacturing thermoelectric module and thermoelectric module manufactured by the apparatus
JP2011166079A (en) * 2010-02-15 2011-08-25 Seiko Epson Corp Method of manufacturing thermoelectric conversion element
JP5810419B2 (en) * 2011-11-17 2015-11-11 北川工業株式会社 Thermoelectric conversion module
JP6145664B2 (en) * 2013-03-13 2017-06-14 北川工業株式会社 Method for manufacturing thermoelectric conversion module
KR101593498B1 (en) * 2014-07-24 2016-02-16 주식회사 제펠 Thermoelectric module having sintered layer and method of manufacturing the module
KR101645585B1 (en) * 2014-12-26 2016-08-09 주식회사 제펠 Thermoelectric module having anker parts of thermoelectric leg and method of manufacturing the module
CN108110130B (en) * 2017-11-16 2019-08-20 浙江大学 A method of micro thermoelectric device is prepared by cutting bonding
GB2577572A (en) * 2018-09-28 2020-04-01 Sumitomo Chemical Co Thermoelectric device

Also Published As

Publication number Publication date
WO2020260881A1 (en) 2020-12-30
GB2585045A (en) 2020-12-30

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)